Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
20185G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.
Konferenzbeitrag
2018Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub
Konferenzbeitrag
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Aufsatz in Buch
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.
Zeitschriftenaufsatz
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Konferenzbeitrag
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Konferenzbeitrag
2018Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.
Konferenzbeitrag
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2018Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.
Zeitschriftenaufsatz
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Konferenzbeitrag
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Konferenzbeitrag
2018Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options
Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Konferenzbeitrag
2018Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Vortrag
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Konferenzbeitrag
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2018First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Zeitschriftenaufsatz
2018Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain
Zeitschriftenaufsatz
2018Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
 
Jahresbericht
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Konferenzbeitrag
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Konferenzbeitrag
2018Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.
Zeitschriftenaufsatz
2018Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M.
Konferenzbeitrag
2018Kombinationsantenne
Ndip, Ivan
Patent
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Konferenzbeitrag
2018Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O.
Zeitschriftenaufsatz
2018Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Konferenzbeitrag
2018Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.
Zeitschriftenaufsatz
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Narrow linewidth micro-integrated high power diode laser module for deployment in space
Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.
Konferenzbeitrag
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Konferenzbeitrag, Zeitschriftenaufsatz
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2018Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate
Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.
Konferenzbeitrag
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Zeitschriftenaufsatz
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Konferenzbeitrag
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz, Konferenzbeitrag
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2018A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.
Konferenzbeitrag
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Konferenzbeitrag
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2018Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Konferenzbeitrag
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Konferenzbeitrag
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2018Workshops der INFORMATIK 2018. Architekturen, Prozesse, Sicherheit und Nachhaltigkeit
: Czarnecki, Christian; Brockmann, Carsten; Sultanow, Eldar; Koschmider, Agnes; Selzer, Annika
Tagungsband
20170.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.
Konferenzbeitrag
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Konferenzbeitrag
2017Advanced packaging for future demands
Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S.
Konferenzbeitrag
2017Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.
Konferenzbeitrag
2017Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
2017Biosensor, Verfahren zu seiner Herstellung und Verfahren zum Nachweisen eines Analyten mit Hilfe des Biosensors
Fiedler, Markus; Grabbert, Niels; Lang, Klaus-Dieter; Meyer, Vera
Patent
2017Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.
Konferenzbeitrag
2017Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Zeitschriftenaufsatz
2017Comprehensive AC performance analysis of ceramic capacitors for DC link usage
Klein, K.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Konferenzbeitrag
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2017Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Konferenzbeitrag
2017Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Konferenzbeitrag
2017Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J.
Zeitschriftenaufsatz
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Zeitschriftenaufsatz
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Konferenzbeitrag
2017Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Konferenzbeitrag
2017Electro-optical circuit boards with single- or multi-mode optical interconnects
Brusberg, L.; Immonen, M.; Lamprecht, T.
Aufsatz in Buch
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Konferenzbeitrag
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.
Konferenzbeitrag
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2017Fiber bundle probes for interconnecting miniaturized medical imaging devices
Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H.
Konferenzbeitrag
2017Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf
Vortrag
2017Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
 
Jahresbericht
2017Germanium "hexa" detector. Production and testing
Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Golfball, System und Verfahren zur Ortung eines Golfballs
Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd
Patent
2017Impact of parasitic coupling on multiline TRL calibration
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W.
Konferenzbeitrag
2017Impact of process control on UBM/RDL contact resistance for next-generation fan-out devices
Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K.
Konferenzbeitrag
2017Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Konferenzbeitrag
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Konferenzbeitrag
2017Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2017Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.
Zeitschriftenaufsatz
2017An integrated versatile lab-on-a-chip platform for the isolation and nucleic acid-based detection of pathogens
Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk
Zeitschriftenaufsatz
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Konferenzbeitrag
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Aufsatz in Buch
2017Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2017Investigation of Effect of Adding Hydrophobically Modified Water Soluble Polymers on the Structure and Viscosity of Anionic Vesicle Dispersion
Sandjaja, M.; Lestari, M.L.A.D.
Zeitschriftenaufsatz
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Zeitschriftenaufsatz
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Konferenzbeitrag
2017Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications
Sedlmair, J.; Mehlmann, B.; Olowinsky, A.
Konferenzbeitrag
2017Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Konferenzbeitrag
2017Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine
Vortrag
2017Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Konferenzbeitrag
2017Miniaturization of power converters by piezoelectric transformers - chances and challenges
Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia
Vortrag
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Vortrag
2017Novel EDA Tools for system planning and 3D layout design of smart items
Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.
Konferenzbeitrag
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Konferenzbeitrag
2017Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Vortrag
2017Panel Level Packaging for Power Applications
Aschenbrenner, Rolf
Vortrag
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Konferenzbeitrag
2017Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.
Zeitschriftenaufsatz
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2017A programmable Si-photonic node for SDN-enabled bloom filter forwarding in disaggregated data centers
Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.
Konferenzbeitrag
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Zeitschriftenaufsatz
2017Prospecting Secondary Raw Materials in the Urban Mine and mining wastes (ProSUM)
Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah
Bericht
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Konferenzbeitrag
2017Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2017RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz
Iannacci, J.; Tschoban, C.
Zeitschriftenaufsatz
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Konferenzbeitrag
2017Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study
Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K.
Konferenzbeitrag
2017SAFESENS - Smart Sensors for Fire Safety
O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Konferenzbeitrag
2017Shrinkage Measurements of UV‐Curable Adhesives
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Zeitschriftenaufsatz
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Sammler, Fiona; Nissen, Nils F.
Aufsatz in Buch
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Konferenzbeitrag
2017Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Konferenzbeitrag
2017Sustainable Solutions for Machine Tools
Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eudard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F.
Aufsatz in Buch
2017Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2017Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Zeitschriftenaufsatz
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2017What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina
Konferenzbeitrag
20164.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Zeitschriftenaufsatz
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2016Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Konferenzbeitrag
2016Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2016Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.
Konferenzbeitrag
2016µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.
Bericht
2016Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2016All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Konferenzbeitrag
2016Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B.
Zeitschriftenaufsatz
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2016Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm
Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.
Konferenzbeitrag
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Konferenzbeitrag
2016Bonding technologies for 3D packaging with high I/O count - An evaluation report
Lohse, S.; Wollanke, A.
Konferenzbeitrag
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Konferenzbeitrag
2016Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf
Vortrag
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Konferenzbeitrag
2016Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
Konferenzbeitrag
2016Design of amorphous silicon photonic crystal-based M-Z modulator operating at 1.55 μm
Rao, S.; Casalino, M.; Coppola, G.; Kisacik, R.; Tekin, T.; Corte, F.G.D.
Konferenzbeitrag
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016Developing an indicator setup to measure life-cycle conditions of electronic products
Winzer, Janis; Wagner, Eduard; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Konferenzbeitrag
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Zeitschriftenaufsatz
2016Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.
Konferenzbeitrag
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Konferenzbeitrag
2016DSC investigation of the undercooling of SnAgCu solder alloys
Mueller, M.; Türke, A.; Panchenko, I.
Konferenzbeitrag
2016Durability and cycle frequency of smartphone and tablet lithium-ion batteries in the field
Clemm, C.; Sinai, C.; Ferkinghoff, C.; Dethlefs, N.; Nissen, N.F.; Lang, K.D.
Konferenzbeitrag
2016Effective method for filter design and semiconductor and inductors loss calculation
Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D.
Konferenzbeitrag
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Zeitschriftenaufsatz
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Konferenzbeitrag
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Konferenzbeitrag
2016Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.
Konferenzbeitrag
2016Energy efficiency of data centers - a system-oriented analysis of current development trends
Hintemann, R.; Beucker, S.; Clausen, J.; Stobbe, L.; Proske, M.; Nissen, N.F.
Konferenzbeitrag
2016Energy efficiency of ICT: Further improvement through customized products
Stobbe, L.; Proske, M.; Beucker, S.; Hintemann, R.; Lang, K.D.
Konferenzbeitrag
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Konferenzbeitrag
2016Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2016Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben
Dietrich, Manfred; Gulbins, Matthias; Haase, Joachim; Markwirth, Thomas; Warmuth, Jens Michael
Bericht
2016Evaluation of indicators supporting the sustainable design of electronic systems
Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Evaluation of pressure stable chip-to-tube fittings enabling high-speed chip-HPLC with mass spectrometric detection
Lotter, Carsten; Heiland, Josef J.; Stein, Volkmar; Klimkait, Michael; Queisser, Marco; Belder, Detlev
Zeitschriftenaufsatz
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, K.; Lang, K.-D.
Konferenzbeitrag
2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016Feasibility study for setting-up reference values to support the calculation of recyclability / recoverability rates of electr(on)ic products
Chancerel, Perrine; Marwede, Max
: Mathieux, Fabrice; Talens Peiró, Laura
Studie
2016Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Konferenzbeitrag
2016Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2015/2016
 
Jahresbericht
2016Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Konferenzbeitrag
2016Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016Highly reliable and cost effective thick film substrates for power LEDs
Gundel, P.; Persons, R.; Bawohl, M.; Challingsworth, M.; Czwickla, C.; Garcia, V.; Modes, C.; Nikolaidis, I.; Reitz, J.; Shahbazi, C.; Nowak, T.
Konferenzbeitrag
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Konferenzbeitrag
2016How will high-performance nonwovens transform your business?
Gwinnutt, J.; Cumming, S.; Prigneaux, J.; Stevenson, A.; Dils, C.; Granberg, H.; Slater, A.; Knorr, K.; Jolly, M.; Möbitz, C.; Lütke, C.; Hofmann, M.; Käppel, D.
Zeitschriftenaufsatz
2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2016In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications
Windrich, F.; Kappert, E.J.; Malanin, M.; Eichhorn, K.-J.; Häußler, L.; Benes, N.E.; Voit, B.
Zeitschriftenaufsatz
2016In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.
Konferenzbeitrag
2016Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Integration Technologies for Smart Textiles
Aschenbrenner, Rolf
Vortrag
2016Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.
Abstract
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Konferenzbeitrag
2016Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D.
Zeitschriftenaufsatz
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Konferenzbeitrag
2016Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Konferenzbeitrag
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Konferenzbeitrag
2016Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.
Zeitschriftenaufsatz
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.
Konferenzbeitrag
2016Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.
Konferenzbeitrag
2016Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process
Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J.
Konferenzbeitrag
2016Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.
Konferenzbeitrag
2016Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.
Konferenzbeitrag
2016Non-destructive mobile monitoring of microbial contaminations on meat surfaces using porphyrin fluorescence intensities
Durek, J.; Fröhling, A.; Bolling, J.; Thomasius, R.; Durek, P.; Schlüter, O.K.
Zeitschriftenaufsatz
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016Obsolescence of electronics - the example of smartphones
Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2016On-chip automation of cell-free protein synthesis
Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan
Zeitschriftenaufsatz
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2016Optical static RAM cell using a monolithically integrated InP Flip-Flop and wavelength-encoded signals
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Konferenzbeitrag
2016An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.
Zeitschriftenaufsatz
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Konferenzbeitrag
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Konferenzbeitrag
2016Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Vortrag
2016Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K.
Konferenzbeitrag
2016Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.
Konferenzbeitrag
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Konferenzbeitrag
2016Potential applications of electron emission membranes in medicine
Bilevych, Y.; Brunner, S.E.; Chan, H.W.; Charbon, E.; Graaf, H. van der; Hagen, C.W.; Nutzel, G.; Pinto, S.D.; Prodanovic, V.; Rotmanc, D.; Santagata, F.; Sarro, L.; Schaart, D.R.; Sinsheimer, J.; Smedley, J.; Tao, S.X.; Theulings, A.M.M.G.
Zeitschriftenaufsatz
2016Rapid scan in-situ FT-IR curing studies of low-temperature cure thin film polymer dielectrics in solid state
Windrich, F.; Malanin, M.; Eichhorn, K.J.; Voit, B.
Konferenzbeitrag
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Zeitschriftenaufsatz
2016Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D.
Zeitschriftenaufsatz
2016A review of green electronics research trends
Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D.
Konferenzbeitrag
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2016RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Zeitschriftenaufsatz
2016RF-MEMS technology for future mobile and high-frequency applications: Reconfigurable 8-Bit power attenuator tested up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Zeitschriftenaufsatz
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Zeitschriftenaufsatz
2016Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M.
Zeitschriftenaufsatz
2016Sensitive brace recognises the right angle
Krshiwoblozki, Malte von; Pawlikowski, Jakub
Zeitschriftenaufsatz
2016Simulation based analysis of LED package reliability regarding encapsulant related failures
Watzke, Stefan
Dissertation
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2016SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.
Konferenzbeitrag
2016Single mode optical interconnects for future data centers
Vyrsokinos, K.; Moralis-Pegios, M.; Vagionas, C.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rohracher, K.; Dorrestein, S.; Bogdan, M.; Pleros, N.
Konferenzbeitrag
2016Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.
Konferenzbeitrag
2016Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D.
Konferenzbeitrag
2016Stocks and flows of critical materials in batteries: Data collection and data uses
Chancerel, Perrine; Maehlitz, Paul; Chanson, Claude; Binnemans, Peter; Huisman, Jaco; Guzman Brechu, Michelle; Rotter, Vera Susanne; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Konferenzbeitrag
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D.
Konferenzbeitrag
2016Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge
Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L.
Konferenzbeitrag
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Konferenzbeitrag
2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert
Patent
2016Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
Brusberg, Lars; Schröder, Henning
Patent
2016Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Zeitschriftenaufsatz
2016Wafer level chip scale packaging
Töpper, M.
Aufsatz in Buch
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2016WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
Pitris, S.; Vagionas, C.; Tekin, T.; Broeke, R.; Kanellos, G.T.; Pleros, N.
Zeitschriftenaufsatz
2016Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina
Studie
2016Would the setting-up of reference values to support the calculation of recyclability rates help improving the material efficiency of electronic products?
Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura
Konferenzbeitrag
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.
Zeitschriftenaufsatz
2015An accurate back to front design methodology for PT based load resonant converters
Yang, Yujia; Radecker, M.; Lang, K.-D.; Fischer, W.-J.
Konferenzbeitrag
2015Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.
Konferenzbeitrag
2015Active power cycling results using copper tin TLPB joints as new die-attach technology
Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter
Konferenzbeitrag
2015Addressing sustainability and flexibility in manufacturing via smart modular machine tool frames to support sustainable value creation
Peukert, B.; Benecke, S.; Clavell, J.; Neugebauer, S.; Nissen, N.F.; Uhlmann, E.; Lang, K.-D.; Finkbeiner, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Advanced approach of calculating wire bond pull test correction factors
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.
Aufsatz in Buch
2015Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.
Zeitschriftenaufsatz
2015Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2015 Hochstromkontakte für Smart-Power Mechanics
Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D.
Zeitschriftenaufsatz
2015Anordnung aus einem Substrat mit mindestens einem optischen Wellenleiter und einer optischen Koppelstelle und aus einem optoelektronischen Bauelement und Verfahren zur Herstellung einer solchen Anordnung
Oppermann, Hermann
Patent
2015Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus
Konferenzbeitrag
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2015Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production
Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2015Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B.
Konferenzbeitrag
2015Challenges of TSV backside process integration
Rudolph, C.; Wachsmuth, H.; Boettcher, M.; Steller, W.; Wolf, M.J.
Konferenzbeitrag
2015Characteristics and aging of PCB embedded power electronics
Randoll, R.; Asef, M.; Wondrak, W.; Böttcher, L.; Schletz, A.
Zeitschriftenaufsatz, Konferenzbeitrag
2015A compact W-band LFMCW radar module with high accuracy and integrated signal processing
Zech, C.; Hülsmann, A.; Schlechtweg, M.; Reinold, Steffen; Giers, Christof; Kleiner, Bernhard; Georgi, L.; Kahle, R.; Becker, K.-F.; Ambacher, O.
Konferenzbeitrag
2015Comparative study of organic, inorganic and hybrid gate-dielectrics for organic field-effect transistors using semiconducting liquid-crystal polymers
Tetzner, Kornelius
Dissertation
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2015Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling
Weber, Constanze; Hutter, Matthias; Schmitz, Stefan; Lang, Klaus-Dieter
Konferenzbeitrag
2015Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D.
Konferenzbeitrag
2015Design, setup and test of a heterogeneous module and characterization by stress measurement
Schreier-Alt, T.; Reitlinger, C.; Kaul, F.; Metzger, T.; Revenberg, K.
Konferenzbeitrag
2015Development of a microcamera with embedded image processor using panel level packaging
Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D.
Konferenzbeitrag
2015Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.
Konferenzbeitrag
2015Development of solder paste jetting processes for advanced packaging
Thomas, Tina; Voges, Steve; Fliess, M.; Becker, Karl-Friedrich; Reiners, Philipp; Koch, Mathias; Bauer, Jörg; Braun, Tanja; Lang, Klaus-Dieter
Konferenzbeitrag
2015Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2015Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers
Brusberg, L.; Whalley, S.; Herbst, C.; Schröder, H.
Zeitschriftenaufsatz
2015Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Zeitschriftenaufsatz
2015Electrical buffer storage for energy harvesting
Hahn, R.; Möller, K.-C.
Aufsatz in Buch
2015Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.
Konferenzbeitrag
2015Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.
Konferenzbeitrag
2015Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2015Embedded very fast switching module for SiC power MOSFETs
Feix, G.; Hoene, E.; Zeiter, O.; Pedersen, K.
Konferenzbeitrag
2015Energy saving potential of information and communication technology
Schlomann, Barbara; Eichhammer, Wolfgang; Stobbe, Lutz
Zeitschriftenaufsatz
2015Entwicklung des IKT-bedingten Strombedarfs in Deutschland
Stobbe, Lutz; Proske, Marina; Zedel, Hannes; Hintemann, Ralph; Clausen, Jens; Beucker, Severin
Bericht
2015Estimating the quantities of critical metals embedded in ICT and consumer equipment
Chancerel, P.; Marwede, M.; Nissen, N.F.; Lang, K.D.
Zeitschriftenaufsatz
2015Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages
Kaya, Burcu; Kaiser, Jan-Martin; Becker, Karl-Friedrich; Braun, Tanja; Lang, Klaus-Dieter
Konferenzbeitrag
2015Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30 deg C up to + 180 deg C
Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D.
Konferenzbeitrag
2015Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2014/2015
 
Jahresbericht
2015From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter
Konferenzbeitrag
2015A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2015Glass-based Manufacturing and Prototyping Platform PhotPack
Böttger, G.; Seifert, S.; Schröder, H.
Zeitschriftenaufsatz
2015Grenzen und Möglichkeiten der Weichlotverbindungen - Betrachtungen von Qualität und Zuverlässigkeit
Hutter, M.; Ehrhardt, C.
Konferenzbeitrag
2015Heterogeneous integration of a miniaturized W-band radar module
Becker, Karl-Friedrich; Georgi, L.; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S.; Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag, Zeitschriftenaufsatz
2015High frequency impedance of Li-ion batteries
Doersam, T.; Schoerle, S.; Spieker, C.; Waldmann, T.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2015High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects
Brusberg, L.; Schröder, H.; Herbst, C.; Frey, C.; Fiebig, C.; Zakharian, A.; Kuchinsky, S.; Liu, X.; Fortusini, D.; Evans, A.
Konferenzbeitrag
2015HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D.
Konferenzbeitrag
2015Hochauflösende Magnetfeld-Positionssensoren
Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K.
Konferenzbeitrag
2015Identification of microplastics by FTIR and Raman microscopy: A novel silicon filter substrate opens the important spectral range below 1300 cm−1 for FTIR transmission measurements
Käppler, A.; Windrich, F.; Löder, M.G.J.; Malanin, M.; Fischer, D.; Labrenz, M.; Eichhorn, K.-J.; Voit, B.
Zeitschriftenaufsatz
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2015Intelligente Steckverbinder und Anschlusstechnologien für die Produktion der Zukunft
Michels, J.S.; Mödinger, R.; Meier, O.; Baar, C.; Ansorge, F.; Schiefelbein, F.-P.
Konferenzbeitrag
2015Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong
Konferenzbeitrag
2015Investigation of room-temperature flip chip connections
Brink, M.; Grams, A.; Eichhammer, Y.; Broll, M.; Fritzsch, T.; Lang, K.-D.
Konferenzbeitrag
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2015Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag
2015Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O.
Konferenzbeitrag
2015Laser melting of metal powders using Nd:yag and compact diode laser for micro particle deposition
Azhdast, M.H.; Lux, O.; Fritsche, H.; Eichler, H.J.; Azdasht, G.; Lüdeke, H.; Glaw, V.; Lang, K.-D.
Konferenzbeitrag
2015Low profile LED off-line phase-cut dimming ballast with piezoelectric transformer
Le, L.; Yang, Y.; Radecker, M.
Konferenzbeitrag
2015μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Konferenzbeitrag
2015Messvorrichtung und Fluidikvorrichtung zum Messen einer Menge einer zu untersuchenden Substanz
Jung, Erik; Georgi, Leopold; Kubick, Stefan
Patent
2015Methodology guidance - energy profiles and carbon footprint data for passive components and connectors
Schischke, Karsten; Proske, Marina; Schulz, Gerd; Husemann, Jürgen; Trenner, Torger; Sonnenberg, Thea; Huck, Walter; Kelm, Klaus; Tempel, Norbert; Wunderlich, Peter; Dietrich, Marcus
Bericht
2015Microelectronic Packaging in the 21st Century
: Aschenbrenner, Rolf; Schneider-Ramelow, Martin
Buch
2015Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D.
Zeitschriftenaufsatz
2015Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Zeitschriftenaufsatz
2015Mikrobatterie und Verfahren zum Herstellen einer Mikrobatterie
Hahn, Robert
Patent
2015Modeling method of stray magnetic couplings in an EMC filter for power electronic devices
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D.
Zeitschriftenaufsatz
2015Monolithically integrated all-optical SOA-based SR Flip-Flop on InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Pleros, N.; Kisacik, R.; Tekin, T.; Broeke, R.
Konferenzbeitrag
2015Nano particle production by laser ablation and metal sputtering on Si-wafer substrate
Azhdast, M.H.; Azdasht, G.; Lüdeke, H.; Lang, K.-D.; Glaw, V.
Konferenzbeitrag
2015Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Zeitschriftenaufsatz
2015Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, M.; Fischer, T.; Walter, H.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2015A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J.
Konferenzbeitrag
2015Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.
Zeitschriftenaufsatz
2015Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2015Photonic millimeter wave transmitter for a real-time coherent wireless link based on injection locking of integrated laser diodes
Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T.
Zeitschriftenaufsatz
2015PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres
Hakansson, A.; Tekin, T.; Brusberg, L.; Pleros, N.; Vyrsokinos, C.; Apostolopoulos, D.; Pitwon, R.; Miller, A.; Wang, Kai; Tulli, D.; Dorrestein, S.; Smink, R.; Tuin, J.; Rijnbach, M. van; Duis, J.
Konferenzbeitrag
2015Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong
Konferenzbeitrag
2015Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.
Zeitschriftenaufsatz
2015Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T.
Konferenzbeitrag
2015Recess photomask contact lithography and the fabrication of coupled silicon photonic and plasmonic waveguide switches
Markey, L.; Zacharatos, F.; Weeber, J.-C.; Prinzen, A.; Waldow, M.; Nielsen, M.G.; Tekin, T.; Dereux, A.
Zeitschriftenaufsatz
2015Reducing inductor size in high frequency grid feeding inverters
Hoffmann, S.; Hoene, E.; Zeiter, O.; Lang, K.-D.; Feix, G.
Konferenzbeitrag
2015Sea water magnesium fuel cell power supply
Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D.
Zeitschriftenaufsatz
2015Silicon photonics packaging on board-level
Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.
Konferenzbeitrag
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Konferenzbeitrag
2015Small fuel cell system with cartridges for controlled hydrogen generation
Hahn, R.; Gabler, A.; Thoma, A.; Glaw, F.; Lang, K.D.
Zeitschriftenaufsatz
2015Smart Power Mechanics – Elektrische Anschlusstechnologien für Morgen
Schreier-Alt, T.; Ansorge, F.; Baar, C.; Radtke, H.; Amende, T.
Konferenzbeitrag
2015Structure investigation of soil aggregates treated with different organic matter using X-ray micro tomography
Nakano, K.; Herppich, W.B.; Kardjilov, N.; Manke, I.; Hilger, A.; Dawson, M.; Masuda, K.; Hara, Y.; Matsushima, U.
Zeitschriftenaufsatz
2015Structuring zeolite bodies for enhanced heat-transfer properties
Borchardt, L.; Michels, N.L.; Nowak, T.; Mitchell, S.; Perez-Ramírez, J.
Zeitschriftenaufsatz
2015A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.
Konferenzbeitrag
2015System und Verfahren zur bedarfsgerechten Zuführung von Beleuchtungsenergie an Pflanzen
Jordan, Rafael
Patent
2015Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding
Zoschke, K.; Lang, K.-D.
Konferenzbeitrag
2015Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D.
Konferenzbeitrag
2015Thin glass based electro-optical circuit board (EOCB): Waveguide process, PCB technology, and coupling interfaces
Schröder, H.; Brusberg, L.
Konferenzbeitrag
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.
Konferenzbeitrag
2015Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X.
Zeitschriftenaufsatz
2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2015Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.
Konferenzbeitrag
2015Ultra-Thin high density capacitors for advanced packaging solutions
Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W.
Konferenzbeitrag
2015Use of amorphous silicon for the design of a photonic crystal based MZ modulator at 1.55µm
Rao, S.; Kisacik, R.; Tekin, T.; Casalino, M.; Coppola, G.; Della Corte, F.G.
Konferenzbeitrag
2015Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.
Aufsatz in Buch
2015Verfahren und Messanordnung zum Überprüfen eines leitfähigen Körpers
Krüger, Michael; Trampert, Stefan
Patent
2015Verfahren zum Bestimmen einer Bondverbindung in einer Bauteilanordnung und Prüfvorrichtung
Middendorf, Andreas; Nowak, Torsten; Janzen, Sergei
Patent
2015W-band coherent wireless link using injection-locked laser diodes
Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T.
Zeitschriftenaufsatz
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Konferenzbeitrag
2014A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
201424"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
20143D IC/stacked device fault isolation using 3D magnetic field imaging
Orozco, A.; Gagliolo, N.E.; Rowlett, C.; Wong, E.; Moghe, A.; Gaudestad, J.; Talanov, V.; Jeffers, A.; Torkashvan, K.; Wellstood, F.C.; Dobritz, S.; Boettcher, M.; Cawthorne, A.B.; Infante, F.
Konferenzbeitrag
20143D integration: Status and requirements
Wolf, M. Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
20143D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried
Vortrag
2014A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance
Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A.
Konferenzbeitrag
2014Accelerating data centre performance. Interview
Tekin, T.; Pleros, N.
Zeitschriftenaufsatz
2014Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Advanced packaging methods for high-power LED modules
Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M.
Konferenzbeitrag
2014Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D.
Konferenzbeitrag
2014Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2014Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Zeitschriftenaufsatz
2014Ansätze zur stofflichen Verwertung von Tablets aus Sicht des Produktdesigns
Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Dimitrova, Gergana; Genz, Paul; Lang, Klaus-Dieter
Aufsatz in Buch
2014Array fiber welding on micro optical glass substrates for chip-to-fiber coupling
Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D.
Konferenzbeitrag
2014Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Automotive high voltage grid simulation. Modelling and simulation high voltage car grids from system prospective
Schörle, S.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Konferenzbeitrag
2014Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Challenges in 3D die stacking
Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D.
Konferenzbeitrag
2014Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, M.; Fischer, T.; Walter, H.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2014Cloud computing based systems for healthcare
Stantchev, V.; Colomo-Palacios, R.; Niedermayer, M.
Zeitschriftenaufsatz
2014CMOS biosensor using TSV interposer technology
Ebefors, T.; Fredlund, J.; Jung, E.; Braun, T.
Zeitschriftenaufsatz
2014CO2-laser drilling of TGVs for glass interposer applications
Brusberg, L.; Queisser, M.; Neitz, M.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2014Combined Loads and Mechanisms
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter
Vortrag
2014Commercialization and application-driven economic viability of sensor technology
Niedermayer, M.
Aufsatz in Buch
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Konferenzbeitrag
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Konferenzbeitrag
2014Design and simulation of an equiangular spiral antenna for extremely high-frequencies
Sirbu, B.; Tekin, T.; Pouhe, D.
Konferenzbeitrag
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Konferenzbeitrag
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Konferenzbeitrag
2014Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer
Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D.
Konferenzbeitrag
2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Disassembly analysis of slates: Design for repair and recycling evaluation. Final report
Schischke, Karsten; Stobbe, Lutz; Dimitrova, Gergana; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.
Bericht
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Konferenzbeitrag
2014Drahtlose Tiefendiagnose
Niedermayer, M.; Hoherz, C.; Reinhardt, D.; Scholtz, H.; Benecke, S.; Middendorf, A.
Zeitschriftenaufsatz
2014Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects
Krüger, Michael; Trampert, Stefan; Middendorf, Andreas; Schmitz, Stefan; Lang, Klaus-Dieter
Konferenzbeitrag
2014Ecodesign Requirements for servers - from single product groups to extended system approach
Nissen, Nils F.; Stobbe, Lutz; Faninger, Thibault; Berwald, Anton; Lang, Klaus-Dieter
Konferenzbeitrag
2014Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D.
Konferenzbeitrag
2014Electromagnetic robustness validation for gate drivers
Junk, S.; Hoene, E.
Konferenzbeitrag
2014Embedding of power semiconductors for innovative packages and modules
Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Konferenzbeitrag
2014Establishing ecoreliability of electronic devices in manufacturing environments
Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag, Zeitschriftenaufsatz
2014Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
Konferenzbeitrag
2014Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application
Brusberg, L.; Neitz, M.; Schröder, H.; Fricke-Begemann, T.; Ihlemann, J.
Konferenzbeitrag
2014Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O.
Konferenzbeitrag
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Konferenzbeitrag
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Konferenzbeitrag
2014Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2013/2014
 
Jahresbericht
2014German Technology Research Program „IT2Green“
Nissen, Nils; Stobbe, Lutz; Lang, Klaus-Dieter
Vortrag
2014A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels
Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M.O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.
Zeitschriftenaufsatz
2014Große H2-Zelle mit innenliegenden Kathoden in Form von Taschen
Hahn, Robert; Krebs, Martin; Schmalz, Michael
Patent
2014Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process Control
Middendorf, Andreas; Lang, Klaus-Dieter
Konferenzbeitrag
2014High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Zeitschriftenaufsatz
2014Highly ionized sputter deposition into through silicon vias with aspect ratios up to 15:1
Viehweger, Kay; Weichart, J.; Elghazzali, M.; Reynolds, G.J.; Wolf, M.J.; Lang, K.-D.; Koller, A.; Dill, A.
Konferenzbeitrag
2014Highly sensitive integrated optical biosensors
Zamora, V.; Lützow, P.; Weiland, M.; Pergande, D.; Schröder, H.
Konferenzbeitrag
2014An holistic approach to optical interconnects in data centres
Tekin, T.; Pleros, N.
Zeitschriftenaufsatz
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Konferenzbeitrag
2014Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter
Konferenzbeitrag, Zeitschriftenaufsatz
2014In situ monitoring of interface delamination by the 3ω-method
Schulz, M.; Sheva, S.; Walter, H.; Mroßko, R.; Yang, G.; Keller, J.; Wunderle, B.
Konferenzbeitrag
2014Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen
Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014The influence of liners with Ti, Ta or Ru finish on thin Cu films
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz, Konferenzbeitrag
2014InGrid: Pixelated Micromegas detectors for a Pixel-TPC
Lupberger, M.; Bilevych, J.; Desch, K.; Fischer, T.; Fritzsch, T.; Kaminski, J.; Kohl, K.; Rogowski, M.; Tomtschak, J.; Graaf, H. van der
Konferenzbeitrag
2014Innovative and reliable power modules: A future trend and evolution of technologies
Neeb, C.; Boettcher, L.; Conrad, M.; Doncker, R.W. de
Zeitschriftenaufsatz
2014Investigating wire bonding pull testing and its calculation basics
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.
Konferenzbeitrag
2014Korrosion in ENIG-Schichtsystemen
Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2014LCA to go for PV systems: Analysis tool for optimized PV design and green marketing
Arranz, Pol; Anzizu, Maria; Vallvé, Xavier; Schischke, Karsten; Helmy, Mohamed; Alonso, Juan Carlos; Rodrigo, Julio
Konferenzbeitrag
2014A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2014Lensless live cell imaging with thermoelectric cooled cell-microscope
Hubl, M.; Blechert, M.; Engelhardt, M.; Jung, E.; Lang, K.D.
Konferenzbeitrag, Zeitschriftenaufsatz
2014Life Cycle Assessment as a practical tool in the eco-design and promotion of eco-innovative electronics - the case of the IAMECO computers
Ospina, Jose Luis; Maher, Paul; Schischke, Karsten
Konferenzbeitrag
2014Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology
Brusberg, L.; Herbst, C.; Neitz, M.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2014Low-temperature photosensitive polyimide processing for use in 3D integration technologies
Windrich, Frank; Malanin, Mikhail; Eichhorn, Klaus-Jochen; Voit, Brigitte; Lang, Klaus-Dieter
Konferenzbeitrag
2014Mechanical properties of individual composite poly(methyl-methacrylate) -multiwalled carbon nanotubes nanofibers
Grabbert, N.; Wang, B.; Avnon, A.; Zhuo, S.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Kaletta, K.; Lang, K.-D.; Ngo, H.-D.
Konferenzbeitrag
2014Microstructural and mechanical analyses of Ag sintered joints
Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Lang, Klaus-Dieter
Konferenzbeitrag
2014Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors
Hahn, Daniel; Straube, Stefan; Abelein, Ulrich; Middendorf, Andreas; Lang, Klaus-Dieter
Konferenzbeitrag
2014Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.
Konferenzbeitrag
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Zeitschriftenaufsatz
2014Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D.
Konferenzbeitrag
2014Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D.
Konferenzbeitrag
2014Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2014Nanoporous gold bumps for thermocompression bonding
Oppermann, Hermann; Dietrich, Lothar; Weber, Constanze; Ziedorn, Morten; Aschenbrenenr, Rolf
Abstract
2014A new broadband antenna for satellite communications
Karlsson, C.; Cavero, P.; Tekin, T.; Pouhè, D.
Konferenzbeitrag
2014Next generation high power electronic module based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Konferenzbeitrag
2014Next Generation Substrates - wie elektronische Systeme maskenlos gedruckt werden
Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D.
Konferenzbeitrag
2014Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages
Wong, C.S.; Bennett, N.S.; Manessis, D.; Danilewsky, A.; McNally, P.J.
Zeitschriftenaufsatz
2014Ökodesign von Unterhaltungselektronik und IKT - Beispiele und Denkanstöße
Schischke, Karsten
Vortrag
2014On double sided cooling
Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2014Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.
Konferenzbeitrag
2014Optisches Kopplungssystem mit einem optischen Koppler und einem lichtdurchlässigen äußeren Medium sowie Herstellung und Verwendung eines solchen Systems
Oppermann, Hermann
Patent
2014Packages for fast switching HV GaN power devices
Klein, K.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2014Packaging very fast switching semiconductors
Hoene, E.; Ostmann, A.; Marczok, C.
Konferenzbeitrag
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Konferenzbeitrag
2014Photonic interconnects for data centers
Tekin, T.; Pleros, N.; Apostolopoulos, D.
Konferenzbeitrag
2014Photonic interconnects for data centers
Tekin, T.; Hakansson, A.; Pleros, N.; Apostolopoulos, D.
Konferenzbeitrag
2014Power electronics packages with embedded components - recent trends and developments
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Zeitschriftenaufsatz
2014Precision jetting of solder paste - a versatile tool for small volume production
Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2014Predicting magnetic coupling of power inductors
Hoffmann, S.; Hoene, E.; Lang, K.-D.
Konferenzbeitrag
2014Printed electroluminescent structures for smart cards
Wróblewski, G.; Sloma, M.; Kallmayer, C.; Marques, J.; Haberland, J.; Janczak, D.; Jakubowska, M.
Konferenzbeitrag
2014Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip
Schreier-Alt, T.; Ansorge, F.; Chmiel, G.; Lang, K.-D.
Konferenzbeitrag
2014Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2014Raffungsmodelle für die Qualifikation von Einpresskontakten für Leiterplatten
Schreier-Alt, T.; Heimerle, D.; Ring, K.; Möhler, A.; Baar, C.; Ansorge, F.
Zeitschriftenaufsatz
2014Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools
Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D.
Konferenzbeitrag
2014Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg
Konferenzbeitrag
2014Reliability improvements in electronic systems by combining condition monitoring approaches
Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2014Sensorsystem zum Überwachen eines Objekts
Hefer, Jan; Rojahn, Johannes
Patent
2014SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
2014Strategies for glass based photonic system integration
Schröder, H.; Brusberg, L.; Böttger, G.
Konferenzbeitrag
2014Stretchable and deformable electronic systems in thermoplastic matrix materials
Löher, T.; Ostmann, A.; Seckel, M.
Konferenzbeitrag
2014Sustainable life cycle engineering of an integrated desktop PC
Fitzpatrick, C.; Hickey, S.; Schischke, K.; Maher, P.
Zeitschriftenaufsatz
2014System simulation of automotive high voltage grids: Modelling of power converters and connecting cables
Schoerle, S.; Hoene, E.; Hoffmann, S.; Kuczmik, A.; Lang, K.-D.
Konferenzbeitrag
2014Tablet PCs through the lens of environment - design trends and impacts on the environmental performance
Dimitrova, Gergana; Nissen, Nils; Stobbe, Lutz; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter
Konferenzbeitrag
2014Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2014Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.
Konferenzbeitrag
2014Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2014Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.
Konferenzbeitrag
2014Towards Zero Waste in Industrial Networks: A case study of the D4R laptop
Hickey, Stewart; Fitzpatrick, Colin; Maher, Paul; Ospina, Jose; Schischke, Karsten; Beigl, Peter; Vidorreta, Itziar; Yang, Mona; Williams, Ian; den Boer, Emilia
Zeitschriftenaufsatz
2014Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook
Schischke, Karsten; Nissen, Nils; Lang, Klaus-Dieter
Konferenzbeitrag
2014Triple transit region photodiodes (TTR-PDs) providing high millimeter wave output power
Rymanov, V.; Stöhr, A.; Dülme, S.; Tekin, T.
Zeitschriftenaufsatz
2014TSV-annealing: A thermo-mechanical assessment
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.
Konferenzbeitrag
2014Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Ostmann, A.
: Lang, K.-D.; Vanfleteren, J.; Nowottnick, M.
Dissertation
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Zeitschriftenaufsatz
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Konferenzbeitrag
2014Vorrichtung und elektrische Baugruppe zum Wandeln einer Gleichspannung in eine Wechselspannung
Domurat-Linde, André; Hoene, Eckart; Ringkleff, Thomas; Enzinger, Tobias
Patent
2014Welding equipment under the energy-related products directive - the process of developing eco-design criteria
Schischke, K.; Nissen, N.F.; Lang, K.D.
Zeitschriftenaufsatz
2014A wide range power cell for modular interleaving supplies
Radecker, M.; Yang, Y.; Nicollini, A.; Le, L.; Lang, K.-D.; Kruse, P.D.; Feistel, K.; Teixeira, L.; Dennstedt, D.; Herfurth, M.
Konferenzbeitrag
2014Wireless condition monitoring for industrial applications based on radio sensor nodes with energy harvesting
Niedermayer, M.; Bennecke, S.; Wirth, R.; Armbruster, E.; Lang, K.-D.
Zeitschriftenaufsatz
2014Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.
Konferenzbeitrag
2013"LCA to go" - Environmental assessment of machine tools according to requirements of small and medium-sized enterprises (SMEs) - Development of the methodological concept
Pamminger, R.; Krautzer, F.; Wimmer, W.; Schischke, K.
Konferenzbeitrag
2013µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery
Saettler, P.; Boettcher, M.; Wolter, K.J.
Konferenzbeitrag
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Konferenzbeitrag
20133D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Parthenopoulos, M.; Goerner, L.; Boettcher, M.; Grafe, J.; Wolf, J.M.
Konferenzbeitrag
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag
2013Active or passive fiber-chip-alignment: Approaches to efficient solutions
Böttger, G.; Schröder, H.; Jordan, R.
Konferenzbeitrag
2013An advanced MEMS sensor packaging concept for use in harsh environments
Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong
Konferenzbeitrag
2013Anwendungen hydrophober Oberflächenmodifikationen in der Mikrosystemtechnik
Georgi, L. von; Kahle, R.; Lang, K.-D.; Bauer, J.; Braun, T.; Becker, K.-F.; Jung, E.
Zeitschriftenaufsatz
2013Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2013Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2013Approach for reliability of thermal interface materials in battery cell sensors
Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2013Bath chemistry and copper overburden as influencing factors of the TSV annealing
Saettler, P.; Boettcher, M.; Rudolph, C.; Wolter, K.-J.
Konferenzbeitrag
2013Bumping technologies
Töpper, Michael; Lu, D.
Aufsatz in Buch
2013Coextrusion and mechanical characterization of aluminum coated Mg-profiles
Negendank, M.; Weber, C.; Müller, S.; Reimers, W.
Konferenzbeitrag
2013A compact, universal and cost-efficient antenna setup for mmW-radar applications
Zech, C.; Hulsmann, A.; Schlechtweg, M.; Georgi, L.; Gulan, H.; Ambacher, O.
Konferenzbeitrag
2013Comparison of acoustic sensor systems for quality analysis of asparagus using scanning laser vibrometry for visualization
Foerster, J.; Truppel, I.; Bochow-Ness, O.; Geyer, M.
Zeitschriftenaufsatz
2013Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Konferenzbeitrag
2013Data availability and the need for research to localize, quantify and recycle critical metals in information technology, telecommunication and consumer equipment
Chancerel, Perrine; Rotter, Vera Susanne; Ueberschaar, Maximilian; Marwede, Max; Nissen, Nils F.; Lang, Klaus-Dieter
Zeitschriftenaufsatz, Konferenzbeitrag
2013Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Konferenzbeitrag, Zeitschriftenaufsatz
2013Design Features of Current Tablet Computers to Facilitate Disassembly and Repair
Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter
Konferenzbeitrag
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2013Development and status of Cu ball/wedge bonding in 2012
Schneider-Ramelow, Martin; Geißler, U.; Schmitz, S.; Grübl, W.; Schuch, B.
Zeitschriftenaufsatz
2013Development of a 40 Watts 5 kV converter using Piezoelectric Transformer for Rheoelectrical damper application
Yang, Y.; Radecker, M.; Guttowski, S.; Lang, K.-D.; Fontana da Silva, B.; Bellinaso, L.V.; Engleitner, R.; Vazquez Carazo, A.
Konferenzbeitrag
2013Development of embedded high power electronics modules for automotive applications
Böttcher, L.
Konferenzbeitrag
2013Dielectric elastomer actuators for adaptive photonic microsystems
Heimann, Marcus; Schröder, Henning; Marx, Sebastian; Lang, Klaus-Dieter
Konferenzbeitrag
2013Dielectric-loaded plasmonic waveguide components: Going practical. Review
Kumar, A.; Gosciniak, J.; Volkov, V.S.; Papaioannou, S.; Kalavrouziotis, D.; Vyrsokinos, K.; Weeber, J.C.; Hassan, K.; Markey, L.; Dereux, A.; Tekin, T.; Waldow, M.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.; Bozhevolnyi, S.I.
Zeitschriftenaufsatz
2013Disassembly analysis of slates: Design for repair and recycling evaluation. Final report
Schischke, Karsten; Stobbe, Lutz; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.
Bericht
2013Drahtlose Sensorsysteme für die zustandsorientierte Instandhaltung und Logistik
Thomasius, R.; Guttowski, S.; Brockmann, C.; Benecke, S.; Kravcenko, E.; Niedermayer, M.; Nachsel, R.
Zeitschriftenaufsatz
2013Early-Warning System for Machine Failures. Self-Sufficient Radio Sensor Systems for Wireless Condition Monitoring
Niedermayer, M.; Armbruster, E.; Wirth, R.; Haubold, A.; Benecke, S.; Lang, K.-D.
Konferenzbeitrag
2013Einfluss der Wechselwirkungen zwischen HV-Komponenten auf die EMV des Fahrzeugs
Hoene, E.; Schörle, S.
Konferenzbeitrag
2013Electrical modeling of the power delivery to an LED array packaged in a textile
Curran, B.; Öz, A.; Linz, Torsten; Ndip, Ivan; Guttowski, Stephan; Lang, Klaus-Dieter
Konferenzbeitrag
2013Electrical, thermal and electromagnetic design of a SiC solar inverter
Hoene, E.; Hoffmann, S.; Zeiter, O.
Konferenzbeitrag
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2013Electronics in textiles – adhesive bonding technology for reliably embedding electronic modules into textile circuits
Krshiwoblozki, Malte von; Linz, Torsten; Neudeck, Andreas; Kallmayer, Christine
Konferenzbeitrag
2013Embedded planar glass waveguide optical interconnect for data centre applications
Pitwon, R.; Schröder, H.; Brusberg, L.; Graham-Jones, J.; Wang, K.
Konferenzbeitrag
2013Entwicklung und Implementierung einer verbesserten Lastwechseltestmethode zur experimentellen Bestimmung der Zuverlässigkeit von Dickdrahtbonds in Leistungsmodulen
Göhre, J.-M.
Dissertation
2013European R&D trends in wire bonding technologies
Schneider-Ramelow, M.; Göhre, J.-M.; Geißler, U.; Schmitz, S.; Lang, K.-D.
Konferenzbeitrag
2013The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Konferenzbeitrag
2013Feuchtediffusion in partikelgefüllten Epoxidharzen für die Mikroelektronik
Braun, Tanja
Dissertation
2013Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2012/2013
 
Jahresbericht
2013From wafer level to panel level mold embedding
Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2013Front to backside alignment for TSV based 3D integration
Windrich, F.; Schenke, A.
Konferenzbeitrag
2013Generative Fertigungstechnologien für eine Direktintegration von mikroelektronischen Komponenten und Kontaktstrukturen
Ifland, D.; Ansorge, F.; Baar, C.; Lang, K.-D.
Zeitschriftenaufsatz
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Konferenzbeitrag
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.
Konferenzbeitrag
2013Heterogeneous 3D integration for smart systems
Wolf, M. Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
2013Heterointegration technologies for multifunctional systems
Lang, Klaus-Dieter
Konferenzbeitrag
2013High-speed electronics for short-link communication
Bauwelinck, J.; Vaernewyck, R.; Verbrugghe, J.; Soenen, W.; Moeneclaey, B.; Van Praet, C.; Vyncke, A.; Torfs, G.; Yin, X.; Qiu, X.Z.; Vandewege, J.; Sotiropoulos, N.; De Waardt, H.; Cronin, R.; Maxwell, G.; Tekin, T.; Bakopoulos, P.; Lai, C.P.; Townsend, P.D.
Konferenzbeitrag
2013Integration platform of dual wavelength signal source for 120GHz wireless communication systems
Palandöken, M.; Tekin, T.
Konferenzbeitrag
2013Introduction
Nowak, M.; Lee, C.; Ndip, I.; Goetz, M.
Konferenzbeitrag
2013Introduction
Ndip, I.; Yu, J.; Rouzaud, A.; Hoffmeyer, M.
Konferenzbeitrag
2013Investigation of different methods for isolation in through silicon via for 3D integration
Sage, S.; John, P.; Dobritz, S.; Börnge, J.; Vitiello, J.; Böttcher, M.
Zeitschriftenaufsatz
2013JEMSIP 3D. Major results & achievements from the project and exploitation thereof in future products
Wolf, M.J.; Kapitza, H.; Pressel, K.; Perrocheau, J.; Maquille, Y. de; Kwakman, L.F.T.; Rouzaud, A.
Konferenzbeitrag
2013The LAMBDA photon-counting pixel detector
Pennicard, D.; Lange, S.; Smoljanin, S.; Hirsemann, H.; Graafsma, H.; Epple, M.; Zuvic, M.; Lampert, M.-O.; Fritzsch, T.; Rothermund, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2013Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration
Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2013Life Cycle Engineering von Turbomaschinen mithilfe der Mikrosystemtechnik
Middendorf, Andreas; Jerchel, Kathleen; Günther, Julia; Rothe, Michael
Zeitschriftenaufsatz
2013Löten ade - elektronische Systeme aus dem Drucker?
Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D.
Zeitschriftenaufsatz
2013Low energy routing platforms for optical interconnects using active plasmonics integrated with Silicon Photonics
Vyrsokinos, K.; Papaioannou, S.; Kalavrouziotis, D.; Zacharatos, F.; Markey, L.; Weeber, J.-C.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Waldow, M.; Giannoulis, G.; Apostolopoulos, D.; Tekin, T.; Avramopoulos, H.; Pleros, N.
Konferenzbeitrag
2013Market drivers and architectural requirements for backplane inter-connect capacities in next generation PON head-end equipment in the access network
Dorward, R.M.; Symington, K.; Brusberg, L.; Kropp, J.-R.; Miller, A.; Pitwon, R.; Whalley, S.
Konferenzbeitrag
2013Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, M.F.; Hölck, O.; Braun, T.; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2013Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Konferenzbeitrag
2013Microtechnology for the HighTec medical industry
Jung, E.
Konferenzbeitrag
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Konferenzbeitrag
2013Miniaturized drug delivery system TUDOS with accurate metering of microliter volumes
Richter, M.; Wackerle, M.; Kibler, S.; Biehl, M.; Koch, T.; Müller, C.; Halter, Roman; Nuffer, J.; Zeiter, O.
Konferenzbeitrag
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2013Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
Lang, K.-D.; Ndip, I.; Guttowksi, S.
Konferenzbeitrag
2013Modular microsystems with embedded components
Böhme, Christian; Ostmann, A.; Schneider-Ramelow, M.
Konferenzbeitrag
2013Moisture induced swelling in epoxy moulding compounds
Walter, H.; Hölck, O.; Dobrinski, H.; Stuermann, J.; Braun, T.; Bauer, J.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2013Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.; Lang, K.D.
Konferenzbeitrag
2013Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength
Hartmann, S.; Hölck, O.; Wunderle, B.
Konferenzbeitrag
2013A new aluminium alloy for heavy wire bonding in power
Geißler, Ute; Göhre, J.-M.; Thomas, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2013Nothing is as it seems - A contribution to changes in the base and filler materials during fusion brazing
Wittke, K.; Scheel, W.; Kising, M.; Rinn, A.
Zeitschriftenaufsatz
2013A novel packaging concept for electronics in textile UHF antennas
Boehme, C.; Vieroth, R.; Hirvonen, M.
Konferenzbeitrag
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013On-body propagation performance with textile antennas 867 MHz
Hirvonen, Mervi; Böhme, Christian; Severac, Daniel; Maman, Mickael
Zeitschriftenaufsatz
2013Optical backplane for board-to-board interconnection based on a glass panel gradient-index mulitmode waveguide technology
Brusberg, Lars; Schröder, Henning; Pitwon, Richard; Miller, Allen; Whalley, Simon; Herbst, Christian; Röder, Julia; Lang, Klaus-Dieter
Konferenzbeitrag
2013Optical system components for navigation grade fiber optic gyroscopes
Heimann, M.; Liesegang, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.
Konferenzbeitrag
2013Optimierung des Störemissionsverhaltens von Leistungsmodulen im UKW-Frequenzbereich
Domurat-Linde, A.
Dissertation
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.
Zeitschriftenaufsatz
2013Panel level packaging - a manufacturing solution for cost-effective systems
Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas
Konferenzbeitrag
2013Panel level packaging for LED lighting
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D.
Konferenzbeitrag
2013Photonic flip-flop based solutions to overcome memory-wall challenges
Tcheg, P.; Wang, B.; Palandöken, M.; Tekin, T.
Konferenzbeitrag
2013Piezoresistive stress sensor for inline monitoring during assembly and packaging of QFN
Schreier-Alt, T.; Chmiel, G.; Ansorge, F.; Lang, K.-D.
Konferenzbeitrag
2013Power electronics packages with embedded components - recent trends and developments
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Konferenzbeitrag
2013Power modules with embedded chips for automotive applications
Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.
Konferenzbeitrag
2013Power modules with embedded components
Ostmann, A.; Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Lang, K.-D.
Konferenzbeitrag
2013Precision jetting of glob top materials - A methodology for process optimization
Becker, K.-F.; Koch, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2013Product Design Trends and Impacts on Recyclability: The Case of Mobile IT Devices
Dimitrova, Gergana; Schischke, Karsten; Stobbe, Lutz; Nissen, Nils F; Schlösser, Alexander
Vortrag
2013Radar based detection and tracking of objects under poor visibility conditions
Ens, A.; Zech, C.; Hülsmann, A.; Georgi, L.; Becker, K.-F.
Konferenzbeitrag
2013Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies
Vanfleteren, J.; Bossuyt, F.; Löher, T.; Hsu, Y.-Y.; Gonzalez, M.; Günther, J.
Aufsatz in Buch
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag
2013Schaffung einer Datenbasis zur Ermittlung ökologischer Wirkungen der Produkte der Informations- und Kommunikationstechnik (IKT)
Prakash, Siddharth; Liu, Ran; Schischke, Karsten; Stobbe, Lutz; Gensch, Carl-Otto
Studie
2013Sensor integrated microfluidics for compact micro-reactors
Jung, E.; Blechert, M.; Schuldt, V.; Hubl, M.; Georg, L.; Lang, K.-D.
Konferenzbeitrag
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter
Konferenzbeitrag
2013A simplification method of a modeling of stray magnetic couplings in EMC filters
Masuzawa, T.; Hoene, E.
Konferenzbeitrag
2013A simplification method of a modeling of stray magnetic couplings in EMC filters
Masuzawa, T.; Hoene, E.
Konferenzbeitrag
2013Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D.
Konferenzbeitrag
2013Smart power module molding advances: Evaluating high temperature suitability of molding compounds
Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2013Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D.
Konferenzbeitrag
2013Stressmessung auf Chip-Ebene - Ein Fahrtenschreiber für die Elektronikverarbeitung
Schreier-Alt, T.; Fraunhofer, F.A.
Zeitschriftenaufsatz
2013System reliability as a key for managing complex requirements, such as robust design of microsystems
Straube, Stefan; Hahn, Daniel; Jerchel, Kathleen; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2013Technologies and processes used in printed circuit board fabrication for the realization of stretchable electronics
Bossuyt, F.; Löher, T.
Aufsatz in Buch
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.
Konferenzbeitrag
2013Terahertz transceiver microprobe for chip-inspection applications using optoelectronic time-domain reflectometry
Nagel, M.; Matheisen, C.; Sawallich, S.; Dobritz, S.; Kurz, H.
Konferenzbeitrag
2013Thermoplastic based system-in-package for RFID application
Kallmayer, C.; Pahl, B.; Grams, A.; Marques, J.; Lang, K.-D.; Suwald, T.
Konferenzbeitrag
2013Thermoplastic packaging and embedding technology for ID-cards
Marques, J.; Pahl, B.; Kallmayer, C.
Konferenzbeitrag
2013Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials
Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2013Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2013Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2013Trends in der Systemintegration
Lang, Klaus-Dieter; Pötter, Harald; Bochow-Neß, Olaf; Becker, Karl-Friedrich; Wolf, M. Jürgen
Zeitschriftenaufsatz
2013Ultra-low-inductance power module for fast switching semiconductors
Hoene, E.; Ostmann, A.; Lai, B.T.; Marczok, C.; Müsing, A.; Kolar, J.W.
Konferenzbeitrag
2013Ursachen und Vermeidung des Black-Pad-Defekts beim Löten von SMDs
Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Konferenzbeitrag
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Konferenzbeitrag
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Konferenzbeitrag
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Konferenzbeitrag
20120.48Tb/s (12x40Gb/s) WDM transmission and high-quality thermo-optic switching in dielectricloaded plasmonics
Kalavrouziotis, D.; Papaioannou, S.; Giannoulis, G.; Apostolopoulos, D.; Hassan, K.; Markey, L.; Weeber, J.-C.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Baus, M.; Karl, M.; Tekin, T.; Tsilipakos, O.; Pitilakis, A.; Kriezis, E.E.; Avramopoulos, H.; Vyrsokinos, K.; Pleros, N.
Zeitschriftenaufsatz
20123D integration - technology and test strategy
Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D.
Konferenzbeitrag
2012Active plasmonics in WDM traffic switching applications
Papaioannou, S.; Kalavrouziotis, D.; Vyrsokinos, K.; Weeber, J.C.; Hassan, K.; Markey, L.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Baus, M.; Tekin, T.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.
Zeitschriftenaufsatz
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.
Konferenzbeitrag
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.
Konferenzbeitrag
2012Advanced thin glass based photonic PCB integration
Schröder, Henning; Brusberg, L.; Arndt-Staufenbiel, Norbert; Richlowski, Karim; Ranzinger, Christian; Lang, Klaus-Dieter
Konferenzbeitrag
2012Advances in CO2-laser drilling of glass substrates
Brusberg, L.; Queisser, M.; Gentsch, C.; Schröder, H.; Lang, K.D.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Aktives optisches Kabel mit transparentem elektro-optischem Baugruppenträger
Brusberg, Lars; Schröder, Henning
Patent
2012Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Geißler, Ute; Milke, Eugen; Prenosil, Peter; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Analysis and reduction of radiated EMI of power modules
Domurat-Linde, A.; Hoene, E.
Konferenzbeitrag
2012Assembly and interconnect formation in MEMS/MOEMS application
Oppermann, H.
Konferenzbeitrag
2012Au/Sn Solder
Oppermann, H.; Hutter, M.
Aufsatz in Buch
2012Bewertung der Lebensdauer von Lotverbindungen unter Betrachtung des Fehlermechanismus Elektromigration
Jaeschke, Johannes
Dissertation
2012Die bonding in embedded substrates
Oppermann, H.; Rothermund, M.; Jurgensen, N.; Yen, U.; Essig, K.
Konferenzbeitrag
2012Challenges in LED packaging and green lighting
Jordan, R.; Hutter, M.; Oppermann, H.
Konferenzbeitrag
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Characterization of the annealing behavior for copper-filled TSVs
Saettler, P.; Boettcher, M.; Wolter, K.-J.
Konferenzbeitrag
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.
Konferenzbeitrag
2012Combination of channel- and droplet-based microfluidics for complex PoC devices
Jung, Erik; Georgi, Leopold; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal
Konferenzbeitrag
2012Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.
Konferenzbeitrag
2012Comparative analysis of load resonant converters for a normalized, control and integration suitable design concept
Yang, Y.
Dissertation
2012Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Zeitschriftenaufsatz
2012Complexity, quality and robustness - the challenges of tomorrow´s automotive electronics
Abelein, Ulrich; Lochner, Helmut; Hahn, Daniel; Straube, Stefan
Konferenzbeitrag
2012Contacting electronics to fabric circuits with nonconductive adhesive bonding
Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Foerster, Philipp
Zeitschriftenaufsatz
2012Copper filling of TSVs for interposer applications
Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C.
Konferenzbeitrag
2012Cost driven design of smart microsystems
Niedermayer, Michael
Buch
2012Data transmission and thermo-optic tuning performance of dielectric-loaded plasmonic structures hetero-integrated on a silicon chip
Giannoulis, G.; Kalavrouziotis, D.; Apostolopoulos, D.; Papaioannou, S.; Kumar, A.; Bozhevolnyi, S.; Markey, L.; Hassan, K.; Weeber, J.-C.; Dereux, A.; Baus, M.; Karl, M.; Tekin, T.; Tsilipakos, O.; Pitilakis, A.K.; Kriezis, E.E.; Vyrsokinos, K.; Avramopoulos, H.; Pleros, N.
Zeitschriftenaufsatz
2012Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Zeitschriftenaufsatz
2012Design, fabrication and characterisation of fully etched TM grating coupler for photonic integrated system-in-package
Gili-De-Villasante, O.; Tcheg, P.; Wang, B.; Suna, A.; Giannoulis, G.; Lazarous, I.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.; Baus, M.; Karl, M.; Tekin, T.
Konferenzbeitrag
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Konferenzbeitrag
2012Development of a multi-terminal crimp package for smart textile integration
Simon, E.; Kallmeyer, C.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2012Development of embedded power electronics modules
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Konferenzbeitrag
2012Development of rechargeable micro batteries based on micro channel structures
Hahn, R.; Höppner, K.; Marquardt, K.; Eisenreich, M.; Ferch, M.; Wilke, M.; Lang, K.-D.
Konferenzbeitrag
2012Development of silicon integrated rechargeable lithium microbatteries
Marquardt, K.; Stolle, T.; Ferch, M.; Hahn, R.; Thunman, M.
Konferenzbeitrag
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Konferenzbeitrag
2012Discharge performance dependence on electrode thickness for Li 4Ti5O12/LiMn2O4 cells for application in wafer-integrated microbatteries
Thunman, M.; Marquardt, K.; Hahn, R.; Kober, D.; Goerke, O.; Schubert, H.
Konferenzbeitrag
2012Early replacement of notebooks considering environmental impacts
Prakash, S.; Liu, R.; Schischke, K.; Stobbe, P.L.
Konferenzbeitrag
2012Eco-reliability - a combined approach to balance environment with reliability
Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Konferenzbeitrag
2012Eco-reliability as a new approach of multi-criteria optimisation
Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2012Effects of bonding pressure on quality of SLID interconnects
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Konferenzbeitrag
2012Einfluss der Drahtbondgeometrie auf die plastischen Dehnungen in Heel-Bereich von AlSi1-Standard-Drahtbondverbindungen
Kripfgans, Johannes; Schneider-Ramelow, M.; Schmitz, S.; Müller, W.H.
Zeitschriftenaufsatz
2012Einsatz von Biopolymeren in der IT
Nissen, Nils F.
Zeitschriftenaufsatz
2012Electronics Goes Green 2012+. Proceedings. CD-ROM
: Lang, Klaus-Dieter; Nissen, Nils F.; Middendorf, Andreas; Chancerel, Perrine
Tagungsband
2012Embedded power electronics for automotive applications
Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.
Konferenzbeitrag
2012Enablers and barriers for producer responsibility in the electrical and electronic equipment sector
Besiou, Maria; Wassenhove, N. Luk van; Williams, Ian; Ongondo, Francis; Curran, Tony; O'Connor, Clementine; Man-Yu Yang, Mona; Dietrich, Johannes; Marwede, Max; Gallo, Maitane; Arnaiz, Sixto; Woolman, Tim; Kopacek, Bernd; Obersteiner, Gudrun
Konferenzbeitrag
2012Energy efficient network equipment for data centers
Schlosser, A.; Stobbe, L.; Nissen, N.F.; Schappi, B.; Lang, K.-D.
Konferenzbeitrag
2012Energy Harvesting for Distributed Microsystems - The Link between Environmental Performance and Availability of Power Supply
Benecke, Stephan; Rückschloss, Jana; Middendorf, Andreas; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2012Energy harvesting on its way to a reliable and green micro energy source
Benecke, S.; Ruckschloss, J.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2012Energy saving potential of converged ICT and CE
Schlomann, B.; Stobbe, L.; Nissen, N.F.
Konferenzbeitrag
2012Enhancement of barrier properties of encapsulants for harsh environment applications
Braun, T.; Bauer, J.; Georgi, L.; Becker, K.F.; Koch, M.; Aschenbrenner, R.; Lang, K.D.
Konferenzbeitrag
2012Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles
Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Konferenzbeitrag
2012Entwicklung einer einmodigen Wellenleitertechnologie in Dünnglas für die photonische Systemintegration
Brusberg, L.
Dissertation
2012Environmental product assessments for small computer and laptop companies - MicroPro's experience with Eco-design of product service systems
Ospina, J.L.; Maher, P.; Schischke, K.; Schlosser, A.
Konferenzbeitrag
2012Environmentally conscious design of autonomous power supplies for distributed micro-systems
Benecke, S.; Rueckschloss, J.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2012ErP - the European directive on ecodesign
Nissen, Nils F.
Aufsatz in Buch
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten
Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2012FE-thermo mechanische Analyse zur Beschreibung der Ausbildung der intermetallischen Phase beim Drahtbonden
Sbeiti, Mohamad; Müller, Wolfgang H.; Geißler, Ute; Schneider-Ramelow, Martin; Schmitz, Stefan
Zeitschriftenaufsatz
2012First approach to cost-efficient fine pitch NCA flip-chip assembly on thermoplastic polyurethane printed circuit boards
Foerster, P.; Dils, C.; Kallmayer, C.; Löher, T.; Lang, K.-D.
Konferenzbeitrag
2012Flexible Mikroverdrahtungsstrukturen für implantierbare Elektroden
Schmidt, Ralf; Zwanzig, M.; Marcos, D.; Wirth, A.; Löher, T.; Seckel, M.
Zeitschriftenaufsatz
2012Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2011/2012
 
Jahresbericht
2012From CRT to flat displays - Consequences for collection and recycling
Chancerel, P.; Deubzer, O.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2012Frühwarnsystem für Maschinenausfälle: Energieautarke Funksensorsysteme zum Condition Monitoring
Niedermayer, Michael; Wirth, Rainer; Kravcenko, Eduard; Benecke, Stephan
Zeitschriftenaufsatz
2012Heterogenous integration - packaging on and in organic substrates
Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2012High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing
Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.
Konferenzbeitrag
2012How to support SMEs in the sustainable design of their products. the LiMaS project approach
Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Chancerel, P.; Schischke, K.; Ruckschloss, J.; Campo, F.; Benito, G.
Konferenzbeitrag
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Zeitschriftenaufsatz
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.
Konferenzbeitrag
2012Influence of bonding parameters on the reliability of heavy wire bonds on power semiconductors
Göhre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2012Influence of conversion level on simulation results of crosslinked polymers
Tesarski, S.J.; Wymysowski, A.; Hölck, O.
Konferenzbeitrag
2012Influence of IGBT-module switching characteristics to radio frequency noise
Domurat-Linde, A.; Lang, K.D.; Hoene, E.
Konferenzbeitrag
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael
Zeitschriftenaufsatz
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.
Aufsatz in Buch
2012Interfacing dielectric-loaded plasmonic and silicon photonic waveguides
Tsilipakos, O.; Pitilakis, A.; Yioultsis, T.V.; Papaioannou, S.; Vyrsokinos, K.; Kalavrouziotis, D.; Giannoulis, G.; Apostolopoulos, D.; Avramopoulos, H.; Tekin, T.; Baus, M.; Karl, M.; Hassan, K.; Weeber, J.C.; Markey, L.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Pleros, N.; Kriezis, E.E.
Zeitschriftenaufsatz
2012International harmonization of models for selecting less toxic chemical alternatives
Lam, Carl W.; Pascualena Aguirre, Muskilda; Schischke, Karsten; Nissen, Nils F.; Ogunseitan, Oladele A.; Schoenung, Julie M.
Zeitschriftenaufsatz
2012Introduction: 2011 International Symposium on Microelectronics
Sigliano, R.; Chiang, K.-N.; Ndip, I.; Chan, B.
Konferenzbeitrag
2012Investigation of pulse overload-behavior of a high-current connector with transient-thermo-electric FEM simulation
Bochow-Ness, O.; Grams, A.; Hoene, E.; Huber, S.; Lang, K.-D.; Potter, H.; Prewitz, T.; Wittier, .O.; Wust, F.
Konferenzbeitrag
2012Kinetic analysis of gas sorption and gas induced dilation and relaxation behaviour of PIM-1 compared to other glassy polymers
Boehnnig, M.; Hoelck, O.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Large area mold embedding technology with PCB based redistribution
Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2012Large area sensor integration in textiles
Kallmayer, C.; Simon, E.
Konferenzbeitrag
2012Leistungselektronik in Leiterplatten einbetten
Böttcher, Lars
Zeitschriftenaufsatz
2012Life Cycle thinking in small and medium sized enterprises - Status quo and strategic needs in the electronics sector
Schischke, K.; Nissen, N.F.; Sherry, J.; O'Rafferty, S.; O'Connor, F.; Sitek, J.; Pamminger, R.; Wimmer, W.
Konferenzbeitrag
2012Lignin in der Elektronik
Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian
Konferenzbeitrag
2012Loss modeling in non-ideal transmission lines for optimal signal integrity
Curran, B.
: Reichl, H.
Dissertation
2012Low temperature wafer level bonding using benzocyclobutene adhesive polymers
Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.
Konferenzbeitrag
2012Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements
Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2012Mass flows of selected target materials in LED products
Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2012Methodology to identify design for recycling measures for high-tech sectors
Marwede, Max; Schischke, Karsten; Arranz, Pol; Hickey, Stewart; Fitzpatrick, Colin; Ospina, Jose; Yang, Mona; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2012Metrics for energy efficiency assessment in data centers and server rooms
Schaeppi, B.; Bogner, T.; Schloesser, A.; Stobbe, L.; Asuncao, M.D. de
Konferenzbeitrag
2012Micro camera based Lensless Microscope for a miniaturized diagnostic platform
Jung, E.; Hubl, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Microdevices for the Medical Industry - Technology, Perspectives and Hurdles for Commercialization -
Jung, Erik
Konferenzbeitrag
2012Microelectronics packaging materials: Correlating structure and property using molecular dynamics simulations
Hölck, Ole; Wunderle, Bernhard
Aufsatz in Buch
2012Mobiles optisches Analysegerät
Großer, V.; Gerritzen, A.; Jung, E.
Patent
2012Modeling and optimization of electronic packaging structures for signal and power integrity
Scogna, A.C.; Engin, A.E.; Ndip, I.
Konferenzbeitrag
2012Modeling embroidered contacts for electronics in textiles
Linz, Torsten; Simon, Erik; Walter, Hans
Zeitschriftenaufsatz
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Konferenzbeitrag
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2012Nanoporous gold bumps for low temperature bonding
Oppermann, H.; Dietrich, L.
Zeitschriftenaufsatz
2012Neue Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Geißler, Ute; Schneider-Ramelow, M.; Milke, E.
Aufsatz in Buch
2012Novel conformal antenna concept for security applications
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Konferenzbeitrag
2012On the development of a modified button shear specimen to characterize the mixed mode delamination toughness
Durix, L.; Dreßler, M.; Coutellier, D.; Wunderle, B.
Zeitschriftenaufsatz
2012Open questions on standby and networked standby
Nissen, Nils F.; Stobbe, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2012Optmized patch-like antennas for through the wall radar imaging and preliminary results with frequency modulated interrupted continuous wave
Fioranelli, F.; Salous, S.; Ndip, I.
Konferenzbeitrag
2012Overview of RoHS 2.0 and status of exemptions
Deubzer, O.; Nissen, N.F.; Lang, K.-D.
Konferenzbeitrag
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.
Konferenzbeitrag
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Konferenzbeitrag
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2012Practical Demonstrator. Design for Recycling Photovoltaic System
Arranz, Pol; Tarragó, Joan; Vallvé, Xavier; Marwede, Max; Boer, Emilia den; Rothe, Michael; Wuest, Felix; Middendorf, Andreas; Cocciantelli, Jean-Michel; Lippert, Michael
Konferenzbeitrag
2012Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.
Konferenzbeitrag
2012Process optimization and biocompatibility of cell carriers suitable for automated magnetic manipulation
Krejci, I.; Piana, C.; Howitz, S.; Wegener, T.; Fiedler, S.; Zwanzig, M.; Schmitt, D.; Daum, N.; Meier, K.; Lehr, C.M.; Batista, U.; Zemljic, S.; Messerschmidt, J.; Franzke, J.; Wirth, M.; Gabor, F.
Zeitschriftenaufsatz
2012Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.
Zeitschriftenaufsatz
2012Qualitätsprüfung von Drahtbondverbindungen - Stand der Technik 2012
Schmitz, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2012Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces
Sbeiti, Mohamad; Müller, W.H.; Schneider-Ramelow, M.; Geißler, U.; Schmitz, S.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Reducing hazardous substances in electronics
Deubzer, O.
Aufsatz in Buch
2012Reduction of voids in solder joints an alternative to vacuum soldering
Diehm, R.; Nowottnick, M.; Pape, U.
Konferenzbeitrag
2012Reliability of power semiconductor modules combining active and passive temperature cycling
Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.
Konferenzbeitrag
2012RFID plus: Aktive Funk-Etiketten zur Bestandskontrolle
Pötter, H.; Hampicke, M.; Seifert, S.; Thomas, M.
Zeitschriftenaufsatz
2012Robust 3D radio sensor systems with embedded active and passive components for industrial applications
Niedermayer, Michael; Scholtz, Hendrik; Bonim, Thomas; Guttowski, Stephan; Lang, Klaus-Dieter
Konferenzbeitrag
2012SCB and SMI: Two stretchable circuit technologies, based on standard printed circuit board processes
Vanfleteren, J.; Loeher, T.; Gonzalez, M.; Bossuyt, F.; Vervust, T.; Wolf, I. de; Jablonski, M.
Zeitschriftenaufsatz
2012Selbstorganisierende Produktion - SOPRO
Hohwieler, Eckhard; Eggers, Achim; Schallock, Burkhard; Baumann, Michael; Kraft, Manfred; Urban, Kamilla; Niedermayer, Michael; Schlenker, Dirk; Schrank, Kai; Patzlaff, Marcel; Erdene-Ochir, Tuguldur; Chemnitz, Moritz
Bericht
2012Sensoranordnung zur Feststellung von Unregelmäßigkeiten in oder an Fahrstromleitungen für schienengebundene Fahrzeuge
Großer, V.; Brockmann, C.
Patent
2012Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Wolfrum, J.; Pfeiffer, M.; Keutel, T.; Brockmann, C.; Grosser, V.; Lissek, S.; During, H.; Rusek, B.; Braunschweig, M.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2012Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.
Konferenzbeitrag
2012Single-mode glass waveguide platform for DWDM chip-to-chip interconnects
Brusberg, Lars; Schröder, Henning; Queiser, Marco; Lang, Klaus-Dieter
Konferenzbeitrag
2012Single-mode glass waveguide technology for optical interchip communication on board level
Brusberg, L.; Neitz, M.; Schröder, H.
Konferenzbeitrag
2012Small - but rich in precious resources
Chancerel, Perrine
Zeitschriftenaufsatz
2012Substrateless sensor packaging using wafer level fan-out technology
Briindel, M.; Scholz, U.; Haag, F.; Graf, E.; Braun, T.; Becker, K.-F.
Konferenzbeitrag
2012Surface plasmon circuitry in opto-electronics
Dereux, A.; Weeber, J.-C.; Bozhevolnyi, S.I.; Kriezis, E.; Pleros, N.; Tekin, T.; Baus, M.; Avramopoulos, H.
Konferenzbeitrag
2012Surface plasmon circuitry in opto-electronics
Dereux, A.; Weeber, J.-C.; Bozhevolnyi, S.I.; Kriezis, E.; Pleros, N.; Tekin, T.; Baus, M.; Avramopoulos, H.
Konferenzbeitrag
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Konferenzbeitrag
2012Technologies and Trends to Improve Power Electronic Packaging
Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter
Konferenzbeitrag
2012A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter
Konferenzbeitrag
2012Through mold via technology for multi-sensor stacking
Braun, T.; Brundel, M.; Becker, K.-F.; Kahle, R.; Piefke, K.; Scholz, U.; Haag, F.; Bader, V.; Voges, S.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2012Transfer molding technology for smart power electronics modules - materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Konferenzbeitrag
2012Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2012Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Konferenzbeitrag
2012Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.
Konferenzbeitrag
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Konferenzbeitrag
2012A via last TSV process applied to ATLAS pixel detector modules: Proof of principle demonstration
Barbero, M.; Fritzsch, T.; Gonella, L.; Hügging, F.; Krüger, H.; Rothermund, M.; Wermes, N.
Zeitschriftenaufsatz
2012Vorrichtung zum Erfassen und Entfernen von schädlichem Gewebe
Großer, V.; Gerritzen, A.
Patent
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
2012Wireless Sensor Networks in der industriellen Automation. Status & Trends
Hampicke, Maik; Pötter, Harald; Großer, Volker; Brockmann, Carsten; Niedermayer, Michael; Benecke, Stefan
Zeitschriftenaufsatz