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2020 | 2D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride Meinel, K.; Melzer, M.; Stoeckel, C.; Shaporin, A.; Forke, R.; Zimmermann, S.; Hiller, K.; Otto, T.; Kuhn, H. | Journal Article |
2020 | Advanced Packaging Cost Reduction by Selective Copper Metallization Mavliev, R.; Gottfried, K.; Rhoades, R. | Conference Paper |
2020 | Analysen der Lotermüdung an montierten Testbaugruppen unter Thermowechselbeanspruchungen Dudek, R.; Hildebrandt, M.; Rzepka, S.; Doering, R.; Scheiter, L.; Tegehall, P.-E.; Zhang, M.; Ortmann, R.W. | Conference Paper |
2020 | Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Scheiter, L.; Zhang, M.; Ortmann, R.W. | Conference Paper |
2020 | Calculation technique of diffuse reflectance spectra using an ensemble of damped harmonic oscillators model for substances identification Anfimov, D.R.; Fufurin, I.L.; Golyak, I.S.; Tabalina, A.S.; Kurth, S. | Conference Paper |
2020 | Charged domains in ferroelectric, polycrystalline yttrium manganite thin films resolved with scanning electron microscopy Rayapati, V.R.; Bürger, D.; Du, N.; Kowol, C.; Blaschke, D.; Stöcker, H.; Matthes, P.; Patra, R.; Skorupa, I.; Schulz, S.E.; Schmidt, H. | Journal Article |
2020 | Co-sputtering of Al1−xScxN thin films on Pt(111): a characterization by Raman and IR spectroscopies Solonenko, D.; Lan, C.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
2020 | Control of magneto-optical properties of cobalt-layers by adsorption of α-helical polyalanine self-assembled monolayers Sharma, A.; Matthes, P.; Soldatov, I.; Arekapudi, S.S.P.K.; Böhm, B.; Lindner, M.; Selyshchev, O.; Thi Ngoc Ha, N.; Mehring, M.; Tegenkamp, C.; Schulz, S.E.; Zahn, D.R.T.; Paltiel, Y.; Hellwig, O.; Salvan, G. | Journal Article |
2020 | Cover Feature: Ferrocenyl‐Pyrenes, Ferrocenyl‐9,10‐Phenanthrenediones, and Ferrocenyl‐9,10‐Dimethoxyphenanthrenes Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
2020 | Crystallization of optically thick films of CoxFe 80-xB20 Sharma, A.; Hoffmann, M.A.; Matthes, P.; Hellwig, O.; Kowol, C.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
2020 | Design of a synthetic jet actuator for flow separation control Weigel, P.; Schüller, M.; Gratias, A.; Lipowski, M.; Meer, T. ter; Bardet, M. | Journal Article |
2020 | A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups Rasadujjaman, M.; Wang, Y.; Zhang, L.; Naumov, S.; Attallah, A.G.; Liedke, M.O.; Koehler, N.; Redzheb, M.; Vishnevskiy, A.S.; Seregin, D.S.; Wu, Y.; Zhang, J.; Leu, J.; Wagner, A.; Vorotilov, K.A.; Schulz, S.E.; Baklanov, M.R. | Journal Article |
2020 | Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S. | Conference Paper |
2020 | Disturbing-free determination of yeast concentration in DI water and in glucose using impedance biochips Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Blaschke, D.; Schmidt, H. | Journal Article |
2020 | Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs Schroeder, D.; Lange, S.; Hangmann, C.; Hedayat, C. | Book Article |
2020 | Ferrocenyl-Pyrenes, Ferrocenyl-9,10-Phenanthrenediones, and Ferrocenyl-9,10-Dimethoxyphenanthrenes: Charge-Transfer Studies and SWCNT Functionalization Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
2020 | Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs Conti, F.; Liu, E.; Bhogaraju, S.K.; Wunderle, B.; Elger, G. | Conference Paper |
2020 | Formation and crystallographic orientation of NiSi2-Si interfaces Fuchs, Florian; Bilal Khan, Muhammad; Deb, Dipjyoti; Pohl, Darius; Schuster, Jörg; Weber, Walter M.; Mühle, Uwe; Löffler, Markus; Georgiev, Yordan M.; Erbe, Artur; Gemming, Sibylle | Journal Article |
2020 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2019 | Annual Report |
2020 | Gate Spacer Investigation for Improving the Speed of High-Frequency Carbon Nanotube-Based Field-Effect Transistors Hartmann, M.; Tittmann-Otto, J.; Böttger, S.; Heldt, G.; Claus, M.; Schulz, S.E.; Schröter, M.; Hermann, S. | Journal Article |
2020 | The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H. | Journal Article |
2020 | Increased static dielectric constant in ZnMnO and ZnCoO thin films with bound magnetic polarons Vegesna, S.V.; Bhat, V.J.; Bürger, D.; Dellith, J.; Skorupa, I.; Schmidt, O.G.; Schmidt, H. | Journal Article |
2020 | Induktives Fügen in der Mikrosystemtechnik Hofmann, C.; Fröhlich, A.; Kroll, M. | Journal Article |
2020 | Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices Mitra, K.Y.; Willert, A.; Chandru, R.; Baumann, R.R.; Zichner, R. | Journal Article |
2020 | Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000 Lange, S.; Schroeder, D.; Hedayat, C.; Hangmann, C.; Otto, T.; Hilleringmann, U. | Conference Paper |
2020 | The Limits of the Post‐Growth Optimization of AlN Thin Films Grown on Si(111) via Magnetron Sputtering Solonenko, D.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
2020 | Macroheterocyclic Compounds - a Key Building Block in New Functional Materials and Molecular Devices Koifman, O.I.; Ageeva, T.A.; Beletskaya, I.P.; Averin, A.D.; Yakushev, A.A.; Tomilova, L.G.; Dubinina, T.V.; Tsivadze, A.Y.; Gorbunova, Y.G.; Martynov, A.G.; Konarev, D.V.; Khasanov, S.S.; Lyubovskaya, R.N.; Lomova, T.N.; Korolev, V.V.; Zenkevich, E.I.; Blaudeck, T.; Borczyskowski, C. von; Zahn, D.R.T.; Mironov, A.F.; Bragina, N.A.; Ezhov, A.V.; Zhdanova, K.A.; Stuzhin, P.A.; Pakhomov, G.L.; Rusakova, N.V.; Semenishyn, N.N.; Smola, S.S.; Parfenyuk, V.I.; Vashurin, A.S.; Makarov, S.V.; Dereven’kov, I.A.; Mamardashvili, N.Z.; Kurtikyan, T.S.; Martirosyan, G.G.; Burmistrov, V.A.; Aleksandriiskii, V.V.; Novikov, I.V.; Pritmov, D.A.; Grin, M.A.; Suvorov, N.V.; Tsygankov, A.A.; Fedorov, A.Y.; Kuzmina, N.S.; Nyuchev, A.V.; Otvagin, V.F.; Kustov, A.V.; Belykh, D.V.; Berezin, D.B.; Solovieva, A.B.; Timashev, P.S.; Milaeva, E.R.; Gracheva, Y.A.; Dodokhova, M.A.; Safronenko, A.V.; Shpakovsky, D.B.; Syrbu, S.A.; Gubarev, Y.A.; Kiselev, A.N.; Koifman, M.O.; Lebedeva, N.S.; Yurina, E.S. | Journal Article |
2020 | Microbial Community Distribution and Core Microbiome in Successive Wound Grades of Individuals with Diabetic Foot Ulcers Jnana, Apoorva; Muthuraman, Vigneshwaran; Varghese, Vinay Koshy; Chakrabarty, Sanjiban; Murali, Thokur Sreepathy; Ramachandra, Lingadakai; Shenoy, Kallya Rajgopal; Rodrigues, Gabriel Sunil; Prasad, Seetharam Shiva; Dendukuri, Dhananjaya; Morschhauser, A.; Nestler, Joerg; Peter, Harald; Bier, Frank F.; Satyamoorthy, Kapaettu | Journal Article |
2020 | Nanoindentation as part of material characterization of thin metal films Jöhrmann, N.; Ecke, R.; Wunderle, B. | Conference Paper |
2020 | On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M. | Journal Article |
2020 | On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes Haase, M.; Melzer, M.; Lang, N.; Ecke, R.; Zimmermann, S.; Helden, J.-P.H. van; Schulz, S.E. | Journal Article |
2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Abstract |
2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Conference Paper |
2020 | PHM features for large circuit boards to be implemented into electric drivetrain applications Otto, A.; Kaulfersch, E.; Singh, P.; Romano, C.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
2020 | Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T. | Journal Article |
2020 | A Platform for Fostering Industry-Academia Collaboration Otto, T. | Journal Article |
2020 | Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B. | Conference Paper |
2020 | Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A. | Journal Article, Conference Paper |
2020 | Quantifying the influence of graphene film nanostructure on the macroscopic electrical conductivity Rizzi, L.; Wijaya, A.F.; Palanisamy, L.V.; Schuster, J.; Koehne, M.; Schulz, S.E. | Journal Article |
2020 | Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics Schaal, M.; Klingler, M.; Metais, B.; Grueninger, R.; Hoffmann, S.; Wunderle, B. | Conference Paper |
2020 | Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation Dudek, R.; Anu, M.; Albrecht, J.; Scherf, C.; Rzepka, S.; Subbiah, N.; Wilde, J. | Conference Paper |
2020 | Ruthenium(II) MOCVD Precursors for Phosphorus‐Doped Ruthenium Layer Formation Preuß, A.; Tamuliene, J.; Madajska, K.; Szymanska, I.B.; Korb, M.; Rüffer, T.; Jeschke, J.; Melzer, M.; Bankwitz, J.; Schulz, S.E.; Lang, H. | Journal Article |
2020 | Selective Heat Input for Low Temperature Metallic Wafer Level Bonding Wiemer, M.; Hofmann, C.; Vogel, K. | Journal Article, Conference Paper |
2020 | Selective induction heating of metallic microstructures for wafer-level MEMS packaging Fröhlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kräusel, V. | Journal Article, Conference Paper |
2020 | Selective Metal Deposition to Increase Productivity Rhoades, R.L.; Mavliev, R.; Gottfried, K. | Conference Paper |
2020 | Special issue: International conference on applied system innovation (ICASI 2018) Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
2020 | Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests Majd, M.; Meszmer, P.; Priscaru, A.; Gromala, P.J.; Wunderle, B. | Conference Paper |
2020 | Synthesis of β-Ketoiminato Copper(II) Complexes and their Use in Copper Deposition Preuß, A.; Korb, M.; Rüffer, T.; Bankwitz, J.; Georgi, C.; Jakob, A.; Schulz, S.E.; Lang, H. | Journal Article |
2020 | System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain Doncker, R.W.de; Fuchs, L.; Hepp, M.; Luedecke, C.; Meyne, C.; Nisch, A.; Otto, A.; Reum, T.; Rzepka, S.; Strenger, C.; Uhlemann, A.; Vanegas, O.; Wondrak, W. | Conference Paper |
2020 | The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F. | Conference Paper |
2020 | Thermal kinetics of free volume in porous spin-on dielectrics: Exploring the network- and pore-properties Attallah, A.G.; Koehler, N.; Liedke, M.O.; Butterling, M.; Hirschmann, E.; Ecke, R.; Schulz, S.E.; Wagner, A. | Journal Article |
2020 | Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using Finite Element Method and Raman spectroscopy Liu, E.; Conti, F.; Bhogaraju, S.K.; Signorini, R.; Pedron, D.; Wunderle, B.; Elger, G. | Journal Article, Conference Paper |
2020 | Towards Bacteria Counting in DI Water of Several Microliters or Growing Suspension Using Impedance Biochips Kiani, M.; Tannert, A.; Du, N.; Hübner, U.; Skorupa, I.; Bürger, D.; Zhao, X.; Blaschke, D.; Rebohle, L.; Cherkouk, C.; Neugebauer, U.; Schmidt, O.G.; Schmidt, H. | Journal Article |
2020 | Tunable Magnetic Vortex Dynamics in Ion-Implanted Permalloy Disks Ramasubramanian, L.; Kákay, A.; Fowley, C.; Yildirim, O.; Matthes, P.; Sorokin, S.; Titova, A.; Hilliard, D.; Böttger, R.; Hübner, R.; Gemming, S.; Schulz, S.E.; Kronast, F.; Makarov, D.; Fassbender, J.; Deac, A. | Journal Article |
2020 | Verbesserte Prozessüberwachung durch hochsensitive CNT-Kraftaufnehmer Bonitz, Jens; Hamm, Lucas; Müller, Peter; Hermann, Sascha | Journal Article |
2020 | Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T. | Conference Paper |
2020 | Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir Franz, M.; Junghans, R.; Schmitt, P.; Szeghalmi, A.; Schulz, S.E. | Journal Article |
2020 | Wafer-level vacuum-packaged translatory MEMS actuator with large stroke for NIR-FT spectrometers Sandner, Thilo; Gaumont, Eric; Graßhoff, Thomas; Rieck, Andreas; Seifert, T.; Auböck, Gerald; Grahmann, Jan | Journal Article |
2020 | Water-Based Primary Cell for Powering of Wireless Sensors Petrov, D.; Hilleringmann, U. | Conference Paper |
2020 | Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten Subbiah, N.; Hamza, A.; Wilde, J.; Mathew, A.; Dudek, R. | Conference Paper |
2019 | Accelerated Pump Out Testing for Thermal Greases Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Schacht, R.; Abo Ras, M. | Conference Paper |
2019 | Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T. | Journal Article |
2019 | Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S. | Conference Paper |
2019 | Ar+ ions irradiation induced memristive behavior and neuromorphic computing in monolithic LiNbO3 thin films Pan, X.; Shuai, Y.; Wu, C.; Zhang, L.; Guo, H.; Cheng, H.; Peng, Y.; Qiao, S.; Luo, W.; Wang, T.; Sun, X.; Zeng, H.; Zhang, J.; Zhang, W.; Ou, X.; Du, N.; Schmidt, H. | Journal Article |
2019 | Assessment of FOWLP process dependent wafer warpage using parametric FE study Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas | Conference Paper |
2019 | BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses Auersperg, J.; Auerswald, E.; Vogel, D.; Rzepka, S. | Conference Paper |
2019 | Beschleunigungssensoren mit großer Bandbreite und geringer Leistungsaufnahme für industrielle Anwendungen Forke, R.; Hiller, K.; Küchler, M.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T. | Conference Paper |
2019 | Carbon Nanotubes for Mechanical Sensor Applications Wagner, C.; Blaudeck, T.; Meszmer, P.; Böttger, S.; Fuchs, F.; Hermann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E. | Journal Article |
2019 | Characterisation of MOS transistors as an electromechanical transducer for stress Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T. | Journal Article |
2019 | A Combined Methodology to Include System Effects in Board-Level Stress Simulations Dudek, R.; Hildebrandt, M.; Rzepka, S.; Döring, R.; Scheiter, L.; Tröger, B.; Zhang, M.J.; Ortmann, R.W. | Conference Paper |
2019 | Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results Dudek, R.; Kreyssig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Frühauf, P.; Weigert, A. | Conference Paper |
2019 | Compliance-current-modulated resistive switching with multi-level resistance states in single-crystalline LiNbO3 thin film Pan, X.; Shuai, Y.; Wu, C.; Luo, W.; Sun, X.; Zeng, H.; Guo, H.; Yuan, Y.; Zhou, S.; Böttger, R.; Cheng, H.; Zhang, J.; Zhang, W.; Schmidt, H. | Journal Article |
2019 | A Compound Control System for FR4-Based Electromagnetic Scanning Micrograting Yu, F.; Wen, Q.; Lei, H.; Huang, L.; Wen, Z. | Journal Article |
2019 | Computationally efficient simulation method for conductivity modeling of 2D-based conductors Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
2019 | Concept of the 3rd Generation of Reliability for Electronic Smart Systems Gromala, P.; Dietz, F.; Rzepka, S.; Han, B. | Conference Paper |
2019 | The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki | Conference Paper |
2019 | Design, Modeling, Fabrication, and Verification of New Multifunctional MEMS/NEMS Components Freitag, M.; Sauppe, M.; Auerswald, C.; Kriebel, D.; Schmidt, H.; Voigt, S.; Arnold, B.; Markert, E.; Hahn, S.; Hiller, K.; Heinkel, U.; Mehner, J. | Journal Article |
2019 | Developing a process to remove single silicon layers by atomic layer etching Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
2019 | Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D. | Conference Paper |
2019 | Development of synthetic jet actuator array for vortex-flow generation Lipowski, M.; Bäcker, D. | Conference Paper |
2019 | Doctor blade system for the deposition of thin semiconducting films Petrov, D.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
2019 | Electrically Controlled Actuation of Strained Nanomembranes Enderlein, T.; Nestler, J.; Stiehl, C.; Morschhauser, A.; Otto, T. | Journal Article |
2019 | Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution Rayapai, V.R.; Bürger, D.; Du, N.; Patra, R.; Skorupa, I.; Blaschke, D.; Stöcker, H.; Matthes, P.; Schulz, S.E.; Schmidt, H. | Journal Article |
2019 | Electron transport through NiSi2–Si contacts and their role in reconfigurable field-effect transistors Fuchs, F.; Gemming, S.; Schuster, J. | Journal Article |
2019 | Evaporation study based on micromodel experiments: Comparison of theory and experiment Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J. | Journal Article |
2019 | Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films Sharma, A.; Hoffmann, M.A.; Matthes, P.; Busse, S.; Selyshchev, O.; Mack, P.; Exner, H.; Horn, A.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
2019 | FR4-based electromagnetic scanning micro-grating integrated with an angle sensor for a low-cost NIR micro-spectrometer Wen, Q.; Lei, H.; Huang, J.; Yu, F.; Huang, L.; Zhang, J.; Li, D.; Peng, Y.; Wen, Z. | Journal Article |
2019 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2018 | Annual Report |
2019 | Herstellung von neuartigen Reflektorsystemen und Erarbeitung einer systembezogenen Integrationstechnologie für VIS und IR Fabry-Pérot Interferometer (Dissertation) Helke, C. : Hiller, K.; Sinzinger, S. | Dissertation |
2019 | Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements - Technology and Functional Test Results Meszmer, P.; Hahn, S.; Hiller, K.; Wunderle, B. | Journal Article |
2019 | The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples Geidel, S.; Morschhauser, A.; Otto, T. | Conference Paper |
2019 | An improved Green's function algorithm applied to quantum transport in carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
2019 | Improved organic thin-film transistor performance by dielectric layer patterning Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Vollbrecht, J.; Kitzerow, H.; Paradies, J.; Hilleringmann, U. | Conference Paper |
2019 | Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics Lange, S.; Schröder, D.; Hedayat, C.; Otto, T.; Hilleringmann, U. | Conference Paper |
2019 | Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik Hofmann, C.; Froehlich, A.; Kroll, M.; Wiemer, M. | Conference Paper |
2019 | Induktives Fügen in der Mikrosystemtechnik Hofmann, C.; Fröhlich, A. | Journal Article |
2019 | Inkjet Printing of Self‐Supporting and Self‐Contained Structured Objects Onto Liquid Surfaces Goedel, W.A.; Gläser, K.; Mitra, D.; Thalheim, R.; Ueberfuhr, P.; Hammerschmidt, J.; Baumann, R.R. | Journal Article |
2019 | Inorganic p-channel thin-film transistors using CuO nanoparticles Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2019 | Integration of plasmonic nanostructures for micro-opto-electromechanical-systems Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T. | Conference Paper |
2019 | Intelligenter Werkstückträger mit Inertialsensorik zum Überwachen und Optimieren von Fertigungsprozessen Forke, Roman; Forke, Erik; Alalus, Mohaned Khaled; Weidlich, Sebastian; Bülz, Daniel | Conference Paper |
2019 | Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices Otto, A.; Rzepka, S.; Wunderle, B. | Journal Article |
2019 | Iron(III) β-diketonates: CVD precursors for iron oxide film formation Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
2019 | Joining two worlds - hybrid integration of silicon based electronics and printed functionalities Roscher, F.; Thalheim, R.; Seifert, T.; Paul, S.-D.; Zichner, R.; Wiemer, M.; Otto, T. | Conference Paper |
2019 | Low Power High Bandwidth Acceleration Sensor for Industrial Applications Forke, R.; Hiller, K.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T. | Conference Paper |
2019 | Magnetic tunnel junctions: Laser annealing versus oven annealing Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
2019 | Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Conference Paper |
2019 | Measurements on the fly: Introducing mobile micro-sensors for biotechnological applications Lauterbach, T.; Lüke, T.; Büker, M.-J.; Hedayat, C.; Gernandt, T.; Moll, R.; Grösel, M.; Lenk, S.; Seidel, F.; Brunner, D.; Bley, T.; Walther, T.; Lenk, F. | Journal Article |
2019 | Mechanical deformation on nanoparticle-based thin-film transistors Vidor, F.F.; Meyers, T.; Reker, J.; Mueller, K.; Wirth, G.I.; Hilleringmann, U. | Conference Paper |
2019 | A MEMS IR optical chopper based on subwavelength structures Kurth, S.; Meinig, M.; Wecker, J.; Seifert, M.; Hiller, K.; Otto, T. | Conference Paper |
2019 | Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications Zschenderlein, U.; Klingler, M.; Arnold, J.; Baum, M.; Weißbach, M.; Schaal, M.; Wunderle, B. | Conference Paper |
2019 | Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J. | Journal Article |
2019 | Microwave Radiation Detection with an Ultrathin Free-Standing Superconducting Niobium Nanohelix Loesch, S.; Alfonsov, A.; Dobrovolskiy, O.V.; Keil, R.; Engemaier, V.; Baunack, S.; Li, G.; Schmidt, O.G.; Buerger, D. | Journal Article |
2019 | Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Filter Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Otto, T. | Conference Paper |
2019 | Miniaturized multi sensor implant for monitoring of hemodynamic parameters Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Schröder, Thomas; Wünsch, Dirk; Görtz, Michael; Seidl, Karsten | Conference Paper |
2019 | Multisensor-Implantat zur Überwachung der Hämodynamik Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Görtz, Michael; Seidl, Karsten | Conference Paper |
2019 | Nanoparticles and Organic Semiconductors for Flexible Electronics Hilleringmann, U.; Reker, J.; Meyers, T.; Vidor, F.F.; Bezuidenhout, P.H.; Joubert, T.-H. | Conference Paper |
2019 | Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T. | Conference Paper |
2019 | Next Generation of highly miniaturized Bulk-MEMS Fabry-Pérot Filters for infrared Microspectrometers Ebermann, M.; Neumann, N.; Hoppe, S.; Hiller, K.; Seiler, J.; Helke, C.; Meinig, M.; Kurth, S. | Conference Paper |
2019 | A Nonlinear Broadband Electromagnetic Vibration Energy Harvester Based on Double-Clamped Beam Lu, Z.; Wen, Q.; He, X.; Wen, Z. | Journal Article |
2019 | A Novel Indirect Quasi-Static Actuation Concept for 2D MEMS Micromirrors Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Journal Article |
2019 | A Novel Method for MEMS Wafer-Level Packaging. Selective and Rapid Induction Heating for Copper-Tin SLID Bonding Hofmann, C.; Fröhlich, A.; Kimme, J.; Wiemer, M.; Otto, T. | Conference Paper |
2019 | Optimization of Platinum dioxide properties by plasma oxidation of sputtered PtOx Basu, Nivedita; Sterin, N.S.; Saketh, Ram Mamidala; Shenoy, Apoorva; Bhat, Navakanta | Journal Article |
2019 | Oxygen detection with zinc oxide nanoparticle structures Schwabe, T.; Balke, A.; Bezuidenhout, P.H.; Reker, J.; Meyers, T.; Joubert, T.-H.; Hilleringmann, U. | Conference Paper |
2019 | P-N Junction-Based Si Biochips with Ring Electrodes for Novel Biosensing Applications Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Schmidt, H. | Journal Article |
2019 | Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2 Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T. | Journal Article, Conference Paper |
2019 | Photosensitive Field‐Effect Transistors Made from Semiconducting Carbon Nanotubes and Non‐Covalently Attached Gold Nanoparticles Blaudeck, T.; Preuß, A.; Scharf, S.; Notz, S.; Kossmann, A.; Hartmann, S.; Kasper, L.; Mendes, R.G.; Gemming, T.; Hermann, S.; Lang, H.; Schulz, S.E. | Journal Article |
2019 | Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter | Conference Paper |
2019 | Printing Reinforcing Structures onto Microsieves that are Floating on a Water Surface Goedel, W.A.; Gläser, K.; Mitra, D.; Hammerschmidt, J.; Thalheim, R.; Ueberfuhr, P.; Baumann, R.R. | Journal Article |
2019 | Radially resolved electronic structure and charge carrier transport in silicon nanowires Fuchs, F.; Gemming, S.; Schuster, J. | Journal Article |
2019 | Regeneration of Assembled, Molecular-Motor-Based Bionanodevices Rahman, M.A.; Reuther, C.; Lindberg, F.W.; Mengoni, M.; Salhotra, A.; Heldt, G.; Linke, H.; Diez, S.; Mansson, A. | Journal Article |
2019 | Role of contacts in carbon nanotube giant piezoresistive sensors Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S. | Conference Paper |
2019 | Sealing of glass with titanium by glass pressing at the softening point Winkler, Sebastian; Edelmann, Jan; Günther, Daniel; Wieland, Sebastian; Selbmann, Franz; Baum, Mario; Schubert, Andreas | Journal Article |
2019 | Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging Froehlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kraeusel, V. | Conference Paper |
2019 | Self-aligned organic thin-film transistors for flexible electronics Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2019 | Sensitivity control of carbon nanotube-based piezoresistive sensors by drain-induced barrier thinning Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Schuster, J.; Hermann, S. | Journal Article |
2019 | Sensoric Micro and Nano Systems. Editorial Zahn, D.R.T.; Schulz, S.E.; Hiller, K.; Wagner, C.; Reuter, D.; Otto, T. | Journal Article |
2019 | Simulation der Eigenerwärmung gedruckter Leiterbahnen für die thermische Auslegung Bülz, D.; Streit, P.; Forke, R.; Otto, T. | Conference Paper |
2019 | Simulation of Self-Heating of Printed Interconnects for Thermal Design Bülz, D.; Streit, P.; Forke, R.; Otto, T. | Conference Paper |
2019 | Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films Hoffmann, M.A.; Sharma, A.; Matthes, P.; Okano, S.; Hellwig, O.; Ecke, R.; Zahn, D.R.T.; Salvan, G.; Schulz, S.E. | Journal Article |
2019 | Strain and screening: Optical properties of a small-diameter carbon nanotube from first principles Wagner, C.; Schuster, J.; Schleife, A. | Journal Article |
2019 | Surface effects and photoinduced relaxation processes in nanocomposites based on semiconductor quantum dots CdSe/ZnS and organic dye molecules Zenkevich, E.I.; Stupak, A.P.; Kowerko, D.; Blaudeck, T.; Borczyskowski, C. von | Conference Paper |
2019 | Synthesis of Mg and Zn diolates and their use in metal oxide deposition Frenzel, P.; Preuß, A.; Bankwitz, J.; Georgi, C.; Ganss, F.; Mertens, L.; Schulz, S.E.; Hellwig, O.; Mehring, M.; Lang, H. | Journal Article |
2019 | Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C. | Journal Article |
2019 | Transport Properties in Co-doped ZnO/YMnO3 n-p Heterojunctions Torres, M.L.; Skorupa, I.; Schmidt, H.; Schmidt, O.G.; Gomez, M.E. | Conference Paper, Journal Article |
2019 | VIS Fabry-Pérot Interferometer with structured (TiO2/PE-SiO2)3 Bragg-reflectors on 5mm large LP-Si3N4 membranes Helke, C.; Hiller, K.; Seiler, J.; Werner, T.; Meinig, M.; Kurth, S.; Otto, T. | Conference Paper |
2018 | "3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W. | Conference Paper |
2018 | 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M. | Conference Paper |
2018 | Active flow control in wind turbines - integration technologies and assessment of economic effects Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar | Conference Paper |
2018 | AlN film based piezoelectric large-aperture MEMS scanning micromirror integrated with angle sensors Lei, H.; Wen, Q.; Yu, F.; Li, D.; Shang, Z.; Huang, J.; Wen, Z. | Journal Article |
2018 | Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T. | Journal Article |
2018 | Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van | Conference Paper |
2018 | Application-driven reliability research of next generation for automotive electronics: Challenges and approaches Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Journal Article |
2018 | Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E. | Conference Paper |
2018 | Automated virtual prototyping for fastest time-to-market of new system in package solutions Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven | Conference Paper |
2018 | β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
2018 | Bidirectional data transmission for battery-less medical implants Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton | Abstract |
2018 | Challenges in transferring quantum dot sensitized solar cells on technical textiles Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T. | Conference Paper |
2018 | Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W. | Journal Article |
2018 | Deposition methods for C8-BTBT in flexible TFTs Meyers, T.; Reker, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2018 | Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2018 | Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development Correia, V.; Mitra, K.Y.; Castro, H.; Rocha, J.G.; Sowade, E.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
2018 | Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T. | Journal Article |
2018 | Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R. | Conference Paper |
2018 | Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung Schacht, R.; Rzepka, S. | Conference Paper |
2018 | Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren Noerdemann, A. | Bachelor Thesis |
2018 | Electrical Conductivity Modeling of Graphene-based Conductor Materials Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
2018 | Electroanalysis moves towards paper-based printed electronics Cinti, S.; Colozza, N.; Cacciotti, I.; Moscone, D.; Polomoshnov, M.; Sowade, E.; Baumann, R.R.; Arduini, F. | Journal Article |
2018 | Electrochemical deposition of reactive material systems for assembly and packaging applications Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas | Conference Paper |
2018 | Electroforming-free resistive switching in polycrystalline YMnO3 thin films Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H. | Journal Article |
2018 | Electronic transport through defective semiconducting carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
2018 | Elektrochemische Abscheidung für die Leiterplatte Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S. | Conference Paper |
2018 | Elektronentransport in Graphen-Nanobändern mit Kantenrauheit Rodemund, T.S. | Bachelor Thesis |
2018 | Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
2018 | Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S. | Conference Paper |
2018 | Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S. | Conference Paper |
2018 | Fabrication and operation of protein-powered biocomputation using nanostructured networks Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S. | Conference Paper |
2018 | Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R. | Journal Article |
2018 | Fatigue Crack Growth Analysis of Interface between Lead Frame and Molding Compound Bektas, E.; Broermann, K.; Brumm, S.P.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
2018 | Feasible device architectures for ultrascaled CNTFETs Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M. | Journal Article |
2018 | Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H. | Journal Article |
2018 | FR4-Based Electromagnetic Scanning Micromirror Integrated with Angle Sensor Lei, H.; Wen, Q.; Yu, F.; Zhou, Y.; Wen, Z. | Journal Article |
2018 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017 | Annual Report |
2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Conference Paper |
2018 | Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology Geneiß, V.; Lüke, T.; Hedayat, C.; Wolf, M.; Janek, F.; Meißner, T.; Barth, M.; Eberhardt, W.; Zimmermann, A.; Otto, T. | Conference Paper |
2018 | Implantable multi-sensor system for hemodynamic controlling Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Journal Article |
2018 | An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T. | Conference Paper |
2018 | Indirect X-ray detectors based on inkjet-printed photodetectors with a screen-printed scintillator layer Oliveira, J.; Correia, V.; Sowade, E.; Etxebarria, I.; Rodriguez, R.D.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
2018 | Influence of defect-induced deformations on electron transport in carbon nanotubes Teichert, F.; Wagner, C.; Croy, A.; Schuster, J. | Journal Article |
2018 | Influence of the electrode material on the performance of BTBT-based thin-film transistors Meyers, T.; Reker, J.; Petrov, D.; Hilleringmann, U.; Vidor, F.F. | Conference Paper |
2018 | Inkjet printing and intense pulsed light sintering of multiwall carbon nanotubes for sensor applications Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R. | Conference Paper |
2018 | Inkjet Printing and Intense Pulsed Light Sintering of Multiwall Carbon Nanotubes for Sensor Applications Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R. | Journal Article |
2018 | Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T. | Conference Paper |
2018 | Inkjet-Printed Wireless Chemiresistive Sensors: A review Hartwig, M.; Zichner, R.; Joseph, Y. | Journal Article |
2018 | Integrated Microsystems for Smart Applications Otto, T.; Kurth, S.; Voigt, S.; Morschhauser, A.; Meinig, M.; Hiller, K.; Martin, J.; Vogel, M. | Journal Article |
2018 | Integration of covalent and non-covalent functionalized SWCNTs in FETs Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H. | Abstract |
2018 | Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications Otto, A.; Rzepka, S.; Wunderle, B. | Conference Paper |
2018 | Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T. | Conference Paper |
2018 | Investigation of Electromagnetic Angle Sensor Integrated in FR4-Based Scanning Micromirror Wen, Q.; Lei, H.; Yu, F.; Li, D.; She, Y.; Huang, J.; Huang, L.; Wen, Z. | Journal Article |
2018 | Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing Wolf, M.; Janek, F.; Meissner, T.; Wigger, B.; Barth, M.; Guenter, T.; Eberhardt, W.; Zimmermann, A.; Geneiss, V.; Lueke, T.; Hedayat, C.; Otto, T. | Conference Paper |
2018 | Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Journal Article |
2018 | Klebeelement und Ventilanordnung Morschhauser, Andreas; Nestler, Jörg; Otto, Thomas; Stiehl, Cornelia | Patent |
2018 | Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung Otto, T. | Book Article |
2018 | Liquid crystalline dithienothiophene derivatives for organic electronics Vollbrecht, J.; Oechsle, P.; Stepen, A.; Hoffmann, F.; Paradies, J.; Meyers, T.; Hilleringmann, U.; Schmidtke, J.; Kitzerow, H. | Journal Article |
2018 | Long-term thermal fatigue testing of solder joints and related fatigue life predictions Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B. | Conference Paper |
2018 | Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B. | Conference Paper |
2018 | Magnesium β-ketoiminates as CVD precursors for MgO formation Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H. | Journal Article |
2018 | Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G. | Abstract |
2018 | Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S. | Conference Paper |
2018 | A micro-electromechanical systems based vibration energy harvester with aluminum nitride piezoelectric thin film deposited by pulsed direct-current magnetron sputtering He, X.; Wen, Q.; Lu, Z.; Shang, Z.; Wen, Z. | Journal Article |
2018 | Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Wecker, J. | Conference Paper |
2018 | Miniaturized NIR Spectrometer Based on Novel MOEMS Scanning Tilted Grating Huang, J.; Wen, Q.; Nie, Q.; Chang, F.; Zhou, Y.; Wen, Z. | Journal Article |
2018 | Multiscale residual stress analysis in thin film layers Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
2018 | Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates Hu, X. | Dissertation |
2018 | Nanostructures for smart systems Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T. | Conference Paper |
2018 | A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A. | Conference Paper |
2018 | On the Experimental Characterization of Morphing Structures Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M. | Book Article |
2018 | On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P. | Conference Paper |
2018 | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation Auersperg, J.; Albrecht, J.; Rzepka, S. | Conference Paper |
2018 | Parylene as a Dielectric Material for Electronic Applications in Space Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
2018 | Performance analysis of CuO nanoparticle-based thin-film transistors Reker, J.; Meyers, T.; Petrov, D.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2018 | Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D. | Conference Paper |
2018 | Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S. | Journal Article |
2018 | Portable Sensor System for UV-Irradiation Measurements Petrov, D.; Narayan, R.S.; Hilleringmann, U. | Conference Paper |
2018 | Printed batteries and conductive patterns in technical textiles Willert, A.; Meuser, C.; Baumann, R.R. | Journal Article, Conference Paper |
2018 | Printing techniques for batteries Willert, A.; Tran-Le, A.-T.; Mitra, K.Y.; Clair, M.; Costa, C.M.; Lanceros-Méndez, S.; Baumann, R.R. | Book Article |
2018 | Process development of large area R2R printing and sintering of conductive patterns by inkjet and infra-red technologies tailored for printed electronics Mitra, K.Y.; Kapadia, S.; Hartwig, M.; Sowade, E.; Xu, Z.; Baumann, R.R.; Zichner, R. | Journal Article |
2018 | Quantum transport in defective carbon nanotubes at mesoscopic length scales Teichert, F. | Dissertation |
2018 | Reactive bonding with oxide based reactive multilayers Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T. | Conference Paper |
2018 | Real time solid waste monitoring using cloud and sensors technologies Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Journal Article |
2018 | Reliability assessment and failure mode analysis of MEMS accelerometers for space applications Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O. | Journal Article |
2018 | Reliability testing of integrated low-temperature PVD PZT films Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K. | Journal Article, Conference Paper |
2018 | RFID units for a product based control of industrial production systems Schmidt, M.; Metz, G.; Hedayat, C.; Otto, T.; Petrov, D. | Conference Paper |
2018 | The role of plasma analytics in leading-edge semiconductor technologies Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T. | Journal Article, Conference Paper |
2018 | SAMPL - Secure Additive Manufacturing Platform Gratias, A.; Böttcher, F.; Holland, M.; Schueller, M. | Conference Paper |
2018 | Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S. | Conference Paper |
2018 | Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016) Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2016) Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article |
2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2017) Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
2018 | Stochastic analyzes and Monte-Carlo simulations of nonlinear and non-ideal mixed-signal phase-locked loops Schmidt, M.; Hangmann, C.; Hedayat, C.; Hilleringmann, U.; Otto, T. | Conference Paper |
2018 | Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen Rothe, T. : Gemming, S.; Schuster, J.; Lorenz, E. | Bachelor Thesis |
2018 | Stress analyses in HPC-soldered assemblies by optical measurement and FEA Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S. | Conference Paper |
2018 | Strukturierungsverfahren Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt | Book Article |
2018 | Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E. | Conference Paper |
2018 | Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H. | Journal Article |
2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Conference Paper |
2018 | Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints Kumar, A.; Zschenderlein, U.; Baum, M.; Brunschwiler, T.; Wright, D.N.; Wunderle, B. | Conference Paper |
2018 | Thin Film Piezoelectric Aluminum Nitride for Piezoelectric Micromachined Ultrasonic Transducers Stoeckel, C.; Meinel, K.; Melzer, M.; Otto, T. | Conference Paper |
2018 | Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors Becker, T.E.; Vidor, F.F.; Wirth, G.I.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
2018 | Transient electro-thermal coupled system simulation Schacht, R.; Rzepka, S. | Conference Paper |
2018 | Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R. | Conference Paper |
2018 | Tuning of diameter and electronic type of CCVD grown SWCNTs Jafarpour, S.M.; Schulz, S.E.; Hermann, S. | Journal Article |
2018 | Vertically aligned carbon nanotube films as absorption layers for IR applications Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha | Conference Paper |
2018 | Warpage measurement on bonded wafers under thermal load Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T. | Conference Paper |
2018 | Welcome to the 12th Smart Systems Integration Otto, T. | Conference Paper |
2018 | Work function and conductivity of inkjet-printed silver layers: Effect of inks and post-treatments Mitra, D.; Mitra, K.Y.; Dzhagan, V.; Pillai, N.; Zahn, R.T.; Baumann, R.R. | Journal Article |
2017 | 3D packaging for an implantable hemodynamic control system Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T. | Journal Article, Conference Paper |
2017 | 3D packaging technologies for smart medical implants Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael | Conference Paper |
2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
2017 | 3D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias Hofmann, L. | Dissertation |
2017 | Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J. | Journal Article |
2017 | Application driven reliability research of next generation for automotive electronics: Challenges and approaches Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Conference Paper |
2017 | Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny | Conference Paper |
2017 | Ätzung von Nanostrukturen Hilleringmann, U. | Book Article |
2017 | Biomedical diagnostics enabled by integrated organic and printed electronics Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J. | Journal Article |
2017 | Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W. | Conference Paper |
2017 | Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
2017 | Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates Mitra, D.; Baumann, R.R. | Conference Paper |
2017 | Characterization of epoxy based highly filled die attach materials in microelectronics Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L. | Conference Paper |
2017 | Characterization of partial discharge performance of die attach adhesives Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Journal Article, Conference Paper |
2017 | Complementary field-effect transistors for flexible electronics Hilleringmann, U.; Vidor, F.F.; Meyers, T. | Conference Paper |
2017 | A concept for an ice detection system on overhead power lines, theory and practical results Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S. | Conference Paper |
2017 | Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates Mitra, D.; Baumann, R.R. | Conference Paper |
2017 | Control system design for a morphing wing trailing edge Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R. | Conference Paper |
2017 | Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R. | Journal Article |
2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Conference Paper |
2017 | Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2017 | Design of a 2D MEMS micromirror with indirect static actuation Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Conference Paper |
2017 | Detection of mechanical loads in lightweight structures using quantum dots photoluminescence Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T. | Conference Paper |
2017 | Development history and current achievements of printed primary batteries Willert, A.; Baumann, R.R. | Conference Paper |
2017 | Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B. | Presentation |
2017 | Development of sensor integration concept for mass production processes Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L. | Conference Paper |
2017 | Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014 Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
2017 | Effective viscoelastic plastic material modeling for faster and reliable calculations Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S. | Conference Paper |
2017 | Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S. | Journal Article |
2017 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Conference Paper |
2017 | Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application Schacht, R.; Rzepka, S. | Conference Paper |
2017 | Elastic and piezoresistive properties of nickel carbides from first principles Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S. | Journal Article |
2017 | An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F. | Journal Article |
2017 | Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
2017 | Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T. | Journal Article |
2017 | Emerging applications: PICs as a platform for lab on chip devices Geidel, S.; Otto, T. | Journal Article |
2017 | Erweiterung konventioneller Bauelemente durch Nanotechniken Hilleringmann, U.; Horstmann, J.T. | Book Article |
2017 | Fabrication and operation of kinesin-1-powered biocomputation networks Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan | Abstract |
2017 | Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S. | Journal Article |
2017 | FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R. | Conference Paper |
2017 | Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K. | Conference Paper |
2017 | Fluidic actuators for separation control at the engine/wing junction Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M. | Journal Article, Conference Paper |
2017 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016 | Annual Report |
2017 | Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R. | Journal Article |
2017 | Go beyond 4.0 - towards digital fabrication based on printing Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T. | Conference Paper |
2017 | Halbleitende Nanopartikel für Feldeffekttransistoren Hilleringmann, U. | Book Article |
2017 | HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
2017 | High-Q whispering gallery microdisk resonators based on silicon oxynitride Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A. | Journal Article |
2017 | Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten Hangmann, C. | Dissertation |
2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
2017 | Implantable multi sensor system for hemodynamic controlling Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Conference Paper |
2017 | Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
2017 | Increase of functional density of hybrid structures by integration of micro and nano systems Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L. | Conference Paper |
2017 | Inductive temperature measurement for fast and optimized adhesive curing Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A. | Conference Paper |
2017 | Influence of processing atmosphere for QD-LEDs Langenickel, J.; Weiß, A.; Otto, T. | Conference Paper |
2017 | Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Journal Article |
2017 | Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G. | Conference Paper |
2017 | Integration of self-healing agent into MEMS bonding frames Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M. | Conference Paper |
2017 | Integration of ZnO nanoparticle transistors on freestanding flexible substrates Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
2017 | Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2017 | Investigation on inkjet printing for electromagnetic applications Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Abstract |
2017 | Investigation on inkjet printing for electromagnetic compatibility application Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Conference Paper |
2017 | Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T. | Conference Paper |
2017 | Investigations on Parylene C for its integrability into MEMS Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
2017 | Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
2017 | Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M. | Journal Article, Conference Paper |
2017 | Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Conference Paper |
2017 | Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
2017 | A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester He, X.; Wen, Q.; Sun, Y.; Wen, Z. | Journal Article |
2017 | Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E. | Journal Article |
2017 | Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U. | Journal Article |
2017 | Mass production of magnesium silicide as a TEG material Schoenhoff, M.; Hilleringmann, U.; Boor, J. de | Conference Paper |
2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Conference Paper |
2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fügmann, U.; Illing-Günther, H.; Nestler, D.; Hübler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Journal Article |
2017 | Mechanical, electronic and optical properties of strained carbon nanotubes Wagner, C.F. | Dissertation |
2017 | MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T. | Conference Paper |
2017 | Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T. | Journal Article |
2017 | Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A. | Conference Paper |
2017 | Multilayer micromechanics process with thick functional layers (EPyC40) Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
2017 | Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper Hu, X.; Schuster, J.; Schulz, S.E. | Journal Article |
2017 | Nanophotonic biosensor for space exploration (PBSA instrument) Pantoja, S.; Parro, V.; Nestler, J.; Geidel, S.; Martins, R.; Cuesta, F.; Elvira, J.G.; Sousa, A. | Conference Paper |
2017 | Novel concept of integrated micro actuation of membranes in liquid environments Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T. | Conference Paper |
2017 | A novel gyroscopic actuation concept for 2D MEMS micromirrors Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Journal Article, Conference Paper |
2017 | Organic thin-film transistors for AMOLED applications Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U. | Conference Paper |
2017 | Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014) Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
2017 | Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P. | Journal Article |
2017 | Printing technologies for the manufacturing of passive microwave components: Antennas Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R. | Journal Article |
2017 | Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T. | Conference Paper |
2017 | Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk | Patent |
2017 | Real time solid waste monitoring using cloud and sensors technologies Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Conference Paper |
2017 | Reliability characterization of aerosol jet printing technology for multilayer secure envelopes Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N. | Conference Paper |
2017 | Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Journal Article, Conference Paper |
2017 | Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A. | Conference Paper |
2017 | Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S. | Conference Paper |
2017 | Robust design optimization: On methodology and short review Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
2017 | Robust vibration Sensor for condition monitoring in railway applications Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D. | Conference Paper |
2017 | Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E. | Abstract |
2017 | Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T. | Journal Article, Conference Paper |
2017 | Sens-o-Spheres - A concept for location independent acquisition of process measurement signals Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P. | Conference Paper |
2017 | Sensor components of a miniaturized implant for haemodynamic controlling Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael | Journal Article, Conference Paper |
2017 | Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process) Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
2017 | Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015) Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
2017 | Temporary wafer bonding - key technology for MEMS devices Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T. | Conference Paper |
2017 | A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B. | Conference Paper |
2017 | Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E. | Conference Paper |
2017 | Welcome to the 11th Smart Systems Integration Otto, T. | Conference Paper |
2016 | 3D integration technologies for MEMS Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S. | Conference Paper |
2016 | Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K. | Conference Paper |
2016 | Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
2016 | Advances in Deposition of Main-Group Metal Oxides and Rare-Earth Oxides from Metal Enolates Lang, H.; Adner, D.; Georgi, C. | Book Article |
2016 | Advances in Deposition of Metals from Metal Enolates Lang, H.; Adner, D.; Georgi, C. | Book Article |
2016 | Advances in Deposition of Transition-Metal Oxides from Metal Enolates Lang, H.; Adner, D.; Georgi, C. | Book Article |
2016 | All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates Moya, A.; Sowade, E.; del Campo, F.J.; Mitra, K.Y.; Ramon, E.; Villa, R.; Baumann, R.R.; Gabriel, G. | Journal Article |
2016 | All-inkjet-printed low-pass filters with adjustable cutoff frequency consisting of resistors, inductors and transistors for sensor applications Castro, H.F.; Correia, V.; Sowade, E.; Mitra, K.Y.; Rocha, J.G.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
2016 | All-inkjet-printed thin-film transistors: Manufacturing process reliability by root cause analysis Sowade, E.; Ramon, E.; Mitra, K.Y.; Martínez-Domingo, C.; Pedró, M.; Pallarès, J.; Loffredo, F.; Villani, F.; Gomes, H.L.; Terés, L.; Baumann, R.R. | Journal Article |
2016 | Analyses of thermo-mechanical reliability issues for power modules designed in planar technology Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K. | Conference Paper |
2016 | Application of microcontrollers in solar-powered model gliders with sensor systems Petrov, D.; Hilleringmann, U. | Conference Paper |
2016 | Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M. | Conference Paper |
2016 | Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
2016 | Best practice approaches for stress measurements on thin layer stacks Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S. | Conference Paper |
2016 | Bis(β-diketonato)-and allyl-(β-diketonato)-palladium(II) complexes: Synthesis, characterization and MOCVD application Assim, K.; Melzer, M.; Korb, M.; Rüffer, T.; Jakob, A.; Noll, J.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
2016 | Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R. | Conference Paper |
2016 | Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
2016 | Cavity-enhanced mm-wave spectrometer with integrated SiGe front-end for oxygen concentration measurement Wecker, J.; Kurth, S.; Mangalgiri, G.; Otto, T.; Gessner, T.; Gaitzsch, M.; Bauch, A.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
2016 | Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M. | Conference Paper |
2016 | Ceramic substrate technology for wafer level packaging of MEMS Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank | Conference Paper |
2016 | CF3Br plasma cryo etching of low-k porous dielectric Clemente, I.; Koehler, N.; Miakonkikh, A.; Zimmermann, S.; Schulz, S.E.; Rudenko, K. | Journal Article, Conference Paper |
2016 | Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Journal Article, Conference Paper |
2016 | Chemical vapor deposition of ruthenium-based layers by a single-source approach Jeschke, J.; Möckel, S.; Korb, M.; Rüffer, T.; Assim, K.; Melzer, M.; Herwig, G.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
2016 | CNTFET-based RF electronics - State-of-the-art and future prospects Schröter, M.; Claus, M.; Hermann, S.; Tittman-Otto, J.; Haferlach, M.; Mothes, S.; Schulz, S. | Conference Paper |
2016 | Comparison of atomistic quantum transport and numerical device simulation for carbon nanotube field-effect transistors Fuchs, F.; Zienert, A.; Mothes, S.; Claus, M.; Gemming, S.; Schuster, J. | Conference Paper |
2016 | Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T. | Journal Article |
2016 | Concept for a miniaturized cardiovascular multi sensor implant Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael | Abstract |
2016 | COSIVU - Compact, smart and reliable drive unit for fully electric vehicles Andersson, D.R.; Brinkfeldt, K.; Nord, S.; Ottosson, J.; Lampic, G.; Gotovac, G.; Zschieschang, O.; Baumgartel, H.; Brusius, M.; Kaulfersch, E.; Hilpert, F.; Otto, A.; Frankeser, S. | Conference Paper |
2016 | Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
2016 | Design and fabrication of a SiC-based power module with double-sided cooling for automotive applications Brinkfeldt, K.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Kaulfersch, E.; Edwards, M.; Otto, A.; Andersson, D. | Conference Paper |
2016 | The design challenge in printing devices and circuits: Influence of the orientation of print patterns in inkjet-printed electronics Sowade, E.; Polomoshnov, M.; Baumann, R.R. | Journal Article |
2016 | Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T. | Conference Paper |
2016 | Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T. | Journal Article |
2016 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T. | Journal Article |
2016 | Efficient design methodology for inductive energy transmission Büker, M.-J.; Hedayat, C.; Hilleringmann, U.; Geßner, T. | Conference Paper |
2016 | Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S. | Conference Paper |
2016 | Electron transport in defective metallic and semiconducting carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
2016 | Electroplating of neodymium iron alloys Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
2016 | Embedding electrochemical impedance spectroscopy in smart battery management systems using multicore technology Armengaud, E.; Macher, G.; Groppo, R.; Novaro, M.; Otto, A.; Döring, R.; Schmidt, H.; Kras, B.; Stankiewicz, S. | Conference Paper |
2016 | Empirical transport model of strained CNT transistors used for sensor applications Wagner, C.; Schuster, J.; Gessner, T. | Journal Article |
2016 | Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S. | Journal Article |
2016 | ENIAC-Projekt ESEE: Photoakustischer Sensor und Sauerstoffsensor mit mm-Wellen Cavity-Resonator Wecker, Julia; Gaitzsch, Markus; Kurth, Steffen; Weber, Christian; Schmitt, Katrin; Wöllenstein, Jürgen | Report |
2016 | Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses Haubold, M. | Dissertation |
2016 | Event driven modeling and characterization of the second order voltage switched charge pump PLL Ali, E.; Hangmann, C.; Hedayat, C.; Haddad, F.; Rahajandraibe, W.; Hilleringmann, U. | Journal Article |
2016 | Exchange-biased Py/CoO vortex structures: Magnetization reversal, cooling-field dependence, and training Nissen, D.; Klein, O.; Matthes, P.; Albrecht, M. | Journal Article |
2016 | Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
2016 | Exploitation of giant piezoresistivity - CNT sensors fabricated with a wafer-level technology Böttger, S.; Schulz, S.E.; Hermann, S. | Journal Article, Conference Paper |
2016 | Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T. | Conference Paper |
2016 | Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S. | Journal Article |
2016 | Fluidic actuators for active flow control on airframe Schueller, M.; Weigel, P.; Lipowski, M.; Meyer, M.; Schlösser, P.; Bauer, M. | Conference Paper |
2016 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2015 | Annual Report |
2016 | High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly Dinh, Nghia Trong; Sowade, Enrico; Blaudeck, T.; Hermann, S.; Rodriguez, Raul D.; Zahn, Dietrich R.T.; Schulz, S.E.; Baumann, R.R.; Kanoun, Olfa | Journal Article |
2016 | A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü | Abstract |
2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
2016 | Improved RF design using precise 3D near-field measurements and near-field to far-field transformations Hangmann, C.; Mager, T.; Khan, S.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
2016 | An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
2016 | An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Journal Article |
2016 | Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps Geidel, S.; Peransi Llopis, S.; Rodrigo, M.; Diego-Castilla, G. de; Sousa, A.; Nestler, J.; Otto, T.; Gessner, T.; Parro, V. | Journal Article |
2016 | Integration of humidity sensors into fibre-reinforced thermoplastic composites Ebert, F.; Seider, T.; Illing-Günther, H.; Nendel, K.; Martin, J.; Otto, T.; Gessner, T.; Nestler, D.; Wagner, G. | Journal Article, Conference Paper |
2016 | Intense pulsed light sintering of an inkjet printed silver nanoparticle ink depending on the spectral absorption and reflection of the background Mitra, D.; Mitra, K.Y.; Hartwig, M.; Baumann, R.R. | Journal Article |
2016 | Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S. | Conference Paper |
2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Journal Article |
2016 | Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T. | Journal Article |
2016 | Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T. | Journal Article |
2016 | Light electric vehicle enabled by smart systems integration John, R.; Kahrimanovic, E.; Otto, A.; Tavernini, D.; Camocardi, M.; Perelli, P.; Dalmasso, D.; Blaz, S.; Trojaniello, D.; Oleari, E.; Sanna, A.; Groppo, R.; Romano, C. | Conference Paper |
2016 | Liquid reagent storage in self-pumping lab-on-a-chip systems for quick assay and biosensor integration Nestler, J.; Haber, N.; Stiehl, C.; Otto, T.; Gessner, T. | Conference Paper |
2016 | Low temperature layer purification by pulsed UV-irradiation for flexible dye sensitized solar cells Kleine, A.; Hilleringmann, U. | Conference Paper |
2016 | Low temperature thermo compression bonding with printed intermediate bonding layers Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T. | Conference Paper |
2016 | Low-cost treatment for flexible electronics Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
2016 | Magnesium silicide TEGs as self-sufficient power supply for smart systems Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
2016 | Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
2016 | Maskless reduction of crosstalk suitable for flexible electronics Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2016 | Master curve synthesis by effective viscoelastic plastic material modeling Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S. | Conference Paper |
2016 | Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas | Conference Paper |
2016 | Measurement and modeling of the effective thermal conductivity of sintered silver pastes Ordonez-Miranda, J.; Hermens, M.; Nikitin, I.; Kouznetsova, V.G.; Sluis, O. van der; Ras, M.A.; Reparaz, J.S.; Wagner, M.R.; Sledzinska, M.; Gomis-Bresco, J.; Sotomayor Torres, C.M.; Wunderle, B.; Volz, S. | Journal Article |
2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Conference Paper |
2016 | A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
2016 | MEMS tunable Fabry-Pérot filters for infrared microspectrometer applications Neumann, N.; Ebermann, M.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
2016 | Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T. | Journal Article |
2016 | Microelectromechanical switch and method for manufacturing the same Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
2016 | Microelectromechanical system and method for manufacturing the same Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
2016 | Microwave filter design optimized for ceramic multilayer technique Uhlig, P.; Kassner, J.; Guenner, C.; Noack, E. | Journal Article, Conference Paper |
2016 | Miniaturized vortex-induced vibration energy harvester for low velocity air flow application Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Geßner, T. | Conference Paper |
2016 | Modeling of MOEMS electromagnetic scanning grating mirror for NIR micro-spectrometer Zhou, Y.; Wen, Q.; Wen, Z.; Yang, T. | Journal Article |
2016 | A new approach for 3D Integration based on printed multilayers and through polymer vias Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T. | Conference Paper |
2016 | Next generation drivetrain concept featuring self-learning capabilities enabled by extended information technology functionalities Otto, A.; Rzepka, S. | Conference Paper |
2016 | Novel test stand for thermal diffusivity measurement of bulk and thin films Ras, M.A.; May, D.; Wunderle, B. | Conference Paper |
2016 | Novel through silicon wiring technology using dry etched sloping vertical terminals Haas, S.; Voigt, S.; Arnold, M.; Schwenzer, F.; Braunschweig, M.; Küchler, M.; Kurth, S.; Gessner, T. | Conference Paper |
2016 | Optimization of a zinc oxide dispersion for building Quantum Dot Light Emitting Diodes Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Gessner, T. | Conference Paper |
2016 | Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end Wecker, J.; Bauch, A.; Kurth, S.; Mangalgiri, G.; Gaitzsch, M.; Meinig, M.; Gessner, T.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
2016 | Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
2016 | Piezoelektrische Aluminiumnitrid-Dünnschichten für mikroelektromechanische Systeme Stöckel, C. | Dissertation |
2016 | A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics Koehler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Journal Article |
2016 | Printed batteries designed to power OLED applications Willert, A.; Helmert, M.; Baumann, R.R. | Conference Paper |
2016 | Processing-structure-property correlations of sintered silver Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B. | Conference Paper |
2016 | Product data and Sensor-based intelligent drive Control for flexible manufacturing and intralogistic processes Geneiß, V.; Hedayat, C.; Bertelsmeier, F.; Henke, C.; Vathauer, K.-E.; Geßner, T. | Conference Paper |
2016 | Re-building the underfill: Performance of percolating fillers at package scale Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
2016 | Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I. | Conference Paper |
2016 | Reliability assessment of PCB for smart secure applications Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B. | Conference Paper |
2016 | Reliability investigation on SiC BJT power module Otto, A.; Kaulfersch, E.; Frankeser, S.; Brinkfeldt, K.; Zschieschang, O.; Rzepka, S. | Conference Paper |
2016 | Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R. | Conference Paper |
2016 | Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
2016 | Self-assembly of spherical colloidal photonic crystals inside inkjet-printed droplets Sowade, E.; Blaudeck, T.; Baumann, RR. | Journal Article |
2016 | Silicon oxynitride microdisk resonators for integrated waveguide coupling Hett, T.; Frers, T.; Widhalm, A.; Berth, G.; Hilleringmann, U.; Zrenner, A. | Conference Paper |
2016 | Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg | Conference Paper |
2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Abstract |
2016 | Stress investigations in 3D-integrated silicon microstructures Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
2016 | Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
2016 | Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
2016 | Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling Niessner, M.; Dudek, R.; Hildebrandt, M.; Gehring, M.; Yongbo, Y.; Piller, A.; Schrag, G. | Conference Paper |
2016 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Journal Article, Conference Paper |
2016 | Thermal design of integrated heating for lab-on-a-chip systems Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T. | Conference Paper |
2016 | Thermal simulations and experimental verification of power modules designed for double sided cooling Brinkfeldt, K.; Ottosson, J.; Otto, A.; Mann, A.; Zschieschang, O.; Frankeser, S.; Andersson, D. | Conference Paper |
2016 | Time-efficient curing of printed dielectrics via infra-red suitable to S2S and R2R manufacturing platforms for electronic devices Mitra, K.Y.; Weise, D.; Hartwig, M.; Kapadia, S.; Baumann, R.R. | Journal Article |
2016 | Towards distributed intelligent sensor and information fusion Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article |
2016 | Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
2016 | Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers Meinig, M.; Kurth, S.; Seifert, M.; Hiller, K.; Wecker, J.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
2016 | Tunable MEMS Fabry-Pérot filters for infrared microspectrometers: A review Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
2016 | Tuning the reduction and conductivity of solution-processed graphene oxide by intense pulsed light Al-Hamry, A.; Kang, H.; Sowade, E.; Dzhagan, V.; Rodriguez, R.D.; Müller, C.; Zahn, D.R.T.; Baumann, R.R.; Kanoun, O. | Journal Article |
2016 | Up-scaling of the manufacturing of all-inkjet-printed organic thin-film transistors: Device performance and manufacturing yield of transistor arrays Sowade, E.; Mitra, K.Y.; Ramon, E.; Martinez-Domingo, C.; Villani, F.; Loffredo, F.; Gomes, H.L.; Baumann, R.R. | Journal Article |
2016 | Upscaling of the inkjet printing process for the manufacturing of passive electronic devices Sternkiker, C.; Sowade, E.; Mitra, K.Y.; Zichner, R.; Baumann, R.R. | Journal Article |
2016 | Using quantum dot photoluminescence for load detection Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.; Gessner, T. | Journal Article |
2016 | Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C. | Conference Paper |
2016 | VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy Helke, C.; Meinig, M.; Seifert, M.; Seiler, J.; Hiller, K.; Kurth, S.; Martin, J.; Gessner, T. | Conference Paper |
2016 | Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B. | Conference Paper |
2016 | Welcome to smart systems integration 2016 Gessner, T. | Conference Paper |
2015 | [Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
2015 | "LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B. | Conference Paper |
2015 | 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T. | Conference Paper |
2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
2015 | Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
2015 | Acceleration of lifetime modeling by isothermal bending fatigue tests Heilmann, J.; Arnold, J.; Wunderle, B. | Conference Paper |
2015 | Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R. | Journal Article |
2015 | Advances in percolated thermal underfill (PTU) simulations for 3D-integration Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B. | Conference Paper |
2015 | Aerosol jet printing of nano particle based electrical chip interconnects Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Journal Article, Conference Paper |
2015 | All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime Gomes, H.L.; Medeiros, M.C.R.; Villani, F.; Canudo, J.; Loffredo, F.; Miscioscia, R.; Martinez-Domingo, C.; Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; McCulloch, I.; Carrabina, J. | Journal Article |
2015 | Assembly and packaging of micro systems by using reactive bonding processes Schumacher, Axel; Gaiß, Ulrike; Knappmann, Stefan; Dietrich, Georg; Braun, Stefan; Pflug, Erik; Roscher, Frank; Vogel, Klaus; Hertel, Silvia; Kähler, Dirk; Reinert, Wolfgang | Conference Paper |
2015 | Back-end-of-line compatible contact materials for carbon nanotube based interconnects Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
2015 | Carbon nanotube based field-effect transistors: Comparison between atomistic quantum transport and numerical device simulation Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
2015 | Carbon Nanotube based sensors in MEMS/NEMS Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
2015 | Carbon nanotubes under strain: Electronic and Optical properties Wagner, C.; Schuster, J.; Gessner, T. | Abstract |
2015 | Challenges in the reliability of 3D integration using TSVs Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Conference Paper |
2015 | Charakterisierung der Verbindungseigenschaften Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C. | Book Article |
2015 | Comparative analysis of multi-mass high precision vibratory MEMS gyroscopes Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Hiller, K.; Hahn, S.; Gessner, T. | Conference Paper |
2015 | Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers Niittynen, J.; Sowade, E.; Kang, H.; Baumann, R.R.; Mäntysalo, M. | Journal Article |
2015 | Controlling the ink spreading on uncoated paper for inkjet printed nanoparticle silver inks in combination with intense pulsed light (IPL) sintering Weise, D.; Hartwig, M.; Mitra, K.Y.; Wagenbach, A.; Shah, K.Y.; Baumann, R.R. | Conference Paper |
2015 | Correction: Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second (J. Mater. Chem. C (2015) DOI: 10.1039/c5tc02291f) Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
2015 | Degradation of all-inkjet-printed organic thin-film transistors with TIPS-pentacene under processes applied in textile manufacturing Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Machado, A.V.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
2015 | Demonstratoren Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J. | Book Article |
2015 | Direct integrated strain sensors for robust temperature behaviour Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T. | Conference Paper |
2015 | Effect of the light spectrum of various substrates for inkjet printed conductive structures sintered with intense pulsed light Weise, D.; Mitra, K.Y.; Ueberfuhr, P.; Baumann, R.R. | Conference Paper |
2015 | Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Rzepka, S. | Conference Paper |
2015 | Efficient K-band antennas fabricated with large-scale processes Gaitzsch, M.; Grossmann, T.D.; Hartwig, M.; Heinrich, M.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L. | Conference Paper |
2015 | Electrical conductivity enhancement of spin-coated PEDOT:PSS thin film via dipping method in low concentration aqueous DMSO Deetuam, C.; Weise, D.; Samthong, C.; Praserthdam, P.; Baumann, R.R.; Somwangthanaroj, A. | Journal Article |
2015 | Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration Meinig, M.; Kurth, S.; Helke, C.; Seifert, M.; Hiller, K.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
2015 | Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M. | Conference Paper |
2015 | Electromagnetic simulation of flexible strain sensor based microstrip patch antenna Benchirouf, A.; Zichner, R.; Müller, C.; Kanoun, O. | Journal Article, Conference Paper |
2015 | Ereignisgesteuerte Methode für schnelle und präzise Analysen Hangmann, C.; Vogel, M. | Journal Article |
2015 | Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S. | Conference Paper |
2015 | Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S. | Conference Paper |
2015 | Exact and approximated discrete-time non-linear models of voltage switched CP-PLL Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
2015 | Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T. | Abstract |
2015 | Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics Köhler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Conference Paper |
2015 | Fabrication of micro needle arrays using an ultra short pulse laser Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
2015 | Fabrication of nanoporous gold and the application for substrate bonding at low temperature Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M. | Journal Article |
2015 | Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
2015 | A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases Ebermann, M.; Neumann, N.; Binder, S.; Meinig, M.; Seifert, M.; Kurth, S.; Hiller, K. | Conference Paper |
2015 | FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B. | Conference Paper |
2015 | FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B. | Conference Paper |
2015 | Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K. | Conference Paper |
2015 | Flexible electronics: Integration processes for organic and inorganic semiconductor-based thin-film transistors Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Journal Article |
2015 | Fluidic actuators in composite structures Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Symmank, C.; Schmidt, A.; Kroll, L.; Gessner, T.; Götze, U. | Conference Paper |
2015 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2014 | Annual Report |
2015 | Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik | Patent |
2015 | Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H. | Journal Article |
2015 | Hierarchical, high-rate, hybrid and roll-to-roll manufacturing : Poliks, M.D.; Blaudeck, T. | Conference Proceedings |
2015 | High-performance giant magnetoresistive sensorics on flexible Si membranes Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G. | Journal Article |
2015 | Highly-sensitive humidity sensors for condition monitoring of hybrid laminates Seider, T.; Martin, J.; Boeddicker, A.; Ruehling, J.; Wett, D.; Nestler, D.J.; Wagner, G.; Huebler, A.; Otto, T.; Gessner, T. | Conference Paper |
2015 | An improved micromechanical method for investigating the statistical strength of poly-silicon membranes Brückner, J.; Pfaff, H.; Dehe, A.; Rzepka, S. | Abstract |
2015 | Improving HV battery efficiency by smart control systems Armengaud, E.; Macher, G.; Kurtulus, C.; Groppo, R.; Haase, S.; Hofer, G.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
2015 | An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
2015 | Influence of different hole transport layers on the performance of quantum dot light emitting diodes Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
2015 | Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics Vidor, F.F.; Meyers, T.; Hilleringmann, U.; Wirth, G.I. | Conference Paper |
2015 | Infra-red curing methodology for Roll-to-Roll (R2R) manufacturing of conductive electrodes through inkjet technology applicable for devices in the field of flexible electronics Mitra, K.Y.; Weise, D.; Hartwig, M.; Baumann, R.R. | Journal Article, Conference Paper |
2015 | An inkjet adaptive backend strategy for low-yield OTFT digital circuits Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R. | Conference Paper |
2015 | Inkjet and gravure printing of conductive patterns for the application in lightweight structures Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
2015 | Inkjet printing of colloidal nanospheres: Engineering the evaporation-driven self-assembly process to form defined layer morphologies Sowade, E.; Blaudeck, T.; Baumann, R.R. | Journal Article |
2015 | Inkjet printing of group-11 metal structures Gäbler, Christian; Schliebe, Christian; Adner, David; Blaudeck, T.; Hildebrandt, Alexander; Lang, Heinrich | Book Article |
2015 | Inkjet printing of UHF antennas on corrugated cardboards for packaging applications Sowade, E.; Göthel, F.; Zichner, R.; Baumann, R.R. | Journal Article |
2015 | Inkjet-printed quantum dot-based sensor for structural health monitoring Hartwig, M.; Ortlepp, F.; Möbius, M.; Martin, J.; Otto, T.; Geßner, T.; Baumann, R.R. | Conference Paper |
2015 | Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring Ortlepp, F.; Hartwig, M.; Moebius, M.; Martin, J.; Otto, T.; Gessner, T.; Baumann, R.R. | Conference Paper |
2015 | Integrated load detection sensor for lightweight structures based on quantum dots Moebius, M.; Martin, J.; Poppitz, E.A.; Hartwig, M.; Dzhagan, D.; Gordan, O.D.; Lang, H.; Zahn, D.R.T.; Baumann, R.R.; Otto, T.; Gessner, T. | Conference Paper |
2015 | Integration and test of synthetic jet actuators Schueller, M.; Weigel, P.; Lipowski, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
2015 | Integration of fluidic jet actuators in composite structures Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Otto, T.; Geßner, T.; Kroll, L. | Conference Paper |
2015 | Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes Weise, D.; Sternkiker, C.; Baumann, R.R. | Conference Paper |
2015 | Intense pulsed light sintering of inkjet printed silver nanoparticle ink: Influence of flashing parameters and substrate Weise, D.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Journal Article, Conference Paper |
2015 | Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Journal Article, Conference Paper |
2015 | Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Conference Paper |
2015 | Investigation of carbon nanotube based field-effect transistors using atomistic quantum transport and numerical device simulation Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
2015 | Investigation of Uncertainty Sources of Piezoresistive Silicon Based Stress Sensor Palczynska, Alicja; Schindler-Saefkow, Florian; Gromala, Przemyslaw; Kreyßig, Kerstin; Rzepka, Sven; Mayer, Dirk; Melz, Tobias | Conference Paper |
2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
2015 | k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study Foerster, A.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E. | Abstract |
2015 | Kombinierte Simulation integrierter mikrofluidischer Aktoren Schulze, R.; Nestler, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T. | Conference Paper |
2015 | Life cycle-oriented analysis and evaluation of Active Flow Control in wind turbines Götze, U.; Symmank, C.; Dressel, M.; Schüller, M.; Schmidt, A.; Lipowski, M.; Geßner, T.; Otto, T. | Journal Article |
2015 | Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Journal Article |
2015 | Materials for Advanced Metallization 2014 (MAM 2014). Preface Schulz, S.E.; Hecker, M.; Korner, H.; Wolf, H. | Conference Paper, Journal Article |
2015 | Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A. | Conference Paper |
2015 | Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B. | Conference Paper |
2015 | Mechanical stress induced in Si sensors during bonding and packaging processes Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Conference Paper |
2015 | Metallic glass as a mechanical material for microscanners Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W. | Journal Article |
2015 | Micro welding of aluminum for post process electrode gap reduction using femtosecond laser Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T. | Conference Paper |
2015 | Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M. | Journal Article |
2015 | Microelectronics packaging materials: Investigating the influence of moisture by molecular dynamics simulations Hölck, O.; Wunderle, B. | Conference Paper |
2015 | Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A. | Conference Paper |
2015 | Mobile communication and control for Smart Microfluidic Systems Otto, T.; Geidel, S.; Morschhauser, A.; Streiter, R.; Gessner, T.; Heibutzki, B.; Nestler, J. | Conference Paper |
2015 | Modeling & PVT characterization of arbitrary ordered VSCP-PLL using an efficient event-driven approach Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
2015 | Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen Weidlich, S.; Forke, R.; Billep, D.; Konietzka, S.; Koehler, D.; Hiller, K.; Gessner, T. | Conference Paper |
2015 | Monolithic integration of 2D spin valve magnetic field sensors for angular sensing Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Journal Article, Conference Paper |
2015 | Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Conference Paper |
2015 | Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T. | Conference Paper |
2015 | Nanoparticle assembly and sintering towards all-copper flip chip interconnects Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T. | Conference Paper |
2015 | A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J. | Conference Paper |
2015 | Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H. | Conference Paper |
2015 | On the optimization of piezoelectric vibration energy harvester Deng, L.; Wen, Q.; Jiang, S.; Zhao, X.; She, Y. | Journal Article |
2015 | On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J. | Journal Article |
2015 | On-chip micro-pseudocapacitors for ultrahigh energy and power delivery Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M. | Journal Article |
2015 | Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E. | Journal Article |
2015 | Optimum laser exposure for setting exchange bias in spin valve sensors Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E. | Journal Article, Conference Paper |
2015 | Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator Wecker, J.; Mangalgiri, G.; Kurth, S.; Meinig, M.; Hackner, A.; Prechtel, U.; Gessner, T. | Journal Article |
2015 | Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Conference Paper |
2015 | Performance investigation of UHF RFID tags designed for air and Rubber Belts - impact of electrical parameters and the shape of the belts Kanwar, K.; Mager, T.; Hilleringmann, U.; Hedayat, C.; Geneis, V.; Gessner, T. | Conference Paper |
2015 | A photonic biosensor for space applications (PBSA) Diego-Castilla, G. de; Pantoja, S.; Geidel, S.; Peransi, S.; Nestler, J.; Martins, R.; Sousa, A.; Gomez-Elvira, J.; Moreno-Paz, M.; Cuesta, L.; Parro, V. | Conference Paper |
2015 | Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics Mitra, K.Y.; Sowade, E.; Martinez-Domingo, C.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Conference Paper |
2015 | Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T. | Conference Paper |
2015 | Precision determination of thermoreflectance coefficients for localised thermometry Schlag, R.; Ras, M.A.; Arlt, V.; May, D.; Winkler, T.; Wunderle, B. | Conference Paper |
2015 | Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology Nossol, P.; Schaufuss, J.; Tsapkolenko, A.; Rost,F; Arnold, B.; Kroll, L.; Mehner, J.; Gessner, T. | Conference Paper |
2015 | Preparation of Ni-C thin films for strain sensor applications in new hybrid laminates with thermoplastic matrix Wett, D.; Nestler, D.; Wagner, G.; Wielage, B.; Seider, T.; Martin, J.; Gessner, T. | Conference Paper |
2015 | Printed functionalities in hybrid laminates Nestler, D.J.; Jung, H.; Trautmann, M.; Wielage, B.; Wagner, G.; Seider, T.; Martin, J.; Otto, T.; Gessner, T.; Ebert, F.; Illing-Guenther, H.; Nendel, K.; Boeddicker, A.; Fuegmann, U.; Huebler, A. | Conference Paper |
2015 | Printing of conductive patterns for application in smart lightweight structures Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
2015 | Pulsed jet actuators and their integration in composite structures Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
2015 | Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes Hübner, M.; Lang, N.; Zimmermann, S.; Schulz, S.E.; Buchholtz, W.; Röpcke, J.; Helden, J.H. van | Journal Article |
2015 | Quantum dot-based sensor layer in lightweight structures Fischer, T.; Heinrich, K.; Spudat, C.; Martin, J.; Otto, T.; Gessner, T.; Kroll, L. | Journal Article |
2015 | Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification Merten, E.; Essen, T. von; Luczack, F.; Otto, A.; Lunding, A.; Lürkens, P.; Bast, M.; Abo Ras, M.; Rzepka, S. | Conference Paper |
2015 | Remote ice detection on rotor blades of wind turbines Großmann, T.D.; Gaitzsch, M.; Hartwig, M.; Heinrich, M.; Symmank, C.; Schmidt, A.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.; Götze, U. | Conference Paper |
2015 | RF MEMS switch for modulated backscatter communication Gaitzsch, M.; Voigt, S.; Haas, S.; Kurth, S.; Gessner, T. | Conference Paper |
2015 | Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
2015 | Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S. | Conference Paper |
2015 | Semiconductor nanocrystals – versatile building blocks for innovative microsystems Weiss, A.; Heinrich, K.; Martin, J.; Otto, T.; Gessner, T.; Langenickel, J. | Conference Paper |
2015 | Simulation and validation of arbitrary ordered VSCP-PLLs using event-driven macromodeling Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
2015 | Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
2015 | Smart systems integration. Short review and further development of smart systems Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Kurth, S.; Nestler, J.; Köhler, T. | Book Article |
2015 | SMART-LIC - Smart and Compact Battery Management System Module for Integration into Lithium-Ion Cell for Fully Electric Vehicles Langheim, J.; Carcaillet, S.; Cavro, P.; Steinau, M.; Kanoun, O.; Günther, T.; Mager, T.; Otto, A.; Lanciotti, C. | Conference Paper |
2015 | Stress measurements on TSVs and BEoL structures with high spatial resolution Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S. | Conference Paper |
2015 | Strong localization in defective carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
2015 | Strong localization in quasi one-dimensional systems with realistic defects: Application to carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Conference Paper |
2015 | Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen Baum, M. | Dissertation |
2015 | Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper, Journal Article |
2015 | Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article |
2015 | Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures Helke, C.; Nestler, J.; Gessner, T. | Conference Paper |
2015 | Synthesis and characterization of nanogenerators based on doped zinc oxide Heinrich, K.; Justeau, C.; Mielke, B.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
2015 | System zum Messen einer Axialkraft einer Schraubverbindung Geßner, Thomas; Otto, Thomas; Halder, Stefan; Hummel, Dieter; Martin, Jörg; Weiss, Martin; Möbius, Martin; Spudat, Christian; Gessner, Thomas; Otto, Thomas | Patent |
2015 | Technological platform for vertical multi-wafer integration of miniature imaging instruments Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S. | Conference Paper |
2015 | Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T. | Conference Paper |
2015 | Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation Förster, A.; Wagner, C.; Gemming, S.; Schuster, J. | Journal Article |
2015 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k materials Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Conference Paper |
2015 | Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S. | Conference Paper |
2015 | Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B. | Poster |
2015 | Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
2015 | Thermo-mechanical simulations of SiC power modules with single and double sided cooling Brinkfeldt, K.; Edwards, M.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Andersson, D. | Conference Paper |
2015 | Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B. | Conference Paper |
2015 | TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T. | Abstract |
2015 | VORRICHTUNGEN ZUR AUSSENDUNG UND/ODER ZUM EMPFANG ELEKTROMAGNETISCHER STRAHLUNG UND VERFAHREN ZUR BEREITSTELLUNG DERSELBEN Geßner, Thomas; Otto, Thomas; Schulz, Stefan; Hermann, Sascha; Blaudeck, Thomas; Spudat, Christian | Patent |
2015 | Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E. | Journal Article, Conference Paper |
2015 | A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes Hartmann, M.; Hermann, S.; Pohl, D.; Rellinghaus, B.; Schulz, S.E. | Abstract |
2015 | Wake up MEMS for inertial sensors Stoeckel, C.; Billep, D.; Konietzka, S.; Zimmermann, S.; Otto, T. | Conference Paper |
2015 | Welcome to Smart Systems Integration 2015 Gessner, T. | Conference Paper |
2015 | Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics Ahner, N.; Zimmermann, S.; Köhler, N.; Krüger, S.; Schulz, S.E. | Conference Paper |
2015 | Yet another tuning fork gyroscope Forke, R.; Hiller, K.; Hahn, S.; Konietzka, S.; Motl, T.; Köhler, D.; Heinz, S.; Billep, D.; Gessner, T. | Conference Paper |
2014 | System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS Kolchuzhin, V.; Mehner, J.; Markert, E.; Heinkel, U.; Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
2014 | 3D technology as a holistic approach - quo vadis? Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried | Presentation |
2014 | An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B. | Book Article |
2014 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B. | Conference Paper |
2014 | Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B. | Conference Paper |
2014 | Adjustment of Carbon Nanotube Properties for Sensor Applications using Pd Adatoms: An Ab-Initio Study Fuchs, F.; Wagner, C.; Zienert, A.; Schuster, J. | Abstract |
2014 | Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R. | Book Article |
2014 | AIM technology and devices - from basic research to industrial proven MEMS platform Bertz, A.; Reuter, D.; Nowack, M. | Book Article |
2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Conference Paper |
2014 | All-inkjet-printed bottom-gate thin-film transistors using UV curable dielectric for well-defined source-drain electrodes Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Lanceros-Méndez, S.; Baumann, R.R. | Journal Article |
2014 | Analysis of Au metal–metal contacts in a lateral actuated RF MEMS switch Gaitzsch, M.; Kurth, S.; Voigt, S.; Haas, S.; Gessner, T. | Conference Paper, Journal Article |
2014 | Analysis of interface delamination by combined theoretical and experimental means Dudek, R.; Braemer, B.; Auersperg, J. | Book Article |
2014 | Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B. | Conference Paper |
2014 | ANAn UPS/IPS Study of Band Level Alignment Of a Quantum Dot Based Sensor Tofighi, G.; Moebius, M.; Haidu, F.; Martin, J.; Dzhagan, V.M.; Spudat, C.; Otto, T.; Gessner, T.; Gordan, O.D.; Zahn, D.R.T. | Abstract |
2014 | Anodized aluminum as effective and cheap alternative substrate for thermoelectric generators Assion, F.; Geneiß, V.; Schönhoff, M.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
2014 | Anti-counterfeiting technique in the micro region for micro and nano systems Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B. | Book Article |
2014 | Applications driven by printed batteries Willert, A.; Espig, M.; Helmert, M.; Baumann, R.R. | Book Article |
2014 | Assisting the design of sensor and information fusion systems Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article, Conference Paper |
2014 | Capillary microfluidic chip with integrated pump and valve actuator Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Gessner, Thomas | Poster |
2014 | Capillary microfluidic chip with integrated pump and valve actuator Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Geßner, Thomas | Conference Paper |
2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
2014 | Carbon nanotubes under strain: Ab-initio investigations and compact models Wagner, C.; Kolchuzhin, V.; Markert, E.; Schuster, J.; Mehner, J.; Gessner, T. | Abstract |
2014 | Ceramic wafer bonding for vertically integrated MEMS Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T. | Conference Paper |
2014 | Challenges of current and future advanced interconnect systems for integrated circuits Schulz, S.E.; Ahner, N.; Fischer, T.; Koerner, H.; Oszinda, T.; Schulze, K.; Zimmermann, S. | Book Article |
2014 | Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B. | Conference Paper |
2014 | Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B. | Conference Paper |
2014 | Characterization of fully inkjet-printed microsieves and of patterns for the mechanical reinforcement of fragile membranes Hammerschmidt, J.; Ueberfuhr, P.; Eck, E.-M.; Zeiner, C.; Thalheim, R.; Baumann, R.R. | Conference Paper |
2014 | Characterization of particle beds in percolating thermal underfills based on centrifugation Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C. | Conference Paper |
2014 | Characterization of thermal interface materials (TIM) Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B. | Book Article |
2014 | Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T. | Journal Article |
2014 | Cluster of Excellence MERGE - Integration of Micro- and Nanosystems in Hybrid Structures Kroll, L.; Troeltzsch, J.; Schueller, M. | Book Article |
2014 | A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
2014 | Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M. | Conference Paper |
2014 | Conductivity and microstructure of inkjet-printed silver tracks depending on the digital pattern, sintering process, substrate and ink Weise, D.; Grimm, A.; Weiß, U.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Journal Article, Conference Paper |
2014 | Corrigendum to "Controlling SWCNT assembling density by electrokinetics" [Sensors and Actuators, A: Physical (2013) 201 (36-42)] Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E. | Journal Article |
2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Book Article |
2014 | Design and manufacturing of roll-to-roll printed copper layers for communication applications Zichner, R.; Baumann, R.R. | Conference Paper |
2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Conference Paper |
2014 | Determination of residual stresses by fib-DAC methodology Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Book Article |
2014 | Development and Characterization of a High Voltage Amplifier ASIC for MEMS based Piezoelectric Actuator Active Flow Control Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
2014 | Development and test of synthetic jet actuators based on dual transducer concept Schueller, M.; Wiegel, P.; Lipowski, M.; Schulze, R.; Otto, T.; Gessner, T. | Conference Paper |
2014 | Development of Micro-Valves for Pulsed Jet Actuators Lipowski, M.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
2014 | The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
2014 | Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds Kang, H.; Sowade, E.; Baumann, R.R. | Journal Article |
2014 | Dispersion Preparation for Wafer-Level Liquid Processing of Carbon Nanotube Microsensors Hille, Toni; Blaudeck, T.; Hermann, S.; Schulz, S.E. | Conference Paper |
2014 | Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R. | Conference Paper |
2014 | Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Dry Integration Strategies of rolled-up Nanostructures by a Combination of Laser and Mems Technologies Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
2014 | Efficiency optimization for a frictionless air flow blade fan – design study Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Electronic transport through defective carbon nanotubes Teichert, F.; Zienert, A.; Schuster, J. | Abstract |
2014 | Elektronischer Transport in defektbehafteten quasi-eindimensionalen Systemen am Beispiel von Kohlenstoffnanoröhrchen Teichert, F. | Master Thesis |
2014 | Embedded UHF RFID tag design process for rubber transmission belt using 3D model Kanwar, K.; Mager, T.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Conference Paper |
2014 | Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator Kasdorf, O.; Vollbrecht, J.; Ohms, B.; Hilleringmann, U.; Bock, H.; Kitzerow, H.S. | Journal Article |
2014 | Entwicklung eines experimentellen Aufbaus zur Systemcharakterisierung von MEMS Gyroskopen auf Waferlevel Weidlich, S.; Forke, R.; Konietzka, S.; Hiller, K.; Gessner, T. | Conference Paper |
2014 | Entwicklung eines intelligenten, textilen Halbzeugs Schaufuss, J.; Decker, R.; Walther, M.; Tsapkolenko, A.; Dienel, M.; Schueller, M.; Kroll, L.; Gessner, T.; Mehner, J. | Conference Paper |
2014 | EUCEMAN - the European Center for MicroNanoReliability Research in Europe Michel, B.; Winkler, T. | Book Article |
2014 | Experimental and numerical investigation of PCB vibration during drop impact Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M. | Book Article |
2014 | Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F. | Conference Paper |
2014 | Experimental testing of silicon die strength depending on the processing history Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
2014 | Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
2014 | Fiber-reinforced Composite Structures with Embedded Piezoelectric Sensors Schulze, R.; Streit, P.; Fischer, T.; Tsapkolenko, A.; Heinrich, M.; Sborikas, M.; Kroll, L.; Gessner, T.; Wegener, M. | Conference Paper |
2014 | Flash lamp annealing of spray coated films containing oxidized or hydrogen terminated silicon nanoparticles Seidel, F.; Toader, I.G.; Koth, S.; Fritzsche, R.; Schäfer, P.; Bülz, D.; Büchter, B.; Gordan, O.D; Freitag, H.; Jakob, A.; Buschbeck, R.; Hietschold, M.; Lang, H.; Mehring, M.; Baumann, R.R.; Zahn, D.R.T. | Journal Article |
2014 | A flexible measurement system for the characterization of thermoelectric materials Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
2014 | Fracture toughness measurements for microelectronic packages Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B. | Book Article |
2014 | Fraunhofer cluster 3D integration Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
2014 | Fraunhofer cluster 3D integration - key to a holistic technology and service approach Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
2014 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2013 | Annual Report |
2014 | Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
2014 | Functional nano patterns realized by aligned nano imprint lithography Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T. | Conference Paper |
2014 | German association of nanotechnology: Objectives and benefits Nonninger, R.; Michel, B. | Book Article |
2014 | A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems Braeuer, J.; Gessner, T. | Journal Article |
2014 | High precision 3D surface reconstruction by combining shape-from-shading and light sectioning techniques Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C. | Book Article |
2014 | High precision vibratory MEMS gyroscope Billep, D.; Hiller, K.; Hahn, S.; Forke, R.; Köhler, D.; Stöckel, C.; Konietzka, S.; Heinz, S. | Book Article |
2014 | High Voltage Amplifier ASIC for High Capacitive Load MEMS based Piezoelectric Actuators Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
2014 | The history of micro mirror fabrication at the center of microtechnologies Kaufmann, C. | Book Article |
2014 | Hysteresis-free carbon nanotube field-effect transistors without passivation Tittmann, J.; Hermann, S.; Schulz, S.E.; Pacheco-Sanchez, A.; Claus, M.; Schröter, M. | Conference Paper |
2014 | Implantable MEMS sensors and medical MEMS packaging issues for future implants Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T. | Conference Paper, Journal Article |
2014 | Improvement of copper bonding by analyzing the mechanical properties of the bond interface Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Book Article |
2014 | Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B. | Book Article |
2014 | In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S. | Conference Paper |
2014 | In-situ characterization of microelectronic systems using 2D digital image correlation and 3D digital volume correlation of X-ray microtomography images Seiler, B.; Haase, S.; Noack, E.; Erb, R.; Scheiter, L. | Book Article |
2014 | INCOBAT – Improving HV battery efficiency by E/E control systems Armengaud, E.; Groppo, R.; Haase, S.; Hofer, G.; Lanciotti, C.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
2014 | Influence of porosity and methyl doping inside silica network Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
2014 | Inkjet printed WLAN antenna for an application in smartphones Zichner, R.; Sowade, E.; Baumann, R.R. | Journal Article |
2014 | Inkjet printed WLAN antenna for an application in smartphones Zichner, R.; Sowade, E.; Baumann, R.R. | Conference Paper |
2014 | Integrateable light sources based on semiconductor nanocrystals Böttger, P.; Meyer, M.; Martin, J.; Otto, T.; Gessner, T.; Seidlitz, H.; Kroll, L. | Conference Paper |
2014 | Integrated investigation approach for determining mechanical properties of poly-silicon membranes Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S. | Journal Article, Conference Paper |
2014 | Integration concept for fluidic actuators in hybrid structures Schüller, M.; Walther, M.; Lipowski, M.; Weigel, P.; Schulze, R.; Nestler, J.; Otto, T.; Geßner, T.; Kroll, L. | Conference Paper |
2014 | Integration von MOS-Transistoren als Wandler für mechanische Spannungen Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Abstract |
2014 | Integration von ZnO Nanopartikel Dünnschicht-Transistoren durch Sprühbeschichtung Vidor, F.F.; Hilleringmann, U. | Conference Paper |
2014 | Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
2014 | Interaction between semiconducting carbon nanotubes and metals: Sensing, stability and electronic properties Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
2014 | Interface characterisation at electronic packages by means af nanoscale deformation analysis Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B. | Book Article |
2014 | Interface Resistance of Carbon-Nanotube-Based Interconnects Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T. | Conference Paper |
2014 | Introducing aerosol-jet printing as semiconductor and MEMS fabrication process Roscher, F.; Seifert, T.; Wiemer, M. | Book Article |
2014 | Investigation of low temperature wafer bonding using plasma activation Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T. | Book Article |
2014 | Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T. | Book Article |
2014 | Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments Johansson, J.; Belov, I.; Johnson, E.; Dudek, R.; Leisner, P. | Journal Article |
2014 | Kombination von Laser- und MEMS Technologieprozessen fuer Integrationsstrategien von rolled-up Nano-Architekturen Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
2014 | Laser based dry Integration of rolled-up Nanomembranes into Polymer Substrates Enderlein, T.; Helke, C.; Harazim, S.; Geidel, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
2014 | Laser based integration method of rolled-up nano membranes in polymer based LoC systems Enderlein, T.; Helke, C.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
2014 | Laser micromachining of brittle and fragile functional materials Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
2014 | Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Localization length of integrated multi-walled carbon nanotubes Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
2014 | Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics Vidor, F.F.; Wirth, G.I.; Hilleringmann, U. | Journal Article |
2014 | Magnetite nanoparticles: Synthesis, thin film properties and inkjet printing of magnetic cores for inductor applications Marjanovic, N.; Chiolerio, A.; Kus, M.; Ozel, F.; Tilki, S.; Ivanović, N.; Rakočević, Z.; Andrić, V.; Barudžija, T.; Baumann, R.R. | Journal Article |
2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Mathematical modeling and simulations for machine directional register in hybrid roll-to-roll printing systems Kang, H.; Baumann, R.R. | Journal Article |
2014 | Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S. | Conference Paper |
2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
2014 | Metallic carbon nanotubes with metal contacts: electronic structure and transport Zienert, A.; Schuster, J.; Gessner, T. | Journal Article |
2014 | Microfluidic chips for cells capture using 3-D hydrodynamic structure array Chen, J.; Chen, D.; Yuan, T.; Chen, X.; Zhu, J.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T. | Journal Article |
2014 | Miniaturized frictionless fan concept for thermal management of electronics Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B. | Book Article |
2014 | Modeling and characterization of CP-PLL phase noise in presence of dead zone Hangmann, C.; Wüllner, I.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
2014 | Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T. | Journal Article, Conference Paper |
2014 | Modeling of SiC power modules with double sided cooling Brinkfeldt, K.; Neumaier, K.; Mann, A.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Edwards, M.; Andersson, D. | Conference Paper |
2014 | Modellierung des optimalen Arbeitsbereiches für Inertialsensoren auf Basis von Kohlenstoffnanoröhrchen Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Book Article |
2014 | Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding Masser, R.; Braeuer, J.; Gessner, T. | Journal Article |
2014 | Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
2014 | Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field Almeida, M.J.; Ueberschär, O.; Matthes, P.; Ecke, R.; Mueller, M.; Exner, H.; Schulze, K. | Conference Paper |
2014 | Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H. | Conference Paper |
2014 | Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C. | Journal Article |
2014 | Multifunctional nanomembranes as sensitive optical sensors in compact MEMS devices Harazim, S.; Bolanos, V.; Helke, C.; Enderlein, T.; Otto, T.; Schmidt, O.G. | Abstract |
2014 | Nanoporous gold as a versatile bonding intermediate Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M. | Conference Paper |
2014 | A new generation of MEMS middle-infrared spectrometers Otto, T.; Saupe, R.; Stock, V.; Seider, T.; Gessner, T. | Conference Paper |
2014 | New methodology for lifetime prediction of smart lightweight structures Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B. | Book Article |
2014 | A novel wearable electronic nose for healthcare based on flexible printed chemical sensor array Lorwongtragool, P.; Sowade, E.; Watthanawisuth, N.; Baumann, R.R.; Kerdcharoen, T. | Journal Article |
2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
2014 | On the crack and delamination risk optimization towards 3D-IC-integration Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B. | Book Article |
2014 | Optimization of primary printed batteries based on Zn/MnO2 Madej, E.; Espig, M.; Baumann, R.R.; Schuhmann, W.; Mantia, F. la | Journal Article |
2014 | Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS study Tofighi, G.; Moebius, M.; Haidu, F.; Gordan, O.D.; Martin, J.; Spudat, C.; Otto, T.; Gessner, T.; Zahn, D.R.T. | Conference Paper |
2014 | Organic lateral trench devices fabricated by trench technology Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G. | Abstract |
2014 | Overview of wafer bonding and characterization of the bonded interface Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T. | Book Article |
2014 | Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel Schacht, R.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Phase change based thermal buffering of transient loads for power converter Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R. | Conference Paper |
2014 | Piezoelectric P(VDF-TrFE) transducers assembled with micro injection molded polymers Schulze, R.; Heinrich, M.; Nossol, P.; Forke, R.; Sborikas, M.; Tsapkolenko, A.; Billep, D.; Wegener, M.; Kroll, L.; Gessner, T. | Journal Article |
2014 | Preparing reliability testing for increased demands of automotive electronics Kreyßig, K.; Otto, A. | Book Article |
2014 | Printed antennas on flexible substrates for highly integrated smart systems Zichner, R.; Baumann, R.R. | Book Article |
2014 | Printed elliptically polarized transponder antenna for UHF-RFID metal item tagging Zichner, R.; Baumann, R.R. | Conference Paper |
2014 | Pulsed DC magnetron sputtered piezoelectric thin film aluminum nitride - Technology and piezoelectric properties Stoeckel, C.; Kaufmann, C.; Hahn, R.; Schulze, R.; Billep, D.; Gessner, T. | Journal Article |
2014 | Pulsed Jet Actuator development for the integration in composite structures Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
2014 | Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
2014 | Raman spectroscopy study of the interaction of gold nanoparticles with carbon-nanotubefield-effect transistors Kalbacova, Jana; Rodriguez, Raul D.; Blaudeck, T.; Hermann, S.; Sheremet, E.; Adner, David; Lang, Heinrich; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
2014 | Rapid, inexpensive and accurate fracture-mechanical interface characterisation Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H. | Book Article |
2014 | Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
2014 | Reliability investigations for high temperature interconnects Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
2014 | Reliability of new SiC BJT power modules for fully electric vehicles Otto, A.; Kaulfersch, E.; Brinkfeldt, K.; Neumaier, K.; Zschieschang, O.; Andersson, D.; Rzepka, S. | Conference Paper |
2014 | Replacing TCO electrodes in dye sensitized solar cells by metal grids Hilleringmann, U.; Kleine, A. | Conference Paper |
2014 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B. | Conference Paper |
2014 | Resolution and speed improvements of mid-infrared Fabry-Perot microspectrometers for the analysis of hydrocarbon gases Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
2014 | Roll-to-roll infrared sintering of gravure printed silver patterns in applications of back-injection-molded functional lightweight structures Hartwig, M.; Ueberfuhr, P.; Mischke, A.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kurth, S.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
2014 | A satellite multiple-beam antenna for high-rate data relays Greda, L.A.; Winterstein, A.; Dreher, A.; Figur, S.A.; Schoenlinner, B.; Ziegler, V.; Haubold, M.; Brueck, M.W. | Journal Article |
2014 | Self-Assembly of Ordered Colloidal Nanoparticle Films in Few-Micron Wide Laser-Desorbed Lines of Octadecylsiloxane Monolayers on Silicon Oxide Surfaces Belgardt, Christian; Blaudeck, T.; Borczyskowsi, Christian von; Graaf, Harald | Journal Article |
2014 | Semiconducing nanoparticles for field effect transistor integration on foils Hilleringmann, U.; Wolff, K.; Vidor, F.F.; Assion, F. | Book Article |
2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Conference Paper |
2014 | Silizium-Halbleitertechnologie. Grundlagen mikroelektronischer Integrationstechnik. 6., korr. und verb. Aufl. Hilleringmann, U. | Book |
2014 | SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter | Conference Paper |
2014 | Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
2014 | Simulations of 3rd order voltage switched CP-PLL using a fast event switching macromodeling Ali, E.; Rahajandraibe, W.; Haddad, F.; Hangmann, C.; Hedayat, C. | Conference Paper |
2014 | Simultaneous damage detection and deflection measurement of morphing wing structures by fiber optic sensing system Djinovic, Z.; Scheerer, M.; Tomic, M.; Stojkovic, M.; Schueller, M. | Conference Paper |
2014 | Smart monitoring systems for a green future Saupe, R.; Stock, V.; Otto, T.; Kurth, S.; Hiller, K.; Meinig, M.; Neumann, N.; Gessner, T. | Conference Paper |
2014 | Smart system integration technologies for lightweight structures Schüller, M.; Walther, M.; Tröltzsch, J.; Otto, T.; Mehner, J.; Geßner, T.; Kroll, L. | Conference Paper |
2014 | Smart systems integration for micro- and nanotechnologies : Michel, B. (Hrsg.); Gessner, T. | Book |
2014 | Smart universal power antenna for optimized wireless energy transfer - SUPA Büker, M.J.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Book Article |
2014 | Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C. | Conference Paper |
2014 | Solid Liquid Inter-Diffusion Bonding at Low Temperature Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
2014 | Stability analysis of a charge pump phase-locked loop using autonomous difference equations Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Journal Article |
2014 | Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch? Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A. | Conference Paper |
2014 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A. | Conference Paper |
2014 | Strategies for responding to the reliability challenges of future smart systems Rzepka, S.; Andersson, D.; Vandevelde, B. | Conference Paper |
2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Conference Paper, Journal Article |
2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Conference Paper |
2014 | Stress chip measurements during temperature cycling test Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S. | Book Article |
2014 | Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Journal Article, Conference Paper |
2014 | Stress measurements at through silicon vias Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
2014 | Strong localization in defective carbon nanotubes: A recursive Green's function study Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
2014 | Structural health monitoring with quantum dots Moebius, M.; Martin, J.; Poppitz, E.A.; Ueberfuhr, P.; Tofighi, G.; Gordan, O.D.; Dzhagan, V.M.; Lang, H.; Baumann, R.R.; Zahn, D.R.T.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
2014 | Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T. | Conference Paper |
2014 | Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A. | Journal Article |
2014 | Tailored printed primary battery system for powering a diagnostic device Willert, A.; Killard, A.J.; Baumann, R.R. | Journal Article |
2014 | Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T. | Conference Paper |
2014 | Technology approaches for tuneable IR Fabry-Perot-Filters applied in gas sensing microspectrometers Hiller, K.; Meinig, M.; Kurth, S.; Seifert, M.; Helke, C.; Neumann, N.; Ebermann, M. | Book Article |
2014 | Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A. | Journal Article |
2014 | Thermal characterization of highly conductive die attach materials Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B. | Conference Paper |
2014 | Thermo-mechanical behavior and reliability issues for high temperature interconnections Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S. | Conference Paper |
2014 | Thermocompression bonding of semiconductor wafers Frömel, J.; Baum, M.; Wiemer, M. | Book Article |
2014 | Tip-Enhanced Raman Spectroscopy for the Characterization of Carbon Nanotubes Sheremet, E.; Rodriguez, Raul D.; Krayev, A.; Kalbacova, Jana; Hermann, S.; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
2014 | Untersuchung des Risswachstums in 3D - Verformungsmessung mittels Röntgenmikrotomographie Zeismann, F.; Bode, B.; Motoyashiki-Besel, Y.; Brueckner-Foit, A.; Tomizato, F.; Kobayashi, M.; Toda, H.; Uesugi, K.; Takeuchi, A.; Suzuki, Y.; Haase, S.; Erb, R.; Seiler, B.; Dost, M. | Conference Paper |
2014 | Wafer bonding technologies for 3D integration Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T. | Conference Paper |
2014 | Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M. | Journal Article |
2014 | Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T. | Conference Paper |
2014 | Welcome to Smart Systems Integration 2014 Gessner, T. | Conference Paper |
2014 | ZnO-Feldeffekttransistoren für flexible elektronische Schaltungen Hilleringmann, U.; Vidor, F.F. | Conference Paper |