Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Konferenzbeitrag
2018Active flow control in wind turbines - integration technologies and assessment of economic effects
Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar
Konferenzbeitrag
2018Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E.
Konferenzbeitrag
2018β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton
Abstract
2018Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T.
Zeitschriftenaufsatz
2018Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T.
Zeitschriftenaufsatz
2018Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R.
Konferenzbeitrag
2018Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren
Noerdemann, A.
Bachelor Thesis
2018Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, S.; Schulte, W.; Weiser, M.; Becker, M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2018Electronic transport through defective semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Konferenzbeitrag
2018Elektronentransport in Graphen-Nanobändern mit Kantenrauheit
Rodemund, T.S.
Bachelor Thesis
2018Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Konferenzbeitrag
2018Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S.
Konferenzbeitrag
2018Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes
Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R.
Zeitschriftenaufsatz
2018Feasible device architectures for ultrascaled CNTFETs
Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M.
Zeitschriftenaufsatz
2018Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching
Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2018Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017
 
Jahresbericht
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Zeitschriftenaufsatz
2018Influence of defect-induced deformations on electron transport in carbon nanotubes
Teichert, F.; Wagner, C.; Croy, A.; Schuster, J.
Zeitschriftenaufsatz
2018Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung
Otto, T.
Aufsatz in Buch
2018Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grubl, W.; Schuck, B.
Konferenzbeitrag
2018Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S.
Konferenzbeitrag
2018Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X.
Dissertation
2018Nanostructures for smart systems
Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T.
Konferenzbeitrag
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018On the Experimental Characterization of Morphing Structures
Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M.
Aufsatz in Buch
2018On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S.
Konferenzbeitrag
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2018Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D.
Konferenzbeitrag
2018Quantum transport in defective carbon nanotubes at mesoscopic length scales
Teichert, F.
Dissertation
2018The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt
Aufsatz in Buch
2018Vertically aligned carbon nanotube films as absorption layers for IR applications
Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha
Konferenzbeitrag
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Konferenzbeitrag
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
20173D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias
Hofmann, L.
Dissertation
2017Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes
Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J.
Zeitschriftenaufsatz
2017Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Konferenzbeitrag
2017Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny
Konferenzbeitrag
2017Ätzung von Nanostrukturen
Hilleringmann, U.
Aufsatz in Buch
2017Biomedical diagnostics enabled by integrated organic and printed electronics
Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J.
Zeitschriftenaufsatz
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Konferenzbeitrag
2017Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Konferenzbeitrag
2017Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Complementary field-effect transistors for flexible electronics
Hilleringmann, U.; Vidor, F.F.; Meyers, T.
Konferenzbeitrag
2017A concept for an ice detection system on overhead power lines, theory and practical results
Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S.
Konferenzbeitrag
2017Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Control system design for a morphing wing trailing edge
Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R.
Konferenzbeitrag
2017Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment
Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R.
Zeitschriftenaufsatz
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Design of a 2D MEMS micromirror with indirect static actuation
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Konferenzbeitrag
2017Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Development history and current achievements of printed primary batteries
Willert, A.; Baumann, R.R.
Konferenzbeitrag
2017Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.
Vortrag
2017Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L.
Konferenzbeitrag
2017Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B.
Zeitschriftenaufsatz
2017Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S.
Konferenzbeitrag
2017Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2017Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Konferenzbeitrag
2017Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2017Elastic and piezoresistive properties of nickel carbides from first principles
Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S.
Zeitschriftenaufsatz
2017An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F.
Zeitschriftenaufsatz
2017Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Zeitschriftenaufsatz
2017Emerging applications: PICs as a platform for lab on chip devices
Geidel, S.; Otto, T.
Zeitschriftenaufsatz
2017Erweiterung konventioneller Bauelemente durch Nanotechniken
Hilleringmann, U.; Horstmann, J.T.
Aufsatz in Buch
2017Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S.
Zeitschriftenaufsatz
2017FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R.
Konferenzbeitrag
2017Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K.
Konferenzbeitrag
2017Fluidic actuators for separation control at the engine/wing junction
Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016
 
Jahresbericht
2017Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications
Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R.
Zeitschriftenaufsatz
2017Go beyond 4.0 - towards digital fabrication based on printing
Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Halbleitende Nanopartikel für Feldeffekttransistoren
Hilleringmann, U.
Aufsatz in Buch
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017High-Q whispering gallery microdisk resonators based on silicon oxynitride
Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A.
Zeitschriftenaufsatz
2017Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten
Hangmann, C.
Dissertation
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Konferenzbeitrag
2017Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Konferenzbeitrag
2017Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Increase of functional density of hybrid structures by integration of micro and nano systems
Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L.
Konferenzbeitrag
2017Inductive temperature measurement for fast and optimized adhesive curing
Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A.
Konferenzbeitrag
2017Influence of processing atmosphere for QD-LEDs
Langenickel, J.; Weiß, A.; Otto, T.
Konferenzbeitrag
2017Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application
Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R.
Zeitschriftenaufsatz
2017Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates
Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G.
Konferenzbeitrag
2017Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.
Konferenzbeitrag
2017Integration of ZnO nanoparticle transistors on freestanding flexible substrates
Vidor, F.F.; Meyers, T.; Hilleringmann, U.
Konferenzbeitrag
2017Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Investigation on inkjet printing for electromagnetic applications
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Abstract
2017Investigation on inkjet printing for electromagnetic compatibility application
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2017Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T.
Konferenzbeitrag
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2017Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities
Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester
He, X.; Wen, Q.; Sun, Y.; Wen, Z.
Zeitschriftenaufsatz
2017Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E.
Zeitschriftenaufsatz
2017Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U.
Zeitschriftenaufsatz
2017Mass production of magnesium silicide as a TEG material
Schoenhoff, M.; Hilleringmann, U.; Boor, J. de
Konferenzbeitrag
2017Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T.
Konferenzbeitrag
2017Mechanical, electronic and optical properties of strained carbon nanotubes
Wagner, C.F.
Dissertation
2017MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung
Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T.
Konferenzbeitrag
2017Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate
Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T.
Zeitschriftenaufsatz
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Multilayer micromechanics process with thick functional layers (EPyC40)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E.
Zeitschriftenaufsatz
2017Novel concept of integrated micro actuation of membranes in liquid environments
Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T.
Konferenzbeitrag
2017A novel gyroscopic actuation concept for 2D MEMS micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Organic thin-film transistors for AMOLED applications
Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U.
Konferenzbeitrag
2017Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B.
Zeitschriftenaufsatz
2017Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol
Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P.
Zeitschriftenaufsatz
2017Printing technologies for the manufacturing of passive microwave components: Antennas
Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R.
Zeitschriftenaufsatz
2017Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.
Konferenzbeitrag
2017Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N.
Konferenzbeitrag
2017Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A.
Konferenzbeitrag
2017Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S.
Konferenzbeitrag
2017Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2017Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D.
Konferenzbeitrag
2017Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Sens-o-Spheres - A concept for location independent acquisition of process measurement signals
Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P.
Konferenzbeitrag
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Zeitschriftenaufsatz, Konferenzbeitrag
2017Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B.
Zeitschriftenaufsatz
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2017A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B.
Konferenzbeitrag
2017Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E.
Konferenzbeitrag
2017Welcome to the 11th Smart Systems Integration
Otto, T.
Konferenzbeitrag