Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, R.; Zufiria, P.G.; Giagka, V.; Serdijn, W.A.
Konferenzbeitrag
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Zeitschriftenaufsatz
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Zeitschriftenaufsatz
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Konferenzbeitrag
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Konferenzbeitrag
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Zeitschriftenaufsatz
2020Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven
Konferenzbeitrag
2020Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications
Schischke, K.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2019/2020
 
Jahresbericht
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Zeitschriftenaufsatz
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Zeitschriftenaufsatz
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Konferenzbeitrag
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Zeitschriftenaufsatz
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Process modules for high-density interconnects in panel-level packaging
Schein, F.-L.; Kahle, R.; Kunz, M.; Kunz, T.; Kossev, J.; Müller, T.; Pentz, M.; Dietterle, M.; Ostmann, A.
Zeitschriftenaufsatz
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Zeitschriftenaufsatz
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Zeitschriftenaufsatz
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
Kossifos, K.M.; Petrou, L.; Varnava, G.; Pitilakis, A.; Tsilipakos, O.; Liu, F.; Karousios, P.; Tasolamprou, A.C.; Seckel, M.; Manessis, D.; Kantartzis, N.V.; Kwon, D.-H.; Antoniades, M.A.; Georgiou, J.
Zeitschriftenaufsatz
2020Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, F.; Etschmaier, H.; Dobs, T.; Walter, H.; Wittler, O.; Hadley, P.
Zeitschriftenaufsatz
2020Wafer-Scale Graphene-Based Soft Electrode Array with Optogenetic Compatibility
Velea, A.I.; Vollebregt, S.; Wardhana, G.K.; Giagka, V.
Konferenzbeitrag
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
Akgun, Omer Can; Nanbakhsh, Kambiz; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Schulz, S.; Heinrich, W.
Konferenzbeitrag
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Demumieux, P.; Avino-Salvado, O.; Buttay, C.; Martin, C.; Sixdenier, F.; Joubert, C.; Magambo, J.S.N.T.; Loher, T.
Konferenzbeitrag
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Zeitschriftenaufsatz
2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
Nanbakhsh, Kambiz; Kluba, Marta; Pahl, Barbara; Bourgeois, Florian; Dekker, Ronald; Serdijn, Wouter; Giagka, Vasiliki
Konferenzbeitrag
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Konferenzbeitrag
2019Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
Löher, Thomas; Ndip, Ivan; Lang, Klaus-Dieter
Patent
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Konferenzbeitrag
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Konferenzbeitrag
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Miniaturized 24 GHz Radar Positioning Transponder Module
Fritzsch, Thomas; Tschoban, Christian; Böttcher, Mathias; Windrich, Frank; Phung, Gia Ngoc; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
Kawasaki, S.; Giagka, V.; Haas, M. de; Louwerse, M.; Henneken, V.; Heesch, C. van; Dekker, R.
Konferenzbeitrag
2019Realisierung und Anwendung energieautarker miniaturisierter Funksensorik: Chancen durch IoT, 5G und Narrowband
Brockmann, Carsten; Günther-Sorge, Julia; Pötter, Harald
Zeitschriftenaufsatz
2019Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR)
Sirbu, B.; Tekin, T.; Weeber, J.C.; Dereux, A.; Markey, L.
Konferenzbeitrag
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2019Vorrichtung zur Erfassung von Objekten
Becker, Karl-Friedrich; Georgi, Leopold; Tschoban, Christian; Hommes, Alexander; Ebberg, Alfred; Hülsmann, Axel; Hofmann, Ulrich; Wantoch, Thomas von
Patent
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
20185G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.
Konferenzbeitrag
2018Accelerated Degradation of High Power Diode Lasers Caused by External Optical Feedback Operation
Kissel, H.; Leonhäuser, B.; Tomm, J.W.; Hempel, M.; Biesenbach, J.
Konferenzbeitrag
2018Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub
Konferenzbeitrag
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Aufsatz in Buch
2018Ag sintering - An alternative large area joining technology
Weber, C.; Hutter, M.
Konferenzbeitrag
2018Alterungsphänomene beim Al-Drahtbonden mit semiautokatalytisch abgeschiedenem Gold auf chemisch Ni-Schichten
Fischer, Felix; Schmidt, R.; Schneider-Ramelow, M.; Schmitz, S.; Ngo, H.-D.; Sitte, N.
Konferenzbeitrag
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Assembly-Line-Compatible Electromagnetic Characterization of Antenna Substrates for Wearable Applications using Polynomial Chaos
Deckmyn, T.; Rossi, M.; Agneessens, S.; Rogier, H.; Ginste, D.V.
Konferenzbeitrag
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018Building Capacities for Transdisciplinary Research
Jaeger-Erben, M.; Kramm, J.; Sonnberger, M.; Völker, C.; Albert, C.; Graf, A.; Hermans, K.; Lange, S.; Santarius, T.; Schröter, B.; Sievers-Glotzbach, S.; Winzer, J.
Zeitschriftenaufsatz
2018Can Bond Wires really be used as Antennas?
Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.
Zeitschriftenaufsatz
2018Challenges for Miniaturised Energy Harvesting Sensor Systems
Rusu, C.; Bader, S.; Oelmann, B.; Alvandpour, A.; Enoksson, P.; Braun, T.; Tiedke, S.; Dal Molin, R.; Ferin, G.; Torvinen, P.; Liljeholm, J.
Konferenzbeitrag
2018Channel Characterization for Chip-scale Wireless Communications within Computing Packages
Timoneda, X.; Cabellos-Aparicio, A.; Manessis, D.; Alarcon, E.; Abadal, S.
Konferenzbeitrag
2018Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, M.; Panchenko, I.; Künzelmann, U.; Reif, J.; Geidel, M.; Wolf, M.J.; Lang, K.-D.
Zeitschriftenaufsatz
2018Characteristics of Li-ion micro batteries fully batch fabricated by micro-fluidic MEMS packaging
Hahn, R.; Ferch, M.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Elia, G.A.
Zeitschriftenaufsatz
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Characterization of self-assembled monolayers for CuCu bonding technology
Lykova, M.; Langer, E.; Hinrichs, K.; Panchenko, I.; Meyer, J.; Künzelmann, U.; Wolf, M.J.; Lang, K.D.
Zeitschriftenaufsatz
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Konferenzbeitrag
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Konferenzbeitrag
2018Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.
Konferenzbeitrag
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2018Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.
Zeitschriftenaufsatz
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2018Cu-In fine-pitch-interconnects: Influence of processing conditions on the interconnection quality
Bickel, S.; Sen, S.; Meyer, J.; Panchenko, I.; Wolf, M.J.
Konferenzbeitrag
2018Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, A.; Schulz, M.; Sheva, S.; Keller, J.; Bader, V.; Wöhrmann, M.; Bauer, J.; May, D.; Wunderle, B.
Konferenzbeitrag
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Design and Custom Fabrication of a Smart Temperature Sensor for an Organ-on-a-chip Platform
Ponte, R.; Giagka, V.; Serdijn, W.A.
Konferenzbeitrag
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2018Determination of Stress-Strain Properties Combining Small-Depth Nanoindentation and Numerical Simulation
Kuttler, S.; Walter, H.; Grams, A.; Schneider-Ramelow, M.; Huber, S.
Konferenzbeitrag
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Konferenzbeitrag
2018Differential-Line Characterization Using Mixed-Port Scattering Parameters
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Konferenzbeitrag
2018Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options
Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Effects of Glob Top on mmWave Bond Wire Antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Konferenzbeitrag
2018Elektronisches Modul mit integrierter Antenne und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Elektronisches Modul und Verfahren zu seiner Herstellung
Böttcher, Lars; Kosmider, Stefan; Löher, Thomas; Ostmann, Andreas
Patent
2018Energy autarkic wireless sensor node for reliable long-term exposure to domestic waste water in a sewage system
Leverenz, E.; Becker, K.-F.; Koch, M.; Straube, S.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Vortrag
2018An Energy-efficient, Inexpensive, Spinal Cord Stimulator with Adaptive Voltage Compliance for Freely Moving Rats
Olafsdottir, Gudrun Erla; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Konferenzbeitrag
2018Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators
Herter, Jonas; Wunderlich, V.; Janeczka, C.; Zamora, V.
Zeitschriftenaufsatz
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2018First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Zeitschriftenaufsatz
2018Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain
Zeitschriftenaufsatz
2018Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
Meyer, J.; Upasani, P.J.; Bickel, S.; Panchenko, I.; Wolf, M.J.
Konferenzbeitrag
2018Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
 
Jahresbericht
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Konferenzbeitrag
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M
Konferenzbeitrag
2018High Density Interconnect Processes for Panel Level Packaging
Ostmann, A.; Schein, F.-L.; Dietterle, M.; Kunz, M.; Lang, K.-D.
Konferenzbeitrag
2018High temperature encapsulation for smart power devices
Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Höchste Datenraten mittels Glasinterposertechnologie
Neitz, Marcel; Wöhrmann, Markus; Schröder, Henning
Zeitschriftenaufsatz
2018Impact of multilayer stack-ups on bond wire antennas at millimetre-wave frequencies
Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D.
Konferenzbeitrag
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Konferenzbeitrag
2018In-situ characterization of thin polyimide films used for microelectronic packaging
Windrich, F.; Malanin, M.; Bittrich, E.; Schwarz, A.; Eichhorn, K.-J.; Voit, B.
Konferenzbeitrag
2018Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.
Zeitschriftenaufsatz
2018Influence of the electrode nano/microstructure on the electrochemical properties of graphite in aluminum batteries
Greco, G.; Tatchev, D.; Hoell, A.; Krumrey, M.; Raoux, S.; Hahn, R.; Elia, G.A.
Zeitschriftenaufsatz
2018Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M.
Konferenzbeitrag
2018Investigation of low temperature bonding process using indium bumps
Fritzsch, Thomas; Kavianpour, F.; Rothermund, Mario; Oppermann, Hermann; Ehrmann, Oswin; Lang, Klaus-Dieter
Zeitschriftenaufsatz, Konferenzbeitrag
2018Kombinationsantenne
Ndip, Ivan
Patent
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Konferenzbeitrag
2018Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O.
Zeitschriftenaufsatz
2018Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Konferenzbeitrag
2018Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.
Zeitschriftenaufsatz
2018Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, E.; Poppe, E.; Schjolberg-Henriksen, K.; Wöhrmann, M.; Moe, S.
Konferenzbeitrag
2018Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D.
Konferenzbeitrag
2018Millimeter-Wave Propagation within a Computer Chip Package
Timoneda, X.; Abadal, S.; Cabellos-Aparicio, A.; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.
Konferenzbeitrag
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Multi sensor node for long-term wireless measurement of density, pH value and temperature in silage for bio gas
Arnold, P.; Tschoban, C.; Heuer, K.; Rochlitzer, R.; Thuenen, T.; Lang, K.-D.
Konferenzbeitrag
2018Nanowires in electronics packaging
Fiedler, S.; Zwanzig, M.; Schmidt, R.; Scheel, W.
Aufsatz in Buch
2018Narrow linewidth micro-integrated high power diode laser module for deployment in space
Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.
Konferenzbeitrag
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Zeitschriftenaufsatz, Konferenzbeitrag
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2018Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate
Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.
Konferenzbeitrag
2018Optimized Thermoforming Process for Conformable Electronics
Kallmayer, C.; Schaller, F.; Löher, T.; Haberland, J.; Kayatz, F.; Schult, A.
Konferenzbeitrag
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Zeitschriftenaufsatz
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Konferenzbeitrag
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Realizing flexible bioelectronic medicines for accessing the peripheral nerves - technology considerations
Giagka, Vasiliki; Serdijn, Wouter A.
Zeitschriftenaufsatz
2018Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Roles and Requirements of Electronic Packaging in 5G
Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2018Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz, Konferenzbeitrag
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Simulation and Electrical Characterization of a Novel 2D-Printed Incontinence Sensor with Conductive Polymer PEDOT:PSS for Medical Applications
Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong
Konferenzbeitrag
2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix
Wunderle, B.; May, D.; Ras, M.A.; Grosse, C.; Wöhrmann, M.; Bader, V.; Keller, J.
Konferenzbeitrag
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2018Surface treatment of gold bumps for thermocompression bonding with low temperature
Fröhlich, Juliane; Dietrich, Lothar; Oppermann, Hermann; Lang, Klaus-Dieter
Konferenzbeitrag
2018A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.
Konferenzbeitrag
2018Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging
Grams, A.; Curran, B.; Kuttler, S.; Reyes, J.; Wüst, F.; Lang, K.-D.
Konferenzbeitrag
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Konferenzbeitrag
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Konferenzbeitrag
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2018An ultrasonically powered and controlled ultra-high-frequency biphasic electrical neurostimulator
Tacchetti, Lucia; Serdijn, Wouter A.; Giakga, Vasiliki
Konferenzbeitrag
2018Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Konferenzbeitrag
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Verfahren zur Herstellung eines Packages und Package
Böttcher, Mathias; Wolf, Jürgen
Patent
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Konferenzbeitrag
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2018Workshops der INFORMATIK 2018. Architekturen, Prozesse, Sicherheit und Nachhaltigkeit
: Czarnecki, Christian; Brockmann, Carsten; Sultanow, Eldar; Koschmider, Agnes; Selzer, Annika
Tagungsband
20170.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.
Konferenzbeitrag
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Konferenzbeitrag
2017Advanced packaging for future demands
Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S.
Konferenzbeitrag
2017Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.
Konferenzbeitrag
2017Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
2017Between the User and the Cloud: Assessing the Energy Footprint of the Access Network Devices
Nissen, Nils F.; Stobbe, Lutz; Richter, Nikolai; Zedel, Hannes; Lang, Klaus-Dieter
Konferenzbeitrag
2017Biosensor, Verfahren zu seiner Herstellung und Verfahren zum Nachweisen eines Analyten mit Hilfe des Biosensors
Fiedler, Markus; Grabbert, Niels; Lang, Klaus-Dieter; Meyer, Vera
Patent
2017Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.
Konferenzbeitrag
2017Circular added value: business model design in the circular economy
Hofmann, Florian; Marwede, Max; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2017Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Zeitschriftenaufsatz
2017Comprehensive AC performance analysis of ceramic capacitors for DC link usage
Klein, K.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Konferenzbeitrag
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2017Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Konferenzbeitrag
2017Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Konferenzbeitrag
2017Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J.
Zeitschriftenaufsatz
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Zeitschriftenaufsatz
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Konferenzbeitrag
2017Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Konferenzbeitrag
2017Electro-optical circuit boards with single- or multi-mode optical interconnects
Brusberg, L.; Immonen, M.; Lamprecht, T.
Aufsatz in Buch
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Konferenzbeitrag
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Konferenzbeitrag
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2017Fiber bundle probes for interconnecting miniaturized medical imaging devices
Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H.
Konferenzbeitrag
2017Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf
Vortrag
2017Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
 
Jahresbericht
2017Germanium "hexa" detector. Production and testing
Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Golfball, System und Verfahren zur Ortung eines Golfballs
Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd
Patent
2017How Modularity of Electronic Functions Can Lead to Longer Product Lifetimes
Nissen, Nils F.; Schischke, Karsten; Proske, Marina; Ballester, Miquel; Lang, Klaus-Dieter
Konferenzbeitrag
2017Impact of parasitic coupling on multiline TRL calibration
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W.
Konferenzbeitrag
2017Impact of process control on UBM/RDL contact resistance for next-generation fan-out devices
Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K.
Konferenzbeitrag
2017Implications of the Circular Economy for Electronic Products
Clemm, Christian; Nissen, Nils F.; Schischke, Karsten; Dimitrova, Gergana; Marwede, Max; Lang, Klaus-Dieter
Konferenzbeitrag
2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Konferenzbeitrag
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Konferenzbeitrag
2017Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2017Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.
Zeitschriftenaufsatz
2017An integrated versatile lab-on-a-chip platform for the isolation and nucleic acid-based detection of pathogens
Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk
Zeitschriftenaufsatz
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Konferenzbeitrag
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Aufsatz in Buch
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2017Investigation of Effect of Adding Hydrophobically Modified Water Soluble Polymers on the Structure and Viscosity of Anionic Vesicle Dispersion
Sandjaja, M.; Lestari, M.L.A.D.
Zeitschriftenaufsatz
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Zeitschriftenaufsatz
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Konferenzbeitrag
2017Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications
Sedlmair, J.; Mehlmann, B.; Olowinsky, A.
Konferenzbeitrag
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Konferenzbeitrag
2017Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine
Vortrag
2017Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Miniaturization of power converters by piezoelectric transformers - chances and challenges
Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia
Vortrag
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Vortrag
2017Nahfeldlokalisierung von Systemen in Produktionslinien - Hardware und Systemintegration
Fritzsch, Thomas; Gulden, Peter; Lipka, Melanie; Muharemovic, Nedim; Meinel, David; Vehring, Sönke; Böck, Georg; Kempf, Markus; Pavlovic, Boban; Schmückle, Fanz-Josef; Phung, Gia Ngoc; Huhn, Max
Konferenzbeitrag
2017Novel EDA Tools for system planning and 3D layout design of smart items
Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.
Konferenzbeitrag
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Konferenzbeitrag
2017Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Vortrag
2017Panel Level Packaging for Power Applications
Aschenbrenner, Rolf
Vortrag
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Konferenzbeitrag
2017Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.
Zeitschriftenaufsatz
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2017A programmable Si-photonic node for SDN-enabled bloom filter forwarding in disaggregated data centers
Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.
Konferenzbeitrag
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Zeitschriftenaufsatz
2017Prospecting Secondary Raw Materials in the Urban Mine and mining wastes (ProSUM)
Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah
Bericht
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Konferenzbeitrag
2017Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2017RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz
Iannacci, J.; Tschoban, C.
Zeitschriftenaufsatz
2017The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Konferenzbeitrag
2017Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study
Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K.
Konferenzbeitrag
2017SAFESENS - Smart Sensors for Fire Safety
O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Konferenzbeitrag
2017Shrinkage Measurements of UV‐Curable Adhesives
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Zeitschriftenaufsatz
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Sammler, Fiona; Nissen, Nils F.
Aufsatz in Buch
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Konferenzbeitrag
2017Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Konferenzbeitrag
2017Sustainable Solutions for Machine Tools
Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eduard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F.
Aufsatz in Buch
2017Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2017Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Zeitschriftenaufsatz
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2017What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina
Konferenzbeitrag
2017Zuverlässigkeitsauslegung eines piezoelektrischen Energy Harvesters
Wittler, Olaf; Hölck, Ole; Benecke, Stephan; Dobs, Tom; Dijk, Marius van; Keller, Jürgen; Schulz, Marcus; Bader, Volker; Braun, Tanja; Lang, Klaus-Dieter
Konferenzbeitrag