Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020(How) can service design and digitalization be used to transition to the circular economy?
Scholz, Ronja; Malila, Saija; Vihma, Markus; Marwede, Max; Cygert, Karolina
Conference Paper
2020Assessment of the influencing parameters of the tumble test for robustness testing of smartphones
Dobs, Tom; Sánchez, David; Schischke, Karsten; Wittler, Olaf; Schneider-Ramelow, Martin
Conference Paper
2020Bidirectional Bioelectronic Interfaces: System Design and Circuit Implications
Liu, Y.; Urso, A.; Martins da Ponte, R.; Costa, T.; Valente, V.; Giagka, V.; Serdijn, W.A.; Constandinou, T.G.; Denison, T.
Journal Article
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin
Conference Paper
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, R.; Zufiria, P.G.; Giagka, V.; Serdijn, W.A.
Conference Paper
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Journal Article
2020Condition monitoring of power electronic modules for predictive maintenance
Wagner, Stefan; Wüst, Felix; Sehr, Frederic; Dobs, Tom; Schneider-Ramelow, Martin
Conference Paper
2020Current State of Durability Assessment for Four Consumer Product Groups
Hahn, Daniel; Sehr, Frederic; Straube, Stefan; Dobs, Tom; Berwald, Anton; Wittler, Olaf; Schneider-Ramelos, Martin
Conference Paper
2020Customer acceptance of mobile devices with permanently installed batteries and accumulators
Winzer, Janis; Czichowski, Johanna; Lascho, Tobias; Bill, Stine; Hipp, Tamina; Wagner, Eduard; Jaeger-Erben, Melanie
Conference Paper
2020Decomposing software obsolescence cases - a cause and effect analysis framework for software induced product replacement
Wagner, Eduard; Poppe, Erik; Hahn, Florian; Jaeger-Erben, Melanie; Druschke, Jan; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
2020Design for and Design from Recycling: The Key Pillars of Circular Product Design
Dimitrova, G.; Berwald, A.; Feenstra T.; Höggerl, G.; Nissen, N.F.; Schneider-Ramelow, M.
Conference Paper
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Journal Article
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Conference Paper
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Conference Paper
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Journal Article
2020Environmental Impacts of Modular Design - Life Cycle Assessment of the Fairphone 3
Proske, Marina; Clemm, Christian; Sánchez Fernández, David; Ballester Salvà, Miquel; Jügel, Marvin; Kukuk-Schmid, Heike; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020Extended Product Lifespan Abroad - Assessing Repair Sector in Ghana
Groscurth, Balthasar; Batteiger, Alexander; Deubzer, Otmar; Jaeger-Erben, Melanie
Conference Paper
2020Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven
Conference Paper
2020FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, A.; Jaeschke, J.; Wittler, O.; Fabian, B.; Thomas, S.; Schneider-Ramelow, M.
Journal Article
2020Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications
Schischke, K.; Nissen, N.F.; Schneider-Ramelow, M.
Journal Article
2020Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2019/2020
 
Annual Report
2020Grading system for post-consumer recycled plastics from WEEE
Wagner, Florian; Bracquene, Ellen; Wagner, Eduard; Keyzer, Jozefien de; Duflout, Joost R.; Dewulf, Wim; Peeters, Jef R.
Conference Paper
2020How long do we care? The role of consumer practices for sustainable electronics
Jaeger-Erben, Melanie; Hipp, Tamina; Frick, Vivian
Conference Paper
2020International Congress "Electronics Goes Green 2020+". Proceedings
: Schneider-Ramelow, Martin
Conference Proceedings
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Journal Article
2020Market Trends in Smartphone Design and Reliability Testing
Clemm, Christian; Berwald, Anton; Prewitz, Carolin; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020Memory-assisted Statistically-ranked RF Beam Training Algorithms for Sparse MIMO
Tiwari, K.K.; Grass, E.; Thompson, J.S.
Conference Paper
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Journal Article
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Conference Paper
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Journal Article
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Journal Article
2020Organizational transition management of circular business model innovations
Hofmann, F.; Jaeger-Erben, M.
Journal Article
2020Overview of Circular Economy Practices in High-tech Manufacturing Industries
Schischke, Karsten; Billaud, Mathilde; Reinhold, Julia; Nissen, Nils F.; Schneider-Ramelow, Martin
Conference Paper
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Journal Article
2020Process modules for high-density interconnects in panel-level packaging
Schein, Friedrich-Leonhard; Kahle, Ruben; Kunz, Marc; Kunz, Tim; Kossev, Jordan; Müller, Tobias; Pentz, Mathias; Dietterle, Michael; Ostmann, Andreas
Journal Article
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Journal Article
2020Review of the List of Restricted Substance (Annex II) of Directive 2011/65/EU (RoHS)
Baron, Yifaat; Moch Katja; Clemm, Christian; Gensch, Carl-Otto; Koehler, Andreas; Deubzer, Otmar; Loew, Clara
Conference Paper
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2020The smartphone evolution - an analysis of the design evolution and environmental impact of smartphones
Proske, Marina; Poppe, Erik; Jaeger-Erben, Melanie
Conference Paper
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Journal Article
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
Kossifos, K.M.; Petrou, L.; Varnava, G.; Pitilakis, A.; Tsilipakos, O.; Liu, F.; Karousios, P.; Tasolamprou, A.C.; Seckel, M.; Manessis, D.; Kantartzis, N.V.; Kwon, D.-H.; Antoniades, M.A.; Georgiou, J.
Journal Article
2020Using Post-Consumer Recycled Plastics in new EEE. A promising Circular Business Model for the Electronics Sector
Maisel, F.; Emmerich, J.; Dimitrova, G.; Berwald, A.; Nissen, N.F.; Schneider-Ramelow, M.
Conference Paper
2020Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, F.; Etschmaier, H.; Dobs, T.; Walter, H.; Wittler, O.; Hadley, P.
Journal Article
2020Wafer-Scale Graphene-Based Soft Electrode Array with Optogenetic Compatibility
Velea, A.I.; Vollebregt, S.; Wardhana, G.K.; Giagka, V.
Conference Paper
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Journal Article
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
2019A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
Akgun, Omer Can; Nanbakhsh, Kambiz; Giagka, Vasiliki; Serdijn, Wouter A.
Conference Paper
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Journal Article
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Journal Article
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Journal Article
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Journal Article
2019Condition monitoring for failure monitoring of power electronic assemblies
Wagner, Stefan; Wuest, Felix; Trampert, Stefan; Sehr, Frederic; Middendorf, Andreas; Wittler, Olaf; Schneider-Ramelow, Martin
Conference Paper
2019Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Schulz, S.; Heinrich, W.
Conference Paper
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Journal Article
2019Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Demumieux, P.; Avino-Salvado, O.; Buttay, C.; Martin, C.; Sixdenier, F.; Joubert, C.; Magambo, J.S.N.T.; Loher, T.
Conference Paper
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Journal Article
2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
Nanbakhsh, Kambiz; Kluba, Marta; Pahl, Barbara; Bourgeois, Florian; Dekker, Ronald; Serdijn, Wouter; Giagka, Vasiliki
Conference Paper
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Journal Article
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Journal Article
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Conference Paper
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Annual Report
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Conference Paper
2019Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
Löher, Thomas; Ndip, Ivan; Lang, Klaus-Dieter
Patent
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Conference Paper
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Conference Paper
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Journal Article
2019Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Journal Article
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Book Article
2019Miniaturized 24 GHz Radar Positioning Transponder Module
Fritzsch, Thomas; Tschoban, Christian; Böttcher, Mathias; Windrich, Frank; Phung, Gia Ngoc; Lang, Klaus-Dieter
Conference Paper
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.
Conference Paper
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Journal Article
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Conference Paper
2019Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
Kawasaki, S.; Giagka, V.; Haas, M. de; Louwerse, M.; Henneken, V.; Heesch, C. van; Dekker, R.
Conference Paper
2019Realisierung und Anwendung energieautarker miniaturisierter Funksensorik: Chancen durch IoT, 5G und Narrowband
Brockmann, Carsten; Günther-Sorge, Julia; Pötter, Harald
Journal Article
2019Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
Velea, Andrada Iulia; Vollebregt, Sten; Hosman, Tim; Pak, Anna; Giagka, Vasiliki
Conference Paper
2019Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR)
Sirbu, B.; Tekin, T.; Weeber, J.C.; Dereux, A.; Markey, L.
Conference Paper
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
2019Vorrichtung zur Erfassung von Objekten
Becker, Karl-Friedrich; Georgi, Leopold; Tschoban, Christian; Hommes, Alexander; Ebberg, Alfred; Hülsmann, Axel; Hofmann, Ulrich; Wantoch, Thomas von
Patent
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Conference Paper
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
20185G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.
Conference Paper
2018Accelerated Degradation of High Power Diode Lasers Caused by External Optical Feedback Operation
Kissel, H.; Leonhäuser, B.; Tomm, J.W.; Hempel, M.; Biesenbach, J.
Conference Paper
2018Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub
Conference Paper
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Book Article
2018Ag sintering - An alternative large area joining technology
Weber, C.; Hutter, M.
Conference Paper
2018Alterungsphänomene beim Al-Drahtbonden mit semiautokatalytisch abgeschiedenem Gold auf chemisch Ni-Schichten
Fischer, Felix; Schmidt, R.; Schneider-Ramelow, M.; Schmitz, S.; Ngo, H.-D.; Sitte, N.
Conference Paper
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Conference Paper
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Assembly-Line-Compatible Electromagnetic Characterization of Antenna Substrates for Wearable Applications using Polynomial Chaos
Deckmyn, T.; Rossi, M.; Agneessens, S.; Rogier, H.; Ginste, D.V.
Conference Paper
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Conference Paper
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018Building Capacities for Transdisciplinary Research
Jaeger-Erben, M.; Kramm, J.; Sonnberger, M.; Völker, C.; Albert, C.; Graf, A.; Hermans, K.; Lange, S.; Santarius, T.; Schröter, B.; Sievers-Glotzbach, S.; Winzer, J.
Journal Article
2018Can Bond Wires really be used as Antennas?
Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.
Journal Article
2018Challenges for Miniaturised Energy Harvesting Sensor Systems
Rusu, C.; Bader, S.; Oelmann, B.; Alvandpour, A.; Enoksson, P.; Braun, T.; Tiedke, S.; Dal Molin, R.; Ferin, G.; Torvinen, P.; Liljeholm, J.
Conference Paper
2018Channel Characterization for Chip-scale Wireless Communications within Computing Packages
Timoneda, X.; Cabellos-Aparicio, A.; Manessis, D.; Alarcon, E.; Abadal, S.
Conference Paper
2018Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, M.; Panchenko, I.; Künzelmann, U.; Reif, J.; Geidel, M.; Wolf, M.J.; Lang, K.-D.
Journal Article
2018Characteristics of Li-ion micro batteries fully batch fabricated by micro-fluidic MEMS packaging
Hahn, R.; Ferch, M.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Elia, G.A.
Journal Article
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Journal Article, Conference Paper
2018Characterization of self-assembled monolayers for CuCu bonding technology
Lykova, M.; Langer, E.; Hinrichs, K.; Panchenko, I.; Meyer, J.; Künzelmann, U.; Wolf, M.J.; Lang, K.D.
Journal Article
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Conference Paper
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Conference Paper
2018Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.
Conference Paper
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Journal Article
2018Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.
Journal Article
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Conference Paper
2018Cu-In fine-pitch-interconnects: Influence of processing conditions on the interconnection quality
Bickel, S.; Sen, S.; Meyer, J.; Panchenko, I.; Wolf, M.J.
Conference Paper
2018Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, A.; Schulz, M.; Sheva, S.; Keller, J.; Bader, V.; Wöhrmann, M.; Bauer, J.; May, D.; Wunderle, B.
Conference Paper
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Conference Paper
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Journal Article
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Ponte, R.; Giagka, V.; Serdijn, W.A.
Conference Paper
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Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Conference Paper
2018Determination of Stress-Strain Properties Combining Small-Depth Nanoindentation and Numerical Simulation
Kuttler, S.; Walter, H.; Grams, A.; Schneider-Ramelow, M.; Huber, S.
Conference Paper
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Journal Article
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Conference Paper
2018Differential-Line Characterization Using Mixed-Port Scattering Parameters
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
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Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.
Journal Article, Conference Paper
2018Effects of Glob Top on mmWave Bond Wire Antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Conference Paper
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Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Conference Paper
2018Elektronisches Modul mit integrierter Antenne und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Elektronisches Modul und Verfahren zu seiner Herstellung
Böttcher, Lars; Kosmider, Stefan; Löher, Thomas; Ostmann, Andreas
Patent
2018Energy autarkic wireless sensor node for reliable long-term exposure to domestic waste water in a sewage system
Leverenz, E.; Becker, K.-F.; Koch, M.; Straube, S.; Pötter, H.; Lang, K.-D.
Conference Paper
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Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Presentation
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Olafsdottir, Gudrun Erla; Serdijn, Wouter A.; Giagka, Vasiliki
Conference Paper
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Conference Paper
2018Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators
Herter, Jonas; Wunderlich, V.; Janeczka, C.; Zamora, V.
Journal Article
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Journal Article
2018Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain
Journal Article
2018Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
Meyer, J.; Upasani, P.J.; Bickel, S.; Panchenko, I.; Wolf, M.J.
Conference Paper
2018Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
 
Annual Report
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
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Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Conference Paper
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Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M
Conference Paper
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Ostmann, A.; Schein, F.-L.; Dietterle, M.; Kunz, M.; Lang, K.-D.
Conference Paper
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Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
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Neitz, Marcel; Wöhrmann, Markus; Schröder, Henning
Journal Article
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Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D.
Conference Paper
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Conference Paper
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Windrich, F.; Malanin, M.; Bittrich, E.; Schwarz, A.; Eichhorn, K.-J.; Voit, B.
Conference Paper
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Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.
Journal Article
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Greco, G.; Tatchev, D.; Hoell, A.; Krumrey, M.; Raoux, S.; Hahn, R.; Elia, G.A.
Journal Article
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Kripfgans, J.; Weber, C.; Hutter, M.
Conference Paper
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Fritzsch, Thomas; Kavianpour, F.; Rothermund, Mario; Oppermann, Hermann; Ehrmann, Oswin; Lang, Klaus-Dieter
Journal Article, Conference Paper
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Ndip, Ivan
Patent
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Conference Paper
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Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Conference Paper
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Bell, A.J.; Deubzer, O.
Journal Article
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Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Conference Paper
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Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.
Journal Article
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Vereshchagina, E.; Poppe, E.; Schjolberg-Henriksen, K.; Wöhrmann, M.; Moe, S.
Conference Paper
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Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2018Millimeter-Wave Propagation within a Computer Chip Package
Timoneda, X.; Abadal, S.; Cabellos-Aparicio, A.; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.
Conference Paper
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Ndip, I.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Multi sensor node for long-term wireless measurement of density, pH value and temperature in silage for bio gas
Arnold, P.; Tschoban, C.; Heuer, K.; Rochlitzer, R.; Thuenen, T.; Lang, K.-D.
Conference Paper
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Fiedler, S.; Zwanzig, M.; Schmidt, R.; Scheel, W.
Book Article
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Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.
Conference Paper
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Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Conference Paper
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Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Journal Article, Conference Paper
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Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Journal Article
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Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.
Conference Paper
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Kallmayer, C.; Schaller, F.; Löher, T.; Haberland, J.; Kayatz, F.; Schult, A.
Conference Paper
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Folk, E.; Ndip, I.
Journal Article
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Conference Paper
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Book Article
2018Realizing flexible bioelectronic medicines for accessing the peripheral nerves - technology considerations
Giagka, Vasiliki; Serdijn, Wouter A.
Journal Article
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Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.
Conference Paper
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Ndip, I.; Lang, K.-D.
Conference Paper
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Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Conference Paper
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Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Journal Article, Conference Paper
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Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Book Article
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Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong
Conference Paper
2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix
Wunderle, B.; May, D.; Ras, M.A.; Grosse, C.; Wöhrmann, M.; Bader, V.; Keller, J.
Conference Paper
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Conference Paper
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Fröhlich, Juliane; Dietrich, Lothar; Oppermann, Hermann; Lang, Klaus-Dieter
Conference Paper
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Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.
Conference Paper
2018Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging
Grams, A.; Curran, B.; Kuttler, S.; Reyes, J.; Wüst, F.; Lang, K.-D.
Conference Paper
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Journal Article
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Conference Paper
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Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
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Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
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Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Conference Paper
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Tacchetti, Lucia; Serdijn, Wouter A.; Giakga, Vasiliki
Conference Paper
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Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Conference Paper
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Verfahren zur Herstellung eines Packages und Package
Böttcher, Mathias; Wolf, Jürgen
Patent
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Conference Paper
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2018Workshops der INFORMATIK 2018. Architekturen, Prozesse, Sicherheit und Nachhaltigkeit
: Czarnecki, Christian; Brockmann, Carsten; Sultanow, Eldar; Koschmider, Agnes; Selzer, Annika
Conference Proceedings
20170.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.
Conference Paper
2017Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.
Conference Paper
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Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S.
Conference Paper
2017Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.
Conference Paper
2017Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M.
Journal Article
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
2017Between the User and the Cloud: Assessing the Energy Footprint of the Access Network Devices
Nissen, Nils F.; Stobbe, Lutz; Richter, Nikolai; Zedel, Hannes; Lang, Klaus-Dieter
Conference Paper
2017Biosensor, Verfahren zu seiner Herstellung und Verfahren zum Nachweisen eines Analyten mit Hilfe des Biosensors
Fiedler, Markus; Grabbert, Niels; Lang, Klaus-Dieter; Meyer, Vera
Patent
2017Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.
Conference Paper
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Hofmann, Florian; Marwede, Max; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
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Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Conference Paper
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Conference Paper
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Journal Article
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Klein, K.; Hoene, E.; Lang, K.-D.
Conference Paper
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Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Conference Paper
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Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.
Conference Paper
2017Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.
Conference Paper
2017Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Conference Paper
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Conference Paper
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Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Conference Paper
2017Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J.
Journal Article
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Journal Article
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
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Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Conference Paper
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Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Conference Paper
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Brusberg, L.; Immonen, M.; Lamprecht, T.
Book Article
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Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
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Conference Paper
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Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Conference Paper
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Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H.
Conference Paper
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Presentation
2017Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
 
Annual Report
2017Germanium "hexa" detector. Production and testing
Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.
Journal Article, Conference Paper
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Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd
Patent
2017How Modularity of Electronic Functions Can Lead to Longer Product Lifetimes
Nissen, Nils F.; Schischke, Karsten; Proske, Marina; Ballester, Miquel; Lang, Klaus-Dieter
Conference Paper
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Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W.
Conference Paper
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Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K.
Conference Paper
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Clemm, Christian; Nissen, Nils F.; Schischke, Karsten; Dimitrova, Gergana; Marwede, Max; Lang, Klaus-Dieter
Conference Paper
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Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.
Conference Paper
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Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Conference Paper
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Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Conference Paper
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Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.
Journal Article
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Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk
Journal Article
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Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Conference Paper
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Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Book Article
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Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Conference Paper
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Sandjaja, M.; Lestari, M.L.A.D.
Journal Article
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Zoschke, Kai; Töpper, Michael
Patent
2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Journal Article
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Zoschke, Kai; Lang, K.-D.
Conference Paper
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Sedlmair, J.; Mehlmann, B.; Olowinsky, A.
Conference Paper
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Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.
Conference Paper
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Aschenbrenner, Rolf; Kallmayer, Christine
Presentation
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Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Conference Paper
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Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia
Presentation
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Conference Paper
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Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Presentation
2017Nahfeldlokalisierung von Systemen in Produktionslinien - Hardware und Systemintegration
Fritzsch, Thomas; Gulden, Peter; Lipka, Melanie; Muharemovic, Nedim; Meinel, David; Vehring, Sönke; Böck, Georg; Kempf, Markus; Pavlovic, Boban; Schmückle, Fanz-Josef; Phung, Gia Ngoc; Huhn, Max
Conference Paper
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Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.
Conference Paper
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Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Conference Paper
2017Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Presentation
2017Panel Level Packaging for Power Applications
Aschenbrenner, Rolf
Presentation
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Aschenbrenner, Rolf; Ostmann, Andreas
Conference Paper
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Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.
Journal Article
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Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
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Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.
Conference Paper
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Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Journal Article
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Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah
Report
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Conference Paper
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Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Journal Article
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Iannacci, J.; Tschoban, C.
Journal Article
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Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
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Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K.
Conference Paper
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O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Conference Paper
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Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Journal Article
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Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Sammler, Fiona; Nissen, Nils F.
Book Article
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Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Conference Paper
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Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.
Conference Paper
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Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eduard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F.
Book Article
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Oppermann, H.; Lang, K.-D.
Conference Paper
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Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
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Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Journal Article
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Brink, Morten; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
2017What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina
Conference Paper
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Wittler, Olaf; Hölck, Ole; Benecke, Stephan; Dobs, Tom; Dijk, Marius van; Keller, Jürgen; Schulz, Marcus; Bader, Volker; Braun, Tanja; Lang, Klaus-Dieter
Conference Paper
20164.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Journal Article
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Conference Paper
2016Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.
Conference Paper
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Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.
Conference Paper
2016µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.
Report
2016Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.
Conference Paper
2016All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Conference Paper
2016Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B.
Journal Article
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Journal Article
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Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.
Conference Paper
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Bonding technologies for 3D packaging with high I/O count - An evaluation report
Lohse, S.; Wollanke, A.
Conference Paper
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Conference Paper
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Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf
Presentation
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Conference Paper
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Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
Conference Paper
2016Design of amorphous silicon photonic crystal-based M-Z modulator operating at 1.55 μm
Rao, S.; Casalino, M.; Coppola, G.; Kisacik, R.; Tekin, T.; Corte, F.G.D.
Conference Paper
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016Developing an indicator setup to measure life-cycle conditions of electronic products
Winzer, Janis; Wagner, Eduard; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, Piotr; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Conference Paper
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Journal Article
2016Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.
Conference Paper
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Journal Article, Conference Paper
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Conference Paper
2016DSC investigation of the undercooling of SnAgCu solder alloys
Mueller, M.; Türke, A.; Panchenko, I.
Conference Paper
2016Durability and cycle frequency of smartphone and tablet lithium-ion batteries in the field
Clemm, C.; Sinai, C.; Ferkinghoff, C.; Dethlefs, N.; Nissen, N.F.; Lang, K.D.
Conference Paper
2016Effective method for filter design and semiconductor and inductors loss calculation
Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D.
Conference Paper
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Conference Paper
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Journal Article, Conference Paper
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.
Conference Paper
2016Energy efficiency of data centers - a system-oriented analysis of current development trends
Hintemann, R.; Beucker, S.; Clausen, J.; Stobbe, L.; Proske, M.; Nissen, N.F.
Conference Paper
2016Energy efficiency of ICT: Further improvement through customized products
Stobbe, L.; Proske, M.; Beucker, S.; Hintemann, R.; Lang, K.D.
Conference Paper
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.
Conference Paper
2016Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter
Journal Article
2016Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben
Dietrich, Manfred; Gulbins, Matthias; Haase, Joachim; Markwirth, Thomas; Warmuth, Jens Michael
Report
2016Evaluation of indicators supporting the sustainable design of electronic systems
Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D.
Journal Article, Conference Paper
2016Evaluation of pressure stable chip-to-tube fittings enabling high-speed chip-HPLC with mass spectrometric detection
Lotter, Carsten; Heiland, Josef J.; Stein, Volkmar; Klimkait, Michael; Queisser, Marco; Belder, Detlev
Journal Article
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, Kai; Lang, Klaus-Dieter
Conference Paper
2016Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Journal Article
2016Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016Feasibility study for setting-up reference values to support the calculation of recyclability / recoverability rates of electr(on)ic products
Chancerel, Perrine; Marwede, Max
: Mathieux, Fabrice; Talens Peiró, Laura
Study
2016Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2015/2016
 
Annual Report
2016Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, Kevin; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2016Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2016High Density Interposer – Challenges and Opportunities
Böttcher, Mathias; Windrich, Frank; Wolf, M. Jürgen
Conference Paper
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2016High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article, Conference Paper
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Conference Paper
2016Highly reliable and cost effective thick film substrates for power LEDs
Gundel, P.; Persons, R.; Bawohl, M.; Challingsworth, M.; Czwickla, C.; Garcia, V.; Modes, C.; Nikolaidis, I.; Reitz, J.; Shahbazi, C.; Nowak, T.
Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016How will high-performance nonwovens transform your business?
Gwinnutt, J.; Cumming, S.; Prigneaux, J.; Stevenson, A.; Dils, C.; Granberg, H.; Slater, A.; Knorr, K.; Jolly, M.; Möbitz, C.; Lütke, C.; Hofmann, M.; Käppel, D.
Journal Article
2016An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Conference Paper
2016In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications
Windrich, Frank; Kappert, E.J.; Malanin, M.; Eichhorn, K.-J.; Häußler, L.; Benes, N.E.; Voit, B.
Journal Article
2016In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article, Conference Paper
2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.
Conference Paper
2016Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.
Conference Paper
2016Integration Technologies for Smart Textiles
Aschenbrenner, Rolf
Presentation
2016Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.
Abstract
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, Jessica; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2016Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D.
Journal Article
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Conference Paper
2016Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.
Conference Paper
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Conference Paper
2016Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.
Journal Article
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, Kai; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Conference Paper
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, Kai; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.
Conference Paper
2016Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.
Conference Paper
2016Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process
Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J.
Conference Paper
2016Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.
Conference Paper
2016Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.
Conference Paper
2016Non-destructive mobile monitoring of microbial contaminations on meat surfaces using porphyrin fluorescence intensities
Durek, J.; Fröhling, A.; Bolling, J.; Thomasius, R.; Durek, P.; Schlüter, O.K.
Journal Article
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry
Zhou, S.Y.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Kröhnert, K.; Gernhardt, R.; Lang, K.D.; Woratz, M.; Herrmann, P.; Volkmer, N.; Pohl, O.; Noack, V.; Ngo, H.D.
Conference Paper
2016Obsolescence of electronics - the example of smartphones
Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Journal Article
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2016On-chip automation of cell-free protein synthesis
Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan
Journal Article
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Optical static RAM cell using a monolithically integrated InP Flip-Flop and wavelength-encoded signals
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.
Conference Paper
2016An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.
Journal Article
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, Charles-Alix; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Conference Paper
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Conference Paper
2016Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf
Presentation
2016Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K.
Conference Paper
2016Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.
Conference Paper
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Potential applications of electron emission membranes in medicine
Bilevych, Y.; Brunner, S.E.; Chan, H.W.; Charbon, E.; Graaf, H. van der; Hagen, C.W.; Nutzel, G.; Pinto, S.D.; Prodanovic, V.; Rotmanc, D.; Santagata, F.; Sarro, L.; Schaart, D.R.; Sinsheimer, J.; Smedley, J.; Tao, S.X.; Theulings, A.M.M.G.
Journal Article
2016Rapid scan in-situ FT-IR curing studies of low-temperature cure thin film polymer dielectrics in solid state
Windrich, Frank; Malanin, M.; Eichhorn, K.J.; Voit, B.
Conference Paper
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Journal Article
2016Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D.
Journal Article
2016A review of green electronics research trends
Nissen, Nils F.; Stobbe, Lutz; Zedel, Hannes; Schischke, Karsten; Lang, Klaus-Dieter
Conference Paper
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Conference Paper
2016RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Journal Article
2016RF-MEMS technology for future mobile and high-frequency applications: Reconfigurable 8-Bit power attenuator tested up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.
Journal Article
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Journal Article
2016Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M.
Journal Article
2016Sensitive brace recognises the right angle
Krshiwoblozki, Malte von; Pawlikowski, Jakub
Journal Article
2016Simulation based analysis of LED package reliability regarding encapsulant related failures
Watzke, Stefan
Dissertation
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.
Conference Paper
2016Single mode optical interconnects for future data centers
Vyrsokinos, K.; Moralis-Pegios, M.; Vagionas, C.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rohracher, K.; Dorrestein, S.; Bogdan, M.; Pleros, N.
Conference Paper
2016Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.
Conference Paper
2016Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D.
Conference Paper
2016Stocks and flows of critical materials in batteries: Data collection and data uses
Chancerel, Perrine; Maehlitz, Paul; Chanson, Claude; Binnemans, Peter; Huisman, Jaco; Guzman Brechu, Michelle; Rotter, Vera Susanne; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
2016Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.
Conference Paper
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, Kai; Wegner, M.; Fischer, T.; Lang, K.-D.
Conference Paper
2016Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge
Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L.
Conference Paper
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, Hermann; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Conference Paper
2016Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.
Journal Article
2016Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert
Patent
2016Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
Brusberg, Lars; Schröder, Henning
Patent
2016Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Journal Article
2016Wafer level chip scale packaging
Töpper, Michael
Book Article
2016Wafer Level Packaging and System Integration
Wolf, M. Jürgen; Ehrmann, Oswin
Book Article
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Piazza, Silvio dalla; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter
Conference Paper
2016WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
Pitris, S.; Vagionas, C.; Tekin, T.; Broeke, R.; Kanellos, G.T.; Pleros, N.
Journal Article
2016Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina
Study
2016Would the setting-up of reference values to support the calculation of recyclability rates help improving the material efficiency of electronic products?
Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura
Conference Paper
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, Ha-Duong; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter
Journal Article