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| 2019 | 3D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W. | Journal Article |
| 2019 | Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K. | Journal Article |
| 2019 | Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Journal Article |
| 2019 | Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A. | Journal Article |
| 2019 | Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie | Journal Article |
| 2019 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
| Annual Report |
| 2019 | High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W. | Journal Article |
| 2019 | Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin | Book Article |
| 2019 | Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias | Conference Paper |
| 2018 | 3D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter | Abstract |
| 2018 | 3D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Conference Paper |
| 2018 | 5G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I. | Conference Paper |
| 2018 | Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub | Conference Paper |
| 2018 | Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong | Book Article |
| 2018 | Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D. | Conference Paper |
| 2018 | Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan | Patent |
| 2018 | Antennenvorrichtung mit Bonddrähten
Ndip, Ivan | Patent |
| 2018 | Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan | Patent |
| 2018 | Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M. | Conference Paper |
| 2018 | Bändchenbondantennen
Ndip, Ivan | Patent |
| 2018 | Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B. | Journal Article |
| 2018 | Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M. | Journal Article, Conference Paper |
| 2018 | Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D. | Conference Paper |
| 2018 | A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D. | Conference Paper |
| 2018 | Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M. | Conference Paper |
| 2018 | Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M. | Journal Article |
| 2018 | Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D. | Journal Article |
| 2018 | Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J. | Conference Paper |
| 2018 | Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M. | Conference Paper |
| 2018 | Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong | Journal Article |
| 2018 | Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D. | Conference Paper |
| 2018 | Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D. | Journal Article |
| 2018 | Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F. | Conference Paper |
| 2018 | Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D. | Conference Paper |
| 2018 | Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D. | Conference Paper |
| 2018 | Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G. | Conference Paper |
| 2018 | Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options
Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F. | Journal Article, Conference Paper |
| 2018 | Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin | Conference Paper |
| 2018 | Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia | Presentation |
| 2018 | The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A. | Conference Paper |
| 2018 | Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D. | Conference Paper |
| 2018 | First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian | Journal Article |
| 2018 | Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain | Journal Article |
| 2018 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
| Annual Report |
| 2018 | Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M. | Conference Paper |
| 2018 | Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O. | Conference Paper |
| 2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Conference Paper |
| 2018 | In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M. | Conference Paper |
| 2018 | Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J. | Journal Article |
| 2018 | Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M. | Conference Paper |
| 2018 | Kombinationsantenne
Ndip, Ivan | Patent |
| 2018 | Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H. | Conference Paper |
| 2018 | Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M. H.; Eichler, H. J.; Lang, K.-D.; Glaw, V.; Kossatz, M. | Conference Paper |
| 2018 | Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O. | Journal Article |
| 2018 | Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D. | Conference Paper |
| 2018 | Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J. | Journal Article |
| 2018 | Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Journal Article |
| 2018 | Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D. | Conference Paper |
| 2018 | Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas | Patent |
| 2018 | Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas | Patent |
| 2018 | Narrow linewidth micro-integrated high power diode laser module for deployment in space
Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G. | Conference Paper |
| 2018 | Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Journal Article |
| 2018 | A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A. | Conference Paper |
| 2018 | A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens | Conference Paper, Journal Article |
| 2018 | On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H. | Journal Article |
| 2018 | Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate
Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V. | Conference Paper |
| 2018 | Packaging for high frequency and reliability
Folk, E.; Ndip, I. | Journal Article |
| 2018 | Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D. | Conference Paper |
| 2018 | Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2018 | Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E. | Journal Article |
| 2018 | Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramleow, Martin; Lang, Klaus-Dieter | Book Article |
| 2018 | Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M. H.; Eichler, H. J.; Lang, K.-D.; Glaw, V.; Kossatz, M. | Conference Paper |
| 2018 | Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter | Journal Article, Conference Paper |
| 2018 | Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter | Book Article |
| 2018 | Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D. | Conference Paper |
| 2018 | A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D. | Conference Paper |
| 2018 | Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E. | Journal Article |
| 2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Conference Paper |
| 2018 | Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2018 | Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B. | Conference Paper |
| 2018 | Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D. | Conference Paper |
| 2018 | Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel | Conference Paper |
| 2018 | Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2018 | Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter | Conference Paper |
| 2018 | Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan | Patent |
| 2018 | Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan | Patent |
| 2018 | Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan | Patent |
| 2017 | 0.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T. | Conference Paper |
| 2017 | Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J. | Conference Paper |
| 2017 | Advanced packaging for future demands
Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S. | Conference Paper |
| 2017 | Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D. | Conference Paper |
| 2017 | Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M. | Journal Article |
| 2017 | Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian | Patent |
| 2017 | Canary devices for through-silicon vias a condition monitoring approach
Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D. | Conference Paper |
| 2017 | Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Conference Paper |
| 2017 | A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2017 | Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M. | Journal Article |
| 2017 | Comprehensive AC performance analysis of ceramic capacitors for DC link usage
Klein, K.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Conference Paper |
| 2017 | Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D. | Conference Paper |
| 2017 | Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects
Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J. | Conference Paper |
| 2017 | Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide
Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Conference Paper |
| 2017 | Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H. | Conference Paper |
| 2017 | Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F. | Conference Paper |
| 2017 | Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J. | Journal Article |
| 2017 | Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K. | Journal Article |
| 2017 | Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M. | Conference Paper |
| 2017 | Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A. | Conference Paper |
| 2017 | Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C. | Conference Paper |
| 2017 | Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M. | Conference Paper |
| 2017 | Electro-optical circuit boards with single- or multi-mode optical interconnects
Brusberg, L.; Immonen, M.; Lamprecht, T. | Book Article |
| 2017 | Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter | Conference Paper |
| 2017 | Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H. | Journal Article |
| 2017 | Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer
Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J. | Conference Paper |
| 2017 | Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D. | Conference Paper |
| 2017 | Fiber bundle probes for interconnecting miniaturized medical imaging devices
Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H. | Conference Paper |
| 2017 | Forschung für die Elektroniksysteme von morgen
Aschenbrenner, Rolf | Presentation |
| 2017 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
| Annual Report |
| 2017 | Germanium "hexa" detector. Production and testing
Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H. | Journal Article, Conference Paper |
| 2017 | Golfball, System und Verfahren zur Ortung eines Golfballs
Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd | Patent |
| 2017 | Impact of parasitic coupling on multiline TRL calibration
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W. | Conference Paper |
| 2017 | Impact of process control on UBM/RDL contact resistance for next-generation fan-out devices
Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K. | Conference Paper |
| 2017 | Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J. | Conference Paper |
| 2017 | Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D. | Conference Paper |
| 2017 | Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D. | Conference Paper |
| 2017 | Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R. | Journal Article |
| 2017 | An integrated versatile lab-on-a-chip platform for the isolation and nucleic acid-based detection of pathogens
Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk | Journal Article |
| 2017 | Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R. | Conference Paper |
| 2017 | International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K. | Book Article |
| 2017 | Interposer-based smartcard system with active wireless communication
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias | Conference Paper |
| 2017 | Investigation of Effect of Adding Hydrophobically Modified Water Soluble Polymers on the Structure and Viscosity of Anionic Vesicle Dispersion
Sandjaja, M.; Lestari, M.L.A.D. | Journal Article |
| 2017 | Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael | Patent |
| 2017 | Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O. | Journal Article |
| 2017 | Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D. | Conference Paper |
| 2017 | Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications
Sedlmair, J.; Mehlmann, B.; Olowinsky, A. | Conference Paper |
| 2017 | Low temperature Cu/In bonding for 3D integration
Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M. | Conference Paper |
| 2017 | Materials and Concepts for Textile Sensor Systems
Aschenbrenner, Rolf; Kallmayer, Christine | Presentation |
| 2017 | Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A. | Conference Paper |
| 2017 | Miniaturization of power converters by piezoelectric transformers - chances and challenges
Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia | Presentation |
| 2017 | Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A. | Conference Paper |
| 2017 | Modular power electronics, realized by PCB embedding technology
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas | Presentation |
| 2017 | Novel EDA Tools for system planning and 3D layout design of smart items
Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D. | Conference Paper |
| 2017 | A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D. | Conference Paper |
| 2017 | Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf | Presentation |
| 2017 | Panel Level Packaging for Power Applications
Aschenbrenner, Rolf | Presentation |
| 2017 | Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas | Conference Paper |
| 2017 | Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R. | Journal Article |
| 2017 | Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G. | Journal Article |
| 2017 | A programmable Si-photonic node for SDN-enabled bloom filter forwarding in disaggregated data centers
Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K. | Conference Paper |
| 2017 | Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H. | Journal Article |
| 2017 | Prospecting Secondary Raw Materials in the Urban Mine and mining wastes (ProSUM)
Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah | Report |
| 2017 | Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G. | Conference Paper |
| 2017 | Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E. | Journal Article |
| 2017 | RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz
Iannacci, J.; Tschoban, C. | Journal Article |
| 2017 | The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter | Conference Paper |
| 2017 | Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study
Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K. | Conference Paper |
| 2017 | SAFESENS - Smart Sensors for Fire Safety
O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian | Conference Paper |
| 2017 | Shrinkage Measurements of UV‐Curable Adhesives
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H. | Journal Article |
| 2017 | Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D. | Conference Paper |
| 2017 | Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Sammler, Fiona; Nissen, Nils F. | Book Article |
| 2017 | Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H. | Conference Paper |
| 2017 | Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E. | Conference Paper |
| 2017 | Sustainable Solutions for Machine Tools
Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eudard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F. | Book Article |
| 2017 | Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D. | Conference Paper |
| 2017 | Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2017 | Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E. | Journal Article |
| 2017 | Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D. | Conference Paper |
| 2017 | Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga | Patent |
| 2017 | What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina | Conference Paper |
| 2016 | 4.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G. | Journal Article |
| 2016 | Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2016 | Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P. | Conference Paper |
| 2016 | Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V. | Conference Paper |
| 2016 | Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K. | Conference Paper |
| 2016 | µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A. | Report |
| 2016 | Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2016 | All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N. | Conference Paper |
| 2016 | Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B. | Journal Article |
| 2016 | Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter | Journal Article |
| 2016 | Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm
Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H. | Conference Paper |
| 2016 | BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei | Conference Paper |
| 2016 | Bonding technologies for 3D packaging with high I/O count - An evaluation report
Lohse, S.; Wollanke, A. | Conference Paper |
| 2016 | Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D. | Conference Paper |
| 2016 | Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong | Conference Paper |
| 2016 | Chip embedding - The key for efficient power electronics solutions
Aschenbrenner, Rolf | Presentation |
| 2016 | Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A. | Conference Paper |
| 2016 | Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Design of amorphous silicon photonic crystal-based M-Z modulator operating at 1.55 μm
Rao, S.; Casalino, M.; Coppola, G.; Kisacik, R.; Tekin, T.; Corte, F.G.D. | Conference Paper |
| 2016 | Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Conference Paper |
| 2016 | Developing an indicator setup to measure life-cycle conditions of electronic products
Winzer, Janis; Wagner, Eduard; Nissen, Nils F.; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D. | Conference Paper |
| 2016 | Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong | Journal Article |
| 2016 | Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D. | Conference Paper |
| 2016 | Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H. | Journal Article, Conference Paper |
| 2016 | Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A. | Conference Paper |
| 2016 | DSC investigation of the undercooling of SnAgCu solder alloys
Mueller, M.; Türke, A.; Panchenko, I. | Conference Paper |
| 2016 | Durability and cycle frequency of smartphone and tablet lithium-ion batteries in the field
Clemm, C.; Sinai, C.; Ferkinghoff, C.; Dethlefs, N.; Nissen, N.F.; Lang, K.D. | Conference Paper |
| 2016 | Effective method for filter design and semiconductor and inductors loss calculation
Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D. | Conference Paper |
| 2016 | Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Journal Article |
| 2016 | Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T. | Conference Paper |
| 2016 | Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y. | Journal Article, Conference Paper |
| 2016 | Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A. | Conference Paper |
| 2016 | Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D. | Conference Paper |
| 2016 | Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D. | Conference Paper |
| 2016 | Energy efficiency of data centers - a system-oriented analysis of current development trends
Hintemann, R.; Beucker, S.; Clausen, J.; Stobbe, L.; Proske, M.; Nissen, N.F. | Conference Paper |
| 2016 | Energy efficiency of ICT: Further improvement through customized products
Stobbe, L.; Proske, M.; Beucker, S.; Hintemann, R.; Lang, K.D. | Conference Paper |
| 2016 | Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D. | Conference Paper |
| 2016 | Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D. | Conference Paper |
| 2016 | Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter | Journal Article |
| 2016 | Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben
Dietrich, Manfred; Gulbins, Matthias; Haase, Joachim; Markwirth, Thomas; Warmuth, Jens Michael | Report |
| 2016 | Evaluation of indicators supporting the sustainable design of electronic systems
Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D. | Journal Article, Conference Paper |
| 2016 | Evaluation of pressure stable chip-to-tube fittings enabling high-speed chip-HPLC with mass spectrometric detection
Lotter, Carsten; Heiland, Josef J.; Stein, Volkmar; Klimkait, Michael; Queisser, Marco; Belder, Detlev | Journal Article |
| 2016 | Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, K.; Lang, K.-D. | Conference Paper |
| 2016 | Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2016 | Feasibility study for setting-up reference values to support the calculation of recyclability / recoverability rates of electr(on)ic products
Chancerel, Perrine; Marwede, Max
: Mathieux, Fabrice; Talens Peiró, Laura | Study |
| 2016 | Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Conference Paper |
| 2016 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2015/2016
| Annual Report |
| 2016 | Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2016 | Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D. | Conference Paper |
| 2016 | Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D. | Conference Paper |
| 2016 | Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article |
| 2016 | High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2016 | High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article, Conference Paper |
| 2016 | Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2016 | Highly reliable and cost effective thick film substrates for power LEDs
Gundel, P.; Persons, R.; Bawohl, M.; Challingsworth, M.; Czwickla, C.; Garcia, V.; Modes, C.; Nikolaidis, I.; Reitz, J.; Shahbazi, C.; Nowak, T. | Conference Paper |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
| 2016 | How will high-performance nonwovens transform your business?
Gwinnutt, J.; Cumming, S.; Prigneaux, J.; Stevenson, A.; Dils, C.; Granberg, H.; Slater, A.; Knorr, K.; Jolly, M.; Möbitz, C.; Lütke, C.; Hofmann, M.; Käppel, D. | Journal Article |
| 2016 | An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications
Windrich, F.; Kappert, E.J.; Malanin, M.; Eichhorn, K.-J.; Häußler, L.; Benes, N.E.; Voit, B. | Journal Article |
| 2016 | In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article, Conference Paper |
| 2016 | In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J. | Conference Paper |
| 2016 | Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D. | Conference Paper |
| 2016 | Integration Technologies for Smart Textiles
Aschenbrenner, Rolf | Presentation |
| 2016 | Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D. | Abstract |
| 2016 | Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T. | Conference Paper |
| 2016 | Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D. | Journal Article |
| 2016 | Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D. | Conference Paper |
| 2016 | Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments
Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E. | Conference Paper |
| 2016 | Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D. | Conference Paper |
| 2016 | Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H. | Journal Article |
| 2016 | Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D. | Conference Paper |
| 2016 | LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D. | Conference Paper |
| 2016 | Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A. | Conference Paper |
| 2016 | Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process
Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J. | Conference Paper |
| 2016 | Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2016 | Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C. | Conference Paper |
| 2016 | Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices
Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J. | Conference Paper |
| 2016 | Non-destructive mobile monitoring of microbial contaminations on meat surfaces using porphyrin fluorescence intensities
Durek, J.; Fröhling, A.; Bolling, J.; Thomasius, R.; Durek, P.; Schlüter, O.K. | Journal Article |
| 2016 | Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J. | Conference Paper |
| 2016 | Obsolescence of electronics - the example of smartphones
Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2016 | On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D. | Journal Article |
| 2016 | On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Conference Paper |
| 2016 | On-chip automation of cell-free protein synthesis
Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan | Journal Article |
| 2016 | Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2016 | Optical static RAM cell using a monolithically integrated InP Flip-Flop and wavelength-encoded signals
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N. | Conference Paper |
| 2016 | An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R. | Journal Article |
| 2016 | Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D. | Conference Paper |
| 2016 | Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong | Conference Paper |
| 2016 | Panel Level Embedding for Power and Sensor Applications
Aschenbrenner, Rolf | Presentation |
| 2016 | Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K. | Conference Paper |
| 2016 | Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A. | Conference Paper |
| 2016 | Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B. | Dissertation |
| 2016 | Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D. | Conference Paper |
| 2016 | Potential applications of electron emission membranes in medicine
Bilevych, Y.; Brunner, S.E.; Chan, H.W.; Charbon, E.; Graaf, H. van der; Hagen, C.W.; Nutzel, G.; Pinto, S.D.; Prodanovic, V.; Rotmanc, D.; Santagata, F.; Sarro, L.; Schaart, D.R.; Sinsheimer, J.; Smedley, J.; Tao, S.X.; Theulings, A.M.M.G. | Journal Article |
| 2016 | Rapid scan in-situ FT-IR curing studies of low-temperature cure thin film polymer dielectrics in solid state
Windrich, F.; Malanin, M.; Eichhorn, K.J.; Voit, B. | Conference Paper |
| 2016 | The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian | Journal Article |
| 2016 | Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D. | Journal Article |
| 2016 | A review of green electronics research trends
Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D. | Conference Paper |
| 2016 | RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H. | Conference Paper |
| 2016 | RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H. | Journal Article |
| 2016 | RF-MEMS technology for future mobile and high-frequency applications: Reconfigurable 8-Bit power attenuator tested up to 110 GHz
Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H. | Journal Article |
| 2016 | A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C. | Journal Article |
| 2016 | Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M. | Journal Article |
| 2016 | Sensitive brace recognises the right angle
Krshiwoblozki, Malte von; Pawlikowski, Jakub | Journal Article |
| 2016 | Simulation based analysis of LED package reliability regarding encapsulant related failures
Watzke, Stefan | Dissertation |
| 2016 | Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2016 | SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H. | Conference Paper |
| 2016 | Single mode optical interconnects for future data centers
Vyrsokinos, K.; Moralis-Pegios, M.; Vagionas, C.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rohracher, K.; Dorrestein, S.; Bogdan, M.; Pleros, N. | Conference Paper |
| 2016 | Solder process for fluxless solder paste applications
Hanss, A.; Hutter, M.; Trodler, J.; Elger, G. | Conference Paper |
| 2016 | Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D. | Conference Paper |
| 2016 | Stocks and flows of critical materials in batteries: Data collection and data uses
Chancerel, Perrine; Maehlitz, Paul; Chanson, Claude; Binnemans, Peter; Huisman, Jaco; Guzman Brechu, Michelle; Rotter, Vera Susanne; Nissen, Nils F.; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
| 2016 | Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D. | Conference Paper |
| 2016 | Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge
Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L. | Conference Paper |
| 2016 | A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D. | Conference Paper |
| 2016 | Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert | Patent |
| 2016 | Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
Brusberg, Lars; Schröder, Henning | Patent |
| 2016 | Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2016 | Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D. | Journal Article |
| 2016 | Wafer level chip scale packaging
Töpper, M. | Book Article |
| 2016 | Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D. | Conference Paper |
| 2016 | WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
Pitris, S.; Vagionas, C.; Tekin, T.; Broeke, R.; Kanellos, G.T.; Pleros, N. | Journal Article |
| 2016 | Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina | Study |
| 2016 | Would the setting-up of reference values to support the calculation of recyclability rates help improving the material efficiency of electronic products?
Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura | Conference Paper |
| 2016 | A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D. | Journal Article |
| 2015 | An accurate back to front design methodology for PT based load resonant converters
Yang, Yujia; Radecker, M.; Lang, K.-D.; Fischer, W.-J. | Conference Paper |
| 2015 | Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M. | Conference Paper |
| 2015 | Active power cycling results using copper tin TLPB joints as new die-attach technology
Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Addressing sustainability and flexibility in manufacturing via smart modular machine tool frames to support sustainable value creation
Peukert, B.; Benecke, S.; Clavell, J.; Neugebauer, S.; Nissen, N.F.; Uhlmann, E.; Lang, K.-D.; Finkbeiner, M. | Journal Article, Conference Paper |
| 2015 | Advanced approach of calculating wire bond pull test correction factors
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D. | Book Article |
| 2015 | Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D. | Journal Article |
| 2015 | Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2015 | Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H. | Journal Article |
| 2015 | Hochstromkontakte für Smart-Power Mechanics
Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D. | Journal Article |
| 2015 | Anordnung aus einem Substrat mit mindestens einem optischen Wellenleiter und einer optischen Koppelstelle und aus einem optoelektronischen Bauelement und Verfahren zur Herstellung einer solchen Anordnung
Oppermann, Hermann | Patent |
| 2015 | Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik
Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus | Conference Paper |
| 2015 | Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D. | Conference Paper |
| 2015 | Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production
Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D. | Conference Paper |
| 2015 | Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Conference Paper |
| 2015 | Challenges of TSV backside process integration
Rudolph, C.; Wachsmuth, H.; Boettcher, M.; Steller, W.; Wolf, M.J. | Conference Paper |
| 2015 | Characteristics and aging of PCB embedded power electronics
Randoll, R.; Asef, M.; Wondrak, W.; Böttcher, L.; Schletz, A. | Journal Article, Conference Paper |
| 2015 | A compact W-band LFMCW radar module with high accuracy and integrated signal processing
Zech, C.; Hülsmann, A.; Schlechtweg, M.; Reinold, Steffen; Giers, Christof; Kleiner, Bernhard; Georgi, L.; Kahle, R.; Becker, K.-F.; Ambacher, O. | Conference Paper |
| 2015 | Comparative study of organic, inorganic and hybrid gate-dielectrics for organic field-effect transistors using semiconducting liquid-crystal polymers
Tetzner, Kornelius | Dissertation |
| 2015 | Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2015 | Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2015 | Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article, Conference Paper |
| 2015 | Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling
Weber, Constanze; Hutter, Matthias; Schmitz, Stefan; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D. | Conference Paper |
| 2015 | Design, setup and test of a heterogeneous module and characterization by stress measurement
Schreier-Alt, T.; Reitlinger, C.; Kaul, F.; Metzger, T.; Revenberg, K. | Conference Paper |
| 2015 | Development of a microcamera with embedded image processor using panel level packaging
Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D. | Conference Paper |
| 2015 | Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S. | Conference Paper |
| 2015 | Development of solder paste jetting processes for advanced packaging
Thomas, Tina; Voges, Steve; Fliess, M.; Becker, Karl-Friedrich; Reiners, Philipp; Koch, Mathias; Bauer, Jörg; Braun, Tanja; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2015 | Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers
Brusberg, L.; Whalley, S.; Herbst, C.; Schröder, H. | Journal Article |
| 2015 | Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2015 | Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Journal Article |
| 2015 | Electrical buffer storage for energy harvesting
Hahn, R.; Möller, K.-C. | Book Article |
| 2015 | Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D. | Conference Paper |
| 2015 | Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M. | Conference Paper |
| 2015 | Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A. | Conference Paper |
| 2015 | Embedded very fast switching module for SiC power MOSFETs
Feix, G.; Hoene, E.; Zeiter, O.; Pedersen, K. | Conference Paper |
| 2015 | Energy saving potential of information and communication technology
Schlomann, Barbara; Eichhammer, Wolfgang; Stobbe, Lutz | Journal Article |
| 2015 | Entwicklung des IKT-bedingten Strombedarfs in Deutschland
Stobbe, Lutz; Proske, Marina; Zedel, Hannes; Hintemann, Ralph; Clausen, Jens; Beucker, Severin | Report |
| 2015 | Estimating the quantities of critical metals embedded in ICT and consumer equipment
Chancerel, P.; Marwede, M.; Nissen, N.F.; Lang, K.D. | Journal Article |
| 2015 | Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages
Kaya, Burcu; Kaiser, Jan-Martin; Becker, Karl-Friedrich; Braun, Tanja; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30 deg C up to + 180 deg C
Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D. | Conference Paper |
| 2015 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2014/2015
| Annual Report |
| 2015 | From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter | Conference Paper |
| 2015 | A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2015 | Glass-based Manufacturing and Prototyping Platform PhotPack
Böttger, G.; Seifert, S.; Schröder, H. | Journal Article |
| 2015 | Grenzen und Möglichkeiten der Weichlotverbindungen - Betrachtungen von Qualität und Zuverlässigkeit
Hutter, M.; Ehrhardt, C. | Conference Paper |
| 2015 | Heterogeneous integration of a miniaturized W-band radar module
Becker, Karl-Friedrich; Georgi, L,; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S., Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper, Journal Article |
| 2015 | High frequency impedance of Li-ion batteries
Doersam, T.; Schoerle, S.; Spieker, C.; Waldmann, T.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2015 | High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects
Brusberg, L.; Schröder, H.; Herbst, C.; Frey, C.; Fiebig, C.; Zakharian, A.; Kuchinsky, S.; Liu, X.; Fortusini, D.; Evans, A. | Conference Paper |
| 2015 | HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D. | Conference Paper |
| 2015 | Hochauflösende Magnetfeld-Positionssensoren
Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K. | Conference Paper |
| 2015 | Identification of microplastics by FTIR and Raman microscopy: A novel silicon filter substrate opens the important spectral range below 1300 cm−1 for FTIR transmission measurements
Käppler, A.; Windrich, F.; Löder, M.G.J.; Malanin, M.; Fischer, D.; Labrenz, M.; Eichhorn, K.-J.; Voit, B. | Journal Article |
| 2015 | Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2015 | Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Intelligente Steckverbinder und Anschlusstechnologien für die Produktion der Zukunft
Michels, J.S.; Mödinger, R.; Meier, O.; Baar, C.; Ansorge, F.; Schiefelbein, F.-P. | Conference Paper |
| 2015 | Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong | Conference Paper |
| 2015 | Investigation of room-temperature flip chip connections
Brink, M.; Grams, A.; Eichhammer, Y.; Broll, M.; Fritzsch, T.; Lang, K.-D. | Conference Paper |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2015 | Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D. | Conference Paper |
| 2015 | Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O. | Conference Paper |
| 2015 | Laser melting of metal powders using Nd:yag and compact diode laser for micro particle deposition
Azhdast, M.H.; Lux, O.; Fritsche, H.; Eichler, H.J.; Azdasht, G.; Lüdeke, H.; Glaw, V.; Lang, K.-D. | Conference Paper |
| 2015 | Low profile LED off-line phase-cut dimming ballast with piezoelectric transformer
Le, L.; Yang, Y.; Radecker, M. | Conference Paper |
| 2015 | μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J. | Journal Article, Conference Paper |
| 2015 | Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A. | Conference Paper |
| 2015 | Messvorrichtung und Fluidikvorrichtung zum Messen einer Menge einer zu untersuchenden Substanz
Jung, Erik; Georgi, Leopold; Kubick, Stefan | Patent |
| 2015 | Methodology guidance - energy profiles and carbon footprint data for passive components and connectors
Schischke, Karsten; Proske, Marina; Schulz, Gerd; Husemann, Jürgen; Trenner, Torger; Sonnenberg, Thea; Huck, Walter; Kelm, Klaus; Tempel, Norbert; Wunderlich, Peter; Dietrich, Marcus | Report |
| 2015 | Microelectronic Packaging in the 21st Century
: Aschenbrenner, Rolf; Schneider-Ramelow, Martin | Book |
| 2015 | Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D. | Journal Article |
| 2015 | Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Journal Article |
| 2015 | Mikrobatterie und Verfahren zum Herstellen einer Mikrobatterie
Hahn, Robert | Patent |
| 2015 | Modeling method of stray magnetic couplings in an EMC filter for power electronic devices
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D. | Journal Article |
| 2015 | Monolithically integrated all-optical SOA-based SR Flip-Flop on InP platform
Pitris, S.; Vagionas, C.; Kanellos, G.T.; Pleros, N.; Kisacik, R.; Tekin, T.; Broeke, R. | Conference Paper |
| 2015 | Nano particle production by laser ablation and metal sputtering on Si-wafer substrate
Azhdast, M.H.; Azdasht, G.; Lüdeke, H.; Lang, K.-D.; Glaw, V. | Conference Paper |
| 2015 | Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A. | Journal Article |
| 2015 | Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, M.; Fischer, T.; Walter, H.; Toepper, M.; Lang, K.-D. | Conference Paper |
| 2015 | A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J. | Conference Paper |
| 2015 | Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F. | Journal Article |
| 2015 | Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H. | Conference Paper |
| 2015 | Photonic millimeter wave transmitter for a real-time coherent wireless link based on injection locking of integrated laser diodes
Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T. | Journal Article |
| 2015 | PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres
Hakansson, A.; Tekin, T.; Brusberg, L.; Pleros, N.; Vyrsokinos, C.; Apostolopoulos, D.; Pitwon, R.; Miller, A.; Wang, Kai; Tulli, D.; Dorrestein, S.; Smink, R.; Tuin, J.; Rijnbach, M. van; Duis, J. | Conference Paper |
| 2015 | Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong | Conference Paper |
| 2015 | Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A. | Journal Article |
| 2015 | Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T. | Conference Paper |
| 2015 | Recess photomask contact lithography and the fabrication of coupled silicon photonic and plasmonic waveguide switches
Markey, L.; Zacharatos, F.; Weeber, J.-C.; Prinzen, A.; Waldow, M.; Nielsen, M.G.; Tekin, T.; Dereux, A. | Journal Article |
| 2015 | Reducing inductor size in high frequency grid feeding inverters
Hoffmann, S.; Hoene, E.; Zeiter, O.; Lang, K.-D.; Feix, G. | Conference Paper |
| 2015 | Sea water magnesium fuel cell power supply
Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D. | Journal Article |
| 2015 | Silicon photonics packaging on board-level
Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T. | Conference Paper |
| 2015 | Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T. | Conference Paper |
| 2015 | Small fuel cell system with cartridges for controlled hydrogen generation
Hahn, R.; Gabler, A.; Thoma, A.; Glaw, F.; Lang, K.D. | Journal Article |
| 2015 | Smart Power Mechanics – Elektrische Anschlusstechnologien für Morgen
Schreier-Alt, T.; Ansorge, F.; Baar, C.; Radtke, H.; Amende, T. | Conference Paper |
| 2015 | Structure investigation of soil aggregates treated with different organic matter using X-ray micro tomography
Nakano, K.; Herppich, W.B.; Kardjilov, N.; Manke, I.; Hilger, A.; Dawson, M.; Masuda, K.; Hara, Y.; Matsushima, U. | Journal Article |
| 2015 | Structuring zeolite bodies for enhanced heat-transfer properties
Borchardt, L.; Michels, N.L.; Nowak, T.; Mitchell, S.; Perez-Ramírez, J. | Journal Article |
| 2015 | A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D. | Conference Paper |
| 2015 | System und Verfahren zur bedarfsgerechten Zuführung von Beleuchtungsenergie an Pflanzen
Jordan, Rafael | Patent |
| 2015 | Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding
Zoschke, K.; Lang, K.-D. | Conference Paper |
| 2015 | Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D. | Conference Paper |
| 2015 | Thin glass based electro-optical circuit board (EOCB): Waveguide process, PCB technology, and coupling interfaces
Schröder, H.; Brusberg, L. | Conference Paper |
| 2015 | Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S. | Conference Paper |
| 2015 | Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X. | Journal Article |
| 2015 | Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2015 | Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R. | Conference Paper |
| 2015 | Ultra-Thin high density capacitors for advanced packaging solutions
Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W. | Conference Paper |
| 2015 | Use of amorphous silicon for the design of a photonic crystal based MZ modulator at 1.55µm
Rao, S.; Kisacik, R.; Tekin, T.; Casalino, M.; Coppola, G.; Della Corte, F.G. | Conference Paper |
| 2015 | Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H. | Book Article |
| 2015 | Verfahren und Messanordnung zum Überprüfen eines leitfähigen Körpers
Krüger, Michael; Trampert, Stefan | Patent |
| 2015 | Verfahren zum Bestimmen einer Bondverbindung in einer Bauteilanordnung und Prüfvorrichtung
Middendorf, Andreas; Nowak, Torsten; Janzen, Sergei | Patent |
| 2015 | W-band coherent wireless link using injection-locked laser diodes
Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T. | Journal Article |
| 2015 | Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G. | Conference Paper |
| 2014 | A "microSD" sized RF transceiver manufactured as an embedded system-in-package
Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D. | Conference Paper |
| 2014 | 24"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | 3D IC/stacked device fault isolation using 3D magnetic field imaging
Orozco, A.; Gagliolo, N.E.; Rowlett, C.; Wong, E.; Moghe, A.; Gaudestad, J.; Talanov, V.; Jeffers, A.; Torkashvan, K.; Wellstood, F.C.; Dobritz, S.; Boettcher, M.; Cawthorne, A.B.; Infante, F. | Conference Paper |
| 2014 | 3D integration: Status and requirements
Wolf, M. Jürgen; Lang, Klaus-Dieter | Conference Paper |
| 2014 | 3D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried | Presentation |
| 2014 | A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance
Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A. | Conference Paper |
| 2014 | Accelerating data centre performance. Interview
Tekin, T.; Pleros, N. | Journal Article |
| 2014 | Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Advanced packaging methods for high-power LED modules
Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M. | Conference Paper |
| 2014 | Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D. | Conference Paper |
| 2014 | Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2014 | Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C. | Conference Paper |
| 2014 | Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H. | Journal Article |
| 2014 | Ansätze zur stofflichen Verwertung von Tablets aus Sicht des Produktdesigns
Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Dimitrova, Gergana; Genz, Paul; Lang, Klaus-Dieter | Book Article |
| 2014 | Array fiber welding on micro optical glass substrates for chip-to-fiber coupling
Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D. | Conference Paper |
| 2014 | Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Automotive high voltage grid simulation. Modelling and simulation high voltage car grids from system prospective
Schörle, S.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2014 | Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D. | Conference Paper |
| 2014 | Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Challenges in 3D die stacking
Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D. | Conference Paper |
| 2014 | Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, M.; Fischer, T.; Walter, H.; Töpper, M.; Lang, K.-D. | Conference Paper |
| 2014 | Cloud computing based systems for healthcare
Stantchev, V.; Colomo-Palacios, R.; Niedermayer, M. | Journal Article |
| 2014 | CMOS biosensor using TSV interposer technology
Ebefors, T.; Fredlund, J.; Jung, E.; Braun, T. | Journal Article |
| 2014 | CO2-laser drilling of TGVs for glass interposer applications
Brusberg, L.; Queisser, M.; Neitz, M.; Schröder, H.; Lang, K.-D. | Conference Paper |
| 2014 | Combined Loads and Mechanisms
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter | Presentation |
| 2014 | Commercialization and application-driven economic viability of sensor technology
Niedermayer, M. | Book Article |
| 2014 | A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H. | Conference Paper |
| 2014 | A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf | Conference Paper |
| 2014 | Design and simulation of an equiangular spiral antenna for extremely high-frequencies
Sirbu, B.; Tekin, T.; Pouhe, D. | Conference Paper |
| 2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Conference Paper |
| 2014 | Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer
Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D. | Conference Paper |
| 2014 | Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Disassembly analysis of slates: Design for repair and recycling evaluation. Final report
Schischke, Karsten; Stobbe, Lutz; Dimitrova, Gergana; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F. | Report |
| 2014 | Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R. | Conference Paper |
| 2014 | Drahtlose Tiefendiagnose
Niedermayer, M.; Hoherz, C.; Reinhardt, D.; Scholtz, H.; Benecke, S.; Middendorf, A. | Journal Article |
| 2014 | Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects
Krüger, Michael; Trampert, Stefan; Middendorf, Andreas; Schmitz, Stefan; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Ecodesign Requirements for servers - from single product groups to extended system approach
Nissen, Nils F.; Stobbe, Lutz; Faninger, Thibault; Berwald, Anton; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D. | Conference Paper |
| 2014 | Electromagnetic robustness validation for gate drivers
Junk, S.; Hoene, E. | Conference Paper |
| 2014 | Embedding of power semiconductors for innovative packages and modules
Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A. | Conference Paper |
| 2014 | Establishing ecoreliability of electronic devices in manufacturing environments
Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper, Journal Article |
| 2014 | Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D. | Conference Paper |
| 2014 | Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application
Brusberg, L.; Neitz, M.; Schröder, H.; Fricke-Begemann, T.; Ihlemann, J. | Conference Paper |
| 2014 | Fan-out wafer level packaging for MEMS and sensor applications
Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D. | Journal Article, Conference Paper |
| 2014 | Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O. | Conference Paper |
| 2014 | Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2013/2014
| Annual Report |
| 2014 | German Technology Research Program „IT2Green“
Nissen, Nils; Stobbe, Lutz; Lang, Klaus-Dieter | Presentation |
| 2014 | A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels
Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M.O.; Fritzsch, T.; Rothermund, M.; Graafsma, H. | Journal Article |
| 2014 | Große H2-Zelle mit innenliegenden Kathoden in Form von Taschen
Hahn, Robert; Krebs, Martin; Schmalz, Michael | Patent |
| 2014 | Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process Control
Middendorf, Andreas; Lang, Klaus-Dieter | Conference Paper |
| 2014 | High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, Th.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H. | Journal Article |
| 2014 | Highly ionized sputter deposition into through silicon vias with aspect ratios up to 15:1
Viehweger, Kay; Weichart, J.; Elghazzali, M.; Reynolds, G.J.; Wolf, M.J.; Lang, K.-D.; Koller, A.; Dill, A. | Conference Paper |
| 2014 | Highly sensitive integrated optical biosensors
Zamora, V.; Lützow, P.; Weiland, M.; Pergande, D.; Schröder, H. | Conference Paper |
| 2014 | An holistic approach to optical interconnects in data centres
Tekin, T.; Pleros, N. | Journal Article |
| 2014 | Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter | Conference Paper, Journal Article |
| 2014 | In situ monitoring of interface delamination by the 3ω-method
Schulz, M.; Sheva, S.; Walter, H.; Mroßko, R.; Yang, G.; Keller, J.; Wunderle, B. | Conference Paper |
| 2014 | Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen
Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | The influence of liners with Ti, Ta or Ru finish on thin Cu films
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article, Conference Paper |
| 2014 | InGrid: Pixelated Micromegas detectors for a Pixel-TPC
Lupberger, M.; Bilevych, J.; Desch, K.; Fischer, T.; Fritzsch, T.; Kaminski, J.; Kohl, K.; Rogowski, M.; Tomtschak, J.; Graaf, H. van der | Conference Paper |
| 2014 | Innovative and reliable power modules: A future trend and evolution of technologies
Neeb, C.; Boettcher, L.; Conrad, M.; Doncker, R.W. de | Journal Article |
| 2014 | Investigating wire bonding pull testing and its calculation basics
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D. | Conference Paper |
| 2014 | Korrosion in ENIG-Schichtsystemen
Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M. | Conference Paper |
| 2014 | Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter | Journal Article |
| 2014 | LCA to go for PV systems: Analysis tool for optimized PV design and green marketing
Arranz, Pol; Anzizu, Maria; Vallvé, Xavier; Schischke, Karsten; Helmy, Mohamed; Alonso, Juan Carlos; Rodrigo, Julio | Conference Paper |
| 2014 | A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D. | Conference Paper |
| 2014 | Lensless live cell imaging with thermoelectric cooled cell-microscope
Hubl, M.; Blechert, M.; Engelhardt, M.; Jung, E.; Lang, K.D. | Conference Paper, Journal Article |
| 2014 | Life Cycle Assessment as a practical tool in the eco-design and promotion of eco-innovative electronics - the case of the IAMECO computers
Ospina, Jose Luis; Maher, Paul; Schischke, Karsten | Conference Paper |
| 2014 | Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology
Brusberg, L.; Herbst, C.; Neitz, M.; Schröder, H.; Lang, K.-D. | Conference Paper |
| 2014 | Low-temperature photosensitive polyimide processing for use in 3D integration technologies
Windrich, Frank; Malanin, Mikhail; Eichhorn, Klaus-Jochen; Voit, Brigitte; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Mechanical properties of individual composite poly(methyl-methacrylate) -multiwalled carbon nanotubes nanofibers
Grabbert, N.; Wang, B.; Avnon, A.; Zhuo, S.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Kaletta, K.; Lang, K.-D.; Ngo, H.-D. | Conference Paper |
| 2014 | Microstructural and mechanical analyses of Ag sintered joints
Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors
Hahn, Daniel; Straube, Stefan; Abelein, Ulrich; Middendorf, Andreas; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B. | Conference Paper |
| 2014 | A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H. | Journal Article |
| 2014 | Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter
Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D. | Conference Paper |
| 2014 | Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D. | Conference Paper |
| 2014 | Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2014 | Nanoporous gold bumps for thermocompression bonding
Oppermann, Hermann; Dietrich, Lothar; Weber, Constanze; Ziedorn, Morten; Aschenbrenenr, Rolf | Abstract |
| 2014 | A new broadband antenna for satellite communications
Karlsson, C.; Cavero, P.; Tekin, T.; Pouhè, D. | Conference Paper |
| 2014 | Next generation high power electronic module based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A. | Conference Paper |
| 2014 | Next Generation Substrates - wie elektronische Systeme maskenlos gedruckt werden
Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D. | Conference Paper |
| 2014 | Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages
Wong, C.S.; Bennett, N.S.; Manessis, D.; Danilewsky, A.; McNally, P.J. | Journal Article |
| 2014 | Ökodesign von Unterhaltungselektronik und IKT - Beispiele und Denkanstöße
Schischke, Karsten | Presentation |
| 2014 | On double sided cooling
Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2014 | On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H. | Conference Paper |
| 2014 | Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D. | Conference Paper |
| 2014 | Optisches Kopplungssystem mit einem optischen Koppler und einem lichtdurchlässigen äußeren Medium sowie Herstellung und Verwendung eines solchen Systems
Oppermann, Hermann | Patent |
| 2014 | Packages for fast switching HV GaN power devices
Klein, K.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2014 | Packaging very fast switching semiconductors
Hoene, E.; Ostmann, A.; Marczok, C. | Conference Paper |
| 2014 | Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R. | Conference Paper |
| 2014 | Photonic interconnects for data centers
Tekin, T.; Pleros, N.; Apostolopoulos, D. | Conference Paper |
| 2014 | Photonic interconnects for data centers
Tekin, T.; Hakansson, A.; Pleros, N.; Apostolopoulos, D. | Conference Paper |
| 2014 | Power electronics packages with embedded components - recent trends and developments
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A. | Journal Article |
| 2014 | Precision jetting of solder paste - a versatile tool for small volume production
Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D. | Conference Paper |
| 2014 | Predicting magnetic coupling of power inductors
Hoffmann, S.; Hoene, E.; Lang, K.-D. | Conference Paper |
| 2014 | Printed electroluminescent structures for smart cards
Wróblewski, G.; Sloma, M.; Kallmayer, C.; Marques, J.; Haberland, J.; Janczak, D.; Jakubowska, M. | Conference Paper |
| 2014 | Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip
Schreier-Alt, T.; Ansorge, F.; Chmiel, G.; Lang, K.-D. | Conference Paper |
| 2014 | Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2014 | Raffungsmodelle für die Qualifikation von Einpresskontakten für Leiterplatten
Schreier-Alt, T.; Heimerle, D.; Ring, K.; Möhler, A.; Baar, C.; Ansorge, F. | Journal Article |
| 2014 | Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools
Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D. | Conference Paper |
| 2014 | Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg | Conference Paper |
| 2014 | Reliability improvements in electronic systems by combining condition monitoring approaches
Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2014 | Sensorsystem zum Überwachen eines Objekts
Hefer, Jan; Rojahn, Johannes | Patent |
| 2014 | SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Strategies for glass based photonic system integration
Schröder, H.; Brusberg, L.; Böttger, G. | Conference Paper |
| 2014 | Stretchable and deformable electronic systems in thermoplastic matrix materials
Löher, T.; Ostmann, A.; Seckel, M. | Conference Paper |
| 2014 | Sustainable life cycle engineering of an integrated desktop PC
Fitzpatrick, C.; Hickey, S.; Schischke, K.; Maher, P. | Journal Article |
| 2014 | System simulation of automotive high voltage grids: Modelling of power converters and connecting cables
Schoerle, S.; Hoene, E.; Hoffmann, S.; Kuczmik, A.; Lang, K.-D. | Conference Paper |
| 2014 | Tablet PCs through the lens of environment - design trends and impacts on the environmental performance
Dimitrova, Gergana; Nissen, Nils; Stobbe, Lutz; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D. | Conference Paper |
| 2014 | Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R. | Conference Paper |
| 2014 | Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U. | Conference Paper |
| 2014 | Towards Zero Waste in Industrial Networks: A case study of the D4R laptop
Hickey, Stewart; Fitzpatrick, Colin; Maher, Paul; Ospina, Jose; Schischke, Karsten; Beigl, Peter; Vidorreta, Itziar; Yang, Mona; Williams, Ian; den Boer, Emilia | Journal Article |
| 2014 | Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook
Schischke, Karsten; Nissen, Nils; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Triple transit region photodiodes (TTR-PDs) providing high millimeter wave output power
Rymanov, V.; Stöhr, A.; Dülme, S.; Tekin, T. | Journal Article |
| 2014 | TSV-annealing: A thermo-mechanical assessment
Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J. | Conference Paper |
| 2014 | Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Ostmann, A.
: Lang, K.-D.; Vanfleteren, J.; Nowottnick, M. | Dissertation |
| 2014 | A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G. | Journal Article |
| 2014 | Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen | Conference Paper |
| 2014 | Vorrichtung und elektrische Baugruppe zum Wandeln einer Gleichspannung in eine Wechselspannung
Domurat-Linde, André; Hoene, Eckart; Ringkleff, Thomas; Enzinger, Tobias | Patent |
| 2014 | Welding equipment under the energy-related products directive - the process of developing eco-design criteria
Schischke, K.; Nissen, N.F.; Lang, K.D. | Journal Article |
| 2014 | A wide range power cell for modular interleaving supplies
Radecker, M.; Yang, Y.; Nicollini, A.; Le, L.; Lang, K.-D.; Kruse, P.D.; Feistel, K.; Teixeira, L.; Dennstedt, D.; Herfurth, M. | Conference Paper |
| 2014 | Wireless condition monitoring for industrial applications based on radio sensor nodes with energy harvesting
Niedermayer, M.; Bennecke, S.; Wirth, R.; Armbruster, E.; Lang, K.-D. | Journal Article |
| 2014 | Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D. | Conference Paper |