Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales
Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T.
Zeitschriftenaufsatz
2019Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving
Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S.
Konferenzbeitrag
2019Ar+ ions irradiation induced memristive behavior and neuromorphic computing in monolithic LiNbO3 thin films
Pan, X.; Shuai, Y.; Wu, C.; Zhang, L.; Guo, H.; Cheng, H.; Peng, Y.; Qiao, S.; Luo, W.; Wang, T.; Sun, X.; Zeng, H.; Zhang, J.; Zhang, W.; Ou, X.; Du, N.; Schmidt, H.
Zeitschriftenaufsatz
2019Carbon Nanotubes for Mechanical Sensor Applications
Wagner, C.; Blaudeck, T.; Meszmer, P.; Böttger, S.; Fuchs, F.; Hermann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.
Zeitschriftenaufsatz
2019Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T.
Zeitschriftenaufsatz
2019Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, R.; Kreyssig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Frühauf, P.; Weigert, A.
Konferenzbeitrag
2019Compliance-current-modulated resistive switching with multi-level resistance states in single-crystalline LiNbO3 thin film
Pan, X.; Shuai, Y.; Wu, C.; Luo, W.; Sun, X.; Zeng, H.; Guo, H.; Yuan, Y.; Zhou, S.; Böttger, R.; Cheng, H.; Zhang, J.; Zhang, W.; Schmidt, H.
Zeitschriftenaufsatz
2019A Compound Control System for FR4-Based Electromagnetic Scanning Micrograting
Yu, F.; Wen, Q.; Lei, H.; Huang, L.; Wen, Z.
Zeitschriftenaufsatz
2019Computationally efficient simulation method for conductivity modeling of 2D-based conductors
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E.
Zeitschriftenaufsatz
2019Concept of the 3rd Generation of Reliability for Electronic Smart Systems
Gromala, P.; Dietz, F.; Rzepka, S.; Han, B.
Konferenzbeitrag
2019Design, Modeling, Fabrication, and Verification of New Multifunctional MEMS/NEMS Components
Freitag, M.; Sauppe, M.; Auerswald, C.; Kriebel, D.; Schmidt, H.; Voigt, S.; Arnold, B.; Markert, E.; Hahn, S.; Hiller, K.; Heinkel, U.; Mehner, J.
Zeitschriftenaufsatz
2019Developing a process to remove single silicon layers by atomic layer etching
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Konferenzbeitrag
2019Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles
Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D.
Konferenzbeitrag
2019Doctor blade system for the deposition of thin semiconducting films
Petrov, D.; Meyers, T.; Reker, J.; Hilleringmann, U.
Konferenzbeitrag
2019Electrically Controlled Actuation of Strained Nanomembranes
Enderlein, T.; Nestler, J.; Stiehl, C.; Morschhauser, A.; Otto, T.
Zeitschriftenaufsatz
2019Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution
Rayapai, V.R.; Bürger, D.; Du, N.; Patra, R.; Skorupa, I.; Blaschke, D.; Stöcker, H.; Matthes, P.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2019Electron transport through NiSi2–Si contacts and their role in reconfigurable field-effect transistors
Fuchs, F.; Gemming, S.; Schuster, J.
Zeitschriftenaufsatz
2019Evaporation study based on micromodel experiments: Comparison of theory and experiment
Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J.
Zeitschriftenaufsatz
2019Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Busse, S.; Selyshchev, O.; Mack, P.; Exner, H.; Horn, A.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2019FR4-based electromagnetic scanning micro-grating integrated with an angle sensor for a low-cost NIR micro-spectrometer
Wen, Q.; Lei, H.; Huang, J.; Yu, F.; Huang, L.; Zhang, J.; Li, D.; Peng, Y.; Wen, Z.
Zeitschriftenaufsatz
2019Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2018
 
Jahresbericht
2019Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements - Technology and Functional Test Results
Meszmer, P.; Hahn, S.; Hiller, K.; Wunderle, B.
Zeitschriftenaufsatz
2019The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples
Geidel, S.; Morschhauser, A.; Otto, T.
Konferenzbeitrag
2019An improved Green's function algorithm applied to quantum transport in carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2019Improved organic thin-film transistor performance by dielectric layer patterning
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Vollbrecht, J.; Kitzerow, H.; Paradies, J.; Hilleringmann, U.
Konferenzbeitrag
2019Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik
Hofmann, C.; Froehlich, A.; Kroll, M.; Wiemer, M.
Konferenzbeitrag
2019Induktives Fügen in der Mikrosystemtechnik
Hofmann, C.; Fröhlich, A.
Zeitschriftenaufsatz
2019Inkjet Printing of Self‐Supporting and Self‐Contained Structured Objects Onto Liquid Surfaces
Goedel, W.A.; Gläser, K.; Mitra, D.; Thalheim, R.; Ueberfuhr, P.; Hammerschmidt, J.; Baumann, R.R.
Zeitschriftenaufsatz
2019Inorganic p-channel thin-film transistors using CuO nanoparticles
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2019Integration of plasmonic nanostructures for micro-opto-electromechanical-systems
Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T.
Konferenzbeitrag
2019Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
Otto, A.; Rzepka, S.; Wunderle, B.
Zeitschriftenaufsatz
2019Iron(III) β-diketonates: CVD precursors for iron oxide film formation
Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2019Joining two worlds - hybrid integration of silicon based electronics and printed functionalities
Roscher, F.; Thalheim, R.; Seifert, T.; Paul, S.-D.; Zichner, R.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2019Low Power High Bandwidth Acceleration Sensor For Industrial Applications
Forke, R.; Hiller, K.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T.
Konferenzbeitrag
2019Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2019Measurements on the fly: Introducing mobile micro-sensors for biotechnological applications
Lauterbach, T.; Lüke, T.; Büker, M.-J.; Hedayat, C.; Gernandt, T.; Moll, R.; Grösel, M.; Lenk, S.; Seidel, F.; Brunner, D.; Bley, T.; Walther, T.; Lenk, F.
Zeitschriftenaufsatz
2019Mechanical deformation on nanoparticle-based thin-film transistors
Vidor, F.F.; Meyers, T.; Reker, J.; Mueller, K.; Wirth, G.I.; Hilleringmann, U.
Konferenzbeitrag
2019A MEMS IR optical chopper based on subwavelength structures
Kurth, S.; Meinig, M.; Wecker, J.; Seifert, M.; Hiller, K.; Otto, T.
Konferenzbeitrag
2019Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J.
Zeitschriftenaufsatz
2019Microwave Radiation Detection with an Ultrathin Free-Standing Superconducting Niobium Nanohelix
Loesch, S.; Alfonsov, A.; Dobrovolskiy, O.V.; Keil, R.; Engemaier, V.; Baunack, S.; Li, G.; Schmidt, O.G.; Buerger, D.
Zeitschriftenaufsatz
2019Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Filter
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Otto, T.
Konferenzbeitrag
2019Miniaturized multi sensor implant for monitoring of hemodynamic parameters
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Schröder, Thomas; Wünsch, Dirk; Görtz, Michael; Seidl, Karsten
Konferenzbeitrag
2019Multisensor-Implantat zur Überwachung der Hämodynamik
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Görtz, Michael; Seidl, Karsten
Konferenzbeitrag
2019Nanoparticles and Organic Semiconductors for Flexible Electronics
Hilleringmann, U.; Reker, J.; Meyers, T.; Vidor, F.F.; Bezuidenhout, P.H.; Joubert, T.-H.
Konferenzbeitrag
2019Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers
Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T.
Konferenzbeitrag
2019Next Generation of highly miniaturized Bulk-MEMS Fabry-Pérot Filters for infrared Microspectrometers
Ebermann, M.; Neumann, N.; Hoppe, S.; Hiller, K.; Seiler, J.; Helke, C.; Meinig, M.; Kurth, S.
Konferenzbeitrag
2019A Nonlinear Broadband Electromagnetic Vibration Energy Harvester Based on Double-Clamped Beam
Lu, Z.; Wen, Q.; He, X.; Wen, Z.
Zeitschriftenaufsatz
2019A Novel Indirect Quasi-Static Actuation Concept for 2D MEMS Micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Zeitschriftenaufsatz
2019Optimization of Platinum dioxide properties by plasma oxidation of sputtered PtOx
Basu, Nivedita; Sterin, N.S.; Saketh, Ram Mamidala; Shenoy, Apoorva; Bhat, Navakanta
Zeitschriftenaufsatz
2019Oxygen detection with zinc oxide nanoparticle structures
Schwabe, T.; Balke, A.; Bezuidenhout, P.H.; Reker, J.; Meyers, T.; Joubert, T.-H.; Hilleringmann, U.
Konferenzbeitrag
2019P-N Junction-Based Si Biochips with Ring Electrodes for Novel Biosensing Applications
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2019Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2019Photosensitive Field‐Effect Transistors Made from Semiconducting Carbon Nanotubes and Non‐Covalently Attached Gold Nanoparticles
Blaudeck, T.; Preuß, A.; Scharf, S.; Notz, S.; Kossmann, A.; Hartmann, S.; Kasper, L.; Mendes, R.G.; Gemming, T.; Hermann, S.; Lang, H.; Schulz, S.E.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Printing Reinforcing Structures onto Microsieves that are Floating on a Water Surface
Goedel, W.A.; Gläser, K.; Mitra, D.; Hammerschmidt, J.; Thalheim, R.; Ueberfuhr, P.; Baumann, R.R.
Zeitschriftenaufsatz
2019Radially resolved electronic structure and charge carrier transport in silicon nanowires
Fuchs, F.; Gemming, S.; Schuster, J.
Zeitschriftenaufsatz
2019Regeneration of Assembled, Molecular-Motor-Based Bionanodevices
Rahman, M.A.; Reuther, C.; Lindberg, F.W.; Mengoni, M.; Salhotra, A.; Heldt, G.; Linke, H.; Diez, S.; Mansson, A.
Zeitschriftenaufsatz
2019Role of contacts in carbon nanotube giant piezoresistive sensors
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S.
Konferenzbeitrag
2019Sealing of glass with titanium by glass pressing at the softening point
Winkler, Sebastian; Edelmann, Jan; Günther, Daniel; Wieland, Sebastian; Selbmann, Franz; Baum, Mario; Schubert, Andreas
Zeitschriftenaufsatz
2019Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
Froehlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kraeusel, V.
Konferenzbeitrag
2019Self-aligned organic thin-film transistors for flexible electronics
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2019Sensitivity control of carbon nanotube-based piezoresistive sensors by drain-induced barrier thinning
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Schuster, J.; Hermann, S.
Zeitschriftenaufsatz
2019Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films
Hoffmann, M.A.; Sharma, A.; Matthes, P.; Okano, S.; Hellwig, O.; Ecke, R.; Zahn, D.R.T.; Salvan, G.; Schulz, S.E.
Zeitschriftenaufsatz
2019Strain and screening: Optical properties of a small-diameter carbon nanotube from first principles
Wagner, C.; Schuster, J.; Schleife, A.
Zeitschriftenaufsatz
2019Surface effects and photoinduced relaxation processes in nanocomposites based on semiconductor quantum dots CdSe/ZnS and organic dye molecules
Zenkevich, E.I.; Stupak, A.P.; Kowerko, D.; Blaudeck, T.; Borczyskowski, C. von
Konferenzbeitrag
2019Synthesis of Mg and Zn diolates and their use in metal oxide deposition
Frenzel, P.; Preuß, A.; Bankwitz, J.; Georgi, C.; Ganss, F.; Mertens, L.; Schulz, S.E.; Hellwig, O.; Mehring, M.; Lang, H.
Zeitschriftenaufsatz
2019Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C.
Zeitschriftenaufsatz
2018"3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W.
Konferenzbeitrag
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Konferenzbeitrag
2018Active flow control in wind turbines - integration technologies and assessment of economic effects
Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar
Konferenzbeitrag
2018AlN film based piezoelectric large-aperture MEMS scanning micromirror integrated with angle sensors
Lei, H.; Wen, Q.; Yu, F.; Li, D.; Shang, Z.; Huang, J.; Wen, Z.
Zeitschriftenaufsatz
2018Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz
2018Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van
Konferenzbeitrag
2018Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Zeitschriftenaufsatz
2018Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E.
Konferenzbeitrag
2018Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, G.; Brämer, B.; Rzepka, S.
Konferenzbeitrag
2018β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton
Abstract
2018Challenges in transferring quantum dot sensitized solar cells on technical textiles
Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T.
Konferenzbeitrag
2018Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W.
Zeitschriftenaufsatz
2018Deposition methods for C8-BTBT in flexible TFTs
Meyers, T.; Reker, J.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development
Correia, V.; Mitra, K.Y.; Castro, H.; Rocha, J.G.; Sowade, E.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2018Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T.
Zeitschriftenaufsatz
2018Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R.
Konferenzbeitrag
2018Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2018Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren
Noerdemann, A.
Bachelor Thesis
2018Electroanalysis moves towards paper-based printed electronics
Cinti, S.; Colozza, N.; Cacciotti, I.; Moscone, D.; Polomoshnov, M.; Sowade, E.; Baumann, R.R.; Arduini, F.
Zeitschriftenaufsatz
2018Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas
Konferenzbeitrag
2018Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2018Electronic transport through defective semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Konferenzbeitrag
2018Elektronentransport in Graphen-Nanobändern mit Kantenrauheit
Rodemund, T.S.
Bachelor Thesis
2018Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Konferenzbeitrag
2018Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S.
Konferenzbeitrag
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Konferenzbeitrag
2018Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S.
Konferenzbeitrag
2018Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes
Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R.
Zeitschriftenaufsatz
2018Feasible device architectures for ultrascaled CNTFETs
Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M.
Zeitschriftenaufsatz
2018Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching
Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2018FR4-Based Electromagnetic Scanning Micromirror Integrated with Angle Sensor
Lei, H.; Wen, Q.; Yu, F.; Zhou, Y.; Wen, Z.
Zeitschriftenaufsatz
2018Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017
 
Jahresbericht
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology
Geneiß, V.; Lüke, T.; Hedayat, C.; Wolf, M.; Janek, F.; Meißner, T.; Barth, M.; Eberhardt, W.; Zimmermann, A.; Otto, T.
Konferenzbeitrag
2018Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Zeitschriftenaufsatz
2018An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Indirect X-ray detectors based on inkjet-printed photodetectors with a screen-printed scintillator layer
Oliveira, J.; Correia, V.; Sowade, E.; Etxebarria, I.; Rodriguez, R.D.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2018Influence of defect-induced deformations on electron transport in carbon nanotubes
Teichert, F.; Wagner, C.; Croy, A.; Schuster, J.
Zeitschriftenaufsatz
2018Influence of the electrode material on the performance of BTBT-based thin-film transistors
Meyers, T.; Reker, J.; Petrov, D.; Hilleringmann, U.; Vidor, F.F.
Konferenzbeitrag
2018Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Integration of covalent and non-covalent functionalized SWCNTs in FETs
Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H.
Abstract
2018Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications
Otto, A.; Rzepka, S.; Wunderle, B.
Konferenzbeitrag
2018Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing
Wolf, M.; Janek, F.; Meissner, T.; Wigger, B.; Barth, M.; Guenter, T.; Eberhardt, W.; Zimmermann, A.; Geneiss, V.; Lueke, T.; Hedayat, C.; Otto, T.
Konferenzbeitrag
2018Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Zeitschriftenaufsatz
2018Klebeelement und Ventilanordnung
Morschhauser, Andreas; Nestler, Jörg; Otto, Thomas; Stiehl, Cornelia
Patent
2018Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung
Otto, T.
Aufsatz in Buch
2018Liquid crystalline dithienothiophene derivatives for organic electronics
Vollbrecht, J.; Oechsle, P.; Stepen, A.; Hoffmann, F.; Paradies, J.; Meyers, T.; Hilleringmann, U.; Schmidtke, J.; Kitzerow, H.
Zeitschriftenaufsatz
2018Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B.
Konferenzbeitrag
2018Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B.
Konferenzbeitrag
2018Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G.
Abstract
2018Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S.
Konferenzbeitrag
2018A micro-electromechanical systems based vibration energy harvester with aluminum nitride piezoelectric thin film deposited by pulsed direct-current magnetron sputtering
He, X.; Wen, Q.; Lu, Z.; Shang, Z.; Wen, Z.
Zeitschriftenaufsatz
2018Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Wecker, J.
Konferenzbeitrag
2018Miniaturized NIR Spectrometer Based on Novel MOEMS Scanning Tilted Grating
Huang, J.; Wen, Q.; Nie, Q.; Chang, F.; Zhou, Y.; Wen, Z.
Zeitschriftenaufsatz
2018Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S.
Konferenzbeitrag
2018Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X.
Dissertation
2018Nanostructures for smart systems
Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T.
Konferenzbeitrag
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018On the Experimental Characterization of Morphing Structures
Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M.
Aufsatz in Buch
2018On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements
Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P.
Konferenzbeitrag
2018On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S.
Konferenzbeitrag
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2018Performance analysis of CuO nanoparticle-based thin-film transistors
Reker, J.; Meyers, T.; Petrov, D.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D.
Konferenzbeitrag
2018Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2018Portable Sensor System for UV-Irradiation Measurements
Petrov, D.; Narayan, R.S.; Hilleringmann, U.
Konferenzbeitrag
2018Printed batteries and conductive patterns in technical textiles
Willert, A.; Meuser, C.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Printing techniques for batteries
Willert, A.; Tran-Le, A.-T.; Mitra, K.Y.; Clair, M.; Costa, C.M.; Lanceros-Méndez, S.; Baumann, R.R.
Aufsatz in Buch
2018Process development of large area R2R printing and sintering of conductive patterns by inkjet and infra-red technologies tailored for printed electronics
Mitra, K.Y.; Kapadia, S.; Hartwig, M.; Sowade, E.; Xu, Z.; Baumann, R.R.; Zichner, R.
Zeitschriftenaufsatz
2018Quantum transport in defective carbon nanotubes at mesoscopic length scales
Teichert, F.
Dissertation
2018Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T.
Konferenzbeitrag
2018Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.
Zeitschriftenaufsatz
2018Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O.
Zeitschriftenaufsatz
2018Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K.
Zeitschriftenaufsatz, Konferenzbeitrag
2018RFID units for a product based control of industrial production systems
Schmidt, M.; Metz, G.; Hedayat, C.; Otto, T.; Petrov, D.
Konferenzbeitrag
2018The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2018SAMPL - Secure Additive Manufacturing Platform
Gratias, A.; Böttcher, F.; Holland, M.; Schueller, M.
Konferenzbeitrag
2018Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems
Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S.
Konferenzbeitrag
2018Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2018Stochastic analyzes and Monte-Carlo simulations of nonlinear and non-ideal mixed-signal phase-locked loops
Schmidt, M.; Hangmann, C.; Hedayat, C.; Hilleringmann, U.; Otto, T.
Konferenzbeitrag
2018Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen
Rothe, T.
: Gemming, S.; Schuster, J.; Lorenz, E.
Bachelor Thesis
2018Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
Konferenzbeitrag
2018Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt
Aufsatz in Buch
2018Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer
Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E.
Konferenzbeitrag
2018Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication
Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors
Becker, T.E.; Vidor, F.F.; Wirth, G.I.; Meyers, T.; Reker, J.; Hilleringmann, U.
Konferenzbeitrag
2018Transient electro-thermal coupled system simulation
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2018Tuning of diameter and electronic type of CCVD grown SWCNTs
Jafarpour, S.M.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2018Vertically aligned carbon nanotube films as absorption layers for IR applications
Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha
Konferenzbeitrag
2018Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T.
Konferenzbeitrag
2018Welcome to the 12th Smart Systems Integration
Otto, T.
Konferenzbeitrag
2018Work function and conductivity of inkjet-printed silver layers: Effect of inks and post-treatments
Mitra, D.; Mitra, K.Y.; Dzhagan, V.; Pillai, N.; Zahn, R.T.; Baumann, R.R.
Zeitschriftenaufsatz
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Konferenzbeitrag
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
20173D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias
Hofmann, L.
Dissertation
2017Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes
Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J.
Zeitschriftenaufsatz
2017Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Konferenzbeitrag
2017Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny
Konferenzbeitrag
2017Ätzung von Nanostrukturen
Hilleringmann, U.
Aufsatz in Buch
2017Biomedical diagnostics enabled by integrated organic and printed electronics
Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J.
Zeitschriftenaufsatz
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Konferenzbeitrag
2017Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Konferenzbeitrag
2017Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Complementary field-effect transistors for flexible electronics
Hilleringmann, U.; Vidor, F.F.; Meyers, T.
Konferenzbeitrag
2017A concept for an ice detection system on overhead power lines, theory and practical results
Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S.
Konferenzbeitrag
2017Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Control system design for a morphing wing trailing edge
Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R.
Konferenzbeitrag
2017Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment
Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R.
Zeitschriftenaufsatz
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Design of a 2D MEMS micromirror with indirect static actuation
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Konferenzbeitrag
2017Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Development history and current achievements of printed primary batteries
Willert, A.; Baumann, R.R.
Konferenzbeitrag
2017Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.
Vortrag
2017Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L.
Konferenzbeitrag
2017Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S.
Konferenzbeitrag
2017Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2017Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Konferenzbeitrag
2017Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2017Elastic and piezoresistive properties of nickel carbides from first principles
Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S.
Zeitschriftenaufsatz
2017An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F.
Zeitschriftenaufsatz
2017Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Zeitschriftenaufsatz
2017Emerging applications: PICs as a platform for lab on chip devices
Geidel, S.; Otto, T.
Zeitschriftenaufsatz
2017Erweiterung konventioneller Bauelemente durch Nanotechniken
Hilleringmann, U.; Horstmann, J.T.
Aufsatz in Buch
2017Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan
Abstract
2017Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S.
Zeitschriftenaufsatz
2017FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R.
Konferenzbeitrag
2017Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K.
Konferenzbeitrag
2017Fluidic actuators for separation control at the engine/wing junction
Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016
 
Jahresbericht
2017Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications
Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R.
Zeitschriftenaufsatz
2017Go beyond 4.0 - towards digital fabrication based on printing
Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Halbleitende Nanopartikel für Feldeffekttransistoren
Hilleringmann, U.
Aufsatz in Buch
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017High-Q whispering gallery microdisk resonators based on silicon oxynitride
Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A.
Zeitschriftenaufsatz
2017Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten
Hangmann, C.
Dissertation
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Konferenzbeitrag
2017Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Konferenzbeitrag
2017Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Increase of functional density of hybrid structures by integration of micro and nano systems
Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L.
Konferenzbeitrag
2017Inductive temperature measurement for fast and optimized adhesive curing
Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A.
Konferenzbeitrag
2017Influence of processing atmosphere for QD-LEDs
Langenickel, J.; Weiß, A.; Otto, T.
Konferenzbeitrag
2017Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application
Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R.
Zeitschriftenaufsatz
2017Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates
Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G.
Konferenzbeitrag
2017Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.
Konferenzbeitrag
2017Integration of ZnO nanoparticle transistors on freestanding flexible substrates
Vidor, F.F.; Meyers, T.; Hilleringmann, U.
Konferenzbeitrag
2017Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Investigation on inkjet printing for electromagnetic applications
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Abstract
2017Investigation on inkjet printing for electromagnetic compatibility application
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2017Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T.
Konferenzbeitrag
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2017Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities
Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester
He, X.; Wen, Q.; Sun, Y.; Wen, Z.
Zeitschriftenaufsatz
2017Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E.
Zeitschriftenaufsatz
2017Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U.
Zeitschriftenaufsatz
2017Mass production of magnesium silicide as a TEG material
Schoenhoff, M.; Hilleringmann, U.; Boor, J. de
Konferenzbeitrag
2017Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T.
Konferenzbeitrag
2017Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fügmann, U.; Illing-Günther, H.; Nestler, D.; Hübler, A.C.; Nendel, K.; Kroll, L.; Otto, T.
Zeitschriftenaufsatz
2017Mechanical, electronic and optical properties of strained carbon nanotubes
Wagner, C.F.
Dissertation
2017MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung
Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T.
Konferenzbeitrag
2017Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate
Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T.
Zeitschriftenaufsatz
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Multilayer micromechanics process with thick functional layers (EPyC40)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E.
Zeitschriftenaufsatz
2017Nanophotonic biosensor for space exploration (PBSA instrument)
Pantoja, S.; Parro, V.; Nestler, J.; Geidel, S.; Martins, R.; Cuesta, F.; Elvira, J.G.; Sousa, A.
Konferenzbeitrag
2017Novel concept of integrated micro actuation of membranes in liquid environments
Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T.
Konferenzbeitrag
2017A novel gyroscopic actuation concept for 2D MEMS micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Organic thin-film transistors for AMOLED applications
Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U.
Konferenzbeitrag
2017Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol
Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P.
Zeitschriftenaufsatz
2017Printing technologies for the manufacturing of passive microwave components: Antennas
Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R.
Zeitschriftenaufsatz
2017Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.
Konferenzbeitrag
2017Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N.
Konferenzbeitrag
2017Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A.
Konferenzbeitrag
2017Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S.
Konferenzbeitrag
2017Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2017Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D.
Konferenzbeitrag
2017Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E.
Abstract
2017Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Sens-o-Spheres - A concept for location independent acquisition of process measurement signals
Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P.
Konferenzbeitrag
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Zeitschriftenaufsatz, Konferenzbeitrag
2017Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2017A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B.
Konferenzbeitrag
2017Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E.
Konferenzbeitrag
2017Welcome to the 11th Smart Systems Integration
Otto, T.
Konferenzbeitrag
20163D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S.
Konferenzbeitrag
2016Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.
Konferenzbeitrag
2016Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2016Advances in Deposition of Main-Group Metal Oxides and Rare-Earth Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C.
Aufsatz in Buch
2016Advances in Deposition of Metals from Metal Enolates
Lang, H.; Adner, D.; Georgi, C.
Aufsatz in Buch
2016Advances in Deposition of Transition-Metal Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C.
Aufsatz in Buch
2016All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates
Moya, A.; Sowade, E.; del Campo, F.J.; Mitra, K.Y.; Ramon, E.; Villa, R.; Baumann, R.R.; Gabriel, G.
Zeitschriftenaufsatz
2016All-inkjet-printed low-pass filters with adjustable cutoff frequency consisting of resistors, inductors and transistors for sensor applications
Castro, H.F.; Correia, V.; Sowade, E.; Mitra, K.Y.; Rocha, J.G.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2016All-inkjet-printed thin-film transistors: Manufacturing process reliability by root cause analysis
Sowade, E.; Ramon, E.; Mitra, K.Y.; Martínez-Domingo, C.; Pedró, M.; Pallarès, J.; Loffredo, F.; Villani, F.; Gomes, H.L.; Terés, L.; Baumann, R.R.
Zeitschriftenaufsatz
2016Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K.
Konferenzbeitrag
2016Application of microcontrollers in solar-powered model gliders with sensor systems
Petrov, D.; Hilleringmann, U.
Konferenzbeitrag
2016Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M.
Konferenzbeitrag
2016Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2016Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S.
Konferenzbeitrag
2016Bis(β-diketonato)-and allyl-(β-diketonato)-palladium(II) complexes: Synthesis, characterization and MOCVD application
Assim, K.; Melzer, M.; Korb, M.; Rüffer, T.; Jakob, A.; Noll, J.; Georgi, C.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2016Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag
2016Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag
2016Cavity-enhanced mm-wave spectrometer with integrated SiGe front-end for oxygen concentration measurement
Wecker, J.; Kurth, S.; Mangalgiri, G.; Otto, T.; Gessner, T.; Gaitzsch, M.; Bauch, A.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U.
Konferenzbeitrag
2016Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M.
Konferenzbeitrag
2016Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank
Konferenzbeitrag
2016CF3Br plasma cryo etching of low-k porous dielectric
Clemente, I.; Koehler, N.; Miakonkikh, A.; Zimmermann, S.; Schulz, S.E.; Rudenko, K.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Chemical vapor deposition of ruthenium-based layers by a single-source approach
Jeschke, J.; Möckel, S.; Korb, M.; Rüffer, T.; Assim, K.; Melzer, M.; Herwig, G.; Georgi, C.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2016CNTFET-based RF electronics - State-of-the-art and future prospects
Schröter, M.; Claus, M.; Hermann, S.; Tittman-Otto, J.; Haferlach, M.; Mothes, S.; Schulz, S.
Konferenzbeitrag
2016Comparison of atomistic quantum transport and numerical device simulation for carbon nanotube field-effect transistors
Fuchs, F.; Zienert, A.; Mothes, S.; Claus, M.; Gemming, S.; Schuster, J.
Konferenzbeitrag
2016Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs
Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2016Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael
Abstract
2016COSIVU - Compact, smart and reliable drive unit for fully electric vehicles
Andersson, D.R.; Brinkfeldt, K.; Nord, S.; Ottosson, J.; Lampic, G.; Gotovac, G.; Zschieschang, O.; Baumgartel, H.; Brusius, M.; Kaulfersch, E.; Hilpert, F.; Otto, A.; Frankeser, S.
Konferenzbeitrag
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016Design and fabrication of a SiC-based power module with double-sided cooling for automotive applications
Brinkfeldt, K.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Kaulfersch, E.; Edwards, M.; Otto, A.; Andersson, D.
Konferenzbeitrag
2016The design challenge in printing devices and circuits: Influence of the orientation of print patterns in inkjet-printed electronics
Sowade, E.; Polomoshnov, M.; Baumann, R.R.
Zeitschriftenaufsatz
2016Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T.
Konferenzbeitrag
2016Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study
Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T.
Zeitschriftenaufsatz
2016Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.
Zeitschriftenaufsatz
2016Efficient design methodology for inductive energy transmission
Büker, M.-J.; Hedayat, C.; Hilleringmann, U.; Geßner, T.
Konferenzbeitrag
2016Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.
Konferenzbeitrag
2016Electron transport in defective metallic and semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Abstract
2016Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Konferenzbeitrag
2016Embedding electrochemical impedance spectroscopy in smart battery management systems using multicore technology
Armengaud, E.; Macher, G.; Groppo, R.; Novaro, M.; Otto, A.; Döring, R.; Schmidt, H.; Kras, B.; Stankiewicz, S.
Konferenzbeitrag
2016Empirical transport model of strained CNT transistors used for sensor applications
Wagner, C.; Schuster, J.; Gessner, T.
Zeitschriftenaufsatz
2016Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S.
Zeitschriftenaufsatz
2016Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses
Haubold, M.
Dissertation
2016Event driven modeling and characterization of the second order voltage switched charge pump PLL
Ali, E.; Hangmann, C.; Hedayat, C.; Haddad, F.; Rahajandraibe, W.; Hilleringmann, U.
Zeitschriftenaufsatz
2016Exchange-biased Py/CoO vortex structures: Magnetization reversal, cooling-field dependence, and training
Nissen, D.; Klein, O.; Matthes, P.; Albrecht, M.
Zeitschriftenaufsatz
2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Exploitation of giant piezoresistivity - CNT sensors fabricated with a wafer-level technology
Böttger, S.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies
Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T.
Konferenzbeitrag
2016Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S.
Zeitschriftenaufsatz
2016Fluidic actuators for active flow control on airframe
Schueller, M.; Weigel, P.; Lipowski, M.; Meyer, M.; Schlösser, P.; Bauer, M.
Konferenzbeitrag
2016Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2015
 
Jahresbericht
2016High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly
Dinh, Nghia Trong; Sowade, Enrico; Blaudeck, T.; Hermann, S.; Rodriguez, Raul D.; Zahn, Dietrich R.T.; Schulz, S.E.; Baumann, R.R.; Kanoun, Olfa
Zeitschriftenaufsatz
2016A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü
Abstract
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Konferenzbeitrag
2016Improved RF design using precise 3D near-field measurements and near-field to far-field transformations
Hangmann, C.; Mager, T.; Khan, S.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2016An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Zeitschriftenaufsatz
2016Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps
Geidel, S.; Peransi Llopis, S.; Rodrigo, M.; Diego-Castilla, G. de; Sousa, A.; Nestler, J.; Otto, T.; Gessner, T.; Parro, V.
Zeitschriftenaufsatz
2016Integration of humidity sensors into fibre-reinforced thermoplastic composites
Ebert, F.; Seider, T.; Illing-Günther, H.; Nendel, K.; Martin, J.; Otto, T.; Gessner, T.; Nestler, D.; Wagner, G.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Intense pulsed light sintering of an inkjet printed silver nanoparticle ink depending on the spectral absorption and reflection of the background
Mitra, D.; Mitra, K.Y.; Hartwig, M.; Baumann, R.R.
Zeitschriftenaufsatz
2016Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S.
Konferenzbeitrag
2016Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S.
Zeitschriftenaufsatz
2016Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz
2016Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors
Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2016Light electric vehicle enabled by smart systems integration
John, R.; Kahrimanovic, E.; Otto, A.; Tavernini, D.; Camocardi, M.; Perelli, P.; Dalmasso, D.; Blaz, S.; Trojaniello, D.; Oleari, E.; Sanna, A.; Groppo, R.; Romano, C.
Konferenzbeitrag
2016Liquid reagent storage in self-pumping lab-on-a-chip systems for quick assay and biosensor integration
Nestler, J.; Haber, N.; Stiehl, C.; Otto, T.; Gessner, T.
Konferenzbeitrag
2016Low temperature layer purification by pulsed UV-irradiation for flexible dye sensitized solar cells
Kleine, A.; Hilleringmann, U.
Konferenzbeitrag
2016Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
Konferenzbeitrag
2016Low-cost treatment for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U.
Konferenzbeitrag
2016Magnesium silicide TEGs as self-sufficient power supply for smart systems
Schönhoff, M.; Assion, F.; Hilleringmann, U.
Konferenzbeitrag
2016Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films
Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H.
Zeitschriftenaufsatz
2016Maskless reduction of crosstalk suitable for flexible electronics
Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2016Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S.
Konferenzbeitrag
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Konferenzbeitrag
2016Measurement and modeling of the effective thermal conductivity of sintered silver pastes
Ordonez-Miranda, J.; Hermens, M.; Nikitin, I.; Kouznetsova, V.G.; Sluis, O. van der; Ras, M.A.; Reparaz, J.S.; Wagner, M.R.; Sledzinska, M.; Gomis-Bresco, J.; Sotomayor Torres, C.M.; Wunderle, B.; Volz, S.
Zeitschriftenaufsatz
2016Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2016A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2016MEMS tunable Fabry-Pérot filters for infrared microspectrometer applications
Neumann, N.; Ebermann, M.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S.
Konferenzbeitrag
2016Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles
Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T.
Zeitschriftenaufsatz
2016Microelectromechanical switch and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira
Patent
2016Microelectromechanical system and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira
Patent
2016Microwave filter design optimized for ceramic multilayer technique
Uhlig, P.; Kassner, J.; Guenner, C.; Noack, E.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Miniaturized vortex-induced vibration energy harvester for low velocity air flow application
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Geßner, T.
Konferenzbeitrag
2016Modeling of MOEMS electromagnetic scanning grating mirror for NIR micro-spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.; Yang, T.
Zeitschriftenaufsatz
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016Next generation drivetrain concept featuring self-learning capabilities enabled by extended information technology functionalities
Otto, A.; Rzepka, S.
Konferenzbeitrag
2016Novel test stand for thermal diffusivity measurement of bulk and thin films
Ras, M.A.; May, D.; Wunderle, B.
Konferenzbeitrag
2016Novel through silicon wiring technology using dry etched sloping vertical terminals
Haas, S.; Voigt, S.; Arnold, M.; Schwenzer, F.; Braunschweig, M.; Küchler, M.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2016Optimization of a zinc oxide dispersion for building Quantum Dot Light Emitting Diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2016Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end
Wecker, J.; Bauch, A.; Kurth, S.; Mangalgiri, G.; Gaitzsch, M.; Meinig, M.; Gessner, T.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U.
Konferenzbeitrag
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016Piezoelektrische Aluminiumnitrid-Dünnschichten für mikroelektromechanische Systeme
Stöckel, C.
Dissertation
2016A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics
Koehler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E.
Zeitschriftenaufsatz
2016Printed batteries designed to power OLED applications
Willert, A.; Helmert, M.; Baumann, R.R.
Konferenzbeitrag
2016Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2016Product data and Sensor-based intelligent drive Control for flexible manufacturing and intralogistic processes
Geneiß, V.; Hedayat, C.; Bertelsmeier, F.; Henke, C.; Vathauer, K.-E.; Geßner, T.
Konferenzbeitrag
2016Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B.
Konferenzbeitrag
2016Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles
Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I.
Konferenzbeitrag
2016Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2016Reliability investigation on SiC BJT power module
Otto, A.; Kaulfersch, E.; Frankeser, S.; Brinkfeldt, K.; Zschieschang, O.; Rzepka, S.
Konferenzbeitrag
2016Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R.
Konferenzbeitrag
2016Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag
2016Self-assembly of spherical colloidal photonic crystals inside inkjet-printed droplets
Sowade, E.; Blaudeck, T.; Baumann, RR.
Zeitschriftenaufsatz
2016Silicon oxynitride microdisk resonators for integrated waveguide coupling
Hett, T.; Frers, T.; Widhalm, A.; Berth, G.; Hilleringmann, U.; Zrenner, A.
Konferenzbeitrag
2016Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg
Konferenzbeitrag
2016Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M.
Abstract
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Konferenzbeitrag
2016Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T.
Konferenzbeitrag
2016Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2016Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling
Niessner, M.; Dudek, R.; Hildebrandt, M.; Gehring, M.; Yongbo, Y.; Piller, A.; Schrag, G.
Konferenzbeitrag
2016Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Thermal design of integrated heating for lab-on-a-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T.
Konferenzbeitrag
2016Thermal simulations and experimental verification of power modules designed for double sided cooling
Brinkfeldt, K.; Ottosson, J.; Otto, A.; Mann, A.; Zschieschang, O.; Frankeser, S.; Andersson, D.
Konferenzbeitrag
2016Time-efficient curing of printed dielectrics via infra-red suitable to S2S and R2R manufacturing platforms for electronic devices
Mitra, K.Y.; Weise, D.; Hartwig, M.; Kapadia, S.; Baumann, R.R.
Zeitschriftenaufsatz
2016Towards distributed intelligent sensor and information fusion
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V.
Zeitschriftenaufsatz
2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2016Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers
Meinig, M.; Kurth, S.; Seifert, M.; Hiller, K.; Wecker, J.; Ebermann, M.; Neumann, N.; Gessner, T.
Konferenzbeitrag
2016Tunable MEMS Fabry-Pérot filters for infrared microspectrometers: A review
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S.
Konferenzbeitrag
2016Tuning the reduction and conductivity of solution-processed graphene oxide by intense pulsed light
Al-Hamry, A.; Kang, H.; Sowade, E.; Dzhagan, V.; Rodriguez, R.D.; Müller, C.; Zahn, D.R.T.; Baumann, R.R.; Kanoun, O.
Zeitschriftenaufsatz
2016Up-scaling of the manufacturing of all-inkjet-printed organic thin-film transistors: Device performance and manufacturing yield of transistor arrays
Sowade, E.; Mitra, K.Y.; Ramon, E.; Martinez-Domingo, C.; Villani, F.; Loffredo, F.; Gomes, H.L.; Baumann, R.R.
Zeitschriftenaufsatz
2016Upscaling of the inkjet printing process for the manufacturing of passive electronic devices
Sternkiker, C.; Sowade, E.; Mitra, K.Y.; Zichner, R.; Baumann, R.R.
Zeitschriftenaufsatz
2016Using quantum dot photoluminescence for load detection
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.; Gessner, T.
Zeitschriftenaufsatz
2016Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C.
Konferenzbeitrag
2016VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy
Helke, C.; Meinig, M.; Seifert, M.; Seiler, J.; Hiller, K.; Kurth, S.; Martin, J.; Gessner, T.
Konferenzbeitrag
2016Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B.
Konferenzbeitrag
2016Welcome to smart systems integration 2016
Gessner, T.
Konferenzbeitrag
2015[Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
Zeitschriftenaufsatz
2015"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B.
Konferenzbeitrag
20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T.
Konferenzbeitrag
20153d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2015Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2015Acceleration of lifetime modeling by isothermal bending fatigue tests
Heilmann, J.; Arnold, J.; Wunderle, B.
Konferenzbeitrag
2015Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R.
Zeitschriftenaufsatz
2015Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B.
Konferenzbeitrag
2015Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2015All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime
Gomes, H.L.; Medeiros, M.C.R.; Villani, F.; Canudo, J.; Loffredo, F.; Miscioscia, R.; Martinez-Domingo, C.; Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; McCulloch, I.; Carrabina, J.
Zeitschriftenaufsatz
2015Assembly and packaging of micro systems by using reactive bonding processes
Schumacher, Axel; Gaiß, Ulrike; Knappmann, Stefan; Dietrich, Georg; Braun, Stefan; Pflug, Erik; Roscher, Frank; Vogel, Klaus; Hertel, Silvia; Kähler, Dirk; Reinert, Wolfgang
Konferenzbeitrag
2015Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Carbon nanotube based field-effect transistors: Comparison between atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J.
Abstract
2015Carbon Nanotube based sensors in MEMS/NEMS
Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2015Carbon nanotubes under strain: Electronic and Optical properties
Wagner, C.; Schuster, J.; Gessner, T.
Abstract
2015Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B.
Konferenzbeitrag
2015Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C.
Aufsatz in Buch
2015Comparative analysis of multi-mass high precision vibratory MEMS gyroscopes
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Hiller, K.; Hahn, S.; Gessner, T.
Konferenzbeitrag
2015Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers
Niittynen, J.; Sowade, E.; Kang, H.; Baumann, R.R.; Mäntysalo, M.
Zeitschriftenaufsatz
2015Controlling the ink spreading on uncoated paper for inkjet printed nanoparticle silver inks in combination with intense pulsed light (IPL) sintering
Weise, D.; Hartwig, M.; Mitra, K.Y.; Wagenbach, A.; Shah, K.Y.; Baumann, R.R.
Konferenzbeitrag
2015Correction: Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second (J. Mater. Chem. C (2015) DOI: 10.1039/c5tc02291f)
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R.
Zeitschriftenaufsatz
2015Degradation of all-inkjet-printed organic thin-film transistors with TIPS-pentacene under processes applied in textile manufacturing
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Machado, A.V.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2015Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J.
Aufsatz in Buch
2015Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T.
Konferenzbeitrag
2015Effect of the light spectrum of various substrates for inkjet printed conductive structures sintered with intense pulsed light
Weise, D.; Mitra, K.Y.; Ueberfuhr, P.; Baumann, R.R.
Konferenzbeitrag
2015Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Rzepka, S.
Konferenzbeitrag
2015Efficient K-band antennas fabricated with large-scale processes
Gaitzsch, M.; Grossmann, T.D.; Hartwig, M.; Heinrich, M.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.
Konferenzbeitrag
2015Electrical conductivity enhancement of spin-coated PEDOT:PSS thin film via dipping method in low concentration aqueous DMSO
Deetuam, C.; Weise, D.; Samthong, C.; Praserthdam, P.; Baumann, R.R.; Somwangthanaroj, A.
Zeitschriftenaufsatz
2015Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration
Meinig, M.; Kurth, S.; Helke, C.; Seifert, M.; Hiller, K.; Ebermann, M.; Neumann, N.; Gessner, T.
Konferenzbeitrag
2015Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.
Konferenzbeitrag
2015Electromagnetic simulation of flexible strain sensor based microstrip patch antenna
Benchirouf, A.; Zichner, R.; Müller, C.; Kanoun, O.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Ereignisgesteuerte Methode für schnelle und präzise Analysen
Hangmann, C.; Vogel, M.
Zeitschriftenaufsatz
2015Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S.
Konferenzbeitrag
2015Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S.
Konferenzbeitrag
2015Exact and approximated discrete-time non-linear models of voltage switched CP-PLL
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C.
Konferenzbeitrag
2015Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials
Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T.
Abstract
2015Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics
Köhler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E.
Konferenzbeitrag
2015Fabrication of micro needle arrays using an ultra short pulse laser
Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2015Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Zeitschriftenaufsatz
2015Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL
Hangmann, C.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2015A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases
Ebermann, M.; Neumann, N.; Binder, S.; Meinig, M.; Seifert, M.; Kurth, S.; Hiller, K.
Konferenzbeitrag
2015FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B.
Konferenzbeitrag
2015FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2015Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K.
Konferenzbeitrag
2015Flexible electronics: Integration processes for organic and inorganic semiconductor-based thin-film transistors
Vidor, F.F.; Meyers, T.; Hilleringmann, U.
Zeitschriftenaufsatz
2015Fluidic actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Symmank, C.; Schmidt, A.; Kroll, L.; Gessner, T.; Götze, U.
Konferenzbeitrag
2015Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2014
 
Jahresbericht
2015Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik
Patent
2015Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process
Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2015Hierarchical, high-rate, hybrid and roll-to-roll manufacturing
: Poliks, M.D.; Blaudeck, T.
Tagungsband
2015High-performance giant magnetoresistive sensorics on flexible Si membranes
Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G.
Zeitschriftenaufsatz
2015Highly-sensitive humidity sensors for condition monitoring of hybrid laminates
Seider, T.; Martin, J.; Boeddicker, A.; Ruehling, J.; Wett, D.; Nestler, D.J.; Wagner, G.; Huebler, A.; Otto, T.; Gessner, T.
Konferenzbeitrag
2015An improved micromechanical method for investigating the statistical strength of poly-silicon membranes
Brückner, J.; Pfaff, H.; Dehe, A.; Rzepka, S.
Abstract
2015Improving HV battery efficiency by smart control systems
Armengaud, E.; Macher, G.; Kurtulus, C.; Groppo, R.; Haase, S.; Hofer, G.; Otto, A.; Schmidt, H.; Stankiewicz, S.
Konferenzbeitrag
2015An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2015Influence of different hole transport layers on the performance of quantum dot light emitting diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Geßner, T.
Konferenzbeitrag
2015Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U.; Wirth, G.I.
Konferenzbeitrag
2015Infra-red curing methodology for Roll-to-Roll (R2R) manufacturing of conductive electrodes through inkjet technology applicable for devices in the field of flexible electronics
Mitra, K.Y.; Weise, D.; Hartwig, M.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2015An inkjet adaptive backend strategy for low-yield OTFT digital circuits
Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.
Konferenzbeitrag
2015Inkjet and gravure printing of conductive patterns for the application in lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R.
Konferenzbeitrag
2015Inkjet printing of colloidal nanospheres: Engineering the evaporation-driven self-assembly process to form defined layer morphologies
Sowade, E.; Blaudeck, T.; Baumann, R.R.
Zeitschriftenaufsatz
2015Inkjet printing of group-11 metal structures
Gäbler, Christian; Schliebe, Christian; Adner, David; Blaudeck, T.; Hildebrandt, Alexander; Lang, Heinrich
Aufsatz in Buch
2015Inkjet printing of UHF antennas on corrugated cardboards for packaging applications
Sowade, E.; Göthel, F.; Zichner, R.; Baumann, R.R.
Zeitschriftenaufsatz
2015Inkjet-printed quantum dot-based sensor for structural health monitoring
Hartwig, M.; Ortlepp, F.; Möbius, M.; Martin, J.; Otto, T.; Geßner, T.; Baumann, R.R.
Konferenzbeitrag
2015Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring
Ortlepp, F.; Hartwig, M.; Moebius, M.; Martin, J.; Otto, T.; Gessner, T.; Baumann, R.R.
Konferenzbeitrag
2015Integrated load detection sensor for lightweight structures based on quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Hartwig, M.; Dzhagan, D.; Gordan, O.D.; Lang, H.; Zahn, D.R.T.; Baumann, R.R.; Otto, T.; Gessner, T.
Konferenzbeitrag
2015Integration and test of synthetic jet actuators
Schueller, M.; Weigel, P.; Lipowski, M.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2015Integration of fluidic jet actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Otto, T.; Geßner, T.; Kroll, L.
Konferenzbeitrag
2015Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes
Weise, D.; Sternkiker, C.; Baumann, R.R.
Konferenzbeitrag
2015Intense pulsed light sintering of inkjet printed silver nanoparticle ink: Influence of flashing parameters and substrate
Weise, D.; Mitra, K.Y.; Sowade, E.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E.
Konferenzbeitrag
2015Investigation of carbon nanotube based field-effect transistors using atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J.
Abstract
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2015k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study
Foerster, A.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.
Abstract
2015Kombinierte Simulation integrierter mikrofluidischer Aktoren
Schulze, R.; Nestler, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T.
Konferenzbeitrag
2015Life cycle-oriented analysis and evaluation of Active Flow Control in wind turbines
Götze, U.; Symmank, C.; Dressel, M.; Schüller, M.; Schmidt, A.; Lipowski, M.; Geßner, T.; Otto, T.
Zeitschriftenaufsatz
2015Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Zeitschriftenaufsatz
2015Materials for Advanced Metallization 2014 (MAM 2014). Preface
Schulz, S.E.; Hecker, M.; Korner, H.; Wolf, H.
Konferenzbeitrag, Zeitschriftenaufsatz
2015Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A.
Konferenzbeitrag
2015Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints
Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B.
Konferenzbeitrag
2015Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S.
Konferenzbeitrag
2015Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W.
Zeitschriftenaufsatz
2015Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T.
Konferenzbeitrag
2015Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M.
Zeitschriftenaufsatz
2015Microelectronics packaging materials: Investigating the influence of moisture by molecular dynamics simulations
Hölck, O.; Wunderle, B.
Konferenzbeitrag
2015Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A.
Konferenzbeitrag
2015Mobile communication and control for Smart Microfluidic Systems
Otto, T.; Geidel, S.; Morschhauser, A.; Streiter, R.; Gessner, T.; Heibutzki, B.; Nestler, J.
Konferenzbeitrag
2015Modeling & PVT characterization of arbitrary ordered VSCP-PLL using an efficient event-driven approach
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C.
Konferenzbeitrag
2015Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen
Weidlich, S.; Forke, R.; Billep, D.; Konietzka, S.; Koehler, D.; Hiller, K.; Gessner, T.
Konferenzbeitrag
2015Monolithic integration of 2D spin valve magnetic field sensors for angular sensing
Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E.
Konferenzbeitrag
2015Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T.
Konferenzbeitrag
2015Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T.
Konferenzbeitrag
2015A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J.
Konferenzbeitrag
2015Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres
Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H.
Konferenzbeitrag
2015On the optimization of piezoelectric vibration energy harvester
Deng, L.; Wen, Q.; Jiang, S.; Zhao, X.; She, Y.
Zeitschriftenaufsatz
2015On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.
Zeitschriftenaufsatz
2015On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M.
Zeitschriftenaufsatz
2015Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E.
Zeitschriftenaufsatz
2015Optimum laser exposure for setting exchange bias in spin valve sensors
Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator
Wecker, J.; Mangalgiri, G.; Kurth, S.; Meinig, M.; Hackner, A.; Prechtel, U.; Gessner, T.
Zeitschriftenaufsatz
2015Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips
Schindler-Saefkow, F.; Rost, F.; Rzepka, S.
Konferenzbeitrag
2015Performance investigation of UHF RFID tags designed for air and Rubber Belts - impact of electrical parameters and the shape of the belts
Kanwar, K.; Mager, T.; Hilleringmann, U.; Hedayat, C.; Geneis, V.; Gessner, T.
Konferenzbeitrag
2015A photonic biosensor for space applications (PBSA)
Diego-Castilla, G. de; Pantoja, S.; Geidel, S.; Peransi, S.; Nestler, J.; Martins, R.; Sousa, A.; Gomez-Elvira, J.; Moreno-Paz, M.; Cuesta, L.; Parro, V.
Konferenzbeitrag
2015Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics
Mitra, K.Y.; Sowade, E.; Martinez-Domingo, C.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R.
Konferenzbeitrag
2015Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T.
Konferenzbeitrag
2015Precision determination of thermoreflectance coefficients for localised thermometry
Schlag, R.; Ras, M.A.; Arlt, V.; May, D.; Winkler, T.; Wunderle, B.
Konferenzbeitrag
2015Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology
Nossol, P.; Schaufuss, J.; Tsapkolenko, A.; Rost,F; Arnold, B.; Kroll, L.; Mehner, J.; Gessner, T.
Konferenzbeitrag
2015Preparation of Ni-C thin films for strain sensor applications in new hybrid laminates with thermoplastic matrix
Wett, D.; Nestler, D.; Wagner, G.; Wielage, B.; Seider, T.; Martin, J.; Gessner, T.
Konferenzbeitrag
2015Printed functionalities in hybrid laminates
Nestler, D.J.; Jung, H.; Trautmann, M.; Wielage, B.; Wagner, G.; Seider, T.; Martin, J.; Otto, T.; Gessner, T.; Ebert, F.; Illing-Guenther, H.; Nendel, K.; Boeddicker, A.; Fuegmann, U.; Huebler, A.
Konferenzbeitrag
2015Printing of conductive patterns for application in smart lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R.
Konferenzbeitrag
2015Pulsed jet actuators and their integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L.
Konferenzbeitrag
2015Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes
Hübner, M.; Lang, N.; Zimmermann, S.; Schulz, S.E.; Buchholtz, W.; Röpcke, J.; Helden, J.H. van
Zeitschriftenaufsatz
2015Quantum dot-based sensor layer in lightweight structures
Fischer, T.; Heinrich, K.; Spudat, C.; Martin, J.; Otto, T.; Gessner, T.; Kroll, L.
Zeitschriftenaufsatz
2015Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification
Merten, E.; Essen, T. von; Luczack, F.; Otto, A.; Lunding, A.; Lürkens, P.; Bast, M.; Abo Ras, M.; Rzepka, S.
Konferenzbeitrag
2015Remote ice detection on rotor blades of wind turbines
Großmann, T.D.; Gaitzsch, M.; Hartwig, M.; Heinrich, M.; Symmank, C.; Schmidt, A.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.; Götze, U.
Konferenzbeitrag
2015RF MEMS switch for modulated backscatter communication
Gaitzsch, M.; Voigt, S.; Haas, S.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2015Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R.
Zeitschriftenaufsatz
2015Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S.
Konferenzbeitrag
2015Semiconductor nanocrystals – versatile building blocks for innovative microsystems
Weiss, A.; Heinrich, K.; Martin, J.; Otto, T.; Gessner, T.; Langenickel, J.
Konferenzbeitrag
2015Simulation and validation of arbitrary ordered VSCP-PLLs using event-driven macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C.
Konferenzbeitrag
2015Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Smart systems integration. Short review and further development of smart systems
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Kurth, S.; Nestler, J.; Köhler, T.
Aufsatz in Buch
2015SMART-LIC - Smart and Compact Battery Management System Module for Integration into Lithium-Ion Cell for Fully Electric Vehicles
Langheim, J.; Carcaillet, S.; Cavro, P.; Steinau, M.; Kanoun, O.; Günther, T.; Mager, T.; Otto, A.; Lanciotti, C.
Konferenzbeitrag
2015Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.
Konferenzbeitrag
2015Strong localization in defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Abstract
2015Strong localization in quasi one-dimensional systems with realistic defects: Application to carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Konferenzbeitrag
2015Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen
Baum, M.
Dissertation
2015Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters
Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T.
Konferenzbeitrag, Zeitschriftenaufsatz
2015Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2015Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures
Helke, C.; Nestler, J.; Gessner, T.
Konferenzbeitrag
2015Synthesis and characterization of nanogenerators based on doped zinc oxide
Heinrich, K.; Justeau, C.; Mielke, B.; Martin, J.; Otto, T.; Geßner, T.
Konferenzbeitrag
2015System zum Messen einer Axialkraft einer Schraubverbindung
Geßner, Thomas; Otto, Thomas; Halder, Stefan; Hummel, Dieter; Martin, Jörg; Weiss, Martin; Möbius, Martin; Spudat, Christian; Gessner, Thomas; Otto, Thomas
Patent
2015Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S.
Konferenzbeitrag
2015Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T.
Konferenzbeitrag
2015Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation
Förster, A.; Wagner, C.; Gemming, S.; Schuster, J.
Zeitschriftenaufsatz
2015Theoretical investigation of in situ k-restore processes for damaged ultra-low-k materials
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S.
Konferenzbeitrag
2015Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S.
Konferenzbeitrag
2015Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag, Poster
2015Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2015Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Thermo-mechanical simulations of SiC power modules with single and double sided cooling
Brinkfeldt, K.; Edwards, M.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Andersson, D.
Konferenzbeitrag
2015Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2015TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T.
Abstract
2015VORRICHTUNGEN ZUR AUSSENDUNG UND/ODER ZUM EMPFANG ELEKTROMAGNETISCHER STRAHLUNG UND VERFAHREN ZUR BEREITSTELLUNG DERSELBEN
Geßner, Thomas; Otto, Thomas; Schulz, Stefan; Hermann, Sascha; Blaudeck, Thomas; Spudat, Christian
Patent
2015Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach
Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2015A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes
Hartmann, M.; Hermann, S.; Pohl, D.; Rellinghaus, B.; Schulz, S.E.
Abstract
2015Wake up MEMS for inertial sensors
Stoeckel, C.; Billep, D.; Konietzka, S.; Zimmermann, S.; Otto, T.
Konferenzbeitrag
2015Welcome to Smart Systems Integration 2015
Gessner, T.
Zeitschriftenaufsatz
2015Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics
Ahner, N.; Zimmermann, S.; Köhler, N.; Krüger, S.; Schulz, S.E.
Konferenzbeitrag
2015Yet another tuning fork gyroscope
Forke, R.; Hiller, K.; Hahn, S.; Konietzka, S.; Motl, T.; Köhler, D.; Heinz, S.; Billep, D.; Gessner, T.
Konferenzbeitrag
2014 System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS
Kolchuzhin, V.; Mehner, J.; Markert, E.; Heinkel, U.; Wagner, C.; Schuster, J.; Gessner, T.
Konferenzbeitrag
20143D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried
Vortrag
2014An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B.
Aufsatz in Buch
2014An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2014Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2014Adjustment of Carbon Nanotube Properties for Sensor Applications using Pd Adatoms: An Ab-Initio Study
Fuchs, F.; Wagner, C.; Zienert, A.; Schuster, J.
Abstract
2014Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies
Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R.
Aufsatz in Buch
2014AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M.
Aufsatz in Buch
2014ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T.
Konferenzbeitrag
2014All-inkjet-printed bottom-gate thin-film transistors using UV curable dielectric for well-defined source-drain electrodes
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Lanceros-Méndez, S.; Baumann, R.R.
Zeitschriftenaufsatz
2014Analysis of Au metal–metal contacts in a lateral actuated RF MEMS switch
Gaitzsch, M.; Kurth, S.; Voigt, S.; Haas, S.; Gessner, T.
Konferenzbeitrag, Zeitschriftenaufsatz
2014Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J.
Aufsatz in Buch
2014Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen
Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B.
Konferenzbeitrag
2014ANAn UPS/IPS Study of Band Level Alignment Of a Quantum Dot Based Sensor
Tofighi, G.; Moebius, M.; Haidu, F.; Martin, J.; Dzhagan, V.M.; Spudat, C.; Otto, T.; Gessner, T.; Gordan, O.D.; Zahn, D.R.T.
Abstract
2014Anodized aluminum as effective and cheap alternative substrate for thermoelectric generators
Assion, F.; Geneiß, V.; Schönhoff, M.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2014Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B.
Aufsatz in Buch
2014Applications driven by printed batteries
Willert, A.; Espig, M.; Helmert, M.; Baumann, R.R.
Aufsatz in Buch
2014Assisting the design of sensor and information fusion systems
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Gessner, Thomas
Poster
2014Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Geßner, Thomas
Konferenzbeitrag
2014Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Carbon nanotubes under strain: Ab-initio investigations and compact models
Wagner, C.; Kolchuzhin, V.; Markert, E.; Schuster, J.; Mehner, J.; Gessner, T.
Abstract
2014Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2014Challenges of current and future advanced interconnect systems for integrated circuits
Schulz, S.E.; Ahner, N.; Fischer, T.; Koerner, H.; Oszinda, T.; Schulze, K.; Zimmermann, S.
Aufsatz in Buch
2014Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2014Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2014Characterization of fully inkjet-printed microsieves and of patterns for the mechanical reinforcement of fragile membranes
Hammerschmidt, J.; Ueberfuhr, P.; Eck, E.-M.; Zeiner, C.; Thalheim, R.; Baumann, R.R.
Konferenzbeitrag
2014Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C.
Konferenzbeitrag
2014Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films
Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T.
Zeitschriftenaufsatz
2014Cluster of Excellence MERGE - Integration of Micro- and Nanosystems in Hybrid Structures
Kroll, L.; Troeltzsch, J.; Schueller, M.
Aufsatz in Buch
2014A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.
Zeitschriftenaufsatz
2014Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M.
Konferenzbeitrag
2014Conductivity and microstructure of inkjet-printed silver tracks depending on the digital pattern, sintering process, substrate and ink
Weise, D.; Grimm, A.; Weiß, U.; Mitra, K.Y.; Sowade, E.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Corrigendum to "Controlling SWCNT assembling density by electrokinetics" [Sensors and Actuators, A: Physical (2013) 201 (36-42)]
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E.
Zeitschriftenaufsatz
2014Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T.
Aufsatz in Buch
2014Design and manufacturing of roll-to-roll printed copper layers for communication applications
Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2014Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Konferenzbeitrag
2014Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S.
Aufsatz in Buch
2014Development and Characterization of a High Voltage Amplifier ASIC for MEMS based Piezoelectric Actuator Active Flow Control
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M.
Konferenzbeitrag
2014Development and test of synthetic jet actuators based on dual transducer concept
Schueller, M.; Wiegel, P.; Lipowski, M.; Schulze, R.; Otto, T.; Gessner, T.
Konferenzbeitrag
2014Development of Micro-Valves for Pulsed Jet Actuators
Lipowski, M.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2014The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M.
Zeitschriftenaufsatz
2014Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds
Kang, H.; Sowade, E.; Baumann, R.R.
Zeitschriftenaufsatz
2014Dispersion Preparation for Wafer-Level Liquid Processing of Carbon Nanotube Microsensors
Hille, Toni; Blaudeck, T.; Hermann, S.; Schulz, S.E.
Konferenzbeitrag
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Konferenzbeitrag
2014Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Dry Integration Strategies of rolled-up Nanostructures by a Combination of Laser and Mems Technologies
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Konferenzbeitrag
2014Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Electronic transport through defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.
Abstract
2014Elektronischer Transport in defektbehafteten quasi-eindimensionalen Systemen am Beispiel von Kohlenstoffnanoröhrchen
Teichert, F.
Master Thesis
2014Embedded UHF RFID tag design process for rubber transmission belt using 3D model
Kanwar, K.; Mager, T.; Hilleringmann, U.; Geneiß, V.; Hedayat, C.
Konferenzbeitrag
2014Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator
Kasdorf, O.; Vollbrecht, J.; Ohms, B.; Hilleringmann, U.; Bock, H.; Kitzerow, H.S.
Zeitschriftenaufsatz
2014Entwicklung eines experimentellen Aufbaus zur Systemcharakterisierung von MEMS Gyroskopen auf Waferlevel
Weidlich, S.; Forke, R.; Konietzka, S.; Hiller, K.; Gessner, T.
Konferenzbeitrag
2014Entwicklung eines intelligenten, textilen Halbzeugs
Schaufuss, J.; Decker, R.; Walther, M.; Tsapkolenko, A.; Dienel, M.; Schueller, M.; Kroll, L.; Gessner, T.; Mehner, J.
Konferenzbeitrag
2014EUCEMAN - the European Center for MicroNanoReliability Research in Europe
Michel, B.; Winkler, T.
Aufsatz in Buch
2014Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M.
Aufsatz in Buch
2014Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips
Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F.
Konferenzbeitrag
2014Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects
Hangmann, C.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2014Fiber-reinforced Composite Structures with Embedded Piezoelectric Sensors
Schulze, R.; Streit, P.; Fischer, T.; Tsapkolenko, A.; Heinrich, M.; Sborikas, M.; Kroll, L.; Gessner, T.; Wegener, M.
Konferenzbeitrag
2014Flash lamp annealing of spray coated films containing oxidized or hydrogen terminated silicon nanoparticles
Seidel, F.; Toader, I.G.; Koth, S.; Fritzsche, R.; Schäfer, P.; Bülz, D.; Büchter, B.; Gordan, O.D; Freitag, H.; Jakob, A.; Buschbeck, R.; Hietschold, M.; Lang, H.; Mehring, M.; Baumann, R.R.; Zahn, D.R.T.
Zeitschriftenaufsatz
2014A flexible measurement system for the characterization of thermoelectric materials
Schönhoff, M.; Assion, F.; Hilleringmann, U.
Konferenzbeitrag
2014Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B.
Aufsatz in Buch
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Konferenzbeitrag
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Konferenzbeitrag
2014Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2013
 
Jahresbericht
2014Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2014Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T.
Konferenzbeitrag
2014German association of nanotechnology: Objectives and benefits
Nonninger, R.; Michel, B.
Aufsatz in Buch
2014A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems
Braeuer, J.; Gessner, T.
Zeitschriftenaufsatz
2014High precision 3D surface reconstruction by combining shape-from-shading and light sectioning techniques
Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C.
Aufsatz in Buch
2014High precision vibratory MEMS gyroscope
Billep, D.; Hiller, K.; Hahn, S.; Forke, R.; Köhler, D.; Stöckel, C.; Konietzka, S.; Heinz, S.
Aufsatz in Buch
2014High Voltage Amplifier ASIC for High Capacitive Load MEMS based Piezoelectric Actuators
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M.
Konferenzbeitrag
2014The history of micro mirror fabrication at the center of microtechnologies
Kaufmann, C.
Aufsatz in Buch
2014Hysteresis-free carbon nanotube field-effect transistors without passivation
Tittmann, J.; Hermann, S.; Schulz, S.E.; Pacheco-Sanchez, A.; Claus, M.; Schröter, M.
Konferenzbeitrag
2014Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag, Zeitschriftenaufsatz
2014Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T.
Aufsatz in Buch
2014Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B.
Aufsatz in Buch
2014In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S.
Konferenzbeitrag
2014In-situ characterization of microelectronic systems using 2D digital image correlation and 3D digital volume correlation of X-ray microtomography images
Seiler, B.; Haase, S.; Noack, E.; Erb, R.; Scheiter, L.
Aufsatz in Buch
2014INCOBAT – Improving HV battery efficiency by E/E control systems
Armengaud, E.; Groppo, R.; Haase, S.; Hofer, G.; Lanciotti, C.; Otto, A.; Schmidt, H.; Stankiewicz, S.
Konferenzbeitrag
2014Influence of porosity and methyl doping inside silica network
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M.
Zeitschriftenaufsatz
2014Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R.
Zeitschriftenaufsatz
2014Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R.
Konferenzbeitrag
2014Integrateable light sources based on semiconductor nanocrystals
Böttger, P.; Meyer, M.; Martin, J.; Otto, T.; Gessner, T.; Seidlitz, H.; Kroll, L.
Konferenzbeitrag
2014Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Abstract
2014Integration von ZnO Nanopartikel Dünnschicht-Transistoren durch Sprühbeschichtung
Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2014Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E.
Konferenzbeitrag
2014Interaction between semiconducting carbon nanotubes and metals: Sensing, stability and electronic properties
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E.
Konferenzbeitrag
2014Interface characterisation at electronic packages by means af nanoscale deformation analysis
Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B.
Aufsatz in Buch
2014Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2014Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M.
Aufsatz in Buch
2014Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T.
Aufsatz in Buch
2014Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Aufsatz in Buch
2014Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
Johansson, J.; Belov, I.; Johnson, E.; Dudek, R.; Leisner, P.
Zeitschriftenaufsatz
2014Kombination von Laser- und MEMS Technologieprozessen fuer Integrationsstrategien von rolled-up Nano-Architekturen
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Konferenzbeitrag
2014Laser based dry Integration of rolled-up Nanomembranes into Polymer Substrates
Enderlein, T.; Helke, C.; Harazim, S.; Geidel, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T.
Konferenzbeitrag
2014Laser based integration method of rolled-up nano membranes in polymer based LoC systems
Enderlein, T.; Helke, C.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T.
Abstract
2014Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Localization length of integrated multi-walled carbon nanotubes
Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2014Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
Vidor, F.F.; Wirth, G.I.; Hilleringmann, U.
Zeitschriftenaufsatz
2014Magnetite nanoparticles: Synthesis, thin film properties and inkjet printing of magnetic cores for inductor applications
Marjanovic, N.; Chiolerio, A.; Kus, M.; Ozel, F.; Tilki, S.; Ivanović, N.; Rakočević, Z.; Andrić, V.; Barudžija, T.; Baumann, R.R.
Zeitschriftenaufsatz
2014Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Mathematical modeling and simulations for machine directional register in hybrid roll-to-roll printing systems
Kang, H.; Baumann, R.R.
Zeitschriftenaufsatz
2014Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2014Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T.
Abstract
2014Metallic carbon nanotubes with metal contacts: electronic structure and transport
Zienert, A.; Schuster, J.; Gessner, T.
Zeitschriftenaufsatz
2014Microfluidic chips for cells capture using 3-D hydrodynamic structure array
Chen, J.; Chen, D.; Yuan, T.; Chen, X.; Zhu, J.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T.
Zeitschriftenaufsatz
2014Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Modeling and characterization of CP-PLL phase noise in presence of dead zone
Hangmann, C.; Wüllner, I.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2014Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Modeling of SiC power modules with double sided cooling
Brinkfeldt, K.; Neumaier, K.; Mann, A.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Edwards, M.; Andersson, D.
Konferenzbeitrag
2014Modellierung des optimalen Arbeitsbereiches für Inertialsensoren auf Basis von Kohlenstoffnanoröhrchen
Wagner, C.; Schuster, J.; Gessner, T.
Konferenzbeitrag
2014Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding
Masser, R.; Braeuer, J.; Gessner, T.
Zeitschriftenaufsatz
2014Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Konferenzbeitrag
2014Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Matthes, P.; Ecke, R.; Mueller, M.; Exner, H.; Schulze, K.
Konferenzbeitrag
2014Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H.
Konferenzbeitrag
2014Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.
Zeitschriftenaufsatz
2014Multifunctional nanomembranes as sensitive optical sensors in compact MEMS devices
Harazim, S.; Bolanos, V.; Helke, C.; Enderlein, T.; Otto, T.; Schmidt, O.G.
Abstract
2014Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M.
Konferenzbeitrag
2014A new generation of MEMS middle-infrared spectrometers
Otto, T.; Saupe, R.; Stock, V.; Seider, T.; Gessner, T.
Konferenzbeitrag
2014New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B.
Aufsatz in Buch
2014A novel wearable electronic nose for healthcare based on flexible printed chemical sensor array
Lorwongtragool, P.; Sowade, E.; Watthanawisuth, N.; Baumann, R.R.; Kerdcharoen, T.
Zeitschriftenaufsatz
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2014On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Optimization of primary printed batteries based on Zn/MnO2
Madej, E.; Espig, M.; Baumann, R.R.; Schuhmann, W.; Mantia, F. la
Zeitschriftenaufsatz
2014Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS study
Tofighi, G.; Moebius, M.; Haidu, F.; Gordan, O.D.; Martin, J.; Spudat, C.; Otto, T.; Gessner, T.; Zahn, D.R.T.
Konferenzbeitrag
2014Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G.
Abstract
2014Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T.
Aufsatz in Buch
2014Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Konferenzbeitrag
2014Piezoelectric P(VDF-TrFE) transducers assembled with micro injection molded polymers
Schulze, R.; Heinrich, M.; Nossol, P.; Forke, R.; Sborikas, M.; Tsapkolenko, A.; Billep, D.; Wegener, M.; Kroll, L.; Gessner, T.
Zeitschriftenaufsatz
2014Preparing reliability testing for increased demands of automotive electronics
Kreyßig, K.; Otto, A.
Aufsatz in Buch
2014Printed antennas on flexible substrates for highly integrated smart systems
Zichner, R.; Baumann, R.R.
Aufsatz in Buch
2014Printed elliptically polarized transponder antenna for UHF-RFID metal item tagging
Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2014Pulsed DC magnetron sputtered piezoelectric thin film aluminum nitride - Technology and piezoelectric properties
Stoeckel, C.; Kaufmann, C.; Hahn, R.; Schulze, R.; Billep, D.; Gessner, T.
Zeitschriftenaufsatz
2014Pulsed Jet Actuator development for the integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L.
Konferenzbeitrag
2014Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Zeitschriftenaufsatz
2014Raman spectroscopy study of the interaction of gold nanoparticles with carbon-nanotubefield-effect transistors
Kalbacova, Jana; Rodriguez, Raul D.; Blaudeck, T.; Hermann, S.; Sheremet, E.; Adner, David; Lang, Heinrich; Schulz, S.E.; Zahn, Dietrich R.T.
Konferenzbeitrag
2014Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H.
Aufsatz in Buch
2014Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2014Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Reliability of new SiC BJT power modules for fully electric vehicles
Otto, A.; Kaulfersch, E.; Brinkfeldt, K.; Neumaier, K.; Zschieschang, O.; Andersson, D.; Rzepka, S.
Konferenzbeitrag
2014Replacing TCO electrodes in dye sensitized solar cells by metal grids
Hilleringmann, U.; Kleine, A.
Konferenzbeitrag
2014Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B.
Konferenzbeitrag
2014Resolution and speed improvements of mid-infrared Fabry-Perot microspectrometers for the analysis of hydrocarbon gases
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S.
Konferenzbeitrag
2014Roll-to-roll infrared sintering of gravure printed silver patterns in applications of back-injection-molded functional lightweight structures
Hartwig, M.; Ueberfuhr, P.; Mischke, A.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kurth, S.; Kroll, L.; Gessner, T.; Baumann, R.R.
Konferenzbeitrag
2014A satellite multiple-beam antenna for high-rate data relays
Greda, L.A.; Winterstein, A.; Dreher, A.; Figur, S.A.; Schoenlinner, B.; Ziegler, V.; Haubold, M.; Brueck, M.W.
Zeitschriftenaufsatz
2014Self-Assembly of Ordered Colloidal Nanoparticle Films in Few-Micron Wide Laser-Desorbed Lines of Octadecylsiloxane Monolayers on Silicon Oxide Surfaces
Belgardt, Christian; Blaudeck, T.; Borczyskowsi, Christian von; Graaf, Harald
Zeitschriftenaufsatz
2014Semiconducing nanoparticles for field effect transistor integration on foils
Hilleringmann, U.; Wolff, K.; Vidor, F.F.; Assion, F.
Aufsatz in Buch
2014Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael
Konferenzbeitrag
2014Silizium-Halbleitertechnologie. Grundlagen mikroelektronischer Integrationstechnik. 6., korr. und verb. Aufl.
Hilleringmann, U.
Buch
2014SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
2014Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2014Simulations of 3rd order voltage switched CP-PLL using a fast event switching macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Hangmann, C.; Hedayat, C.
Konferenzbeitrag
2014Simultaneous damage detection and deflection measurement of morphing wing structures by fiber optic sensing system
Djinovic, Z.; Scheerer, M.; Tomic, M.; Stojkovic, M.; Schueller, M.
Konferenzbeitrag
2014Smart monitoring systems for a green future
Saupe, R.; Stock, V.; Otto, T.; Kurth, S.; Hiller, K.; Meinig, M.; Neumann, N.; Gessner, T.
Konferenzbeitrag
2014Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T.
Buch
2014Smart universal power antenna for optimized wireless energy transfer - SUPA
Büker, M.J.; Hilleringmann, U.; Geneiß, V.; Hedayat, C.
Aufsatz in Buch
2014Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C.
Konferenzbeitrag
2014Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2014Stability analysis of a charge pump phase-locked loop using autonomous difference equations
Hangmann, C.; Hedayat, C.; Hilleringmann, U.
Zeitschriftenaufsatz
2014Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A.
Konferenzbeitrag
2014Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A.
Konferenzbeitrag
2014Strategies for responding to the reliability challenges of future smart systems
Rzepka, S.; Andersson, D.; Vandevelde, B.
Konferenzbeitrag
2014Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B.
Konferenzbeitrag, Zeitschriftenaufsatz
2014Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2014Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S.
Aufsatz in Buch
2014Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Aufsatz in Buch
2014Strong localization in defective carbon nanotubes: A recursive Green's function study
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2014Structural health monitoring with quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Ueberfuhr, P.; Tofighi, G.; Gordan, O.D.; Dzhagan, V.M.; Lang, H.; Baumann, R.R.; Zahn, D.R.T.; Otto, T.; Gessner, T.; Kroll, L.
Konferenzbeitrag
2014Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture
Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T.
Konferenzbeitrag
2014Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A.
Zeitschriftenaufsatz
2014Tailored printed primary battery system for powering a diagnostic device
Willert, A.; Killard, A.J.; Baumann, R.R.
Zeitschriftenaufsatz
2014Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T.
Konferenzbeitrag
2014Technology approaches for tuneable IR Fabry-Perot-Filters applied in gas sensing microspectrometers
Hiller, K.; Meinig, M.; Kurth, S.; Seifert, M.; Helke, C.; Neumann, N.; Ebermann, M.
Aufsatz in Buch
2014Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A.
Zeitschriftenaufsatz
2014Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B.
Konferenzbeitrag
2014Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S.
Konferenzbeitrag
2014Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M.
Aufsatz in Buch
2014Tip-Enhanced Raman Spectroscopy for the Characterization of Carbon Nanotubes
Sheremet, E.; Rodriguez, Raul D.; Krayev, A.; Kalbacova, Jana; Hermann, S.; Schulz, S.E.; Zahn, Dietrich R.T.
Konferenzbeitrag
2014Untersuchung des Risswachstums in 3D - Verformungsmessung mittels Röntgenmikrotomographie
Zeismann, F.; Bode, B.; Motoyashiki-Besel, Y.; Brueckner-Foit, A.; Tomizato, F.; Kobayashi, M.; Toda, H.; Uesugi, K.; Takeuchi, A.; Suzuki, Y.; Haase, S.; Erb, R.; Seiler, B.; Dost, M.
Konferenzbeitrag
2014Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2014Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Zeitschriftenaufsatz
2014Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles
Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T.
Konferenzbeitrag
2014ZnO-Feldeffekttransistoren für flexible elektronische Schaltungen
Hilleringmann, U.; Vidor, F.F.
Konferenzbeitrag
2013The 2nd International Conference on Engineering of Technology Innovation (ICETI 2012) Kaohsiung, Taiwan, Nov. 2-6, 2012
Hsieh, W.-H.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
20133D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Hofmann, L.; Baum, M.; Schulz, S.E.; Wiemer, M.; Geßner, T.
Konferenzbeitrag
20133D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel, S.; Gorecki, C.; Baranski, M.; Passilly, N.; Wiemer, M.; Jia, C.; Frömel, J.
Konferenzbeitrag
20133D range scan enhancement using image-based methods
Herbort, S.; Gerken, B.; Schugk, D.; Wöhler, C.
Zeitschriftenaufsatz
2013Actuator net design for morphing wing structure
Gratias, A.; Schueller, M.; Lipowski, M.; Dimino, I.
Konferenzbeitrag
2013An adaptive control system for wing TE shape control
Dimino, I.; Concilio, A.; Schueller, M.; Gratias, A.
Konferenzbeitrag
2013Advanced mixed-mode bending test experimental-numerical characterization of the critical energy release rate Gc including mixed-mode-angle psi in interfaces under independent external loads
Schulz, M.; Springborn, M.; Keller, J.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2013Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Aluminum-germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
Goßler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Köhler, K.; Schwarz, U.T.; Wagner, J.
Zeitschriftenaufsatz
2013Analysis of metal-metal contacts in RF MEMS switches
Kurth, S.; Voigt, S.; Haas, S.; Bertz, A.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Konferenzbeitrag
2013Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M.; Haubold, M.; Besser, J.; Wiemer, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Characterization and analysis of the hysteresis in a ZnO nanoparticle thin-film transistor
Vidor, F.F.; Wirth, G.; Assion, F.; Wolff, K.; Hilleringmann, U.
Zeitschriftenaufsatz
2013Characterization of the thermo-mechanical deformation behaviour of composite materials for power electronics using digital image correlation method microDAC
Seiler, B.; Dudek, R.; Scheiter, L.; Kreyssig, K.; Haase, S.
Konferenzbeitrag
2013Clean Sky – European Technology Demonstration for greener Aviation
Kaulfersch, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Combined method for thermal characterization of high power semiconductors
Merten, E.; Abo Ras, M.; Essen, T. von; Schacht, R.; May, D.; Winkler, T.; Michel, B.
Konferenzbeitrag
2013Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes
Zienert, A.; Schuster, J.; Gessner, T.
Zeitschriftenaufsatz
2013Conductive AFM for CNT characterization
Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Controlling SWCNT assembling density by electrokinetics
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E.
Zeitschriftenaufsatz
2013Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, M.; Waechtler, T.; Müller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T.
Zeitschriftenaufsatz
2013COSIVU – Compact, Smart and Reliable Drive Unit for Fully Electric Vehicles
Rzepka, S.; Otto, A.
Konferenzbeitrag
2013Customized printed batteries driving sensor applications
Willert, A.; Baumann, R.R.
Konferenzbeitrag
2013Degree of integration enhancement of membrane actuators in LOCs utilizing laser technology
Geidel, S.; Enderlein, T.; Nestler, J.; Morschhauser, A.; Otto, T.; Gessner, T.
Konferenzbeitrag
2013Design and analysis of UHF RFID tag for a rubber transmission belt based on 3D electrical model
Kanwar, K.; Geneiss, V.; Mager, T.; Sheele, S.; Ballhausen, U.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2013Design and Implementation of a High Temperature Control Monitoring Applied to Micro Thermoelectric Generators
Juca, S.C.S.; Carvalho, P.C.M.; Pereira, R.I.S.; Petrov, D.; Hilleringmann, U.
Konferenzbeitrag
2013Design and implementation of a measurement system for automatically measurement of electrical parameters of thermoelectric generators
Petrov, D.; Assion, F.; Hilleringmann, U.
Konferenzbeitrag
2013Design and simulation of nanomaterial-enhanced LTCC integrated inductors
Lin, Y.-C.; Gabler, F.; Tanaka, S.; Esashi, M.; Gessner, T.
Konferenzbeitrag
2013Design, fabrication and characterization of MEMS probe card for fine pitch IC testing
Yuan, T.; Chen, D.; Chen, J.; Fu, H.; Kurth, S.; Otto, T.; Gessner, T.
Zeitschriftenaufsatz
2013Designing output-power-optimized thermoelectric generators via analytic and finite element method modelling
Assion, F.; Fischer, C.; Schönhof, M.; Hilleringmann, U.; Hedayat, C.
Konferenzbeitrag
2013Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Maus, I.; Pape, H.; Nabi, H.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2013Determination of parameters with uncertainties for quality control in MEMS fabrication
Gennat, M.; Meinig, M.; Shaporin, A.; Kurth, S.; Rembe, C.; Tibken, B.
Zeitschriftenaufsatz
2013Determination of surface energy characteristics of plasma processed ultra low-k dielectrics for optimized wetting in wet chemical plasma etch residue removal
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Konferenzbeitrag
2013Development and characterisation of 3D integration technologies for MEMS based on copper filled TSVs and copper-to-copper metal thermo compression bonding
Baum, M.; Hofmann, L.; Wiemer, M.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2013Development and characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics
Koehler, D.; Hiller, K.; Forke, R.; Konietzka, S.; Pohle, A.; Billep, D.; Heinz, S.; Lange, A.
Konferenzbeitrag
2013Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S.
Konferenzbeitrag
2013Direct integration of field effect transistors as electro mechanical transducer for stress
Haas, S.; Reuter, D.; Bertz, A.; Gessner, T.; Schramm, M.; Loebel, K.-U.; Horstmann, J.T.
Konferenzbeitrag
2013DoE Simulation for a Micro Cantilever with a Piezo Resistivity Sensor
Schindler-Saefkow, F.; Wiora, N.
Zeitschriftenaufsatz
2013Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
Wunderle, B.; Manier, C.-A.; Abo Ras, M.; Springborn, M.; May, D.; Oppermann, H.; Toepper, M.; Mrossko, R.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Konferenzbeitrag
2013Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Energy efficiency enhancements for semiconductors, communications, sensors and software achieved in cool silicon cluster project
Ellinger, F.; Mikolajick, T.; Fettweis, G.; Hentschel, D.; Kolodinski, S.; Warnecke, H.; Reppe, T.; Tzschoppe, C.; Dohl, J.; Carta, C.; Fritsche, D.; Tretter, G.; Wiatr, M.; Kronholz, S.D.; Mikalo, R.P.; Heinrich, H.; Paulo, R.; Wolf, R.; Hübner, J.; Waltsgott, J.; Meißner, K.; Richter, R.; Michler, O.; Bausinger, M.; Mehlich, H.; Hahmann, M.; Möller, H.; Wiemer, M.; Holland, H.-J.; Gärtner, R.; Schubert, S.; Richter, A.; Strobel, A.; Fehske, A.; Cech, S.; Aßmann, U.; Pawlak, A.; Schröter, M.; Finger, W.; Schumann, S.; Höppner, S.; Walter, D.; Eisenreich, H.; Schüffny, R.
Zeitschriftenaufsatz
2013Enhanced event-driven modeling of a CP-PLL with nonlinearities and nonidealities
Hangmann, C.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2013Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment
Luo, J.; Billep, D.; Waechtler, T.; Otto, T.; Toader, M.; Gordan, O.; Sheremet, E.; Martin, J.; Hietschold, M.; Zahn, D.R.T.; Gessner, T.
Zeitschriftenaufsatz
2013Erweiterungen und Anwendungen der BDRIE-Technologie zur Herstellung hermetisch gekapselter Sensoren mit hoher Güte
Hiller, K.; Hahn, S.; Kuechler, M.; Billep, D.; Forke, R.; Koehler, D.; Konietzka, S.; Pohle, A.; Gessner, T.
Konferenzbeitrag
2013Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2013Experimental modal analysis versus 3d surface digitization, two methods for detection of assembly failures in engine manufacturing
Brabandt, I.; Hasse, S.; Hartmann, T.; Ruemmler, N.
Konferenzbeitrag
2013Extended Hückel Theory for Carbon Nanotubes: Band Structure and Transport Properties
Zienert, A.; Schuster, J.; Gessner, T.
Zeitschriftenaufsatz
2013Fabrication of subwavelength holes using nanoimprint lithography
Weiss, A.; Besser, J.; Baum, M.; Saupe, R.; Otto, T.; Gessner, T.
Konferenzbeitrag
2013FEM-basierte Zuverlässigkeitsprognostik für die Verbindungstechnik in der Leistungselektronik
Dudek, R.; Doering, R.; Seiler, B.
Aufsatz in Buch
2013Fiber optic system for deflection and damage detection in morphing wing structures
Scheerer, M.; Djinovic, Z.; Schüller, M.
Konferenzbeitrag
2013Finite Element Analysis for BEOL Stress Engineering to Improve Yield and Reliability of sub-30 nm Structures
Kaulfersch, E.; Braemer, B.; Rzepka, S.; Breuer, D.; Cluass, E.; Feustel, F.
Konferenzbeitrag
2013Finite-Element-Modelling of Intermetallics in Solders
Sommer, J.-P.; Dudek, R.; Michel, B.
Konferenzbeitrag
2013Flip-chip packaging of piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A.
Konferenzbeitrag
2013Formation and properties of TiSi2 as contact material for high-temperature thermoelectric generators
Assion, F.; Schönhoff, M.; Hilleringmann, U.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Formation and Properties of TiSi2 as Contact Material for High-temperature Thermoelectric Generators
Assion, F.; Schoenhoff, M.; Hilleringmann, U.
Konferenzbeitrag
2013Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2012
 
Jahresbericht
2013Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth, S.; Nowack, M.; Voigt, S.; Bertz, A.; Froemel, J.; Kaufmann, C.; Gessner, T.; Akiba, A.; Ikeda, K.
Aufsatz in Buch
2013Imaging device and method for optical 3d deformation characterization of materials. composites and components.
Dost, M.; Scheiter, L.; Seiler, B.; Lauenstein, T.; Haase, S.
Konferenzbeitrag
2013Inkjet printing as a tool for the patterned deposition of octadecylsiloxane monolayers on silicon oxide surfaces
Belgardt, C.; Sowade, E.; Blaudeck, T.; Baumgärtel, T.; Graaf, H.; Borczyskowski, C. von; Baumann, R.R.
Zeitschriftenaufsatz
2013Inkjet Printing of Microsieves and Reinforcing Patterns for Fragile Microsieves
Hammerschmidt, J.; Gläser, K.; Ueberfuhr, P.; Wolf, F.M.; Goedel, W.A.; Baumann, R.R.
Konferenzbeitrag
2013Inkjet-printed organic electronics: Operational stability and reliability issues
Medeiros, M.C.R.; Martinez-Domingo, C.; Ramon, E.; Negrier, A.T.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; McCulloch, I.; Carrabina, J.; Gomes, H.L.
Konferenzbeitrag
2013Inkjet-printed organic electronics: Traps, operational stability and reliability issues
Martinez-Domingo,C.; Medeiros, M.C.R.; Sowade, E.; Mitra, K.Y.; Ramon, E.; Baumann, R.R.; Gomes, H.L.
Abstract
2013Inkjet-Printed Rectifying Metal-Insulator-Semiconductor (MIS) Diodes for Flexible Electronic Applications
Mitra, K.Y.; Martinez, C.; Sowade, E.; Ramon, E.; Gomes, H.L.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Der Inkjetdruck als Beschichtungstechnologie für funktionale Schichtsysteme
Sowade, E.; Hammerschmidt, J.; Mitra, K.Y.; Weise, D.; Kang, H.; Baumann, R.R.
Konferenzbeitrag
2013Integrated smart systems for theranostic applications
Haubold, M.; Baum, M.; Wiemer, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Integration and fabrication of PZT and metallic glass films for micro-mirror device
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Konferenzbeitrag
2013Integration eines photometrischen Stereoverfahrens in ein Laserscanner-System zur 3D-Oberflächenrekonstruktion
Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C.; Herbort, S.; Woehler, C.
Konferenzbeitrag
2013Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration
Lu, H.-S.; Gottfried, K.; Ahner, N.; Schulz, S.; Qu, X.-P.
Zeitschriftenaufsatz
2013Investigation of the failure mode formation in BGA components subjected to JEDEC drop test
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J.
Konferenzbeitrag
2013Investigations on partially filled HAR TSVs for MEMS applications
Hofmann, L.; Schubert, I.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2013Joint Technology Initiative Clean Sky - Aims for greener Aviation
Schueller, M.; Kaulfersch, E.; Lipowski, M.
Konferenzbeitrag
2013Kombinierte Zuverlässigkeitstests für die Elektromobilität
Otto, A.; Matkowski, P.; Winkler, T.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2013Laterally stacked organic devices fabricated by trench technology
Reuter, D.; Banerjee, S.; Fronk, M.; Salvan, G.; Hiller, K.; Zahn, D.R.T.; Gessner, T.
Konferenzbeitrag
2013Low temperature wafer bonding technology for RF based MEMS devices
Haubold, M.; Figur, S.; Schoenlinner, B.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2013LTCC-based three dimensional inductors with nano-ferrite embedded core for one-chip tunable RF system
Lin, Y.-C.; Gabler, F.; Tsai, Y.-C.; Tanaka, S.; Gessner, T.; Esashi, M.
Konferenzbeitrag
2013Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures
Salvan, G.; Robaschik, P.; Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Schubert, C.; Thomas, S.; Albrecht, M.; Zahn, D.R.T.
Zeitschriftenaufsatz
2013Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique
Jankowski, K.; Swierczynski, R.; Urbanski, K.; Wymyslowski, A.; Chicot, D.; Dudek, R.
Konferenzbeitrag
2013Manipulation of Ni catalyst particle size, shape and areal density on TiN support layer for growth of vertical aligned CNTs
Tittmann, J.; Hermann, S.; Fiedler, H.; Schulz, S.E.; Gessner, T.
Abstract
2013Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Metallic glass micro-mirror integrated with PZT actuation for low resonant frequency and large exciting angle
Tsai, Y.-C.; Lee, J.-W.; Naono, T.; Lin, Y.-C.; Esashi, M.; Fujii, T.; Gessner, T.
Konferenzbeitrag
2013Micromarking of plastic substrates by applying Q-switched fiber IR laser radiation
Sivakumar, G.; Heinz, S.; Willert, A.; Baumann, R.R.
Zeitschriftenaufsatz
2013Mikrofluidisches System für Agglutinationsuntersuchungen
Morschhauser, A.; Geidel, S.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2013Modeling and simulation of the interplay between contact metallization and stress liner technologies for strained silicon
Schuster, J.; Schulz, S.E.; Herrmann, T.; Richter, R.
Zeitschriftenaufsatz
2013Modellierungsansatz zur thermo-mechanischen Analyse von gesinterten Halbleiterbauelementen in der Leistungselektronik
Dudek, R.; Guenther, M.; Sommer, J.-P.; Doering, R.; Kreyssig, K.
Zeitschriftenaufsatz
2013Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer, M.; Wuensch, D.; Froemel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passily, N.; Gorecki, C.
Konferenzbeitrag
2013Nanoporous gold for MEMS packing applications
Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.
Zeitschriftenaufsatz
2013A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M.
Konferenzbeitrag
2013New Reliability Testing Methods for Electromobility Applications
Otto, A.; Matkowski, P.; Brabandt, I.; Winkler, T.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2013New Test Bench for Active Power Cycling Tests
Otto, A.; Vohra, A.; Rzepka, S.
Konferenzbeitrag
2013Optimization of biogas production using MEMS based near infrared inline-sensor
Saupe, R.; Seider, T.; Stock, V.; Kujawski, O.; Otto, T.; Gessner, T.
Konferenzbeitrag
2013Optimization of MEMS/NEMS for reliable resonance frequencies
Stoeckel, C.; Hofmann, K.; Forke, R.; Billep, D.; Gessner, T.
Konferenzbeitrag
2013Optimized printing conditions for gravure-printed silver conductive layer in flexible OPV applications
Tran-Le,A.; Kang, H.; Baumann, R.R.
Konferenzbeitrag
2013Package Characterization with Stress Chip Measurements for Health Monitoring
Rost, F.; Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Parametric transient thermo-electrical PSPICE model for a power cable
Schacht, R.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Particle-free gold metal–organic decomposition ink for inkjet printing of gold structures
Schoner, C.; Tuchscherer, A.; Blaudeck, T.; Jahn, S.F.; Baumann, R.R.
Zeitschriftenaufsatz
2013Photonic sintering of inkjet printed copper oxide layer
Kang, H.; Sowade, E.; Baumann, R.R.
Konferenzbeitrag
2013Picosecond Laser Micromachining in the context of MEMS/NEMS applications
Enderlein, T.; Helke, C.; Hiller, K.; Nestler, J.; Schueller, M.; Geidel, S.; Otto, T.; Gessner, T.
Konferenzbeitrag
2013Piezoelectric Accelerometer Based on Micro Injection Molded Polymers
Schulze, R.; Heinrich, M.; Wegener, M.; Forke, R.; Billep, D.; Gessner, T.
Konferenzbeitrag
2013Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments
Schondelmaier, G.; Hartmann, S.; May, D.; Shaporin, A.; Voigt, S.; Rodriguez, R.D.; Gordan, O.D.; Zahn, D.R.T.; Mehner, J.; Hiller, K.; Wunderle, B.
Konferenzbeitrag
2013Precise determination of piezoelectric longitudinal charge coefficients for piezoelectric thin films assisted by finite element modeling
Stoeckel, C.; Kaufmann, C.; Schulze, R.; Billep, D.; Gessner, T.
Konferenzbeitrag
2013Printed antennas: From theory to praxis, challenges and applications
Zichner, R.; Baumann, R.R.
Zeitschriftenaufsatz
2013Printing of GHz antenna pattern on flexible substrates for the manufacturing of intelligent light-weight structures
Ueberfuhr, P.; Siegel, F.; Grossmann, T.; Gaitzsch, M.; Kurth, S.; Baumann, R.R.
Konferenzbeitrag
2013Printing technologies for pyrotechnic devices - a design study
Weiss, U.; Espig, M.; Helmert, M.; Weise, D.; Baumann, R.R.
Konferenzbeitrag
2013R2R Screen Printed RFID Transponder Antennas for Vehicle Tracking Systems
Zichner, R.; Baumann, R.R.
Zeitschriftenaufsatz
2013Reaktives Bonden
Braeuer, J.; Freitag, A.; Dietrich, T.R.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2013Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Reliability of advanced thermal interface technologies based on sintered die-attach materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2013Reliability simulation on solder joints for high temperature application
Dudek, R.; Doering, R.
Konferenzbeitrag
2013Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Ihle, Martin; Ziesche, Steffen; Roscher, Frank; Capraro, Beate; Partsch, Uwe
Konferenzbeitrag
2013Resistivity reduction in flexible dye sensitized solar cells by UV irradiation and carbon nanotubes
Hilleringmann, U.; Ohms, B.; Kleine, A.
Konferenzbeitrag
2013Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Roll-to-roll screen printed radio frequency identification transponder antennas for vehicle tracking systems
Zichner, R.; Baumann, R.R.
Konferenzbeitrag, Zeitschriftenaufsatz
2013Schichtsystem mit einer Schicht aus parallel zueinander angeordneten Kohlenstoffröhren und einer elektrisch leitenden Deckschicht, Verfahren zur Herstellung des Schichtsystems und dessen Verwendung in der Mikrosystemtechnik
Schulz, Stefan; Hermann, Sascha; Geßner, Thomas
Patent
2013Self-organization of nanospheres in trenches on silicon surfaces
Brassat, K.; Assion, F.; Hilleringmann, U.; Lindner, J.K.N.
Zeitschriftenaufsatz
2013Simulative characterization of the stability for second order voltage switched CP-PLL
Ali, E.; Rahajandraibe, W.; Haddad, F.; Hedayat, C.; Hangmann, C.
Konferenzbeitrag
2013Smart systems for a better life
Gessner, T.; Vogel, M.; Nestler, J.; Hiller, K.; Kurth, S.; Otto, T.
Konferenzbeitrag
2013Smart Systems Integration - trends in the field of smart medtech systems
Gessner, T.; Nestler, J.; Vogel, M.; Otto, T.
Konferenzbeitrag
2013Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature
Froemel, J.; Wiemer, M.; Tanaka, S.; Esashi, M.; Gessner, T.
Konferenzbeitrag
2013Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J.
Konferenzbeitrag
2013Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Winkler, T.; Wunderle, B.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2013Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors
Haas, S.; Schramm, M.; Loebel, K.-U.; Heinz, S.; Reuter, D.; Bertz, A.; Horstmann, J.T.; Gessner, T.
Konferenzbeitrag
2013System Design of Double Wall Synthetic Jet Actuators
Lipowski, M.; Schueller, M.; Schulze, R.
Konferenzbeitrag
2013Tailored printed primary battery system developed for a diagnostic system
Willert, A.; Helmert, M.; Chikushi, N.; Espig, M.; Baumann, R.R.
Konferenzbeitrag
2013Technologieentwicklung für optimiertes MEMS Packaging durch Si-TSV-Rückseitenkontaktierung
Meinecke, C.; Hofmann, L.; Bertz, A.; Gottfried, K.; Gessner, T.
Konferenzbeitrag
2013Titanium disilicide as high-temperature contact material for thermoelectric generators
Assion, F.; Schönhoff, M.; Hilleringmann, U.
Zeitschriftenaufsatz, Konferenzbeitrag
2013Toolbox for visco-elastic material modeling of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Brabandt, I.; Michel, B.
Konferenzbeitrag
2013Transient thermal response as failure analytical tool - a comparison of different techniques
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Konferenzbeitrag
2013Transient thermal techniques as failure analytical tool
May, D.; Wunderle, B.; Schacht, R.
Konferenzbeitrag
2013TSVs mit hohem Aspektverhältnis und Kupfer-Bonden für MEMS
Hofmann, L.; Baum, M.; Gottfried, K.; Schulz, S.E.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2013Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum – FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2013Verfahren zur Fixierung einer beweglichen Komponente eines mikromechanischen Bauelementes
Bertz, Andreas; Schulz, Stefan
Patent
2013Vertical Integration techniques for MEMS using HAR TSV
Hofmann, L.; Schubert, I.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2013Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
Bargiel, S.; Baranski, M.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M.
Konferenzbeitrag
2013Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes
Shaporin, A.; Hermann, S.; Kaufmann, C.; Schulz, S.E.; Gessner, T.; Voigt, S.; Mehner, J.; Hartmann, S.; Wunderle, B.; Bonitz, J.
Konferenzbeitrag
2013Welcome note. International Semiconductor Conference Dresden - Grenoble, ISCDG 2013
Gessner, T.
Konferenzbeitrag
2013Wetting optimized solutions for plasma etch residue removal for application in interconnect systems of integrated circuits
Ahner, N.
Dissertation
2013A Zigbee-based wireless wearable electronic nose using flexible printed sensor array
Lorwongtragool, P.; Baumann, R.R.; Sowade, E.; Watthanawisuth, N.; Kerdcharoen, T.
Konferenzbeitrag
2012Adapted gravure printing process for the production of carbon based electrodes
Siegel, F.; Kohl, A.; Enns, E.; Willert, A.; Deger, W.; Dziallas, H.; Baumann, R.R.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.
Konferenzbeitrag
2012ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks
Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer, M.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012All inkjet-printed chemical gas sensors based on CNT/polymer nanocomposites: Comparison between double printed layers and blended single layer
Lorwongtragool, P.; Sowade, E.; Kerdcharoen, T.; Baumann, R.R.
Konferenzbeitrag
2012Analysis of pore sealing processes and TiN diffusion barrier deposition on a porous ultra low-k dielectric by ellipsometric porosimetry and PALS
Ahner, N.; Ecke, R.; Schulz, S.E.; Jungmann, M.; Krause-Rehberg, R.; Butterling, M.; Anwand, W.; Wagner, A.; Preusse, A.
Konferenzbeitrag
2012Autarkes Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Pfeiffer, M.; Grolms, A.; Kurth, S.; Keutel, T.; Brockmann, C.; Braunschweig, M.; Gessner, T.
Konferenzbeitrag
2012Autonomous sensor network for power line monitoring
Voigt, S.; Kurth, S.; Geßner, T.
Konferenzbeitrag
2012Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications
Fiedler, H.; Ecke, R.; Hermann, S.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study
Sommer, J.; Zienert, A.; Gemming, S.; Schuster, J.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Battery management network for fully electrical vehicles featuring smart systems at cell and pack level
Otto, A.; Rzepka, S.; Mager, T.; Michel, B.; Lanciotti, C.; Günther, T.; Kanoun, O.
Konferenzbeitrag
2012Bonding technologies for standard bulk PZT ceramics without the need of after process-polarization especially on thin silicon membranes
Helke, C.; Schueller, M.; Hiller, K.; Schulze, R.; Braeuer, J.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.
Konferenzbeitrag
2012Central challenges when up scaling the manufacturing of thin-film battery applications
Espig, M.; Siegel, F.; Hammerschmidt, J.; Willert, A.; Baumann, R.R.
Konferenzbeitrag
2012Chances and limits of computer tomography in materialographic investigations
Faust, W.; Noack, E.; Michel, B.
Zeitschriftenaufsatz
2012Chip-based optical sensor to determine the arterial oxygen concentration
Möbius, M.; Weiss, A.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Comparison of lumped and finite element modeling for thermoelectric devices
Streit, P.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Zeitschriftenaufsatz
2012Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2012Design and implementation of a measurement system for automatically measurement of electrical parameters of thermoelectric generators
Petrov, D.; Assion, F.; Hilleringmann, U.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Design and manufacturing of micro synthetic jet actuators
Gebauer, C.; Schueller, M.; Hiller, K.; Schulze, R.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Determination of interface fracture parameters by shear testing using different theoretical approaches
Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.
Konferenzbeitrag
2012Development and characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics
Koehler, D.; Hiller, K.; Forke, R.; Konietzka, S.; Pohle, A.; Billep, D.; Heinz, S.; Lange, A.
Konferenzbeitrag
2012Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.
Konferenzbeitrag
2012Device for storing power supply information of e.g. TV, supplies electrical charge carriers to nanoparticles selectively in regions in specific operating state
Reuter, Danny; Geßner, Thomas; Morschhauser, Andreas; Otto, Thomas; Martin, Jörg; Kießling, Torsten; Piasta, Doreen
Patent
2012DFT investigations of the piezoresistive effect of carbon nanotubes for sensor application
Wagner, C.; Schuster, J.; Gessner, T.
Zeitschriftenaufsatz
2012Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2012Disturbance factors in a one impression gravure printing process for the production of PEM fuel cell electrodes
Siegel, F.; Kohl, A.; Enns, E.; Willert, A.; Deger, W.; Dziallas, H.; Baumann, R.R.
Konferenzbeitrag
2012The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Poshtan, E.A.; Rzepka, S.; Wunderle, B.; Silber, C.; Bargen, T. von; Michel, B.
Konferenzbeitrag
2012Electrical characterization of rubber mixture sheets based on a coaxial probe method in combination with 3D electromagnetic simulation model
Kanwar, K.; Fischer, C.; Geneiss, V.; Mager, T.; Ballhausen, U.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2012Electronic device integration on foils using semiconductor nanoparticles
Hilleringmann, U.; Wolff, K.; Assion, F.; Vidor, F.F.; Wirth, G.I.
Konferenzbeitrag
2012Entwurfsmethodik für induktive Energieübertragungssysteme
Büker, M.-J.; Geneiß, V.; Hedayat, C.; Hilleringmann, U.
Konferenzbeitrag
2012Erarbeitung einer Raumtemperatur-Bondtechnologie in der Mikrosystemtechnik
Bräuer, J.; Schneider, W.; Dietrich, T.R.; Brode, W.; Schäfer, R.
Zeitschriftenaufsatz
2012Experimental and numerical methods for evaluation of interface cracks in electronics systems
Keller, J.; Schulz, M.; Wunderle, B.; Auersperg, J.; Michel, B.
Konferenzbeitrag
2012Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten
Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D.
Konferenzbeitrag
2012Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Konferenzbeitrag
2012Fabrication of freestanding Pb(Zr,Ti)O film microstructures using Ge sacrificial layer
Lee, J.-W.; Kawai, Y.; Tanaka, S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Zeitschriftenaufsatz
2012Fabry-Perot tunable infrared filter based on structured reflectors
Kurth, S.; Hiller, K.; Neumann, N.; Seifert, M.; Ebermann, M.; Specht, H.; Meinig, M.; Gessner, T.
Konferenzbeitrag
2012FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S.
Konferenzbeitrag
2012Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung
Vogel, K.; Baum, M.; Roscher, F.; Kinner, R.; Rank, H.; Mayer, T.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Field emitting carbon nanotubes in MEMS-structures for movement sensors
Loschek, S.; Hermann, S.; Haibo, Y.; Schulz, S.E.
Konferenzbeitrag
2012Formation principles and ligand dynamics of nanoassemblies of CdSe quantum dots and functionalised dye molecules
Blaudeck, T.; Zenkevich, E.I.; Abdel-Mottaleb, M.M.S.; Szwaykowska, K.; Kowerko, D.; Cichos, F.; Borczyskowski, C. von
Zeitschriftenaufsatz
2012Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2011
 
Jahresbericht
2012Frictionless air flow blade fan for thermal management of electronics
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B.
Konferenzbeitrag
2012Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
2012Health Monitoring durch In-situ Messung der Eigenspannungen im Package
Rost, F.; Schindler-Saefkow, F.; Schulz, M.; Otto, A.; Rzepka, S.
Konferenzbeitrag
2012A hierarchic bonding procedure for the assembly of micro confocal microscope
Jia, C.; Frömel, J.; Wiemer, M.; Gessner, T.; Bargiel, S.; Passilly, N.; Baraski, M.; Gorecki, C.
Konferenzbeitrag
2012Highly-integrated lab-on-chip system for point-of-care multiparameter analysis
Schumacher, Soeren; Nestler, Jörg; Otto, Thomas; Wegener, Michael; Ehrentreich-Förster, Eva; Michel, Dirk; Wunderlich, Kai; Palzer, Silke; Sohn, Kai; Weber, Achim; Burgard, Matthias; Grzesiak, Andrzej; Teichert, Andreas; Brandenburg, Albrecht; Koger, Birgit; Albers, Jörg; Nebling, Eric; Bier, Frank F.
Zeitschriftenaufsatz
2012Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2012Hochpräzise Konturerfassung unstetiger heterogener Oberflächen mit weitgehend unbekannter Topologie
Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C.
Konferenzbeitrag
2012Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems
Pantou, R.; Shah, D.L.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2012In-flight inkjet self-assembly of spherical nanoparticle aggregates
Sowade, E.; Hammerschmidt, J.; Blaudeck, T.; Baumann, R.R.
Zeitschriftenaufsatz
2012In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.
Konferenzbeitrag
2012Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation
Pufall, R.; Goroll, M.; Kanert, W.; Dudek, R.
Konferenzbeitrag
2012Influence of post-treatment strategies in Inkjet printing on the morphology of layers and the functional performances of electronic devices
Hammerschmidt, J.; Sowade, E.; Mitra, K.Y.; Wohlleben, L.M.; Baumann, R.R.
Konferenzbeitrag
2012The influence of post-treatment strategies in inkjet printing on the morphology of layers and the functional performances of electronic devices
Hammerschmidt, J.; Sowade, E.; Mitra, K.Y.; Wohlleben, L.M.; Baumann, R.R.
Konferenzbeitrag
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2012Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Inkjet printing of chemiresistive sensors based on polymer and carbon nanotube networks
Lorwongtragool, P.; Sowade, E.; Dinh, T.N.; Kanoun, O.; Kerdcharoen, T.; Baumann, R.R.
Konferenzbeitrag
2012Inkjet printing of chemiresistive sensors for the detection of volatile organic compounds
Lorwongtragool, P.; Sowade, E.; Hammerschmidt, J.; Kerdcharoen, T.; Baumann, R.R.
Konferenzbeitrag
2012Inkjet printing of reinforcing patterns for the mechanical stabilization of fragile polymeric microsieves
Hammerschmidt, J.; Wolf, F.M.; Goedel, W.A.; Baumann, R.R.
Zeitschriftenaufsatz
2012Inkjet system for printing mechanical reinforcing patterns directly on fragile membranes floating on liquid surfaces
Ueberfuhr, P.; Hammerschmidt, J.; Gläser, K.; Goedel, W.A.; Baumann, R.R.
Konferenzbeitrag
2012Integrated nano scale multilayer systems for reactive bonding in microsystems technology
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012Integration of piezoelectric polymer transducers into microsystems for sensing applications
Schulze, R.; Gessner, T.; Schueller, M.; Forke, R.; Billep, D.; Hahn, R.; Heinrich, M.; Sborikas, M.; Wegener, M.
Konferenzbeitrag
2012Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2012Inverter circuits on glass substrates based on ZnO-nanoparticle thin-film transistors
Wolff, K.; Hilleringmann, U.
Zeitschriftenaufsatz
2012Investigation of different nano scale energetic material systems for reactive wafer bonding
Braeuer, J.; Besser, J.; Tomoscheit, E.; Klimm, D.; Anbumani, S.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012Investigation of RFID passive strain sensors based on carbon nanotubes using inkjet printing technology
Benchirouf, A.; Sowade, E.; Al-Hamry, A.; Blaudeck, T.; Kanoun, O.; Baumann, R.
Konferenzbeitrag
2012L10 FePtCu bit patterned media
Brombacher, C.; Grobis, M.; Lee, J.; Fidler, J.; Eriksson, T.; Werner, T.; Hellwig, O.; Albrecht, M.
Zeitschriftenaufsatz
2012Laser micromachining and micro hot embossing for highly integrated lab-on-chip systems
Enderlein, T.; Baum, M.; Nestler, J.; Otto, T.; Besser, J.; Wiemer, M.; John, B.; Hänel, J.; Gessner, T.
Konferenzbeitrag
2012Laser Micromachining for Micro- and Lab-on- Chip-Systems
Nestler, J.; Enderlein, T.; Geidel, S.
Konferenzbeitrag
2012Laserbasierter Multilayer-Fügeprozess zur Erzeugung heterogener und druckstabiler mikrofluidischer Systeme
Geidel, S.; Enderlein, T.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Ligand exchange dynamics and temperature effects upon formation of nanocomposites based on semiconductor CdSe/ZnS quantum dots and porphyrins
Zenkevich, E.I.; Blaudeck, T.; Kowerko, D.; Stupak, A.P.; Cichos, F.; Borczyskowski, C. von
Zeitschriftenaufsatz
2012LoC Integrationsstrategien für aufgerollte Sensoren
Harazim, S.; Helke, C.; Enderlein, T.; Morschhauser, A.; Nestler, J.; Sanchez, S.; Grimm, D.; Otto, T.; Schmidt, O.; Gessner, T.
Konferenzbeitrag
2012Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2012A Low Damage Patterning Scheme for Ultra Low-k Dielectrics
Zimmermann, S.; Ahner, N.; Fischer,T.; Oszinda,T.; Uhlig, B.; Schulz, S.E.; Gessner,T.
Zeitschriftenaufsatz
2012Low temperature metal interdiffusion bonding for micro devices
Frömel, J.; Lin, Y.; Wiemer, M.; Gessner, T.; Esashi, M.
Konferenzbeitrag
2012Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2
Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Manufacturing of Organic Electrochemical Transistors combining Two Printing Technologies and a Self-Aligning Laser Ablation Step
Blaudeck, T.; Heinz, S.; Andersson Ersman, P.; Sandberg, M.; Laiho, A.; Liu, J.; Engquist, I.; Berggren, M.; Baumann, R.R.
Konferenzbeitrag
2012Mass printing Technologies for Technical Applications
Willert, A.; Hammerschmidt, J.; Baumann, R.R.
Konferenzbeitrag
2012Material properties characterization of BiCMOS BEOL metal stacks for RF-MEMS applications
Wietstruck, M.; Kaynak, M.; Zhang, W.; Wolansky, D.; Kurth, S.; Erler, B.; Tillack, B.
Konferenzbeitrag
2012Membrane based sample preparation chip
Morschhauser, A.; Stiehl, C.; Große, A.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M.; Leidich, S.; Reuter, D.; Kurth, S.; Kuechler, M.; Bertz, A.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Micro hot embossing and micro laser welding technologies for fluidic applications
Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012Micro injection moulded MEMS with integrated piezoelectric PVDF
Heinrich, H.; Schulze, R.; Wegener, M.; Kroll, L.; Walther, M.; Schueller, M.; Gessner, T.
Konferenzbeitrag
2012Mikromechanisches kraftgekoppeltes Sensor-Aktuator-System für die resonante Detektion niederfrequenter Schwingungen
Forke, R.
Dissertation
2012Miniaturized frictionless fan concept for thermal management of electronic
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B.
Konferenzbeitrag
2012Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Blský, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Konferenzbeitrag
2012Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen Automobil, Luftfahrt und Elektronik
Michel, B.; Winkler, T.
Konferenzbeitrag
2012Nanomechanics oc CNTs for Sensor Simulation
Wagner, C.; Hartmann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Nanomechanics of CNTs for sensor application
Wagner, C.; Hartmann, S.; Wunderle, B.; Schuster, J.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages
Keller, J.; Schulz, M.; Mrossko, R.; Wunderle, B.; Michel, B.
Konferenzbeitrag
2012Nanoscale optical and electrical characterization of horizontally aligned single-walled carbon nanotubes
Rodriguez, R.D.; Toader, M.; Hermann, S.; Sheremet, E.; Mueller, S.; Gordan, O.D.; Yu, H.; Schulz, S.E.; Hietschold, M.; Zahn, D.R.T.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Nanosensor technology based on semiconductor nanocrystals
Martin, J.; Staudinger, U.; Demir, E.; Spudat, C.; Pötschke, P.; Voit, B.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B.
Konferenzbeitrag
2012A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M.; Lin, Y.; Frömel, J.; Wiemer, M.; Esashi, M.; Geßner, T.
Zeitschriftenaufsatz
2012Novel architecture for battery management systems in fully electrical cars
Rzepka, S.; Otto, A.; Dudek, R.; Michel, B.
Konferenzbeitrag
2012Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012A novel technique for MEMS packaging: Reactive bonding with integrated material systems
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E.
Konferenzbeitrag
2012Optimizing sonication parameters for dispersion of single-walled carbon nanotubes
Yu, H.B.; Hermann, S.; Schulz, S.E.; Gessner, T.; Dong, Z.L.; Li, W.J.
Zeitschriftenaufsatz
2012Out of plane capacitive transducer in air gap insulation microstructures technology for high precision monolithic 3-axis sensors
Reuter, D.; Nowack, M.; Shaporin, A.; Rockstroh, J.; Haas, S.; Bertz, A.; Mehner, J.; Gessner, T.
Konferenzbeitrag
2012Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2
Wuensch, D.; Braeuer, J.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012Plasma-activated bonding
Wiemer, M.; Wuensch, D.; Braeuer, J.; Gessner, T.
Aufsatz in Buch
2012Preparation of spherical, ordered colloidal aggregates using inkjet printing
Sowade, E.; Blaudeck, T.; Baumann, R.R.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Processes for wafer level integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Loschek, S.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B.
Konferenzbeitrag
2012Reaktive nanoskalige Mehrschichtsysteme lösen Temperaturprobleme bei Mikrosystemen
Braeuer, J.; Bonitz, J.
Zeitschriftenaufsatz
2012RIE patterning technology of Zr-based metallic glass for MEMS devices fabrication
Tsai, Y.-C.; Lin, Y.-C.; Abe, T.; Esashi, M.; Gessner, T.
Konferenzbeitrag
2012Ruthenocenes and half-open ruthenocenes: Synthesis, characterization, and their use as CVD precursors for ruthenium thin film deposition
Tuchscherer, A.; Georgi, C.; Roth, N.; Schaarschmidt, D.; Rüffer, T.; Waechtler, T.; Schulze, S.E.; Oswald, S.; Gessner, T.; Lang, H.
Zeitschriftenaufsatz
2012Sensormodul und Verfahren zum Herstellen eines Sensormoduls
Roscher, F.; Baum, M.; Wiemer, M.; Geßner, T.; Gebhardt, C.
Patent
2012Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Wolfrum, J.; Pfeiffer, M.; Keutel, T.; Brockmann, C.; Grosser, V.; Lissek, S.; During, H.; Rusek, B.; Braunschweig, M.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2012Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Kurth, S.; Gessner, T.
Konferenzbeitrag
2012Si interposer technologies for three dimensional AMR sensor systems
Raukopf, S.; Gebhardt, C.; Roscher, F.; Baum, M.; Kinner, R.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2012Simplified large-area manufacturing of organic electrochemical transistors combining printing and a self-aligning laser ablation step
Blaudeck, T.; Ersman, P.A.; Sandberg, M.; Heinz, S.; Laiho, A.; Liu, J.; Engquist, I.; Berggren, M.; Baumann, R.R.
Zeitschriftenaufsatz
2012Simulation of nanostructures for sensor and circuit applications
Zienert, A.; Wagner, C.; Mohammadzadeh, S.; Schuster, J.; Streiter, R.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Simulation von Kohlenstoffnanoröhrchen für NEMS
Wagner, C.; Schuster, J.; Gessner, T.
Konferenzbeitrag
2012Size-dependent non-FRET photoluminescence quenching in nanocomposites based on semiconductor quantum dots CdSe/ZnS and functionalized porphyrin ligands
Zenkevich, E.I.; Blaudeck, T.; Milekhin, A.; Borczyskowski, C. von
Zeitschriftenaufsatz
2012Smart Systems for Different Applications from Fraunhofer ENAS
Vogel, M.; Braeuer, J.; Wiemer, M.; Nestler, J.; Kurth, S.; Otto, T.; Gessner, T.
Aufsatz in Buch
2012Smart Systems Integration - short review and further development of smart systems
Gessner,Thomas; Koehler, Thomas
Konferenzbeitrag
2012Spectral diffusion of quasi localized excitons in single silicon nanocrystals
Martin, J.; Cichos, F.; Borczyskowski, C. von
Zeitschriftenaufsatz
2012Spektral abstimmbare IR-Sensoren für die industrielle Prozessmesstechnik und die medizinische Gasanalyse
Ebermann, M.; Neumann, N.; Hiller, K.; Meinig, M.
Zeitschriftenaufsatz
2012Strain mapping of tensile strained transistors by dark-field off-axis electron holography
Sickmann, J.; Schuster, J.; Richter, R.; Wuerfel, A.; Geisler, H.; Engelmann, H.-J.; Lichte, H.
Abstract
2012Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S.
Konferenzbeitrag
2012Structuring of carbon nanotubes for field emission based movement sensors
Loschek, S.; Hermann, S.; Yu, H.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.
Zeitschriftenaufsatz
2012A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2012Substrate bonding at low temperature by using plasma activated porous gold
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M.
Konferenzbeitrag
2012Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
Besser, J.; Baum, M.; Wiemer, M.; Gessner, T.; Sanchez-Ordonez,S.; Thanner, C.; Vetter, C.
Konferenzbeitrag
2012Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns
Messerschmidt, M.; Schleunitz, A.; Spreu, C.; Werner, T.; Vogler, M.; Reuther, F.; Bertz, A.; Schift, H.; Grüzner, G.
Zeitschriftenaufsatz
2012Thermoelectric Generators with TiSi2 Contacts for High-Temperature Applications
Assion, F.; Schoenhoff, M.; Hilleringmann, U.
Konferenzbeitrag
2012Towards integration of silica membrand based DNA extraction on chip
Morschhauser, A.; Stiehl, C.; Geidel, S.; Nestler, J.; Otto, T.; Gessner, T.
Konferenzbeitrag
2012Transient thermal analysis as failure analytical tool in electronic packaging
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Konferenzbeitrag
2012Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.
Konferenzbeitrag
2012Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy
Kurth, S.; Hiller, K.; Meinig, M.; Gessner, T.
Aufsatz in Buch
2012A two-step UV curing process for producing high tensile stressed silicon nitride layers
Fischer, T.; Prager, L.; Hohage, J.; Ruelke, H.; Schulz, S.E.; Richter, R.; Gessner, T.
Konferenzbeitrag
2012Untersuchungen zum piezoresistiven Effekt in MOS-Transistoren für die Anwendung in integrierten MEMS-Sensoren
Haas, S.; Schramm, M.; Heinz, S.; Loebel, K.-U.; Reuter, D.; Bertz, A.; Gessner, T.; Horstmann, J.T.
Konferenzbeitrag
2012Using of Different Nano Scale Energetic Material Systems for Reactive Bonding
Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.
Abstract
2012Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses
Bargiel, S.; Jia, C.; Baranski, M.; Frömel, J.; Passilly, N.; Gorecki, C.; Wiemer, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2012Vorrichtung zur Erzeugung einer Strömung
Schüller, Martin; Lipowski, M.; Gebauer, C.; Nestler, J.; Otto, T.; Gessner, T.
Patent
2012Wafer level approaches for carbon nanotube integration in interconnects and MEMS/NEMS
Hermann, S.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Haibo, Y.; Loschek, S.; Bonitz, J.; Schulz, S.E.; Gessner, T.
Konferenzbeitrag
2012Widely tunable Fabry-Perot filter based MWIR and LWIR microspectrometers
Ebermann, M.; Neumann, N.; Hiller, K.; Gittler, E.; Meinig, M.; Kurth, S.
Konferenzbeitrag