Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Anordnung mit einem Substrat und zwei Bauelementen mit Lichtwellenleitern sowie Verfahren zur Herstellung
Oppermann, Hermann; Tekin, Tolga; Stockmeyer, Jörg; Fröhlich, Juliane
Patent
2021Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
Papatryfonos, K.; Selviah, D.R.; Maman, A.; Hasharoni, K.; Brimont, A.; Zanzi, A.; Kraft, J.; Sidorov, V.; Seifried, M.; Baumgartner, Y.; Horst, F.; Offrein, B.J.; Lawniczuk, K.; Broeke, R.G.; Terzenidis, N.; Mourgias-Alexandris, G.; Tang, M.; Seeds, A.J.; Liu, H.; Sanchis, P.; Moralis-Pegios, M.; Manolis, T.; Pleros, N.; Vyrsokinos, K.; Sirbu, B.; Eichhammer, Y.; Oppermann, H.; Tekin, T.
Journal Article
2021Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
Franieck, E.; Fleischmann, M.; Hölck, O.; Kutuzova, L.; Kandelbauer, A.
Journal Article
2021Design for Circularity Guidelines for the EEE Sector
Berwald, A.; Dimitrova, G.; Feenstra, T.; Onnekink, J.; Peters, H.; Vyncke, G.; Ragaert, K.
Journal Article
2021Dual-Rotor Electromagnetic-Based Energy Harvesting System for Smart Home Applications
Dinulovic, D.; Shousha, M.; Al-Batol, M.; Zafar, T.; Bickel, J.; Ngo, H.-D.; Haug, M.
Journal Article
2021Durability of smartphones: A technical analysis of reliability and repairability aspects
Cordella, M.; Alfieri, F.; Clemm, C.; Berwald, A.
Journal Article
2021Ecological Cost-Benefit Analysis of a Sensor-Based Parking Prediction Service
Druschke, J.; Fath, S.; Stobbe, L.; Nissen, N.F.; Richter, N.; Lang, K.-D.
Book Article
2021Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration
Braun, T.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Schneider-Ramelow, M.
Conference Paper
2021Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2020/2021
 
Annual Report
2021Generative Machine Learning for Resource-Aware 5G and IoT Systems
Piatkowski, Nico; Mueller-Roemer, Johannes; Hasse, Peter; Bachorek, Adam; Werner, Tim; Birnstill, Pascal; Morgenstern, Andreas; Stobbe, Lutz
Conference Paper
2021High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications
Murugesan, K.S.; Chernobryvko, M.; Zinal, S.; Rossi, M.; Ndip, I.; Boettcher, M.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S.B.; Trewhella, J.
Conference Paper
2021A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Kosfeld, Andre; Utz, Alexander; Weber, Constanze; Rämer, Olaf; Spanier, Malte; Ihle, Martin; Ziesche, Steffen; Kokozinski, Rainer
Journal Article
2021Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
Dilek, S.; Ndip, I.; Rossi, M.; Tschoban, C.; Kuttler, S.; Wittler, O.; Lang, K.-D.; Goetze, C.; Berger, D.; Wieland, M.; Schneider-Ramelow, M.
Conference Paper
2021Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling
Erbacher, K.; Mackowiak, P.; Schiffer, M.; Lang, K.-D.; Schneider-Ramelow, M.; Ngo, H.-D.
Conference Paper
2021Methodology for Modeling the Energy and Material Footprint of Future Telecommunication Networks
Stobbe, L.; Nissen, N.F.; Druschke, J.; Zedel, H.; Richter, N.; Lang, K.-D.
Book Article
2021Monolithic integration of a smart temperature sensor on a modular silicon-based organ-on-a-chip device
Ponte, Ronaldo Martins da; Gaio, Nikolas; Zeijl, Henk van; Vollebregt, Sten; Dijkstra, Paul; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Journal Article
2021A Multi-Functional Reconfigurable Metasurface: Electromagnetic Design Accounting for Fabrication Aspects
Pitilakis, A.; Tsilipakos, O.; Liu, F.; Kossifos, K.M.; Tasolamprou, A.C.; Kwon, D.-H.; Mirmoosa, M.S.; Manessis, D.; Kantartzis, N.V.; Liaskos, C.; Antoniades, M.A.; Georgiou, J.; Soukoulis, C.M.; Kafesaki, M.; Tretyakov, S.A.
Journal Article
2021A New Filter Concept for High Pulse-Frequency 3-Phase AFE Motor Drives
Hoffmann, S.; Bock, M.; Hoene, E.
Journal Article
2021Optisches System, optische Komponente und Verfahren zum Herstellen eines optischen Systems
Oppermann, Hermann; Tekin, Tolga; Manier, Charles-Alix
Patent
2021Optisches System, Trägersubstrat und Verfahren zum Herstellen eines optischen Systems
Manier, Charles-Alix; Oppermann, Hermann; Zoschke, Kai; Tekin, Tolga
Patent
2021Quantifying the environmental impact of clustering strategies in waste management: A case study for plastic recycling from large household appliances
Bracquené, E.; Martinez, M.G.; Wagner, E.; Wagner, F.; Boudewijn, A.; Peeters, J.; Duflou, J.
Journal Article
2021Recyclability of tungsten, tantalum and neodymium from smartphones
Nissen, N.F.; Reinhold, J.; Schischke, K.; Lang, Klaus-Dieter
Book Article
2021RF Modeling and Measurement of a Novel Aperture-Coupled Hybrid Glass-Silicon 5G Antenna Array
Le, T.H.; Rossi, M.; Ndip, I.; Kaiser, M.; Manier, C.-A.; Gernhardt, R.; Oppermann, H.; Lang, K.-D.; Reichl, H.
Conference Paper
2021Rohstoffe für Zukunftstechnologien 2021
Marscheider-Weidemann, Frank; Langkau, Sabine; Eberling, Elisabeth; Erdmann, Lorenz; Haendel, Michael; Krail, Michael; Loibl, Antonia; Neef, Christoph; Neuwirth, Marius; Rostek, Leon; Shirinzadeh, Saeideh; Stijepic, Denis; Tercero Espinoza, Luis A.; Baur, Sarah-Jane; Billaud, Mathilde; Deubzer, Otmar; Maisel, Franziska; Marwede, Max; Rückschloss, Jana; Tippner, Max
Study
2021Silicon photonics for terabit/s communication in data centers and exascale computers
Bernabé, S.; Wilmart, Q.; Hasharoni, K.; Hassan, K.; Thonnart, Y.; Tissier, P.; Désières, Y.; Olivier, S.; Tekin, T.; Szelag, B.
Review
2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: A comparative long-term ageing study
Lamont, C.; Grego, T.; Nanbakhsh, K.; Shah Idil, A.; Giagka, V.; Vanhoestenberghe, A.; Cogan, S.; Donaldson, N.
Journal Article
2021Smart sensor systems for extremely harsh environments
Kappert, Holger; Schopferer, Sebastian; Döring, Ralf; Ziesche, Steffen; Olowinsky, Alexander; Naumann, Falk; Jaegle, Martin; Ostmann, Andreas
Conference Paper
2021Study on FO-WLP Warpage Behavior - Influence of Process Temperature and Geometry
Dijk, M. van; Huber, S.; Stegmaier, A.; Walter, H.; Wittler, O.; Schneider-Ramelow, M.
Conference Paper
2021Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
Tavakolibasti, M.; Meszmer, P.; Böttger, G.; Kettelgerdes, M.; Elger, G.; Erdogan, H.; Seshaditya, A.; Wunderle, B.
Conference Paper
2021Verbindungsmethode für Leistungsmodule mit einer Zwischenkreisverschienung
Hoene, Eckart
Patent
2021Washability of e-textiles: Current testing practices and the need for standardization
Rotzler, S.; Krshiwoblozki, M. von; Schneider-Ramelow, M.
Journal Article
2020(How) can service design and digitalization be used to transition to the circular economy?
Scholz, Ronja; Malila, Saija; Vihma, Markus; Marwede, Max; Cygert, Karolina
Conference Paper
2020Assessment of the influencing parameters of the tumble test for robustness testing of smartphones
Dobs, Tom; Sánchez, David; Schischke, Karsten; Wittler, Olaf; Schneider-Ramelow, Martin
Conference Paper
2020Bestandsaufnahme Smartphones. Übersicht Modellhistorie und modulare Konzepte
Proske, Marina; Baur, Sarah-Jane; Rückschloss, Jana; Teusch,Christoph; Krause, Thomas; Poppe, Erik
Report
2020Bidirectional Bioelectronic Interfaces: System Design and Circuit Implications
Liu, Yan; Urso, Alessandro; Martins da Ponte, Ronaldo; Costa, Tiago; Valente, Virgilio; Giagka, Vasiliki; Serdijn, Wouter A.; Constandinou, Timothy G.; Denison, Timothy
Journal Article
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, K.; MacKowiak, P.; Kröhnert, K.; Oppermann, H.; Jürgensen, N.; Wietstruck, M.; Göritz, A.; Tolunay Wipf, S.; Kaynak, M.; Lang, K.-D.
Conference Paper
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin
Conference Paper
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, Rui; Zufiria, Pedro G.; Giagka, Vasiliki; Serdijn, Wouter A.
Conference Paper
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Journal Article
2020Condition monitoring of power electronic modules for predictive maintenance
Wagner, Stefan; Wüst, Felix; Sehr, Frederic; Dobs, Tom; Schneider-Ramelow, Martin
Conference Paper
2020Current State of Durability Assessment for Four Consumer Product Groups
Hahn, Daniel; Sehr, Frederic; Straube, Stefan; Dobs, Tom; Berwald, Anton; Wittler, Olaf; Schneider-Ramelos, Martin
Conference Paper
2020Customer acceptance of mobile devices with permanently installed batteries and accumulators
Winzer, Janis; Czichowski, Johanna; Lascho, Tobias; Bill, Stine; Hipp, Tamina; Wagner, Eduard; Jaeger-Erben, Melanie
Conference Paper
2020Decomposing software obsolescence cases - a cause and effect analysis framework for software induced product replacement
Wagner, Eduard; Poppe, Erik; Hahn, Florian; Jaeger-Erben, Melanie; Druschke, Jan; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
2020Das Design bestimmt die Ökobilanz. Mobile Endgeräte im Umweltfokus
Schischke, Karsten
Journal Article
2020Design for and Design from Recycling: The Key Pillars of Circular Product Design
Dimitrova, G.; Berwald, A.; Feenstra T.; Höggerl, G.; Nissen, N.F.; Schneider-Ramelow, M.
Conference Paper
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Journal Article
2020Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors
Kuczmik, A.; Hoffmann, S.; Hoene, E.
Conference Paper
2020Dreidimensionale Antennenvorrichtung
Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Patent
2020Dreidimensionale Schleifen-Antennenvorrichtung
Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Patent
2020Dry Etched through SiC Via (TSiCV) Process Analysis Using DOE Modeling
MacKowiak, P.; Schiffer, M.; Scheider-Ramelow, M.; Lang, K.-D.
Conference Paper
2020Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology
Le, T.H.; Kanitkar, A.; Rossi, M.; Ndip, I.; Braun, T.; Mueller, F.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S.B.; Trewhella, J.
Conference Paper
2020Electromagnetic switching cell design and characterization for WBG power semiconductors
Klein, K.; Hoene, E.; Lang, K.-D.
Conference Paper
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Conference Paper
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Conference Paper
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Journal Article
2020Environmental Impacts of Modular Design - Life Cycle Assessment of the Fairphone 3
Proske, Marina; Clemm, Christian; Sánchez Fernández, David; Ballester Salvà, Miquel; Jügel, Marvin; Kukuk-Schmid, Heike; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020Experimental study of panel level packaging warpage
Ecoiffier, D.; Vernhes, P.; Ooi, R.C.; Braun, T.; Dreissigacker, M.; Fu, H.
Conference Paper
2020Extended Product Lifespan Abroad - Assessing Repair Sector in Ghana
Groscurth, Balthasar; Batteiger, Alexander; Deubzer, Otmar; Jaeger-Erben, Melanie
Conference Paper
2020Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven
Conference Paper
2020FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, A.; Jaeschke, J.; Wittler, O.; Fabian, B.; Thomas, S.; Schneider-Ramelow, M.
Journal Article
2020Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Thomas, T.; Dijk, M. van; Dreissigacker, M.; Hoffmann, S.; Walter, H.; Becker, K.-F.; Schneider-Ramelow, M.
Journal Article
2020Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications
Schischke, K.; Nissen, N.F.; Schneider-Ramelow, M.
Journal Article
2020Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications
Kanitkar, A.; Chernobryvko, M.; Rossi, M.; Ndip, I.; Braun, T.; Müller, F.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S. bin; Trewhella, J.
Conference Paper
2020Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2019/2020
 
Annual Report
2020Grading system for post-consumer recycled plastics from WEEE
Wagner, Florian; Bracquene, Ellen; Wagner, Eduard; Keyzer, Jozefien de; Duflout, Joost R.; Dewulf, Wim; Peeters, Jef R.
Conference Paper
2020Grain Structure Analysis of Cu/SiO2Hybrid Bond Interconnects after Reliability Testing
Panchenko, I.; Wambera, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Bartusseck, I.; Wolf, M.J.
Conference Paper
2020How long do we care? The role of consumer practices for sustainable electronics
Jaeger-Erben, Melanie; Hipp, Tamina; Frick, Vivian
Conference Paper
2020Improving the washability of smart textiles: influence of different washing conditions on textile integrated conductor tracks
Rotzler, S.; Kallmayer, C.; Dils, C.; Krshiwoblozki, M. von; Bauer, U.; Schneider-Ramelow, M.
Journal Article
2020Influence of process and stress conditions on microstructure and failure mechanisms of second level sintered Ag joints
Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Conference Paper
2020Influence of temperature and humidity on power cycling capability of power modules
Wuest, F.; Wittler, O.; Schneider-Ramelow, M.
Journal Article
2020Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling
Schwietering, J.; Herbst, C.; Kirsch, O.; Arndt-Staufenbiel, N.; Wachholz, P.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2020International Congress "Electronics Goes Green 2020+". Proceedings
: Schneider-Ramelow, Martin
Conference Proceedings
2020Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
Kolbinger, E.; Kuttler, S.; Wagner, S.; Schneider-Ramelow, M.
Journal Article
2020Life Cycle Assessment of the Fairphone 3
Proske, Marina; Sánchez, David; Clemm, Christian; Baur, Sarah-Jane
Study
2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Conference Paper
2020Low inductive full ceramic sic power module for high-temperature automotive applications
Klein, K.; Rämer, O.; Hoene, E.; Yasuda, Y.; Ito, H.; Kurita, F.; Enoki, M.; Nakamura, H.; Okishiro, K.
Conference Paper
2020Low temperature solid state bonding of Cu-In fine-pitch interconnects
Bickel, S.; Panchenko, I.; Tachikawa, W.; Wolf, M.J.
Conference Paper
2020Low voltage silicon photonic modulators and switches for high radix integrated transmitters
Brimont, A.; Zanzi, A.; Vagionas, C.; Pegios, M.M.; Vyrsokinos, K.; Pleros, N.; Kraft, J.; Sidorov, V.; Sirbu, B.; Tekin, T.; Sanchis, P.
Conference Paper
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Journal Article
2020Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes
Manessis, D.; Seckel, M.; Fu, L.; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C.M.; Tretyakov, S.; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2020Market Trends in Smartphone Design and Reliability Testing
Clemm, Christian; Berwald, Anton; Prewitz, Carolin; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020Memory-assisted Statistically-ranked RF Beam Training Algorithms for Sparse MIMO
Tiwari, K.K.; Grass, E.; Thompson, J.S.
Conference Paper
2020Microstructure and shear force correlation after reliability testing of bond contacts using alternative al heavy wire materials
Klengel, R.; Groth, A.; Hempel, M.; Schischka, J.; Stephan, T.; Klengel, S.; Schneider-Ramelow, M.
Conference Paper
2020Microwave and Millimeter Wave Sensors for Industrial, Scientific and Medical Applications in BiCMOS Technology
Wessel, J.; Schmalz, K.; Yadav, R.K.; Zarrin, P.S.; Jamal, F.I.; Wang, D.; Fischer, G.
Conference Paper
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Journal Article
2020A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Conference Paper
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Journal Article
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Journal Article
2020The opportunities of integration technologies for active and passive components
Ostmann, A.; Hoene, E.; Marczok, C.
Conference Paper
2020Organizational transition management of circular business model innovations
Hofmann, F.; Jaeger-Erben, M.
Journal Article
2020Overview of Circular Economy Practices in High-tech Manufacturing Industries
Schischke, Karsten; Billaud, Mathilde; Reinhold, Julia; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020PCB layout tool integrated loss and inductance estimation
Hoffmann, S.; Hoene, E.; Schroeder, B.; Stube, B.; Alraai, A.; Moritz, O.; Müller, O.
Conference Paper
2020PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
Bakhshaee, Nasim; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Conference Paper
2020Performance simulation of a 5G hybrid beamforming millimeter-wave system
Kühne, T.; Song, X.; Caire, G.; Rasilainen, K.; Le, T.H.; Rossi, M.; Ndip, I.; Fager, C.
Conference Paper
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Journal Article
2020Process modules for high-density interconnects in panel-level packaging
Schein, Friedrich-Leonhard; Kahle, Ruben; Kunz, Marc; Kunz, Tim; Kossev, Jordan; Müller, Tobias; Pentz, Mathias; Dietterle, Michael; Ostmann, Andreas
Journal Article
2020Process simulation of fan-out wafer level packaging: Influence of material and geometry on warpage
Dijk, M. van; Jaeschke, J.; Wittler, O.; Stegmaier, A.; Schneider-Ramelow, M.
Conference Paper
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Journal Article
2020Real-time impedance monitoring of epithelial cultures with inkjet-printed interdigitated-electrode sensors
Mojena-Medina, D.; Hubl, M.; Bäuscher, M.; Jorcano, J.L.; Ngo, H.-D.; Acedo, P.
Journal Article
2020Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method
Woehrmann, M.; Keller, A.; Fritzsch, T.; Schiffer, M.; Gollhardt, A.; Walter, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2020Reliabillity of through glass vias and hermetically sealing for a versatile sensor plattform
Kröhnert, K.; Friedrich, G.; Starukhin, D.; Wöhrmann, M.; Schiffer, M.; Schneider-Ramelow, M.
Conference Paper
2020Review of the List of Restricted Substance (Annex II) of Directive 2011/65/EU (RoHS)
Baron, Yifaat; Moch Katja; Clemm, Christian; Gensch, Carl-Otto; Koehler, Andreas; Deubzer, Otmar; Loew, Clara
Conference Paper
2020Robust converters for renewable energy plants
Bayer, Christoph Friedrich; Wagner, Stefan
Journal Article
2020Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Journal Article
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2020SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering
Marczok, C.; Martina, M.; Laumen, M.; Richter, S.; Birkhold, A.; Flieger, B.; Wendt, O.; Päsler, T.
Conference Paper
2020Simulation challenges of warpage for wafer- and panel level packaging
Dijk, M. van; Kuttler, S.; Rost, F.; Jeaschke, J.; Walter, H.; Wittler, O.; Braun, T.; Schneider-Ramelow, M.
Conference Paper
2020Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries
Elia, G.A.; Greco, G.; Kamm, P.H.; Garcia-Moreno, F.; Raoux, S.; Hahn, R.
Journal Article
2020The smartphone evolution - an analysis of the design evolution and environmental impact of smartphones
Proske, Marina; Poppe, Erik; Jaeger-Erben, Melanie
Conference Paper
2020Solder joint fatigue testing with harsh temperature rates: Influence of dwell time
Schambeck, S.; Jaeschke, J.; Hutter, M.; Deutinger, A.; Kederer, F.; Schneider-Ramelow, M.
Conference Paper
2020Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Schambeck, S.; Hutter, M.; Jaeschke, J.; Deutinger, A.; Schneider-Ramelow, M.
Journal Article
2020A time-temperature-moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging
Huber, F.; Etschmaier, H.; Walter, H.; Urstöger, G.; Hadley, P.
Journal Article
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Journal Article
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
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