| | |
|---|
| 2021 | Low-power emerging memristive designs towards secure hardware systems for applications in internet of things
Du, Nan; Schmidt, Heidemarie; Polian, Ilia | Journal Article |
| 2020 | 2D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride
Meinel, K.; Melzer, M.; Stoeckel, C.; Shaporin, A.; Forke, R.; Zimmermann, S.; Hiller, K.; Otto, T.; Kuhn, H. | Journal Article |
| 2020 | Advanced Packaging Cost Reduction by Selective Copper Metallization
Mavliev, R.; Gottfried, K.; Rhoades, R. | Conference Paper |
| 2020 | Analysen der Lotermüdung an montierten Testbaugruppen unter Thermowechselbeanspruchungen
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Doering, R.; Scheiter, L.; Tegehall, P.-E.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2020 | Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Scheiter, L.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2020 | Calculation technique of diffuse reflectance spectra using an ensemble of damped harmonic oscillators model for substances identification
Anfimov, D.R.; Fufurin, I.L.; Golyak, I.S.; Tabalina, A.S.; Kurth, S. | Conference Paper |
| 2020 | Charged domains in ferroelectric, polycrystalline yttrium manganite thin films resolved with scanning electron microscopy
Rayapati, V.R.; Bürger, D.; Du, N.; Kowol, C.; Blaschke, D.; Stöcker, H.; Matthes, P.; Patra, R.; Skorupa, I.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2020 | Co-sputtering of Al1−xScxN thin films on Pt(111): a characterization by Raman and IR spectroscopies
Solonenko, D.; Lan, C.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
| 2020 | Control of magneto-optical properties of cobalt-layers by adsorption of α-helical polyalanine self-assembled monolayers
Sharma, A.; Matthes, P.; Soldatov, I.; Arekapudi, S.S.P.K.; Böhm, B.; Lindner, M.; Selyshchev, O.; Thi Ngoc Ha, N.; Mehring, M.; Tegenkamp, C.; Schulz, S.E.; Zahn, D.R.T.; Paltiel, Y.; Hellwig, O.; Salvan, G. | Journal Article |
| 2020 | Cover Feature: Ferrocenyl‐Pyrenes, Ferrocenyl‐9,10‐Phenanthrenediones, and Ferrocenyl‐9,10‐Dimethoxyphenanthrenes
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Crystallization of optically thick films of CoxFe 80-xB20
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Hellwig, O.; Kowol, C.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2020 | Design of a synthetic jet actuator for flow separation control
Weigel, P.; Schüller, M.; Gratias, A.; Lipowski, M.; Meer, T. ter; Bardet, M. | Journal Article |
| 2020 | A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups
Rasadujjaman, M.; Wang, Y.; Zhang, L.; Naumov, S.; Attallah, A.G.; Liedke, M.O.; Koehler, N.; Redzheb, M.; Vishnevskiy, A.S.; Seregin, D.S.; Wu, Y.; Zhang, J.; Leu, J.; Wagner, A.; Vorotilov, K.A.; Schulz, S.E.; Baklanov, M.R. | Journal Article |
| 2020 | Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I
Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S. | Conference Paper |
| 2020 | Disturbing-free determination of yeast concentration in DI water and in glucose using impedance biochips
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Blaschke, D.; Schmidt, H. | Journal Article |
| 2020 | Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs
Schroeder, D.; Lange, S.; Hangmann, C.; Hedayat, C. | Book Article |
| 2020 | Ferrocenyl-Pyrenes, Ferrocenyl-9,10-Phenanthrenediones, and Ferrocenyl-9,10-Dimethoxyphenanthrenes: Charge-Transfer Studies and SWCNT Functionalization
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
Conti, F.; Liu, E.; Bhogaraju, S.K.; Wunderle, B.; Elger, G. | Conference Paper |
| 2020 | Formation and crystallographic orientation of NiSi2-Si interfaces
Fuchs, Florian; Bilal Khan, Muhammad; Deb, Dipjyoti; Pohl, Darius; Schuster, Jörg; Weber, Walter M.; Mühle, Uwe; Löffler, Markus; Georgiev, Yordan M.; Erbe, Artur; Gemming, Sibylle | Journal Article |
| 2020 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2019
| Annual Report |
| 2020 | Gate Spacer Investigation for Improving the Speed of High-Frequency Carbon Nanotube-Based Field-Effect Transistors
Hartmann, M.; Tittmann-Otto, J.; Böttger, S.; Heldt, G.; Claus, M.; Schulz, S.E.; Schröter, M.; Hermann, S. | Journal Article |
| 2020 | The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H. | Journal Article |
| 2020 | Increased static dielectric constant in ZnMnO and ZnCoO thin films with bound magnetic polarons
Vegesna, S.V.; Bhat, V.J.; Bürger, D.; Dellith, J.; Skorupa, I.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2020 | Induktives Fügen in der Mikrosystemtechnik
Hofmann, C.; Fröhlich, A.; Kroll, M. | Journal Article |
| 2020 | Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices
Mitra, K.Y.; Willert, A.; Chandru, R.; Baumann, R.R.; Zichner, R. | Journal Article |
| 2020 | Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000
Lange, S.; Schroeder, D.; Hedayat, C.; Hangmann, C.; Otto, T.; Hilleringmann, U. | Conference Paper |
| 2020 | The Limits of the Post‐Growth Optimization of AlN Thin Films Grown on Si(111) via Magnetron Sputtering
Solonenko, D.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
| 2020 | Macroheterocyclic Compounds - a Key Building Block in New Functional Materials and Molecular Devices
Koifman, O.I.; Ageeva, T.A.; Beletskaya, I.P.; Averin, A.D.; Yakushev, A.A.; Tomilova, L.G.; Dubinina, T.V.; Tsivadze, A.Y.; Gorbunova, Y.G.; Martynov, A.G.; Konarev, D.V.; Khasanov, S.S.; Lyubovskaya, R.N.; Lomova, T.N.; Korolev, V.V.; Zenkevich, E.I.; Blaudeck, T.; Borczyskowski, C. von; Zahn, D.R.T.; Mironov, A.F.; Bragina, N.A.; Ezhov, A.V.; Zhdanova, K.A.; Stuzhin, P.A.; Pakhomov, G.L.; Rusakova, N.V.; Semenishyn, N.N.; Smola, S.S.; Parfenyuk, V.I.; Vashurin, A.S.; Makarov, S.V.; Dereven’kov, I.A.; Mamardashvili, N.Z.; Kurtikyan, T.S.; Martirosyan, G.G.; Burmistrov, V.A.; Aleksandriiskii, V.V.; Novikov, I.V.; Pritmov, D.A.; Grin, M.A.; Suvorov, N.V.; Tsygankov, A.A.; Fedorov, A.Y.; Kuzmina, N.S.; Nyuchev, A.V.; Otvagin, V.F.; Kustov, A.V.; Belykh, D.V.; Berezin, D.B.; Solovieva, A.B.; Timashev, P.S.; Milaeva, E.R.; Gracheva, Y.A.; Dodokhova, M.A.; Safronenko, A.V.; Shpakovsky, D.B.; Syrbu, S.A.; Gubarev, Y.A.; Kiselev, A.N.; Koifman, M.O.; Lebedeva, N.S.; Yurina, E.S. | Journal Article |
| 2020 | Microbial Community Distribution and Core Microbiome in Successive Wound Grades of Individuals with Diabetic Foot Ulcers
Jnana, Apoorva; Muthuraman, Vigneshwaran; Varghese, Vinay Koshy; Chakrabarty, Sanjiban; Murali, Thokur Sreepathy; Ramachandra, Lingadakai; Shenoy, Kallya Rajgopal; Rodrigues, Gabriel Sunil; Prasad, Seetharam Shiva; Dendukuri, Dhananjaya; Morschhauser, A.; Nestler, Joerg; Peter, Harald; Bier, Frank F.; Satyamoorthy, Kapaettu | Journal Article |
| 2020 | Nanoindentation as part of material characterization of thin metal films
Jöhrmann, N.; Ecke, R.; Wunderle, B. | Conference Paper |
| 2020 | On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M. | Journal Article |
| 2020 | On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes
Haase, M.; Melzer, M.; Lang, N.; Ecke, R.; Zimmermann, S.; Helden, J.-P.H. van; Schulz, S.E. | Journal Article |
| 2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Abstract |
| 2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Conference Paper |
| 2020 | PHM features for large circuit boards to be implemented into electric drivetrain applications
Otto, A.; Kaulfersch, E.; Singh, P.; Romano, C.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
| 2020 | Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride
Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T. | Journal Article |
| 2020 | A Platform for Fostering Industry-Academia Collaboration
Otto, T. | Journal Article |
| 2020 | Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B. | Conference Paper |
| 2020 | Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS
Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A. | Journal Article, Conference Paper |
| 2020 | Quantifying the influence of graphene film nanostructure on the macroscopic electrical conductivity
Rizzi, L.; Wijaya, A.F.; Palanisamy, L.V.; Schuster, J.; Koehne, M.; Schulz, S.E. | Journal Article |
| 2020 | Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
Schaal, M.; Klingler, M.; Metais, B.; Grueninger, R.; Hoffmann, S.; Wunderle, B. | Conference Paper |
| 2020 | Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, R.; Anu, M.; Albrecht, J.; Scherf, C.; Rzepka, S.; Subbiah, N.; Wilde, J. | Conference Paper |
| 2020 | Ruthenium(II) MOCVD Precursors for Phosphorus‐Doped Ruthenium Layer Formation
Preuß, A.; Tamuliene, J.; Madajska, K.; Szymanska, I.B.; Korb, M.; Rüffer, T.; Jeschke, J.; Melzer, M.; Bankwitz, J.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Selective Heat Input for Low Temperature Metallic Wafer Level Bonding
Wiemer, M.; Hofmann, C.; Vogel, K. | Journal Article, Conference Paper |
| 2020 | Selective induction heating of metallic microstructures for wafer-level MEMS packaging
Fröhlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kräusel, V. | Journal Article, Conference Paper |
| 2020 | Selective Metal Deposition to Increase Productivity
Rhoades, R.L.; Mavliev, R.; Gottfried, K. | Conference Paper |
| 2020 | Special issue: International conference on applied system innovation (ICASI 2018)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
| 2020 | Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests
Majd, M.; Meszmer, P.; Priscaru, A.; Gromala, P.J.; Wunderle, B. | Conference Paper |
| 2020 | Synthesis of β-Ketoiminato Copper(II) Complexes and their Use in Copper Deposition
Preuß, A.; Korb, M.; Rüffer, T.; Bankwitz, J.; Georgi, C.; Jakob, A.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain
Doncker, R.W.de; Fuchs, L.; Hepp, M.; Luedecke, C.; Meyne, C.; Nisch, A.; Otto, A.; Reum, T.; Rzepka, S.; Strenger, C.; Uhlemann, A.; Vanegas, O.; Wondrak, W. | Conference Paper |
| 2020 | The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F. | Conference Paper |
| 2020 | Thermal kinetics of free volume in porous spin-on dielectrics: Exploring the network- and pore-properties
Attallah, A.G.; Koehler, N.; Liedke, M.O.; Butterling, M.; Hirschmann, E.; Ecke, R.; Schulz, S.E.; Wagner, A. | Journal Article |
| 2020 | Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using Finite Element Method and Raman spectroscopy
Liu, E.; Conti, F.; Bhogaraju, S.K.; Signorini, R.; Pedron, D.; Wunderle, B.; Elger, G. | Journal Article, Conference Paper |
| 2020 | Towards Bacteria Counting in DI Water of Several Microliters or Growing Suspension Using Impedance Biochips
Kiani, M.; Tannert, A.; Du, N.; Hübner, U.; Skorupa, I.; Bürger, D.; Zhao, X.; Blaschke, D.; Rebohle, L.; Cherkouk, C.; Neugebauer, U.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2020 | Tunable Magnetic Vortex Dynamics in Ion-Implanted Permalloy Disks
Ramasubramanian, L.; Kákay, A.; Fowley, C.; Yildirim, O.; Matthes, P.; Sorokin, S.; Titova, A.; Hilliard, D.; Böttger, R.; Hübner, R.; Gemming, S.; Schulz, S.E.; Kronast, F.; Makarov, D.; Fassbender, J.; Deac, A. | Journal Article |
| 2020 | Verbesserte Prozessüberwachung durch hochsensitive CNT-Kraftaufnehmer
Bonitz, Jens; Hamm, Lucas; Müller, Peter; Hermann, Sascha | Journal Article |
| 2020 | Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T. | Conference Paper |
| 2020 | Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir
Franz, M.; Junghans, R.; Schmitt, P.; Szeghalmi, A.; Schulz, S.E. | Journal Article |
| 2020 | Wafer-level vacuum-packaged translatory MEMS actuator with large stroke for NIR-FT spectrometers
Sandner, Thilo; Gaumont, Eric; Graßhoff, Thomas; Rieck, Andreas; Seifert, T.; Auböck, Gerald; Grahmann, Jan | Journal Article |
| 2020 | Water-Based Primary Cell for Powering of Wireless Sensors
Petrov, D.; Hilleringmann, U. | Conference Paper |
| 2020 | Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten
Subbiah, N.; Hamza, A.; Wilde, J.; Mathew, A.; Dudek, R. | Conference Paper |