Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Highly sensitive reflection based colorimetric gas sensor to detect CO in realistic fire scenarios
Pannek, Carolin; Vetter, Thomas; Oppmann, Maximilian; Weber, Christian; Eberhardt, André; Dold, Martin; Bauersfeld, Marie-Luise; Henfling, Michael; Trupp, Sabine; Schug, Benedikt; Wöllenstein, Jürgen; Mandel, Karl-Sebastian
Zeitschriftenaufsatz
2020Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Zeitschriftenaufsatz
2019Design and Realization of a Measuring Circuit for Self-sensing Micro Pumps
Böck, Stephan
: Schrag, Gabriele
Master Thesis
2019Design of a Charge Pump for a 4.3 GHz Frequency Synthesizer in 22 nm FD-SOI CMOS Technology
Zhang, Lei
: Tas, Büsra; Böhme, Enno; Kreupl, Franz
Master Thesis
2019Design of a High Voltage Linear Regulator with Current Sinking Capability for Capacitive Micromachined Ultrasonic Transducer Driver Circuit
Sakolski, Oleg
: Vanselow, Frank
Master Thesis
2019Directed Assembly of Nanoparticle Threshold-Selector Arrays
Speckbacher, M.; Rinderle, M.; Kaiser, W.; Osman, E.A.; Chryssikos, D.; Cattani-Scholz, A.; Gibbs, J.M.; Gagliardi, A.; Tornow, M.
Zeitschriftenaufsatz
2019Elucidation of the functional role of the Q- and I-motif in the human chromatin-remodeling enzyme BRG1
Hoffmeister, Helen; Fuchs, Andreas; Strobl, Laura; Sprenger, Frank; Gröbner-Ferreira, Regina; Michaelis, Stefanie; Hoffmann, Petra; Nazet, Julian; Merkl, Rainer; Längst, Gernot
Zeitschriftenaufsatz
2019Entwicklung eines Messaufbaus zur Charakterisierung piezoelektrischer Keramiken
Ganser, Richard
: Bußmann, Agnes
Bachelor Thesis
2019Entwicklung und Evaluierung eines Dosiersystems zur indirekten Förderung von partikelbeladenen Flüssigkeiten mit integrierter Volumenkontrolle und Partikelzählung
Pommerening, Florian
Master Thesis
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Vortrag
2019Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien. Jahresbericht 2018
 
Jahresbericht
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Buch
2019Identification of Soft Failure Mechanisms Triggered by ESD Stress on a Powered USB 3.0 Interface
Koch, Sebastian; Orr, Benjamin J.; Gossner, H.; Gieser, Horst A.; Maurer, Linus
Zeitschriftenaufsatz
2019Image-based monitoring of oxygenation in microfluidic cell culture
Schmittlein, Carina; Meier, Robert Johannes; Sauer, Lisa; Liebsch, Gregor; Wegener, Joachim
Zeitschriftenaufsatz
2019Impedance-based assays along the life span of adherent mammalian cells in vitro: From initial adhesion to cell death
Stolwijk, Judith A.; Wegener, Joachim
Aufsatz in Buch
2019Impedimetric array in polymer microfluidic cartridge for low cost point-of-care diagnostics
Lakey, A.; Ali, Z.; Scott, S.M.; Chebil, S.; Korri-Youssoufi, H.; Hunor, S.; Ohlander, A.; Kuphal, M.; Marti, J.S.
Zeitschriftenaufsatz
2019Increasing piezo micro diaphragm pump performance by optimizing piezo actuation
Bußmann, Agnes; Grünerbel, Lorenz
Konferenzbeitrag
2019Increasing the throughput of label-free cell assays to study the activation of G-protein-coupled receptors by using a serial agonist exposure protocol
Stolwijk, Judith A.; Skiba, Michael; Kade, Christian; Bernhardt, Günther; Buschauer, Armin; Hübner, Harald; Gmeiner, Peter; Wegener, Joachim
Zeitschriftenaufsatz
2019Indicator Supraparticles for Smart Gasochromic Sensor Surfaces Reacting Ultrafast and Highly Sensitive
Wintzheimer, Susanne; Oppmann, Maximilian; Dold, Martin; Pannek, Carolin; Bauersfeld, Marie-Luise; Henfling, Michael; Trupp, Sabine; Schug, Benedikt; Mandel, Karl
Zeitschriftenaufsatz
2019Integrated Flow for Reverse Engineering of Nanoscale Technologies
Lippmann, Bernhard; Werner, Michael; Unverricht, Niklas; Singla, Aayush; Egger, Peter; Dübotzky, Anja; Gieser, Horst; Rasche, Martin; Kellermann, Oliver; Graeb, Helmut
Konferenzbeitrag
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Aufsatz in Buch
2019Investigation of Shear Forces using Coupled ANSYS Simulation of Micro Diaphragm Pump Dynamics
Ravada, Kiran Vani Himaja
: Durasiewicz, Claudia Patricia
Master Thesis
2019Investigation of Transient Micro Diaphragm Pump Dynamics
Wankhade, Akshay
: Durasiewicz, Claudia
Master Thesis
2019Label-free monitoring of cells in vitro
: Wegener, Joachim
Buch
2019Measuring the Permeability of Endothelial Cell Monolayers: Teaching New Tricks to an Old Dog
Wegener, Joachim
Zeitschriftenaufsatz
2019Mikrowellenplasmaunterstützte Prozesse für Anwendungen in der Halbleitertechnologie
Altmannshofer, Stephan
: Kutter, C.; Eisele, I.
Dissertation
2019Minority carrier lifetime measurements for contactless oxidation process characterization and furnace profiling
Bscheid, Christian; Engst, Christian R.; Eisele, Ignaz; Kutter, Christoph
Zeitschriftenaufsatz
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Konferenzbeitrag
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Zeitschriftenaufsatz
2019One-step transfer printing of patterned nanogap electrodes
Saller, K.B.; Riedl, H.; Lugli, P.; Koblmüller, G.; Tornow, M.
Zeitschriftenaufsatz
2019Pulsed High Current Characterization of Highly Integrated Circuits and System
Weber, Johannes
: Maurer, Linus
Dissertation
2019Quartz Crystal Microbalance: Basics and Applications in Biology
Ruckdäschel, Simone; Kade, Christian; Wegener, Joachim
Aufsatz in Buch
2019Role of Different Receptor-Surface Binding Modes in the Morphological and Electrochemical Properties of Peptide-Nucleic-Acid-Based Sensing Platforms
Bartl, J.D.; Scarbolo, P.; Brandalise, D.; Stutzmann, M.; Tornow, M.; Selmi, L.; Cattani-Scholz, A.
Zeitschriftenaufsatz
2019Secondary Discharge during System Level ESD Tests
Wolf, Heinrich; Weber, Johannes; Gieser, Horst
Konferenzbeitrag
2019Smart sensor system for constant dosing with micro diaphragm pumps
Häfner, Johannes; Durasiewicz, Claudia; Thalhofer, Thomas; Kibler, S.; Kutter, C.
Konferenzbeitrag
2019Space charge-limited current transport in thin films of alkyl-functionalized silicon nanocrystals
Pfaehler, S.; Angi, A.; Chryssikos, D.; Cattani-Scholz, A.; Rieger, B.; Tornow, M.
Zeitschriftenaufsatz
2019Stress current slew rate sensitivity of an ultra-high-speed interface IC
Weber, Johannes; Fung, Rita; Wong, Richard; Wolf, Heinrich; Gieser, Horst; Maurer, Linus
Zeitschriftenaufsatz
2019Synthetic protein-conductive membrane nanopores built with DNA
Diederichs, T.; Pugh, G.; Dorey, A.; Xing, Y.; Burns, J.R.; Nguyen, Q.H.; Tornow, M.; Tampé, R.; Howorka, S.
Zeitschriftenaufsatz
2019Towards low cost and low temperature capacitive CO2 sensors based on amine functionalized silica nanoparticles
Boudaden, J.; Klumpp, A.; Endres, H.-E.; Eisele, I.
Zeitschriftenaufsatz
2019Ultra-thin flexible interposer - a flexible hybrid integration approach to replace wire bonds
Yacoub-George, Erwin; Palavesam, Nagarajan; Hell, Waltraud; König, Martin; Faul, Robert; Landesberger, Christof; Kutter, Christof
Konferenzbeitrag
2019Untersuchung der Flussparameter von Piezomembranpumpen für den Einsatz in der Zellkultur
Bittner, William
: Mela, Petra
Bachelor Thesis
2019Using animal cells as sensors for xenobiotics: Monitoring phenotypic changes by multimodal impedance assays
Zinkl, Maria; Wegener, Joachim
Zeitschriftenaufsatz
2019Zellen als Sensoren
Michaelis, Stefanie; Wegener, Joachim
Aufsatz in Buch
2018'Instant ECIS': A concept for storing frozen cells on electrode surfaces for instant use
Michaelis, Stefanie; Wegener, Joachim
Abstract
20183D integration processes for advanced sensor systems and high-performance RF components
Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter
Konferenzbeitrag
2018Advanced sensor systems by low-temperature heterogeneous 3D integration processes
Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter
Konferenzbeitrag
2018An approach to reduce greenhouse gases in the semiconductor industry using F2 dissociated in plasma for CVD chamber cleaning
Boudaden, Jamila; Altmannshofer, Stephan; Wieland, Robert; Pittroff, Michael; Eisele, Ignaz
Zeitschriftenaufsatz
2018Cells in contact to carbon dots: A label-free, impedance-based and multidimensional approach
Pütz, Pierre; Lemberger, Michael; Wegener, Joachim
Abstract
2018Comparison of CDM and CC-TLP robustness for an ultra-high speed interface IC
Weber, Johannes; Fung, Rita; Wong, Richard; Wolf, Heinrich; Gieser, A. Horst; Maurer, Linus
Konferenzbeitrag
2018Deposition of micro crystalline silicon films using microwave plasma enhanced chemical vapor deposition
Altmannshofer, Stephan; Miller, Bastian; Holleitner, Alexander W.; Boudaden, Jamila; Eisele, Ignaz; Kutter, Christoph
Zeitschriftenaufsatz
2018Device and method for actuating a load and device
Isa, Erkan Nevzat; Kinzel, Bernadette; Vanselow, Frank
Patent
2018Dynamic Bending Reliability Analysis of Flexible Hybrid Integrated Chip-Foil Packages
Palavesam, Nagarajan; Yacoub-George, E.; Hell, W.; Landesberger, C.; Kutter, C.; Bock, K.
Konferenzbeitrag
2018Entgasungsvorrichtung
Richter, Martin; Strohmair, Simone; Wald, Christian; Wille, Axel
Patent
2018Enzymatic sensor based on dye sensitized TiO2 electrode for detection of catechol in water
Klumpp, Armin; Adrovic, Asmir; Boudaden, Jamila
Zeitschriftenaufsatz, Konferenzbeitrag
2018ESD robustness of IoT devices: Are we going to face new challenges?
Wolf, Heinrich
Vortrag
2018Expanding the information depth of impedance based assays by using piezoelectric growth substrates
Ruckdäschel, Simone; Wegener, Joachim
Abstract
2018Flicker distortion power factor analysis in lighting LED's
Ionescu, C.; Dima, M.; Bonfert, D.
Konferenzbeitrag
2018Flow rate influencing effects of micropumps
Jenke, C.; Kager, S.; Richter, M.; Kutter, C.
Zeitschriftenaufsatz
2018Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien. Jahresbericht 2017
 
Jahresbericht
2018Gerät mit Mikrofluidaktor
Congar, Yücel; Richter, Martin; Wald, Christian
Patent
2018Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
Henfling, Michael; Neumeier, Karl; Trupp, Sabine
Patent
2018Impedance analysis of heterogeneous cell populations: Impact on data analysis and modeling
Skiba, Michael; Wegener, Joachim
Abstract
2018Impedance-based characterization of pH-dependent cell behavior
Sauer, Lisa; Meier, Robert; Wegener, Joachim
Abstract
2018Increased throughput in GPCR screening using impedance assays: Inspiration from organ studies
Stolwijk, Judith A.; Kade, Christian; Skiba, Michael; Wegener, Joachim
Abstract
2018An integrated all foil based micro device for point of care diagnostic applications
Bose, I.; Ohlander, A.; Kutter, C.; Russom, A.
Zeitschriftenaufsatz
2018Lifetime verification by circuit level aging simulations
Jancke, Roland
Vortrag
2018Low power, low noise JFETs for room temperature X-ray detectors
Sturm, Leonhard; Nebrich, L.; Neumeier, K.; Eisele, I.; Kutter, C.
Konferenzbeitrag
2018A low power, offset compensated, CMOS only bandgap reference in 22 nm FD-SOI technology
Poongodan, Prajith Kumar; Bora, Pragoti Pran; Borggreve, David; Vanselow, Frank; Maurer, Linus
Konferenzbeitrag
2018Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process
Bose, Indranil; Palavesam, Nagarajan; Hochreiter, Christian; Landesberger, Christof; Kutter, Christoph
Konferenzbeitrag
2018Low-voltage low-distortion sampling switch design in 22 nm FD-SOI CMOS technology
Bora, P.P.; Borggreve, D.; Vanselow, F.; Isa, E.; Maurer, L.
Konferenzbeitrag
2018Messanordnung und Verfahren zum Lenken und Detektieren von Partikeln
Haberger, Karl; Möbius, Katrin
Patent
2018Method to study water diffusion into polymers
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Müller-Buschbaum, Peter
Zeitschriftenaufsatz, Konferenzbeitrag
2018Monitoring the toxicity of bisphenol A using multiple impedance-based cellular assays
Zinkl, Maria; Sauer, Lisa; Azzam, Saphia; Wegener, Joachim
Abstract
2018A non-isolated asynchronous low power high voltage boost converter for discontinuous conduction mode and portable applications
Vanselow, F.; Kinzel, B.; Maurer, L.; Isa, E.
Konferenzbeitrag
2018Novel chip embedding and interconnection technology for mm-wave System-in-Package (SiP) applications
Landesberger, Christof; Drost,, A.; Faul, R.; Hell, W.; Scherbaum, S.; Bonfert, D.; Ott, A.; Hotopan, R.; Böhnke, R.
Konferenzbeitrag
2018A novel current-mode actuator driver for enhanced piezoelectric reliability
Kinzel, B.; Vanselow, F.; Isa, E.; Maurer, L.
Konferenzbeitrag
2018Numerical Simulation of Electrostatic Microactuator
Zhuang, Qinyu
Master Thesis
2018Polyimide-based capacitive humidity sensor
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Drost, Andreas; Eisele, Ignaz; Kutter, Christoph; Müller-Buschbaum, Peter
Zeitschriftenaufsatz
2018A Rapid Innovation Framework for Connected Mobility Applications
Pöhn, Daniela; Wessel, Sascha; Fischer, Felix; Braunsdorf, Oliver; Wenninger, Franz; Seydel, Dominique; Weiß, Gereon; Roscher, Karsten
: Freese-Wagner, Manuela (Hrsg.)
Studie
2018Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICs
Bose, I.R.; Palavesam, N.; Landesberger, C.; Kutter, C.
Aufsatz in Buch
2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph
Zeitschriftenaufsatz
2018Safety & security testing of cooperative automotive systems
Seydel, Dominique; Weiß, Gereon; Pöhn, Daniela; Wessel, Sascha; Wenninger, Franz
Konferenzbeitrag
2018Slow-wave coplanar strip line based Low-power 80-GHz voltage control oscillator on 22-nm FDSOI technology
Lim, T.; Sharma, E.; Borggreve, D.; Pistono, E.; Bourdel, S.; Isa, E.N.; Vanselow, F.; Ferrari, P.; Maurer, L.
Konferenzbeitrag
2018Smart monitoring system for air quality control with capacitive sensors
Steinmaßl, Matthias; Boudaden, Jamila; Endres, Hanns-Erik; Eisele, Ignaz; Kutter, Christoph; Müller-Buschbaum, Peter
Konferenzbeitrag
2018Time-resolved response profiles of GPCR activation: Combining two independent impedance-based approaches
Kade, Christian; Stolwijk, Judith; Michaelis, Stefanie; Wegener, Joachim
Abstract
2018Transepithelial permeation of bioactive molecules determined online by impedance-based monitoring in a co-culture setup
Urban, Florian; Hajek, Kathrin; Bernhardt, Günther; Wegener, Joachim
Abstract
2018Transparent nanopore cavity arrays enable highly parallelized optical studies of single membrane proteins on chip
Diederichs, Tim; Nguyen, Quoc Hung; Urban, Michael; Tampé, Robert; Tornow, Marc
Zeitschriftenaufsatz
2018Vision 2030 - Flagship Proposal Health-EU
Ramm, Peter; Bose, Indranil; Kutter, Christoph
Vortrag
2018Vorrichtung und Verfahren zum anisotropen DRIE-ätzen mit Fluorgasmischung
Wieland, Robert
Patent
2017The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Ramm, Peter; Poupon, Gilles; Couderc, Pascal; Leitgeb, Markus; Taklo, Maaike M.V.
Zeitschriftenaufsatz
2017Analysesystem und Verfahren zum Durchführen einer Analyse
Bose, Indranil; Ohlander, Anna; Russom, Aman
Patent
2017Bulk lifetime characterization of corona charged silicon wafers with high resistivity by means of microwave detected photoconductivity
Engst, Christian R.; Rommel, Mathias; Bscheid, Christian; Eisele, Ignaz; Kutter, Christoph
Zeitschriftenaufsatz
2017Capacitive CO2 sensor
Boudaden, Jamila; Klumpp, Armin; Endres, Hanns-Erik; Eisele, Ignaz
Zeitschriftenaufsatz, Konferenzbeitrag
2017Charge sensitive fluid sensor for chemical and biological applications
Heigl, M.; Neumeier, K.; Spitzlsperger, G.; Kutter, C.; Eisele, I.
Konferenzbeitrag
2017Charge/discharge effects and ESD prevention at the example of RFID smart card manufacturing
Jacob, Peter; Thiemann, Uwe; Weber, Johannes; Gieser, Horst; Wolf, Heinrich
Konferenzbeitrag
2017The combination of micro diaphragm pumps and flow sensors for single stroke based liquid flow control
Jenke, Christoph; Rubio, Jaume Pallejà; Kibler, Sebastian; Häfner, Johannes; Richter, Martin; Kutter, Christoph
Zeitschriftenaufsatz
2017Correlation limits between capacitively coupled transmission line pulsing (CC-TLP) and CDM for a large chip-on-flex assembly
Weber, Johannes; Reinprecht, Wolfgang; Gieser, Horst; Wolf, Heinrich; Maurer, Linus
Konferenzbeitrag
2017Correlation study of different CDM testers and CC-TLP
Weber, Johannes; Kaschani, Karim T.; Gieser, Horst; Wolf, Heinrich; Maurer, Linus; Famulok, Nicolai; Moser, Reinhard; Rajagopal, Krishna; Sellmayer, Michael; Sharma, Anmol; Tamm, Heiko
Konferenzbeitrag
2017Expanding the Scope of Impedance Spectroscopy for the Analysis of Adherent Cells
Götz, C.
Dissertation
2017Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien. Jahresbericht 2016
 
Jahresbericht
2017Freistrahldosiersystem
Richter, Martin; Wackerle, Martin; Kibler, Sebastian
Patent
2017Highly integrated chips
Ramm, P.; Weber, J.
Zeitschriftenaufsatz
2017Label-free profiling of cell dynamics: A sequence of impedance-based assays to estimate tumor cell invasiveness in vitro
Láng, Orsolya; Kőhidai, László; Wegener, Joachim
Zeitschriftenaufsatz
2017Low-temperature 3D integration processes for advanced sensor systems
Ramm, P.; Fernandez-Bolanos, M.; Weber, J.
Vortrag
2017Microwave plasma assisted process for cleaning and deposition in future semiconductor technology
Altmannshofer, S.; Boudaden, J.; Wieland, R.; Eisele, I.; Kutter, C.
Konferenzbeitrag
2017Mikrodosiersystem
Richter, Martin; Wackerle, Martin; Kibler, Sebastian
Patent
2017Mobilgerät zum Bestimmen eines Bestandteils in Umgebungsluft
Richter, Martin; Jenke, Christoph; Röhl, Siegried; Kutter, Christoph
Patent
2017New concept for cost efficient temporary wafer bonding by electrostatic forces: "E-Foil"
Landesberger, Christof; Bose, Indranil; König, Martin; Kutter, Christoph
Konferenzbeitrag
2017Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism
Siris, R.; Boudaden, J.; Klumpp, A.
Konferenzbeitrag
2017Roll-to-Roll processed foil inlay as an electrostatic chuck for flexible thin semiconductor wafer handling
Bose, I.; Gest, P.; Landesberger, C.; Kutter, C.
Konferenzbeitrag
2017Sensitive, selective, and rapid method for optical recognition of ultra-traces level of Hg(II), Ag(I), Au(III), and Pd(II) in electronic wastes
Shahat, A.; Trupp, S.
Zeitschriftenaufsatz
2017Simulation and experimental investigation of slew rate related ESD failures of CDM and CC-TLP
Weber, Johannes; Kaschani, Karim T.; Gieser, Horst; Wolf, Heinrich; Maurer, Linus; Famulok, Nicolai; Moser, Reinhard; Rajagopal, Krishna; Sellmayer, Michael; Sharma, Anmol; Tamm, Heiko
Konferenzbeitrag
2017Simultaneous optical and electrical CO2 detection in one sensitive film
Henfling, M.; Gossner, U.; Kutter, C.; Hansch, W.; Trupp, S.
Zeitschriftenaufsatz
2017Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices
El Hasni, Akram; Pfirrmann, Stefan; Kolander, Anett; Yacoub-George, Erwin; König, Martin; Landesberger, Christof; Voigt, Anja; Grützner, Gabi; Schnakenberg, Uwe
Zeitschriftenaufsatz
2017Smart HVAC sensors for smart energy
Boudaden, J.; Wenninger, F.; Klumpp, A.; Eisele, I.; Kutter, C.
Konferenzbeitrag
2017Zwei-Phasen-Strömungssensor für die geregelte Mikrodosierung von Mineralöl in einem autarken Dosiersystem
Kibler, Sebastian
: Kutter, C.; Zengerle, R.
Dissertation
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Konferenzbeitrag
2016CMOS compatible nanogap-field-effect-transistor for integrated NEMS application
Heigl, M.; Neumeier, K.; Eisele, I.
Konferenzbeitrag
2016Colorimetric detection of selected gases for work and food safety applications
Linhardt, J.
Dissertation
2016Design of an integrated piezoelectric micro-flapper based on bionic principles
Behlert, R.; Schrag, G.; Wachutka, G.; Wieland, R.; Kutter, C.
Konferenzbeitrag
2016Environmental-friendly fluorine mixture for CVD cleaning processes to replace C2F6, CF4 and NF3
Wieland, R.; Pittroff, M.; Boudaden, J.; Altmannshofer, S.; Kutter, C.
Konferenzbeitrag
2016FFT based investigations on light flicker in new lighting systems
Ionescu, C.; Dima, M.; Bonfert, D.
Konferenzbeitrag
2016Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien. Jahresbericht 2015
 
Jahresbericht
2016Hydrogen microwave plasma treatment of Si and SiO2
Altmannshofer, S.; Eisele, I.; Gschwandtner, A.
Zeitschriftenaufsatz
2016An integrated dual-polarity high-voltage driver concept for micropump applications
Isa, B.K.E.; Schmitt-Landsiedel, D.; Maurer, L.
Konferenzbeitrag
2016JS-002 module and product CDM result comparison to JEDEC and ESDA CDM methods
Righter, A.; Ashton, R.; Carn, B.; Johnson, M.; Reynolds, B.; Smedes, T.; Ward, S.; Wolf, H.
Konferenzbeitrag
2016Mechanical reliability analysis of ultra-thin chip-on-foil assemblies under different types of recurrent bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Konferenzbeitrag
2016Messvorrichtung und System zur Schmelzkurvenanalyse eines DNA Microarrays, sowie Verwendung eines Fluoreszenzdetektorarrays zur Analyse
Ohlander, Anna; Bock, Karlheinz; Ganka, Thomas
Patent
2016A novel micropump driver used in environmental sensor applications
Kinzel, B.; Bonfert, D.; Lippert, F.; Vanselow, F.; Isa, E.; Schmitt-Landsiedel, D.; Maurer, L.
Konferenzbeitrag
2016Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C.; Palavesam, N.; Hell, W.; Drost, A.; Faul, R.; Gieser, H.; Bonfert, D.; Bock, K.; Kutter, C.
Konferenzbeitrag
2016A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Konferenzbeitrag
2016Organic semiconductor based disposable bio-chemical sensors manufactured in a roll-to-roll compatible process
Bose, I.
Dissertation
2016Smart capacitive CO2 sensor
Boudaden, Jamila; Klumpp, Armin; Eisele, Ignaz; Kutter, Christoph
Konferenzbeitrag
2016Thin chip foil packaging: An enabling technology for ultra-thin packages
Landesberger, C.; Palavesam, N.; Drost, A.; Hell, W.; Faul, R.; Kutter, C.
Zeitschriftenaufsatz
2016Vorrichtung mit Folie zum elektrostatischen Koppeln eines Substrates mit einem Substratträger
Landesberger, Christof
Patent
2015Current and future 3D activities at Fraunhofer
Heinig, A.; Chaudhary, M.W.; Schneider, P.; Ramm, P.; Weber, J.
Konferenzbeitrag
2015Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Palavesam, N.; Bonfert, D.; Hell, W.; Landesberger, C.; Gieser, H.; Kutter, C.; Bock, K.
Konferenzbeitrag
2015Electro-thermal analysis of flexible micro-heater
Botau, A.; Bonfert, D.; Negrea, C.; Svasta, P.; Ionescu, C.
Konferenzbeitrag
2015Electrostatic discharge sensitivity investigation on organic field-effect thin film transistors
Lim, T.; Gieser, H.; Santarelli, L.; Cacialli, F.
Konferenzbeitrag
2015ESD performance evaluation of powered high-speed interfaces
Koch, S.; Gossner, H.; Gieser, H.; Maurer, L.
Konferenzbeitrag
2015The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Ramm, P.; Klumpp, A.; Weber, J.; Mathewson, A.; Razeeb, K.M.; Pufall, R.
Konferenzbeitrag
2015Fine pitch 3D-TSV based high frequency components of RF MEMS applications
Vitale, W.A.; Fernandez-Bolanos, M.; Merkel, R.; Enayati, A.; Ocker, I.; Raedt, W. de; Weber, J.; Ramm, P.; Ionescu, A.M.
Konferenzbeitrag
2015Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Kutter, C.; Bock, K.
Konferenzbeitrag
2015Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien. Jahresbericht 2014
 
Jahresbericht
2015Generic Electrostatic Discharges Protection Solutions for RF and Millimeter-Wave Applications
Lim, T.; Benech, P.; Jimenez, J.; Fournier, J.-M.; Heitz, B.; Bourgeat, J.; Galy, P.
Zeitschriftenaufsatz
2015Grenzen der Dosiergenauigkeit eines geregelten Nanoliter pro Sekunde Mikrodosiersystems für Schmierstoffdosierung mit einem kapazitiven Time-of-Flight Flow Sensor
Kibler, S.; Richter, M.; Kutter, C.
Konferenzbeitrag
2015Homogeneous crystallization of micro-dispensed TIPS-pentacene using a two-solvent system to enable printed inverters on foil substrates
Bose, I.; Tetzner, K.; Borner, K.; Bock, K.
Zeitschriftenaufsatz
2015An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate
Fiore, V.; Battiato, P.; Abdinia, S.; Jacobs, S.; Chartier, I.; Coppard, R.; Klink, G.; Cantatore, E.; Ragonese, E.; Palmisano, G.
Zeitschriftenaufsatz
2015Leuchtvorrichtung, Vorrichtung mit einer Leuchtvorrichtung und Herstellungsverfahren
Bock, Karlheinz
Patent
2015Low-Cost Edelstahl-Mikropumpe zur Probenzufuhr eines miniaturisierten Gassensorsystems zur Brandfrüherkennung
Wald, C.; Richter, M.
Konferenzbeitrag
2015Particle tolerance of micro diaphragm pumps with low chamber heights and passive flap valves
Jenke, C.W.; Muster, T.; Richter, M.; Kutter, C.
Konferenzbeitrag
2015Secondary discharge - a potential risk during system level ESD testing
Wolf, H.; Gieser, H.
Konferenzbeitrag
2015Self-aligned flexible organic thin-film transistors with gates patterned by nano-imprint lithography
Gold, H.; Haase, A.; Fian, A.; Prietl, C.; Striedinger, B.; Zanella, F.; Marjanović, N.; Ferrini, R.; Ring, J.; Lee, K.D.; Jiawook, R.; Drost, A.; König, M.; Müller, R.; Myny, K.; Genoe, J.; Kleb, U.; Hirshy, H.; Prétôt, R.; Kraxner, J.; Schmied, R.; Stadlober, B.
Zeitschriftenaufsatz
2015Self-ESD-protected transmission line broadband in CMOS28nm UTBB-FDSOI
Bourgeat, J.; Lim, T.; Heitz, B.; Jimenez, J.; Galy, P.
Konferenzbeitrag
2015Simulation und Charakterisierung einer bi-direktionalen Dreikammermikropumpe aus Edelstahl
Artelsmair, A.; Wackerle, M.; Richter, M.; Irlinger, F.
Konferenzbeitrag
2015A SPICE model for electroluminescent foils
Ionescu, C.; Draghici, F.; Bonfert, D.
Konferenzbeitrag
2015Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
Vitale, W.A.; Fernandez-Bolanos, M.; Klumpp, A.; Weber, J.; Ramm, P.; Ionescu, A.M.
Konferenzbeitrag
2015Using CC-TLP to get a CDM robustness value
Esmark, K.; Gaertner, R.; Seidl, S.; Nieden, F. zur; Wolf, H.; Gieser, H.
Konferenzbeitrag
2015VERFAHREN ZUR ERKENNUNG RESISTENTER KEIME UND VORRICHTUNG ZUM DURCHFÜHREN DESSELBEN
Trupp, Sabine; Schmidt, Jennifer; Eisele, Ignaz; Haberger, Karl; Sittel, Wolfgang
Patent
2015Wafer edge protection kit for MEMS and TSV Si-etching
Wieland, R.; Nguyen, K.; Seidelmann, U.; Scholz, M.; Schrag, G.
Konferenzbeitrag
20143D IC Integration Since 2008
Garrou, P.; Ramm, P.; Koyanagi, M.
Aufsatz in Buch
2014Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags
Bose, I.; Tetzner, K.; Borner, K.; Bock, K.
Zeitschriftenaufsatz
2014APPARATUS FOR CLOSING AND OPENING A FLOW PATH HAVING A FLEXIBLE FLOW PATH WALL
Richter, Martin; Kibler, Sebastian
Patent
2014Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
Landesberger, C.; Paschke, C.; Spöhrle, H.-P.; Bock, K.
Aufsatz in Buch
2014Closed loop micro dosing for oil lubrication of precision bearings in high speed machine spindles using capacitive flow metering
Kibler, S.; Richter, M.; Kutter, C.; Möller, C.
Konferenzbeitrag
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Konferenzbeitrag
2014DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substrate
Ohlander, A.; Hammerle, T.; Klink, G.; Zilio, C.; Damin, F.; Chiari, M.; Russom, A.; Bock, K.
Konferenzbeitrag
2014Electrical and thermal behavior for DC and pulsed stress on chip resistors
Botau, A.; Bonfert, D.; Negrea, C.
Konferenzbeitrag
2014Elektrische Einrichtung zum Anschluss an ein Infrastrukturstromnetz und Verfahren
Faul, Robert
Patent
2014ESD protective equipment. Investigation of two-layer knitted structures with conductive fibres content
Carpus, E.; Scarlat, R.; Bonfert, D.; Ene, A.; Mihai, C.; Visileanu, E.; Donciu, C.; Popa, A.; Enache, G.
Zeitschriftenaufsatz
2014Foil-based DNA melting curve analysis platform for low-cost point-of-care molecular diagnostics
Ohlander, A.; Bauer, S.; Ramachandraiah, H.; Russom, A.; Bock, K.
Konferenzbeitrag
2014Handbook of 3D integration. Vol.3
: Garrou, P.; Koyanagi, M.; Ramm, P.
Buch
2014High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed Surfaces
Landesberger, C.; Hiroshima, M.; Weber, J.; Bock, K.
Aufsatz in Buch
2014Investigation on thermal properties of substrates for printed electronics
Ionescu, C.; Bonfert, D.; Branzei, M.
Konferenzbeitrag
2014Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates
Palavesam, N.; Landesberger, C.; Bock, K.
Konferenzbeitrag
2014Key Applications and Market Trends for 3D Integration and Interposer Technologies
Beica, R.; Eloy, J.-C.; Ramm, P.
Aufsatz in Buch
2014Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process
Bose, I.; Bonfert, D.; Heim, S.; Bock, K.
Konferenzbeitrag
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Konferenzbeitrag
2014Microfluidic Detection Module for DNA Analysis Using Integrated Micro Heaters and DNA Microarrays on Plastic Foil
Ohlander, A.; Bauer, S.; Bock, K.; Ramachandraiah, H.; Russom, A.
Konferenzbeitrag
2014Modul, System und Verfahren zur Analyse dreidimensionaler Strukturen
Schmidt, Jennifer; Wegener, Joachim
Patent
2014Multifunctional system integration in flexible substrates
Bock, K.; Yacoub-George, E.; Hell, W.; Drost, A.; Wolf, H.; Bollmann, D.; Landesberger, C.; Klink, G.; Gieser, H.; Kutter, C.
Konferenzbeitrag
2014Optimization of a Piezoelectric Micropump Actuator for Medical Application in Glaucoma and Phthisis Therapy
Jenke, C.W.; Kibler, S.; Gao, Y.; Hollot, A.; Neuhann, T.; Kirchhof, B.; Montag, B.; Geiger, M.; Neitzel, J.; Kutter, C.; Richter, M.
Konferenzbeitrag
2014Organic field-effect transistors based on a liquid-crystalline polymeric semiconductor using SU-8 gate dielectrics on flexible substrates
Tetzner, K.; Bose, I.R.; Bock, K.
Zeitschriftenaufsatz
2014Overview of Bonding and Assembly for 3D Integration
Lu, J.J.-Q.; Zhang, D.; Ramm, P.
Aufsatz in Buch
2014Photonic curing of sol-gel derived HfO2 dielectrics for organic field-effect transistors
Tetzner, K.; Schroder, K.A.; Bock, K.
Zeitschriftenaufsatz
2014PUMP ARRANGEMENT COMPRISING A SAFETY VALVE ARRANGEMENT
Richter, Martin; Wackerle, Martin
Patent
2014Real-time monitoring of melting curves on DNA microarrays in plastic lab-on-foil system using silicon photomultiplier detectors
Ohlander, A.; Ganka, T.; Binder, T.; Wiest, F.; Russom, A.; Bock, K.
Konferenzbeitrag
2014Reliability characterization of blind-hole vias for a system-in-foil
Lorenz, E.; Niemann, N.; Koyuncu, M.; Bock, K.
Konferenzbeitrag
2014Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B.
Konferenzbeitrag
2014Simple cost effective and network compatible readout for capacitive and resistive (chemical) sensors
Nastasi, Giuseppe Antonio Maria; Scuderi, Antonino; Endres, Hanns-Erik; Hell, Waltraud; Bock, Karlheinz
Zeitschriftenaufsatz, Konferenzbeitrag
2014Studies on thermal properties of substrates for electronics using IR thermography
Ionescu, C.; Branzei, M.; Mihailescu, B.; Bonfert, D.
Konferenzbeitrag
2014Die Vision von der Trillion Sensor World
Endres, Hanns-Erik; Kutter, Christoph
Zeitschriftenaufsatz
2014Vorrichtung und Verfahren zum Bestimmen einer Stärke einer Adhäsion eines biologischen Materials
Schmidt, Jennifer; Alberti, Martin; Endres, Hanns-Erik; Wegener, Joachim
Patent
2014Wafer-level manufacturing technology of glass microlenses
Gossner, U.; Hoeftmann, T.; Wieland, R.; Hansch, W.
Zeitschriftenaufsatz