Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Zeitschriftenaufsatz
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Konferenzbeitrag
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
20185G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.
Konferenzbeitrag
2018Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub
Konferenzbeitrag
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Aufsatz in Buch
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.
Zeitschriftenaufsatz
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Konferenzbeitrag
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Konferenzbeitrag
2018Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.
Konferenzbeitrag
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2018Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.
Zeitschriftenaufsatz
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Konferenzbeitrag
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Konferenzbeitrag
2018Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options
Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Konferenzbeitrag
2018Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Vortrag
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Konferenzbeitrag
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2018First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Zeitschriftenaufsatz
2018Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain
Zeitschriftenaufsatz
2018Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
 
Jahresbericht
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Konferenzbeitrag
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Konferenzbeitrag
2018Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.
Zeitschriftenaufsatz
2018Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M.
Konferenzbeitrag
2018Kombinationsantenne
Ndip, Ivan
Patent
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Konferenzbeitrag
2018Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O.
Zeitschriftenaufsatz
2018Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Konferenzbeitrag
2018Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.
Zeitschriftenaufsatz
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Narrow linewidth micro-integrated high power diode laser module for deployment in space
Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.
Konferenzbeitrag
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Konferenzbeitrag, Zeitschriftenaufsatz
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2018Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate
Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.
Konferenzbeitrag
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Zeitschriftenaufsatz
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Konferenzbeitrag
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz, Konferenzbeitrag
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2018A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.
Konferenzbeitrag
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Konferenzbeitrag
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2018Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Konferenzbeitrag
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Konferenzbeitrag
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2018Workshops der INFORMATIK 2018. Architekturen, Prozesse, Sicherheit und Nachhaltigkeit
: Czarnecki, Christian; Brockmann, Carsten; Sultanow, Eldar; Koschmider, Agnes; Selzer, Annika
Tagungsband
20170.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.
Konferenzbeitrag
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Konferenzbeitrag
2017Advanced packaging for future demands
Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S.
Konferenzbeitrag
2017Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.
Konferenzbeitrag
2017Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
2017Biosensor, Verfahren zu seiner Herstellung und Verfahren zum Nachweisen eines Analyten mit Hilfe des Biosensors
Fiedler, Markus; Grabbert, Niels; Lang, Klaus-Dieter; Meyer, Vera
Patent
2017Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.
Konferenzbeitrag
2017Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Zeitschriftenaufsatz
2017Comprehensive AC performance analysis of ceramic capacitors for DC link usage
Klein, K.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Konferenzbeitrag
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2017Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Konferenzbeitrag
2017Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Konferenzbeitrag
2017Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J.
Zeitschriftenaufsatz
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Zeitschriftenaufsatz
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Konferenzbeitrag
2017Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Konferenzbeitrag
2017Electro-optical circuit boards with single- or multi-mode optical interconnects
Brusberg, L.; Immonen, M.; Lamprecht, T.
Aufsatz in Buch
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Konferenzbeitrag
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Konferenzbeitrag
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2017Fiber bundle probes for interconnecting miniaturized medical imaging devices
Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H.
Konferenzbeitrag
2017Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf
Vortrag
2017Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
 
Jahresbericht
2017Germanium "hexa" detector. Production and testing
Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Golfball, System und Verfahren zur Ortung eines Golfballs
Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd
Patent
2017Impact of parasitic coupling on multiline TRL calibration
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W.
Konferenzbeitrag
2017Impact of process control on UBM/RDL contact resistance for next-generation fan-out devices
Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K.
Konferenzbeitrag
2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Konferenzbeitrag
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Konferenzbeitrag
2017Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2017Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.
Zeitschriftenaufsatz
2017An integrated versatile lab-on-a-chip platform for the isolation and nucleic acid-based detection of pathogens
Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk
Zeitschriftenaufsatz
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Konferenzbeitrag
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Aufsatz in Buch
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2017Investigation of Effect of Adding Hydrophobically Modified Water Soluble Polymers on the Structure and Viscosity of Anionic Vesicle Dispersion
Sandjaja, M.; Lestari, M.L.A.D.
Zeitschriftenaufsatz
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Zeitschriftenaufsatz
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Konferenzbeitrag
2017Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications
Sedlmair, J.; Mehlmann, B.; Olowinsky, A.
Konferenzbeitrag
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Konferenzbeitrag
2017Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine
Vortrag
2017Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Miniaturization of power converters by piezoelectric transformers - chances and challenges
Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia
Vortrag
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Vortrag
2017Novel EDA Tools for system planning and 3D layout design of smart items
Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.
Konferenzbeitrag
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Konferenzbeitrag
2017Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Vortrag
2017Panel Level Packaging for Power Applications
Aschenbrenner, Rolf
Vortrag
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Konferenzbeitrag
2017Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.
Zeitschriftenaufsatz
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2017A programmable Si-photonic node for SDN-enabled bloom filter forwarding in disaggregated data centers
Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.
Konferenzbeitrag
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Zeitschriftenaufsatz
2017Prospecting Secondary Raw Materials in the Urban Mine and mining wastes (ProSUM)
Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah
Bericht
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Konferenzbeitrag
2017Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2017RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz
Iannacci, J.; Tschoban, C.
Zeitschriftenaufsatz
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Konferenzbeitrag
2017Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study
Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K.
Konferenzbeitrag
2017SAFESENS - Smart Sensors for Fire Safety
O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Konferenzbeitrag
2017Shrinkage Measurements of UV‐Curable Adhesives
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Zeitschriftenaufsatz
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Sammler, Fiona; Nissen, Nils F.
Aufsatz in Buch
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Konferenzbeitrag
2017Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Konferenzbeitrag
2017Sustainable Solutions for Machine Tools
Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eduard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F.
Aufsatz in Buch
2017Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2017Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Zeitschriftenaufsatz
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2017What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina
Konferenzbeitrag
20164.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Zeitschriftenaufsatz
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2016Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Konferenzbeitrag
2016Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2016Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.
Konferenzbeitrag
2016µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.
Bericht
2016Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2016All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Konferenzbeitrag
2016Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B.
Zeitschriftenaufsatz
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2016Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm
Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.
Konferenzbeitrag
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Konferenzbeitrag
2016Bonding technologies for 3D packaging with high I/O count - An evaluation report
Lohse, S.; Wollanke, A.
Konferenzbeitrag
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Konferenzbeitrag
2016Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf
Vortrag
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Konferenzbeitrag
2016Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
Konferenzbeitrag
2016Design of amorphous silicon photonic crystal-based M-Z modulator operating at 1.55 μm
Rao, S.; Casalino, M.; Coppola, G.; Kisacik, R.; Tekin, T.; Corte, F.G.D.
Konferenzbeitrag
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016Developing an indicator setup to measure life-cycle conditions of electronic products
Winzer, Janis; Wagner, Eduard; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Konferenzbeitrag
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Zeitschriftenaufsatz
2016Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.
Konferenzbeitrag
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Konferenzbeitrag
2016DSC investigation of the undercooling of SnAgCu solder alloys
Mueller, M.; Türke, A.; Panchenko, I.
Konferenzbeitrag
2016Durability and cycle frequency of smartphone and tablet lithium-ion batteries in the field
Clemm, C.; Sinai, C.; Ferkinghoff, C.; Dethlefs, N.; Nissen, N.F.; Lang, K.D.
Konferenzbeitrag
2016Effective method for filter design and semiconductor and inductors loss calculation
Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D.
Konferenzbeitrag
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Zeitschriftenaufsatz
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Konferenzbeitrag
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Konferenzbeitrag
2016Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.
Konferenzbeitrag
2016Energy efficiency of data centers - a system-oriented analysis of current development trends
Hintemann, R.; Beucker, S.; Clausen, J.; Stobbe, L.; Proske, M.; Nissen, N.F.
Konferenzbeitrag
2016Energy efficiency of ICT: Further improvement through customized products
Stobbe, L.; Proske, M.; Beucker, S.; Hintemann, R.; Lang, K.D.
Konferenzbeitrag
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Konferenzbeitrag
2016Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2016Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben
Dietrich, Manfred; Gulbins, Matthias; Haase, Joachim; Markwirth, Thomas; Warmuth, Jens Michael
Bericht
2016Evaluation of indicators supporting the sustainable design of electronic systems
Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Evaluation of pressure stable chip-to-tube fittings enabling high-speed chip-HPLC with mass spectrometric detection
Lotter, Carsten; Heiland, Josef J.; Stein, Volkmar; Klimkait, Michael; Queisser, Marco; Belder, Detlev
Zeitschriftenaufsatz
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, K.; Lang, K.-D.
Konferenzbeitrag
2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016Feasibility study for setting-up reference values to support the calculation of recyclability / recoverability rates of electr(on)ic products
Chancerel, Perrine; Marwede, Max
: Mathieux, Fabrice; Talens Peiró, Laura
Studie
2016Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Konferenzbeitrag
2016Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2015/2016
 
Jahresbericht
2016Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Konferenzbeitrag
2016Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016Highly reliable and cost effective thick film substrates for power LEDs
Gundel, P.; Persons, R.; Bawohl, M.; Challingsworth, M.; Czwickla, C.; Garcia, V.; Modes, C.; Nikolaidis, I.; Reitz, J.; Shahbazi, C.; Nowak, T.
Konferenzbeitrag
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Konferenzbeitrag
2016How will high-performance nonwovens transform your business?
Gwinnutt, J.; Cumming, S.; Prigneaux, J.; Stevenson, A.; Dils, C.; Granberg, H.; Slater, A.; Knorr, K.; Jolly, M.; Möbitz, C.; Lütke, C.; Hofmann, M.; Käppel, D.
Zeitschriftenaufsatz
2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2016In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications
Windrich, F.; Kappert, E.J.; Malanin, M.; Eichhorn, K.-J.; Häußler, L.; Benes, N.E.; Voit, B.
Zeitschriftenaufsatz
2016In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.
Konferenzbeitrag
2016Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Integration Technologies for Smart Textiles
Aschenbrenner, Rolf
Vortrag
2016Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.
Abstract
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Konferenzbeitrag
2016Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D.
Zeitschriftenaufsatz
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Konferenzbeitrag
2016Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Konferenzbeitrag
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Konferenzbeitrag
2016Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.
Zeitschriftenaufsatz
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.
Konferenzbeitrag
2016Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.
Konferenzbeitrag
2016Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process
Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J.
Konferenzbeitrag
2016Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.
Konferenzbeitrag
2016Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.
Konferenzbeitrag
2016Non-destructive mobile monitoring of microbial contaminations on meat surfaces using porphyrin fluorescence intensities
Durek, J.; Fröhling, A.; Bolling, J.; Thomasius, R.; Durek, P.; Schlüter, O.K.
Zeitschriftenaufsatz
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016Obsolescence of electronics - the example of smartphones
Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2016On-chip automation of cell-free protein synthesis
Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan
Zeitschriftenaufsatz
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2016Optical static RAM cell using a monolithically integrated InP Flip-Flop and wavelength-encoded signals
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Konferenzbeitrag
2016An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.
Zeitschriftenaufsatz
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Konferenzbeitrag
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Konferenzbeitrag
2016Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Vortrag
2016Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K.
Konferenzbeitrag
2016Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.
Konferenzbeitrag
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Konferenzbeitrag
2016Potential applications of electron emission membranes in medicine
Bilevych, Y.; Brunner, S.E.; Chan, H.W.; Charbon, E.; Graaf, H. van der; Hagen, C.W.; Nutzel, G.; Pinto, S.D.; Prodanovic, V.; Rotmanc, D.; Santagata, F.; Sarro, L.; Schaart, D.R.; Sinsheimer, J.; Smedley, J.; Tao, S.X.; Theulings, A.M.M.G.
Zeitschriftenaufsatz
2016Rapid scan in-situ FT-IR curing studies of low-temperature cure thin film polymer dielectrics in solid state
Windrich, F.; Malanin, M.; Eichhorn, K.J.; Voit, B.
Konferenzbeitrag
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Zeitschriftenaufsatz
2016Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D.
Zeitschriftenaufsatz
2016A review of green electronics research trends
Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D.
Konferenzbeitrag
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2016RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Zeitschriftenaufsatz
2016RF-MEMS technology for future mobile and high-frequency applications: Reconfigurable 8-Bit power attenuator tested up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Zeitschriftenaufsatz
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Zeitschriftenaufsatz
2016Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M.
Zeitschriftenaufsatz
2016Sensitive brace recognises the right angle
Krshiwoblozki, Malte von; Pawlikowski, Jakub
Zeitschriftenaufsatz
2016Simulation based analysis of LED package reliability regarding encapsulant related failures
Watzke, Stefan
Dissertation
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2016SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.
Konferenzbeitrag
2016Single mode optical interconnects for future data centers
Vyrsokinos, K.; Moralis-Pegios, M.; Vagionas, C.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rohracher, K.; Dorrestein, S.; Bogdan, M.; Pleros, N.
Konferenzbeitrag
2016Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.
Konferenzbeitrag
2016Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D.
Konferenzbeitrag
2016Stocks and flows of critical materials in batteries: Data collection and data uses
Chancerel, Perrine; Maehlitz, Paul; Chanson, Claude; Binnemans, Peter; Huisman, Jaco; Guzman Brechu, Michelle; Rotter, Vera Susanne; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Konferenzbeitrag
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D.
Konferenzbeitrag
2016Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge
Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L.
Konferenzbeitrag
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Konferenzbeitrag
2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert
Patent
2016Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
Brusberg, Lars; Schröder, Henning
Patent
2016Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Zeitschriftenaufsatz
2016Wafer level chip scale packaging
Töpper, M.
Aufsatz in Buch
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2016WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
Pitris, S.; Vagionas, C.; Tekin, T.; Broeke, R.; Kanellos, G.T.; Pleros, N.
Zeitschriftenaufsatz
2016Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina
Studie
2016Would the setting-up of reference values to support the calculation of recyclability rates help improving the material efficiency of electronic products?
Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura
Konferenzbeitrag
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.
Zeitschriftenaufsatz