| | |
|---|
| 2019 | Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving
Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S. | Conference Paper |
| 2019 | Compliance-current-modulated resistive switching with multi-level resistance states in single-crystalline LiNbO3 thin film
Pan, X.; Shuai, Y.; Wu, C.; Luo, W.; Sun, X.; Zeng, H.; Guo, H.; Yuan, Y.; Zhou, S.; Böttger, R.; Cheng, H.; Zhang, J.; Zhang, W.; Schmidt, H. | Journal Article |
| 2019 | Computationally efficient simulation method for conductivity modeling of 2D-based conductors
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
| 2019 | Doctor blade system for the deposition of thin semiconducting films
Petrov, D.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
| 2019 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2018
| Annual Report |
| 2019 | Improved organic thin-film transistor performance by dielectric layer patterning
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Vollbrecht, J.; Kitzerow, H.; Paradies, J.; Hilleringmann, U. | Conference Paper |
| 2019 | Inorganic p-channel thin-film transistors using CuO nanoparticles
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2019 | Iron(III) β-diketonates: CVD precursors for iron oxide film formation
Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2019 | Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2019 | Measurements on the fly: Introducing mobile micro-sensors for biotechnological applications
Lauterbach, T.; Lüke, T.; Büker, M.-J.; Hedayat, C.; Gernandt, T.; Moll, R.; Grösel, M.; Lenk, S.; Seidel, F.; Brunner, D.; Bley, T.; Walther, T.; Lenk, F. | Journal Article |
| 2019 | Mechanical deformation on nanoparticle-based thin-film transistors
Vidor, F.F.; Meyers, T.; Reker, J.; Mueller, K.; Wirth, G.I.; Hilleringmann, U. | Conference Paper |
| 2019 | Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J. | Journal Article |
| 2019 | Microwave Radiation Detection with an Ultrathin Free-Standing Superconducting Niobium Nanohelix
Loesch, S.; Alfonsov, A.; Dobrovolskiy, O.V.; Keil, R.; Engemaier, V.; Baunack, S.; Li, G.; Schmidt, O.G.; Buerger, D. | Journal Article |
| 2019 | Nanoparticles and Organic Semiconductors for Flexible Electronics
Hilleringmann, U.; Reker, J.; Meyers, T.; Vidor, F.F.; Bezuidenhout, P.H.; Joubert, T.-H. | Conference Paper |
| 2019 | Oxygen detection with zinc oxide nanoparticle structures
Schwabe, T.; Balke, A.; Bezuidenhout, P.H.; Reker, J.; Meyers, T.; Joubert, T.-H.; Hilleringmann, U. | Conference Paper |
| 2019 | Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T. | Journal Article, Conference Paper |
| 2019 | Radially resolved electronic structure and charge carrier transport in silicon nanowires
Fuchs, F.; Gemming, S.; Schuster, J. | Journal Article |
| 2019 | Self-aligned organic thin-film transistors for flexible electronics
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2019 | Strain and screening: Optical properties of a small-diameter carbon nanotube from first principles
Wagner, C.; Schuster, J.; Schleife, A. | Journal Article |
| 2019 | Surface effects and photoinduced relaxation processes in nanocomposites based on semiconductor quantum dots CdSe/ZnS and organic dye molecules
Zenkevich, E.I.; Stupak, A.P.; Kowerko, D.; Blaudeck, T.; Borczyskowski, C. von | Conference Paper |
| 2018 | "3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2018 | 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M. | Conference Paper |
| 2018 | Active flow control in wind turbines - integration technologies and assessment of economic effects
Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar | Conference Paper |
| 2018 | AlN film based piezoelectric large-aperture MEMS scanning micromirror integrated with angle sensors
Lei, H.; Wen, Q.; Yu, F.; Li, D.; Shang, Z.; Huang, J.; Wen, Z. | Journal Article |
| 2018 | Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T. | Journal Article |
| 2018 | Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van | Conference Paper |
| 2018 | Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Journal Article |
| 2018 | Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E. | Conference Paper |
| 2018 | Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, G.; Brämer, B.; Rzepka, S. | Conference Paper |
| 2018 | β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton | Abstract |
| 2018 | Challenges in transferring quantum dot sensitized solar cells on technical textiles
Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T. | Conference Paper |
| 2018 | Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T. | Journal Article |
| 2018 | Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W. | Journal Article |
| 2018 | Deposition methods for C8-BTBT in flexible TFTs
Meyers, T.; Reker, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development
Correia, V.; Mitra, K.Y.; Castro, H.; Rocha, J.G.; Sowade, E.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2018 | Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T. | Journal Article |
| 2018 | Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R. | Conference Paper |
| 2018 | Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung
Schacht, R.; Rzepka, S. | Conference Paper |
| 2018 | Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren
Noerdemann, A. | Bachelor Thesis |
| 2018 | Electroanalysis moves towards paper-based printed electronics
Cinti, S.; Colozza, N.; Cacciotti, I.; Moscone, D.; Polomoshnov, M.; Sowade, E.; Baumann, R.R.; Arduini, F. | Journal Article |
| 2018 | Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas | Conference Paper |
| 2018 | Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2018 | Electronic transport through defective semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2018 | Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S. | Conference Paper |
| 2018 | Elektronentransport in Graphen-Nanobändern mit Kantenrauheit
Rodemund, T.S. | Bachelor Thesis |
| 2018 | Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
| 2018 | Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S. | Conference Paper |
| 2018 | Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S. | Conference Paper |
| 2018 | Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S. | Conference Paper |
| 2018 | Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes
Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R. | Journal Article |
| 2018 | Feasible device architectures for ultrascaled CNTFETs
Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M. | Journal Article |
| 2018 | Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching
Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2018 | FR4-Based Electromagnetic Scanning Micromirror Integrated with Angle Sensor
Lei, H.; Wen, Q.; Yu, F.; Zhou, Y.; Wen, Z. | Journal Article |
| 2018 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017
| Annual Report |
| 2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Conference Paper |
| 2018 | Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology
Geneiß, V.; Lüke, T.; Hedayat, C.; Wolf, M.; Janek, F.; Meißner, T.; Barth, M.; Eberhardt, W.; Zimmermann, A.; Otto, T. | Conference Paper |
| 2018 | Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Journal Article |
| 2018 | An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Indirect X-ray detectors based on inkjet-printed photodetectors with a screen-printed scintillator layer
Oliveira, J.; Correia, V.; Sowade, E.; Etxebarria, I.; Rodriguez, R.D.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2018 | Influence of defect-induced deformations on electron transport in carbon nanotubes
Teichert, F.; Wagner, C.; Croy, A.; Schuster, J. | Journal Article |
| 2018 | Influence of the electrode material on the performance of BTBT-based thin-film transistors
Meyers, T.; Reker, J.; Petrov, D.; Hilleringmann, U.; Vidor, F.F. | Conference Paper |
| 2018 | Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Integration of covalent and non-covalent functionalized SWCNTs in FETs
Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H. | Abstract |
| 2018 | Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications
Otto, A.; Rzepka, S.; Wunderle, B. | Conference Paper |
| 2018 | Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing
Wolf, M.; Janek, F.; Meissner, T.; Wigger, B.; Barth, M.; Guenter, T.; Eberhardt, W.; Zimmermann, A.; Geneiss, V.; Lueke, T.; Hedayat, C.; Otto, T. | Conference Paper |
| 2018 | Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Journal Article |
| 2018 | Klebeelement und Ventilanordnung
Morschhauser, Andreas; Nestler, Jörg; Otto, Thomas; Stiehl, Cornelia | Patent |
| 2018 | Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung
Otto, T. | Book Article |
| 2018 | Liquid crystalline dithienothiophene derivatives for organic electronics
Vollbrecht, J.; Oechsle, P.; Stepen, A.; Hoffmann, F.; Paradies, J.; Meyers, T.; Hilleringmann, U.; Schmidtke, J.; Kitzerow, H. | Journal Article |
| 2018 | Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B. | Conference Paper |
| 2018 | Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B. | Conference Paper |
| 2018 | Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G. | Abstract |
| 2018 | Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S. | Conference Paper |
| 2018 | A micro-electromechanical systems based vibration energy harvester with aluminum nitride piezoelectric thin film deposited by pulsed direct-current magnetron sputtering
He, X.; Wen, Q.; Lu, Z.; Shang, Z.; Wen, Z. | Journal Article |
| 2018 | Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Wecker, J. | Conference Paper |
| 2018 | Miniaturized NIR Spectrometer Based on Novel MOEMS Scanning Tilted Grating
Huang, J.; Wen, Q.; Nie, Q.; Chang, F.; Zhou, Y.; Wen, Z. | Journal Article |
| 2018 | Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
| 2018 | Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X. | Dissertation |
| 2018 | Nanostructures for smart systems
Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T. | Conference Paper |
| 2018 | A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A. | Conference Paper |
| 2018 | On the Experimental Characterization of Morphing Structures
Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M. | Book Article |
| 2018 | On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements
Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P. | Conference Paper |
| 2018 | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S. | Conference Paper |
| 2018 | Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
| 2018 | Performance analysis of CuO nanoparticle-based thin-film transistors
Reker, J.; Meyers, T.; Petrov, D.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D. | Conference Paper |
| 2018 | Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2018 | Portable Sensor System for UV-Irradiation Measurements
Petrov, D.; Narayan, R.S.; Hilleringmann, U. | Conference Paper |
| 2018 | Printed batteries and conductive patterns in technical textiles
Willert, A.; Meuser, C.; Baumann, R.R. | Journal Article, Conference Paper |
| 2018 | Printing techniques for batteries
Willert, A.; Tran-Le, A.-T.; Mitra, K.Y.; Clair, M.; Costa, C.M.; Lanceros-Méndez, S.; Baumann, R.R. | Book Article |
| 2018 | Process development of large area R2R printing and sintering of conductive patterns by inkjet and infra-red technologies tailored for printed electronics
Mitra, K.Y.; Kapadia, S.; Hartwig, M.; Sowade, E.; Xu, Z.; Baumann, R.R.; Zichner, R. | Journal Article |
| 2018 | Quantum transport in defective carbon nanotubes at mesoscopic length scales
Teichert, F. | Dissertation |
| 2018 | Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T. | Conference Paper |
| 2018 | Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Journal Article |
| 2018 | Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O. | Journal Article |
| 2018 | Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K. | Journal Article, Conference Paper |
| 2018 | RFID units for a product based control of industrial production systems
Schmidt, M.; Metz, G.; Hedayat, C.; Otto, T.; Petrov, D. | Conference Paper |
| 2018 | The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T. | Journal Article, Conference Paper |
| 2018 | SAMPL - Secure Additive Manufacturing Platform
Gratias, A.; Böttcher, F.; Holland, M.; Schueller, M. | Conference Paper |
| 2018 | Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems
Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S. | Conference Paper |
| 2018 | Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
| 2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
| 2018 | Stochastic analyzes and Monte-Carlo simulations of nonlinear and non-ideal mixed-signal phase-locked loops
Schmidt, M.; Hangmann, C.; Hedayat, C.; Hilleringmann, U.; Otto, T. | Conference Paper |
| 2018 | Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen
Rothe, T.
: Gemming, S.; Schuster, J.; Lorenz, E. | Bachelor Thesis |
| 2018 | Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S. | Conference Paper |
| 2018 | Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt | Book Article |
| 2018 | Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication
Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Conference Paper |
| 2018 | Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors
Becker, T.E.; Vidor, F.F.; Wirth, G.I.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
| 2018 | Transient electro-thermal coupled system simulation
Schacht, R.; Rzepka, S. | Conference Paper |
| 2018 | Tuning of diameter and electronic type of CCVD grown SWCNTs
Jafarpour, S.M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2018 | Vertically aligned carbon nanotube films as absorption layers for IR applications
Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha | Conference Paper |
| 2018 | Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T. | Conference Paper |
| 2018 | Welcome to the 12th Smart Systems Integration
Otto, T. | Conference Paper |
| 2018 | Work function and conductivity of inkjet-printed silver layers: Effect of inks and post-treatments
Mitra, D.; Mitra, K.Y.; Dzhagan, V.; Pillai, N.; Zahn, R.T.; Baumann, R.R. | Journal Article |
| 2017 | 3D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T. | Journal Article, Conference Paper |
| 2017 | 3D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael | Conference Paper |
| 2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2017 | 3D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias
Hofmann, L. | Dissertation |
| 2017 | Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes
Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J. | Journal Article |
| 2017 | Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Conference Paper |
| 2017 | Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny | Conference Paper |
| 2017 | Ätzung von Nanostrukturen
Hilleringmann, U. | Book Article |
| 2017 | Biomedical diagnostics enabled by integrated organic and printed electronics
Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J. | Journal Article |
| 2017 | Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W. | Conference Paper |
| 2017 | Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates
Mitra, D.; Baumann, R.R. | Conference Paper |
| 2017 | Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L. | Conference Paper |
| 2017 | Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Journal Article, Conference Paper |
| 2017 | Complementary field-effect transistors for flexible electronics
Hilleringmann, U.; Vidor, F.F.; Meyers, T. | Conference Paper |
| 2017 | A concept for an ice detection system on overhead power lines, theory and practical results
Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S. | Conference Paper |
| 2017 | Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates
Mitra, D.; Baumann, R.R. | Conference Paper |
| 2017 | Control system design for a morphing wing trailing edge
Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R. | Conference Paper |
| 2017 | Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment
Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R. | Journal Article |
| 2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Conference Paper |
| 2017 | Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2017 | Design of a 2D MEMS micromirror with indirect static actuation
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Conference Paper |
| 2017 | Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T. | Conference Paper |
| 2017 | Development history and current achievements of printed primary batteries
Willert, A.; Baumann, R.R. | Conference Paper |
| 2017 | Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B. | Presentation |
| 2017 | Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L. | Conference Paper |
| 2017 | Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S. | Conference Paper |
| 2017 | Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2017 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Conference Paper |
| 2017 | Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S. | Conference Paper |
| 2017 | Elastic and piezoresistive properties of nickel carbides from first principles
Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S. | Journal Article |
| 2017 | An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F. | Journal Article |
| 2017 | Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2017 | Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T. | Journal Article |
| 2017 | Emerging applications: PICs as a platform for lab on chip devices
Geidel, S.; Otto, T. | Journal Article |
| 2017 | Erweiterung konventioneller Bauelemente durch Nanotechniken
Hilleringmann, U.; Horstmann, J.T. | Book Article |
| 2017 | Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan | Abstract |
| 2017 | Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S. | Journal Article |
| 2017 | FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R. | Conference Paper |
| 2017 | Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K. | Conference Paper |
| 2017 | Fluidic actuators for separation control at the engine/wing junction
Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M. | Journal Article, Conference Paper |
| 2017 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016
| Annual Report |
| 2017 | Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications
Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R. | Journal Article |
| 2017 | Go beyond 4.0 - towards digital fabrication based on printing
Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T. | Conference Paper |
| 2017 | Halbleitende Nanopartikel für Feldeffekttransistoren
Hilleringmann, U. | Book Article |
| 2017 | HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | High-Q whispering gallery microdisk resonators based on silicon oxynitride
Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A. | Journal Article |
| 2017 | Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten
Hangmann, C. | Dissertation |
| 2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
| 2017 | Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Conference Paper |
| 2017 | Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2017 | Increase of functional density of hybrid structures by integration of micro and nano systems
Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L. | Conference Paper |
| 2017 | Inductive temperature measurement for fast and optimized adhesive curing
Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A. | Conference Paper |
| 2017 | Influence of processing atmosphere for QD-LEDs
Langenickel, J.; Weiß, A.; Otto, T. | Conference Paper |
| 2017 | Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application
Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Journal Article |
| 2017 | Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates
Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G. | Conference Paper |
| 2017 | Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M. | Conference Paper |
| 2017 | Integration of ZnO nanoparticle transistors on freestanding flexible substrates
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
| 2017 | Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2017 | Investigation on inkjet printing for electromagnetic applications
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Abstract |
| 2017 | Investigation on inkjet printing for electromagnetic compatibility application
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Conference Paper |
| 2017 | Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T. | Conference Paper |
| 2017 | Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
| 2017 | Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities
Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M. | Journal Article, Conference Paper |
| 2017 | Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Conference Paper |
| 2017 | Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester
He, X.; Wen, Q.; Sun, Y.; Wen, Z. | Journal Article |
| 2017 | Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E. | Journal Article |
| 2017 | Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U. | Journal Article |
| 2017 | Mass production of magnesium silicide as a TEG material
Schoenhoff, M.; Hilleringmann, U.; Boor, J. de | Conference Paper |
| 2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Conference Paper |
| 2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fügmann, U.; Illing-Günther, H.; Nestler, D.; Hübler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Journal Article |
| 2017 | Mechanical, electronic and optical properties of strained carbon nanotubes
Wagner, C.F. | Dissertation |
| 2017 | MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung
Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T. | Conference Paper |
| 2017 | Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate
Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T. | Journal Article |
| 2017 | Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A. | Conference Paper |
| 2017 | Multilayer micromechanics process with thick functional layers (EPyC40)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E. | Journal Article |
| 2017 | Nanophotonic biosensor for space exploration (PBSA instrument)
Pantoja, S.; Parro, V.; Nestler, J.; Geidel, S.; Martins, R.; Cuesta, F.; Elvira, J.G.; Sousa, A. | Conference Paper |
| 2017 | Novel concept of integrated micro actuation of membranes in liquid environments
Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T. | Conference Paper |
| 2017 | A novel gyroscopic actuation concept for 2D MEMS micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Organic thin-film transistors for AMOLED applications
Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U. | Conference Paper |
| 2017 | Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol
Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P. | Journal Article |
| 2017 | Printing technologies for the manufacturing of passive microwave components: Antennas
Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R. | Journal Article |
| 2017 | Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T. | Conference Paper |
| 2017 | Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk | Patent |
| 2017 | Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Conference Paper |
| 2017 | Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N. | Conference Paper |
| 2017 | Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Journal Article, Conference Paper |
| 2017 | Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A. | Conference Paper |
| 2017 | Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S. | Conference Paper |
| 2017 | Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2017 | Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D. | Conference Paper |
| 2017 | Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E. | Abstract |
| 2017 | Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T. | Journal Article, Conference Paper |
| 2017 | Sens-o-Spheres - A concept for location independent acquisition of process measurement signals
Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P. | Conference Paper |
| 2017 | Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael | Journal Article, Conference Paper |
| 2017 | Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T. | Conference Paper |
| 2017 | A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B. | Conference Paper |
| 2017 | Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E. | Conference Paper |
| 2017 | Welcome to the 11th Smart Systems Integration
Otto, T. | Conference Paper |
| 2016 | 3D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S. | Conference Paper |
| 2016 | Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K. | Conference Paper |
| 2016 | Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2016 | Advances in Deposition of Main-Group Metal Oxides and Rare-Earth Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | Advances in Deposition of Metals from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | Advances in Deposition of Transition-Metal Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates
Moya, A.; Sowade, E.; del Campo, F.J.; Mitra, K.Y.; Ramon, E.; Villa, R.; Baumann, R.R.; Gabriel, G. | Journal Article |
| 2016 | All-inkjet-printed low-pass filters with adjustable cutoff frequency consisting of resistors, inductors and transistors for sensor applications
Castro, H.F.; Correia, V.; Sowade, E.; Mitra, K.Y.; Rocha, J.G.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2016 | All-inkjet-printed thin-film transistors: Manufacturing process reliability by root cause analysis
Sowade, E.; Ramon, E.; Mitra, K.Y.; Martínez-Domingo, C.; Pedró, M.; Pallarès, J.; Loffredo, F.; Villani, F.; Gomes, H.L.; Terés, L.; Baumann, R.R. | Journal Article |
| 2016 | Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K. | Conference Paper |
| 2016 | Piezoelektrische Aluminiumnitrid-Dünnschichten für mikroelektromechanische Systeme
Stöckel, C. | Dissertation |
| 2016 | Application of microcontrollers in solar-powered model gliders with sensor systems
Petrov, D.; Hilleringmann, U. | Conference Paper |
| 2016 | Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M. | Conference Paper |
| 2016 | Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S. | Conference Paper |
| 2016 | Bis(β-diketonato)-and allyl-(β-diketonato)-palladium(II) complexes: Synthesis, characterization and MOCVD application
Assim, K.; Melzer, M.; Korb, M.; Rüffer, T.; Jakob, A.; Noll, J.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Cavity-enhanced mm-wave spectrometer with integrated SiGe front-end for oxygen concentration measurement
Wecker, J.; Kurth, S.; Mangalgiri, G.; Otto, T.; Gessner, T.; Gaitzsch, M.; Bauch, A.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
| 2016 | Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M. | Conference Paper |
| 2016 | Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank | Conference Paper |
| 2016 | CF3Br plasma cryo etching of low-k porous dielectric
Clemente, I.; Koehler, N.; Miakonkikh, A.; Zimmermann, S.; Schulz, S.E.; Rudenko, K. | Journal Article, Conference Paper |
| 2016 | Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2016 | Chemical vapor deposition of ruthenium-based layers by a single-source approach
Jeschke, J.; Möckel, S.; Korb, M.; Rüffer, T.; Assim, K.; Melzer, M.; Herwig, G.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | CNTFET-based RF electronics - State-of-the-art and future prospects
Schröter, M.; Claus, M.; Hermann, S.; Tittman-Otto, J.; Haferlach, M.; Mothes, S.; Schulz, S. | Conference Paper |
| 2016 | Comparison of atomistic quantum transport and numerical device simulation for carbon nanotube field-effect transistors
Fuchs, F.; Zienert, A.; Mothes, S.; Claus, M.; Gemming, S.; Schuster, J. | Conference Paper |
| 2016 | Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs
Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael | Abstract |
| 2016 | COSIVU - Compact, smart and reliable drive unit for fully electric vehicles
Andersson, D.R.; Brinkfeldt, K.; Nord, S.; Ottosson, J.; Lampic, G.; Gotovac, G.; Zschieschang, O.; Baumgartel, H.; Brusius, M.; Kaulfersch, E.; Hilpert, F.; Otto, A.; Frankeser, S. | Conference Paper |
| 2016 | Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | Design and fabrication of a SiC-based power module with double-sided cooling for automotive applications
Brinkfeldt, K.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Kaulfersch, E.; Edwards, M.; Otto, A.; Andersson, D. | Conference Paper |
| 2016 | The design challenge in printing devices and circuits: Influence of the orientation of print patterns in inkjet-printed electronics
Sowade, E.; Polomoshnov, M.; Baumann, R.R. | Journal Article |
| 2016 | Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2016 | Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study
Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T. | Journal Article |
| 2016 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T. | Journal Article |
| 2016 | Efficient design methodology for inductive energy transmission
Büker, M.-J.; Hedayat, C.; Hilleringmann, U.; Geßner, T. | Conference Paper |
| 2016 | Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S. | Conference Paper |
| 2016 | Electron transport in defective metallic and semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
| 2016 | Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
| 2016 | Embedding electrochemical impedance spectroscopy in smart battery management systems using multicore technology
Armengaud, E.; Macher, G.; Groppo, R.; Novaro, M.; Otto, A.; Döring, R.; Schmidt, H.; Kras, B.; Stankiewicz, S. | Conference Paper |
| 2016 | Empirical transport model of strained CNT transistors used for sensor applications
Wagner, C.; Schuster, J.; Gessner, T. | Journal Article |
| 2016 | Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S. | Journal Article |
| 2016 | Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses
Haubold, M. | Dissertation |
| 2016 | Event driven modeling and characterization of the second order voltage switched charge pump PLL
Ali, E.; Hangmann, C.; Hedayat, C.; Haddad, F.; Rahajandraibe, W.; Hilleringmann, U. | Journal Article |
| 2016 | Exchange-biased Py/CoO vortex structures: Magnetization reversal, cooling-field dependence, and training
Nissen, D.; Klein, O.; Matthes, P.; Albrecht, M. | Journal Article |
| 2016 | Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Exploitation of giant piezoresistivity - CNT sensors fabricated with a wafer-level technology
Böttger, S.; Schulz, S.E.; Hermann, S. | Journal Article, Conference Paper |
| 2016 | Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies
Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T. | Conference Paper |
| 2016 | Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S. | Journal Article |
| 2016 | Fluidic actuators for active flow control on airframe
Schueller, M.; Weigel, P.; Lipowski, M.; Meyer, M.; Schlösser, P.; Bauer, M. | Conference Paper |
| 2016 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2015
| Annual Report |
| 2016 | High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly
Dinh, Nghia Trong; Sowade, Enrico; Blaudeck, T.; Hermann, S.; Rodriguez, Raul D.; Zahn, Dietrich R.T.; Schulz, S.E.; Baumann, R.R.; Kanoun, Olfa | Journal Article |
| 2016 | A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü | Abstract |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
| 2016 | Improved RF design using precise 3D near-field measurements and near-field to far-field transformations
Hangmann, C.; Mager, T.; Khan, S.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2016 | An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Journal Article |
| 2016 | Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps
Geidel, S.; Peransi Llopis, S.; Rodrigo, M.; Diego-Castilla, G. de; Sousa, A.; Nestler, J.; Otto, T.; Gessner, T.; Parro, V. | Journal Article |
| 2016 | Integration of humidity sensors into fibre-reinforced thermoplastic composites
Ebert, F.; Seider, T.; Illing-Günther, H.; Nendel, K.; Martin, J.; Otto, T.; Gessner, T.; Nestler, D.; Wagner, G. | Journal Article, Conference Paper |
| 2016 | Intense pulsed light sintering of an inkjet printed silver nanoparticle ink depending on the spectral absorption and reflection of the background
Mitra, D.; Mitra, K.Y.; Hartwig, M.; Baumann, R.R. | Journal Article |
| 2016 | Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S. | Conference Paper |
| 2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Journal Article |
| 2016 | Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T. | Journal Article |
| 2016 | Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors
Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Light electric vehicle enabled by smart systems integration
John, R.; Kahrimanovic, E.; Otto, A.; Tavernini, D.; Camocardi, M.; Perelli, P.; Dalmasso, D.; Blaz, S.; Trojaniello, D.; Oleari, E.; Sanna, A.; Groppo, R.; Romano, C. | Conference Paper |
| 2016 | Liquid reagent storage in self-pumping lab-on-a-chip systems for quick assay and biosensor integration
Nestler, J.; Haber, N.; Stiehl, C.; Otto, T.; Gessner, T. | Conference Paper |
| 2016 | Low temperature layer purification by pulsed UV-irradiation for flexible dye sensitized solar cells
Kleine, A.; Hilleringmann, U. | Conference Paper |
| 2016 | Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T. | Conference Paper |
| 2016 | Low-cost treatment for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
| 2016 | Magnesium silicide TEGs as self-sufficient power supply for smart systems
Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
| 2016 | Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films
Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2016 | Maskless reduction of crosstalk suitable for flexible electronics
Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2016 | Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S. | Conference Paper |
| 2016 | Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas | Conference Paper |
| 2016 | Measurement and modeling of the effective thermal conductivity of sintered silver pastes
Ordonez-Miranda, J.; Hermens, M.; Nikitin, I.; Kouznetsova, V.G.; Van Der Sluis, O.; Ras, M.A.; Reparaz, J.S.; Wagner, M.R.; Sledzinska, M.; Gomis-Bresco, J.; Sotomayor Torres, C.M.; Wunderle, B.; Volz, S. | Journal Article |
| 2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Conference Paper |
| 2016 | A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | MEMS tunable Fabry-Pérot filters for infrared microspectrometer applications
Neumann, N.; Ebermann, M.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2016 | Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles
Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T. | Journal Article |
| 2016 | Microelectromechanical switch and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
| 2016 | Microelectromechanical system and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
| 2016 | Microwave filter design optimized for ceramic multilayer technique
Uhlig, P.; Kassner, J.; Guenner, C.; Noack, E. | Journal Article, Conference Paper |
| 2016 | Miniaturized vortex-induced vibration energy harvester for low velocity air flow application
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Geßner, T. | Conference Paper |
| 2016 | Modeling of MOEMS electromagnetic scanning grating mirror for NIR micro-spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.; Yang, T. | Journal Article |
| 2016 | A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | Next generation drivetrain concept featuring self-learning capabilities enabled by extended information technology functionalities
Otto, A.; Rzepka, S. | Conference Paper |
| 2016 | Novel test stand for thermal diffusivity measurement of bulk and thin films
Ras, M.A.; May, D.; Wunderle, B. | Conference Paper |
| 2016 | Novel through silicon wiring technology using dry etched sloping vertical terminals
Haas, S.; Voigt, S.; Arnold, M.; Schwenzer, F.; Braunschweig, M.; Küchler, M.; Kurth, S.; Gessner, T. | Conference Paper |
| 2016 | Optimization of a zinc oxide dispersion for building Quantum Dot Light Emitting Diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2016 | Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end
Wecker, J.; Bauch, A.; Kurth, S.; Mangalgiri, G.; Gaitzsch, M.; Meinig, M.; Gessner, T.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
| 2016 | Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics
Koehler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Journal Article |
| 2016 | Printed batteries designed to power OLED applications
Willert, A.; Helmert, M.; Baumann, R.R. | Conference Paper |
| 2016 | Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B. | Conference Paper |
| 2016 | Product data and Sensor-based intelligent drive Control for flexible manufacturing and intralogistic processes
Geneiß, V.; Hedayat, C.; Bertelsmeier, F.; Henke, C.; Vathauer, K.-E.; Geßner, T. | Conference Paper |
| 2016 | Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow,F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
| 2016 | Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles
Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I. | Conference Paper |
| 2016 | Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B. | Conference Paper |
| 2016 | Reliability investigation on SiC BJT power module
Otto, A.; Kaulfersch, E.; Frankeser, S.; Brinkfeldt, K.; Zschieschang, O.; Rzepka, S. | Conference Paper |
| 2016 | Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R. | Conference Paper |
| 2016 | Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Self-assembly of spherical colloidal photonic crystals inside inkjet-printed droplets
Sowade, E.; Blaudeck, T.; Baumann, RR. | Journal Article |
| 2016 | Silicon oxynitride microdisk resonators for integrated waveguide coupling
Hett, T.; Frers, T.; Widhalm, A.; Berth, G.; Hilleringmann, U.; Zrenner, A. | Conference Paper |
| 2016 | Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg | Conference Paper |
| 2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Abstract |
| 2016 | Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
| 2016 | Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
| 2016 | Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling
Niessner, M.; Dudek, R.; Hildebrandt, M.; Gehring, M.; Yongbo, Y.; Piller, A.; Schrag, G. | Conference Paper |
| 2016 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Journal Article, Conference Paper |
| 2016 | Thermal design of integrated heating for lab-on-a-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T. | Conference Paper |
| 2016 | Thermal simulations and experimental verification of power modules designed for double sided cooling
Brinkfeldt, K.; Ottosson, J.; Otto, A.; Mann, A.; Zschieschang, O.; Frankeser, S.; Andersson, D. | Conference Paper |
| 2016 | Time-efficient curing of printed dielectrics via infra-red suitable to S2S and R2R manufacturing platforms for electronic devices
Mitra, K.Y.; Weise, D.; Hartwig, M.; Kapadia, S.; Baumann, R.R. | Journal Article |
| 2016 | Towards distributed intelligent sensor and information fusion
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article |
| 2016 | Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers
Meinig, M.; Kurth, S.; Seifert, M.; Hiller, K.; Wecker, J.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2016 | Tunable MEMS Fabry-Pérot filters for infrared microspectrometers: A review
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2016 | Tuning the reduction and conductivity of solution-processed graphene oxide by intense pulsed light
Al-Hamry, A.; Kang, H.; Sowade, E.; Dzhagan, V.; Rodriguez, R.D.; Müller, C.; Zahn, D.R.T.; Baumann, R.R.; Kanoun, O. | Journal Article |
| 2016 | Up-scaling of the manufacturing of all-inkjet-printed organic thin-film transistors: Device performance and manufacturing yield of transistor arrays
Sowade, E.; Mitra, K.Y.; Ramon, E.; Martinez-Domingo, C.; Villani, F.; Loffredo, F.; Gomes, H.L.; Baumann, R.R. | Journal Article |
| 2016 | Upscaling of the inkjet printing process for the manufacturing of passive electronic devices
Sternkiker, C.; Sowade, E.; Mitra, K.Y.; Zichner, R.; Baumann, R.R. | Journal Article |
| 2016 | Using quantum dot photoluminescence for load detection
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.; Gessner, T. | Journal Article |
| 2016 | Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C. | Conference Paper |
| 2016 | VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy
Helke, C.; Meinig, M.; Seifert, M.; Seiler, J.; Hiller, K.; Kurth, S.; Martin, J.; Gessner, T. | Conference Paper |
| 2016 | Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B. | Conference Paper |
| 2016 | Welcome to smart systems integration 2016
Gessner, T. | Conference Paper |
| 2015 | [Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2015 | "LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B. | Conference Paper |
| 2015 | 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T. | Conference Paper |
| 2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2015 | Acceleration of lifetime modeling by isothermal bending fatigue tests
Heilmann, J.; Arnold, J.; Wunderle, B. | Conference Paper |
| 2015 | Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R. | Journal Article |
| 2015 | Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B. | Conference Paper |
| 2015 | Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime
Gomes, H.L.; Medeiros, M.C.R.; Villani, F.; Canudo, J.; Loffredo, F.; Miscioscia, R.; Martinez-Domingo, C.; Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; McCulloch, I.; Carrabina, J. | Journal Article |
| 2015 | Assembly and packaging of micro systems by using reactive bonding processes
Schumacher, Axel; Gaiß, Ulrike; Knappmann, Stefan; Dietrich, Georg; Braun, Stefan; Pflug, Erik; Roscher, Frank; Vogel, Klaus; Hertel, Silvia; Kähler, Dirk; Reinert, Wolfgang | Conference Paper |
| 2015 | Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Carbon nanotube based field-effect transistors: Comparison between atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
| 2015 | Carbon Nanotube based sensors in MEMS/NEMS
Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Carbon nanotubes under strain: Electronic and Optical properties
Wagner, C.; Schuster, J.; Gessner, T. | Abstract |
| 2015 | Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Conference Paper |
| 2015 | Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C. | Book Article |
| 2015 | Comparative analysis of multi-mass high precision vibratory MEMS gyroscopes
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Hiller, K.; Hahn, S.; Gessner, T. | Conference Paper |
| 2015 | Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers
Niittynen, J.; Sowade, E.; Kang, H.; Baumann, R.R.; Mäntysalo, M. | Journal Article |
| 2015 | Controlling the ink spreading on uncoated paper for inkjet printed nanoparticle silver inks in combination with intense pulsed light (IPL) sintering
Weise, D.; Hartwig, M.; Mitra, K.Y.; Wagenbach, A.; Shah, K.Y.; Baumann, R.R. | Conference Paper |
| 2015 | Correction: Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second (J. Mater. Chem. C (2015) DOI: 10.1039/c5tc02291f)
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
| 2015 | Degradation of all-inkjet-printed organic thin-film transistors with TIPS-pentacene under processes applied in textile manufacturing
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Machado, A.V.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2015 | Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J. | Book Article |
| 2015 | Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2015 | Effect of the light spectrum of various substrates for inkjet printed conductive structures sintered with intense pulsed light
Weise, D.; Mitra, K.Y.; Ueberfuhr, P.; Baumann, R.R. | Conference Paper |
| 2015 | Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Rzepka, S. | Conference Paper |
| 2015 | Efficient K-band antennas fabricated with large-scale processes
Gaitzsch, M.; Grossmann, T.D.; Hartwig, M.; Heinrich, M.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L. | Conference Paper |
| 2015 | Electrical conductivity enhancement of spin-coated PEDOT:PSS thin film via dipping method in low concentration aqueous DMSO
Deetuam, C.; Weise, D.; Samthong, C.; Praserthdam, P.; Baumann, R.R.; Somwangthanaroj, A. | Journal Article |
| 2015 | Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration
Meinig, M.; Kurth, S.; Helke, C.; Seifert, M.; Hiller, K.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2015 | Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M. | Conference Paper |
| 2015 | Electromagnetic simulation of flexible strain sensor based microstrip patch antenna
Benchirouf, A.; Zichner, R.; Müller, C.; Kanoun, O. | Journal Article, Conference Paper |
| 2015 | Ereignisgesteuerte Methode für schnelle und präzise Analysen
Hangmann, C.; Vogel, M. | Journal Article |
| 2015 | Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S. | Conference Paper |
| 2015 | Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S. | Conference Paper |
| 2015 | Exact and approximated discrete-time non-linear models of voltage switched CP-PLL
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials
Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T. | Abstract |
| 2015 | Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics
Köhler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Conference Paper |
| 2015 | Fabrication of micro needle arrays using an ultra short pulse laser
Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M. | Journal Article |
| 2015 | Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2015 | A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases
Ebermann, M.; Neumann, N.; Binder, S.; Meinig, M.; Seifert, M.; Kurth, S.; Hiller, K. | Conference Paper |
| 2015 | FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B. | Conference Paper |
| 2015 | FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B. | Conference Paper |
| 2015 | Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K. | Conference Paper |
| 2015 | Flexible electronics: Integration processes for organic and inorganic semiconductor-based thin-film transistors
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Journal Article |
| 2015 | Fluidic actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Symmank, C.; Schmidt, A.; Kroll, L.; Gessner, T.; Götze, U. | Conference Paper |
| 2015 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2014
| Annual Report |
| 2015 | Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik | Patent |
| 2015 | Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process
Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2015 | Hierarchical, high-rate, hybrid and roll-to-roll manufacturing
: Poliks, M.D.; Blaudeck, T. | Conference Proceedings |
| 2015 | High-performance giant magnetoresistive sensorics on flexible Si membranes
Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G. | Journal Article |
| 2015 | Highly-sensitive humidity sensors for condition monitoring of hybrid laminates
Seider, T.; Martin, J.; Boeddicker, A.; Ruehling, J.; Wett, D.; Nestler, D.J.; Wagner, G.; Huebler, A.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | An improved micromechanical method for investigating the statistical strength of poly-silicon membranes
Brückner, J.; Pfaff, H.; Dehe, A.; Rzepka, S. | Abstract |
| 2015 | Improving HV battery efficiency by smart control systems
Armengaud, E.; Macher, G.; Kurtulus, C.; Groppo, R.; Haase, S.; Hofer, G.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
| 2015 | An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2015 | Influence of different hole transport layers on the performance of quantum dot light emitting diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
| 2015 | Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U.; Wirth, G.I. | Conference Paper |
| 2015 | Infra-red curing methodology for Roll-to-Roll (R2R) manufacturing of conductive electrodes through inkjet technology applicable for devices in the field of flexible electronics
Mitra, K.Y.; Weise, D.; Hartwig, M.; Baumann, R.R. | Conference Paper |
| 2015 | An inkjet adaptive backend strategy for low-yield OTFT digital circuits
Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet and gravure printing of conductive patterns for the application in lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet printing of colloidal nanospheres: Engineering the evaporation-driven self-assembly process to form defined layer morphologies
Sowade, E.; Blaudeck, T.; Baumann, R.R. | Journal Article |
| 2015 | Inkjet printing of group-11 metal structures
Gäbler, Christian; Schliebe, Christian; Adner, David; Blaudeck, T.; Hildebrandt, Alexander; Lang, Heinrich | Book Article |
| 2015 | Inkjet printing of UHF antennas on corrugated cardboards for packaging applications
Sowade, E.; Göthel, F.; Zichner, R.; Baumann, R.R. | Journal Article |
| 2015 | Inkjet-printed quantum dot-based sensor for structural health monitoring
Hartwig, M.; Ortlepp, F.; Möbius, M.; Martin, J.; Otto, T.; Geßner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring
Ortlepp, F.; Hartwig, M.; Moebius, M.; Martin, J.; Otto, T.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Integrated load detection sensor for lightweight structures based on quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Hartwig, M.; Dzhagan, D.; Gordan, O.D.; Lang, H.; Zahn, D.R.T.; Baumann, R.R.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Integration and test of synthetic jet actuators
Schueller, M.; Weigel, P.; Lipowski, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Integration of fluidic jet actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Otto, T.; Geßner, T.; Kroll, L. | Conference Paper |
| 2015 | Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes
Weise, D.; Sternkiker, C.; Baumann, R.R. | Conference Paper |
| 2015 | Intense pulsed light sintering of inkjet printed silver nanoparticle ink: Influence of flashing parameters and substrate
Weise, D.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Conference Paper |
| 2015 | Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Conference Paper |
| 2015 | Investigation of carbon nanotube based field-effect transistors using atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study
Foerster, A.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E. | Abstract |
| 2015 | Kombinierte Simulation integrierter mikrofluidischer Aktoren
Schulze, R.; Nestler, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Life cycle-oriented analysis and evaluation of Active Flow Control in wind turbines
Götze, U.; Symmank, C.; Dressel, M.; Schüller, M.; Schmidt, A.; Lipowski, M.; Geßner, T.; Otto, T. | Journal Article |
| 2015 | Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Journal Article |
| 2015 | Materials for Advanced Metallization 2014 (MAM 2014). Preface
Schulz, S.E.; Hecker, M.; Korner, H.; Wolf, H. | Conference Paper, Journal Article |
| 2015 | Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A. | Conference Paper |
| 2015 | Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints
Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B. | Conference Paper |
| 2015 | Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Conference Paper |
| 2015 | Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W. | Journal Article |
| 2015 | Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M. | Journal Article |
| 2015 | Microelectronics packaging materials: Investigating the influence of moisture by molecular dynamics simulations
Hölck, O.; Wunderle, B. | Conference Paper |
| 2015 | Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A. | Conference Paper |
| 2015 | Mobile communication and control for Smart Microfluidic Systems
Otto, T.; Geidel, S.; Morschhauser, A.; Streiter, R.; Gessner, T.; Heibutzki, B.; Nestler, J. | Conference Paper |
| 2015 | Modeling & PVT characterization of arbitrary ordered VSCP-PLL using an efficient event-driven approach
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen
Weidlich, S.; Forke, R.; Billep, D.; Konietzka, S.; Koehler, D.; Hiller, K.; Gessner, T. | Conference Paper |
| 2015 | Monolithic integration of 2D spin valve magnetic field sensors for angular sensing
Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Conference Paper |
| 2015 | Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T. | Conference Paper |
| 2015 | Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T. | Conference Paper |
| 2015 | A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J. | Conference Paper |
| 2015 | Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres
Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H. | Conference Paper |
| 2015 | On the optimization of piezoelectric vibration energy harvester
Deng, L.; Wen, Q.; Jiang, S.; Zhao, X.; She, Y. | Journal Article |
| 2015 | On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J. | Journal Article |
| 2015 | On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M. | Journal Article |
| 2015 | Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E. | Journal Article |
| 2015 | Optimum laser exposure for setting exchange bias in spin valve sensors
Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator
Wecker, J.; Mangalgiri, G.; Kurth, S.; Meinig, M.; Hackner, A.; Prechtel, U.; Gessner, T. | Journal Article |
| 2015 | Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips
Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Conference Paper |
| 2015 | Performance investigation of UHF RFID tags designed for air and Rubber Belts - impact of electrical parameters and the shape of the belts
Kanwar, K.; Mager, T.; Hilleringmann, U.; Hedayat, C.; Geneis, V.; Gessner, T. | Conference Paper |
| 2015 | A photonic biosensor for space applications (PBSA)
Diego-Castilla, G. de; Pantoja, S.; Geidel, S.; Peransi, S.; Nestler, J.; Martins, R.; Sousa, A.; Gomez-Elvira, J.; Moreno-Paz, M.; Cuesta, L.; Parro, V. | Conference Paper |
| 2015 | Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics
Mitra, K.Y.; Sowade, E.; Martinez-Domingo, C.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Conference Paper |
| 2015 | Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T. | Conference Paper |
| 2015 | Precision determination of thermoreflectance coefficients for localised thermometry
Schlag, R.; Ras, M.A.; Arlt, V.; May, D.; Winkler, T.; Wunderle, B. | Conference Paper |
| 2015 | Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology
Nossol, P.; Schaufuss, J.; Tsapkolenko, A.; Rost,F; Arnold, B.; Kroll, L.; Mehner, J.; Gessner, T. | Conference Paper |
| 2015 | Preparation of Ni-C thin films for strain sensor applications in new hybrid laminates with thermoplastic matrix
Wett, D.; Nestler, D.; Wagner, G.; Wielage, B.; Seider, T.; Martin, J.; Gessner, T. | Conference Paper |
| 2015 | Printed functionalities in hybrid laminates
Nestler, D.J.; Jung, H.; Trautmann, M.; Wielage, B.; Wagner, G.; Seider, T.; Martin, J.; Otto, T.; Gessner, T.; Ebert, F.; Illing-Guenther, H.; Nendel, K.; Boeddicker, A.; Fuegmann, U.; Huebler, A. | Conference Paper |
| 2015 | Printing of conductive patterns for application in smart lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Pulsed jet actuators and their integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2015 | Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes
Hübner, M.; Lang, N.; Zimmermann, S.; Schulz, S.E.; Buchholtz, W.; Röpcke, J.; Helden, J.H. van | Journal Article |
| 2015 | Quantum dot-based sensor layer in lightweight structures
Fischer, T.; Heinrich, K.; Spudat, C.; Martin, J.; Otto, T.; Gessner, T.; Kroll, L. | Journal Article |
| 2015 | Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification
Merten, E.; Essen, T. von; Luczack, F.; Otto, A.; Lunding, A.; Lürkens, P.; Bast, M.; Abo Ras, M.; Rzepka, S. | Conference Paper |
| 2015 | Remote ice detection on rotor blades of wind turbines
Großmann, T.D.; Gaitzsch, M.; Hartwig, M.; Heinrich, M.; Symmank, C.; Schmidt, A.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.; Götze, U. | Conference Paper |
| 2015 | RF MEMS switch for modulated backscatter communication
Gaitzsch, M.; Voigt, S.; Haas, S.; Kurth, S.; Gessner, T. | Conference Paper |
| 2015 | Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
| 2015 | Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S. | Conference Paper |
| 2015 | Semiconductor nanocrystals – versatile building blocks for innovative microsystems
Weiss, A.; Heinrich, K.; Martin, J.; Otto, T.; Gessner, T.; Langenickel, J. | Conference Paper |
| 2015 | Simulation and validation of arbitrary ordered VSCP-PLLs using event-driven macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Smart systems integration. Short review and further development of smart systems
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Kurth, S.; Nestler, J.; Köhler, T. | Book Article |
| 2015 | Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S. | Conference Paper |
| 2015 | Strong localization in defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
| 2015 | Strong localization in quasi one-dimensional systems with realistic defects: Application to carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Conference Paper |
| 2015 | Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen
Baum, M. | Dissertation |
| 2015 | Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters
Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper, Journal Article |
| 2015 | Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2015 | Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures
Helke, C.; Nestler, J.; Gessner, T. | Conference Paper |
| 2015 | Synthesis and characterization of nanogenerators based on doped zinc oxide
Heinrich, K.; Justeau, C.; Mielke, B.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
| 2015 | System zum Messen einer Axialkraft einer Schraubverbindung
Geßner, Thomas; Otto, Thomas; Halder, Stefan; Hummel, Dieter; Martin, Jörg; Weiss, Martin; Möbius, Martin; Spudat, Christian; Gessner, Thomas; Otto, Thomas | Patent |
| 2015 | Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S. | Conference Paper |
| 2015 | Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation
Förster, A.; Wagner, C.; Gemming, S.; Schuster, J. | Journal Article |
| 2015 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k materials
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Conference Paper |
| 2015 | Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S. | Conference Paper |
| 2015 | Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B. | Conference Paper, Poster |
| 2015 | Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2015 | Thermo-mechanical simulations of SiC power modules with single and double sided cooling
Brinkfeldt, K.; Edwards, M.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Andersson, D. | Conference Paper |
| 2015 | Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2015 | TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T. | Abstract |
| 2015 | VORRICHTUNGEN ZUR AUSSENDUNG UND/ODER ZUM EMPFANG ELEKTROMAGNETISCHER STRAHLUNG UND VERFAHREN ZUR BEREITSTELLUNG DERSELBEN
Geßner, Thomas; Otto, Thomas; Schulz, Stefan Prof.; Hermann, Sascha; Blaudeck, Thomas; Spudat, Christian | Patent |
| 2015 | Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach
Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes
Hartmann, M.; Hermann, S.; Pohl, D.; Rellinghaus, B.; Schulz, S.E. | Abstract |
| 2015 | Wake up MEMS for inertial sensors
Stoeckel, C.; Billep, D.; Konietzka, S.; Zimmermann, S.; Otto, T. | Conference Paper |
| 2015 | Welcome to Smart Systems Integration 2015
Gessner, T. | Journal Article |
| 2015 | Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics
Ahner, N.; Zimmermann, S.; Köhler, N.; Krüger, S.; Schulz, S.E. | Conference Paper |
| 2015 | Yet another tuning fork gyroscope
Forke, R.; Hiller, K.; Hahn, S.; Konietzka, S.; Motl, T.; Köhler, D.; Heinz, S.; Billep, D.; Gessner, T. | Conference Paper |
| 2014 | System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS
Kolchuzhin, V.; Mehner, J.; Markert, E.; Heinkel, U.; Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
| 2014 | 3D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried | Presentation |
| 2014 | An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B. | Book Article |
| 2014 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B. | Conference Paper |
| 2014 | Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2014 | Adjustment of Carbon Nanotube Properties for Sensor Applications using Pd Adatoms: An Ab-Initio Study
Fuchs, F.; Wagner, C.; Zienert, A.; Schuster, J. | Abstract |
| 2014 | Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies
Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R. | Book Article |
| 2014 | AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M. | Book Article |
| 2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Conference Paper |
| 2014 | All-inkjet-printed bottom-gate thin-film transistors using UV curable dielectric for well-defined source-drain electrodes
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Lanceros-Méndez, S.; Baumann, R.R. | Journal Article |
| 2014 | Analysis of Au metal–metal contacts in a lateral actuated RF MEMS switch
Gaitzsch, M.; Kurth, S.; Voigt, S.; Haas, S.; Gessner, T. | Conference Paper, Journal Article |
| 2014 | Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J. | Book Article |
| 2014 | Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen
Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B. | Conference Paper |
| 2014 | ANAn UPS/IPS Study of Band Level Alignment Of a Quantum Dot Based Sensor
Tofighi, G.; Moebius, M.; Haidu, F.; Martin, J.; Dzhagan, V.M.; Spudat, C.; Otto, T.; Gessner, T.; Gordan, O.D.; Zahn, D.R.T. | Abstract |
| 2014 | Anodized aluminum as effective and cheap alternative substrate for thermoelectric generators
Assion, F.; Geneiß, V.; Schönhoff, M.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B. | Book Article |
| 2014 | Applications driven by printed batteries
Willert, A.; Espig, M.; Helmert, M.; Baumann, R.R. | Book Article |
| 2014 | Assisting the design of sensor and information fusion systems
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article, Conference Paper |
| 2014 | Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Gessner, Thomas | Poster |
| 2014 | Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Geßner, Thomas | Conference Paper |
| 2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2014 | Carbon nanotubes under strain: Ab-initio investigations and compact models
Wagner, C.; Kolchuzhin, V.; Markert, E.; Schuster, J.; Mehner, J.; Gessner, T. | Abstract |
| 2014 | Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Challenges of current and future advanced interconnect systems for integrated circuits
Schulz, S.E.; Ahner, N.; Fischer, T.; Koerner, H.; Oszinda, T.; Schulze, K.; Zimmermann, S. | Book Article |
| 2014 | Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B. | Conference Paper |
| 2014 | Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B. | Conference Paper |
| 2014 | Characterization of fully inkjet-printed microsieves and of patterns for the mechanical reinforcement of fragile membranes
Hammerschmidt, J.; Ueberfuhr, P.; Eck, E.-M.; Zeiner, C.; Thalheim, R.; Baumann, R.R. | Conference Paper |
| 2014 | Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C. | Conference Paper |
| 2014 | Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films
Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T. | Journal Article |
| 2014 | Cluster of Excellence MERGE - Integration of Micro- and Nanosystems in Hybrid Structures
Kroll, L.; Troeltzsch, J.; Schueller, M. | Book Article |
| 2014 | A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2014 | Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M. | Conference Paper |
| 2014 | Conductivity and microstructure of inkjet-printed silver tracks depending on the digital pattern, sintering process, substrate and ink
Weise, D.; Grimm, A.; Weiß, U.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Conference Paper |
| 2014 | Corrigendum to "Controlling SWCNT assembling density by electrokinetics" [Sensors and Actuators, A: Physical (2013) 201 (36-42)]
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E. | Journal Article |
| 2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Book Article |
| 2014 | Design and manufacturing of roll-to-roll printed copper layers for communication applications
Zichner, R.; Baumann, R.R. | Conference Paper |
| 2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Conference Paper |
| 2014 | Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Book Article |
| 2014 | Development and Characterization of a High Voltage Amplifier ASIC for MEMS based Piezoelectric Actuator Active Flow Control
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
| 2014 | Development and test of synthetic jet actuators based on dual transducer concept
Schueller, M.; Wiegel, P.; Lipowski, M.; Schulze, R.; Otto, T.; Gessner, T. | Conference Paper |
| 2014 | Development of Micro-Valves for Pulsed Jet Actuators
Lipowski, M.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2014 | The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds
Kang, H.; Sowade, E.; Baumann, R.R. | Journal Article |
| 2014 | Dispersion Preparation for Wafer-Level Liquid Processing of Carbon Nanotube Microsensors
Hille, Toni; Blaudeck, T.; Hermann, S.; Schulz, S.E. | Conference Paper |
| 2014 | Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R. | Conference Paper |
| 2014 | Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Dry Integration Strategies of rolled-up Nanostructures by a Combination of Laser and Mems Technologies
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Electronic transport through defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J. | Abstract |
| 2014 | Elektronischer Transport in defektbehafteten quasi-eindimensionalen Systemen am Beispiel von Kohlenstoffnanoröhrchen
Teichert, F. | Master Thesis |
| 2014 | Embedded UHF RFID tag design process for rubber transmission belt using 3D model
Kanwar, K.; Mager, T.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Conference Paper |
| 2014 | Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator
Kasdorf, O.; Vollbrecht, J.; Ohms, B.; Hilleringmann, U.; Bock, H.; Kitzerow, H.S. | Journal Article |
| 2014 | Entwicklung eines experimentellen Aufbaus zur Systemcharakterisierung von MEMS Gyroskopen auf Waferlevel
Weidlich, S.; Forke, R.; Konietzka, S.; Hiller, K.; Gessner, T. | Conference Paper |
| 2014 | Entwicklung eines intelligenten, textilen Halbzeugs
Schaufuss, J.; Decker, R.; Walther, M.; Tsapkolenko, A.; Dienel, M.; Schueller, M.; Kroll, L.; Gessner, T.; Mehner, J. | Conference Paper |
| 2014 | EUCEMAN - the European Center for MicroNanoReliability Research in Europe
Michel, B.; Winkler, T. | Book Article |
| 2014 | Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M. | Book Article |
| 2014 | Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips
Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F. | Conference Paper |
| 2014 | Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Fiber-reinforced Composite Structures with Embedded Piezoelectric Sensors
Schulze, R.; Streit, P.; Fischer, T.; Tsapkolenko, A.; Heinrich, M.; Sborikas, M.; Kroll, L.; Gessner, T.; Wegener, M. | Conference Paper |
| 2014 | Flash lamp annealing of spray coated films containing oxidized or hydrogen terminated silicon nanoparticles
Seidel, F.; Toader, I.G.; Koth, S.; Fritzsche, R.; Schäfer, P.; Bülz, D.; Büchter, B.; Gordan, O.D; Freitag, H.; Jakob, A.; Buschbeck, R.; Hietschold, M.; Lang, H.; Mehring, M.; Baumann, R.R.; Zahn, D.R.T. | Journal Article |
| 2014 | A flexible measurement system for the characterization of thermoelectric materials
Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
| 2014 | Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B. | Book Article |
| 2014 | Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2013
| Annual Report |
| 2014 | Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T. | Conference Paper |
| 2014 | German association of nanotechnology: Objectives and benefits
Nonninger, R.; Michel, B. | Book Article |
| 2014 | A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems
Braeuer, J.; Gessner, T. | Journal Article |
| 2014 | High precision 3D surface reconstruction by combining shape-from-shading and light sectioning techniques
Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C. | Book Article |
| 2014 | High precision vibratory MEMS gyroscope
Billep, D.; Hiller, K.; Hahn, S.; Forke, R.; Köhler, D.; Stöckel, C.; Konietzka, S.; Heinz, S. | Book Article |
| 2014 | High Voltage Amplifier ASIC for High Capacitive Load MEMS based Piezoelectric Actuators
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
| 2014 | The history of micro mirror fabrication at the center of microtechnologies
Kaufmann, C. | Book Article |
| 2014 | Hysteresis-free carbon nanotube field-effect transistors without passivation
Tittmann, J.; Hermann, S.; Schulz, S.E.; Pacheco-Sanchez, A.; Claus, M.; Schröter, M. | Conference Paper |
| 2014 | Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T. | Conference Paper, Journal Article |
| 2014 | Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B. | Book Article |
| 2014 | In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S. | Conference Paper |
| 2014 | In-situ characterization of microelectronic systems using 2D digital image correlation and 3D digital volume correlation of X-ray microtomography images
Seiler, B.; Haase, S.; Noack, E.; Erb, R.; Scheiter, L. | Book Article |
| 2014 | INCOBAT – Improving HV battery efficiency by E/E control systems
Armengaud, E.; Groppo, R.; Haase, S.; Hofer, G.; Lanciotti, C.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
| 2014 | Influence of porosity and methyl doping inside silica network
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R. | Journal Article |
| 2014 | Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R. | Conference Paper |
| 2014 | Integrateable light sources based on semiconductor nanocrystals
Böttger, P.; Meyer, M.; Martin, J.; Otto, T.; Gessner, T.; Seidlitz, H.; Kroll, L. | Conference Paper |
| 2014 | Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S. | Journal Article, Conference Paper |
| 2014 | Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Abstract |
| 2014 | Integration von ZnO Nanopartikel Dünnschicht-Transistoren durch Sprühbeschichtung
Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2014 | Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interaction between semiconducting carbon nanotubes and metals: Sensing, stability and electronic properties
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interface characterisation at electronic packages by means af nanoscale deformation analysis
Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B. | Book Article |
| 2014 | Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M. | Book Article |
| 2014 | Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
Johansson, J.; Belov, I.; Johnson, E.; Dudek, R.; Leisner, P. | Journal Article |
| 2014 | Kombination von Laser- und MEMS Technologieprozessen fuer Integrationsstrategien von rolled-up Nano-Architekturen
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Laser based dry Integration of rolled-up Nanomembranes into Polymer Substrates
Enderlein, T.; Helke, C.; Harazim, S.; Geidel, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Laser based integration method of rolled-up nano membranes in polymer based LoC systems
Enderlein, T.; Helke, C.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Localization length of integrated multi-walled carbon nanotubes
Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
Vidor, F.F.; Wirth, G.I.; Hilleringmann, U. | Journal Article |
| 2014 | Magnetite nanoparticles: Synthesis, thin film properties and inkjet printing of magnetic cores for inductor applications
Marjanovic, N.; Chiolerio, A.; Kus, M.; Ozel, F.; Tilki, S.; Ivanović, N.; Rakočević, Z.; Andrić, V.; Barudžija, T.; Baumann, R.R. | Journal Article |
| 2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Mathematical modeling and simulations for machine directional register in hybrid roll-to-roll printing systems
Kang, H.; Baumann, R.R. | Journal Article |
| 2014 | Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S. | Conference Paper |
| 2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
| 2014 | Metallic carbon nanotubes with metal contacts: electronic structure and transport
Zienert, A.; Schuster, J.; Gessner, T. | Journal Article |
| 2014 | Microfluidic chips for cells capture using 3-D hydrodynamic structure array
Chen, J.; Chen, D.; Yuan, T.; Chen, X.; Zhu, J.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T. | Journal Article |
| 2014 | Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Modeling and characterization of CP-PLL phase noise in presence of dead zone
Hangmann, C.; Wüllner, I.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T. | Journal Article, Conference Paper |
| 2014 | Modeling of SiC power modules with double sided cooling
Brinkfeldt, K.; Neumaier, K.; Mann, A.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Edwards, M.; Andersson, D. | Conference Paper |
| 2014 | Modellierung des optimalen Arbeitsbereiches für Inertialsensoren auf Basis von Kohlenstoffnanoröhrchen
Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
| 2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding
Masser, R.; Braeuer, J.; Gessner, T. | Journal Article |
| 2014 | Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2014 | Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Matthes, P.; Ecke, R.; Mueller, M.; Exner, H.; Schulze, K. | Conference Paper |
| 2014 | Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H. | Conference Paper |
| 2014 | Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C. | Journal Article |
| 2014 | Multifunctional nanomembranes as sensitive optical sensors in compact MEMS devices
Harazim, S.; Bolanos, V.; Helke, C.; Enderlein, T.; Otto, T.; Schmidt, O.G. | Abstract |
| 2014 | Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M. | Conference Paper |
| 2014 | A new generation of MEMS middle-infrared spectrometers
Otto, T.; Saupe, R.; Stock, V.; Seider, T.; Gessner, T. | Conference Paper |
| 2014 | New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B. | Book Article |
| 2014 | A novel wearable electronic nose for healthcare based on flexible printed chemical sensor array
Lorwongtragool, P.; Sowade, E.; Watthanawisuth, N.; Baumann, R.R.; Kerdcharoen, T. | Journal Article |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2014 | On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Optimization of primary printed batteries based on Zn/MnO2
Madej, E.; Espig, M.; Baumann, R.R.; Schuhmann, W.; Mantia, F. la | Journal Article |
| 2014 | Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS study
Tofighi, G.; Moebius, M.; Haidu, F.; Gordan, O.D.; Martin, J.; Spudat, C.; Otto, T.; Gessner, T.; Zahn, D.R.T. | Conference Paper |
| 2014 | Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G. | Abstract |
| 2014 | Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R. | Conference Paper |
| 2014 | Piezoelectric P(VDF-TrFE) transducers assembled with micro injection molded polymers
Schulze, R.; Heinrich, M.; Nossol, P.; Forke, R.; Sborikas, M.; Tsapkolenko, A.; Billep, D.; Wegener, M.; Kroll, L.; Gessner, T. | Journal Article |
| 2014 | Preparing reliability testing for increased demands of automotive electronics
Kreyßig, K.; Otto, A. | Book Article |
| 2014 | Printed antennas on flexible substrates for highly integrated smart systems
Zichner, R.; Baumann, R.R. | Book Article |
| 2014 | Printed elliptically polarized transponder antenna for UHF-RFID metal item tagging
Zichner, R.; Baumann, R.R. | Conference Paper |
| 2014 | Pulsed DC magnetron sputtered piezoelectric thin film aluminum nitride - Technology and piezoelectric properties
Stoeckel, C.; Kaufmann, C.; Hahn, R.; Schulze, R.; Billep, D.; Gessner, T. | Journal Article |
| 2014 | Pulsed Jet Actuator development for the integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2014 | Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2014 | Raman spectroscopy study of the interaction of gold nanoparticles with carbon-nanotubefield-effect transistors
Kalbacova, Jana; Rodriguez, Raul D.; Blaudeck, T.; Hermann, S.; Sheremet, E.; Adner, David; Lang, Heinrich; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H. | Book Article |
| 2014 | Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2014 | Reliability of new SiC BJT power modules for fully electric vehicles
Otto, A.; Kaulfersch, E.; Brinkfeldt, K.; Neumaier, K.; Zschieschang, O.; Andersson, D.; Rzepka, S. | Conference Paper |
| 2014 | Replacing TCO electrodes in dye sensitized solar cells by metal grids
Hilleringmann, U.; Kleine, A. | Conference Paper |
| 2014 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B. | Conference Paper |
| 2014 | Resolution and speed improvements of mid-infrared Fabry-Perot microspectrometers for the analysis of hydrocarbon gases
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2014 | Roll-to-roll infrared sintering of gravure printed silver patterns in applications of back-injection-molded functional lightweight structures
Hartwig, M.; Ueberfuhr, P.; Mischke, A.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kurth, S.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2014 | A satellite multiple-beam antenna for high-rate data relays
Greda, L.A.; Winterstein, A.; Dreher, A.; Figur, S.A.; Schoenlinner, B.; Ziegler, V.; Haubold, M.; Brueck, M.W. | Journal Article |
| 2014 | Self-Assembly of Ordered Colloidal Nanoparticle Films in Few-Micron Wide Laser-Desorbed Lines of Octadecylsiloxane Monolayers on Silicon Oxide Surfaces
Belgardt, Christian; Blaudeck, T.; Borczyskowsi, Christian von; Graaf, Harald | Journal Article |
| 2014 | Semiconducing nanoparticles for field effect transistor integration on foils
Hilleringmann, U.; Wolff, K.; Vidor, F.F.; Assion, F. | Book Article |
| 2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Conference Paper |
| 2014 | Silizium-Halbleitertechnologie. Grundlagen mikroelektronischer Integrationstechnik. 6., korr. und verb. Aufl.
Hilleringmann, U. | Book |
| 2014 | SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Simulations of 3rd order voltage switched CP-PLL using a fast event switching macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2014 | Simultaneous damage detection and deflection measurement of morphing wing structures by fiber optic sensing system
Djinovic, Z.; Scheerer, M.; Tomic, M.; Stojkovic, M.; Schueller, M. | Conference Paper |
| 2014 | Smart monitoring systems for a green future
Saupe, R.; Stock, V.; Otto, T.; Kurth, S.; Hiller, K.; Meinig, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2014 | Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T. | Book |
| 2014 | Smart universal power antenna for optimized wireless energy transfer - SUPA
Büker, M.J.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Book Article |
| 2014 | Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C. | Conference Paper |
| 2014 | Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Stability analysis of a charge pump phase-locked loop using autonomous difference equations
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Journal Article |
| 2014 | Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A. | Conference Paper |
| 2014 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A. | Conference Paper |
| 2014 | Strategies for responding to the reliability challenges of future smart systems
Rzepka, S.; Andersson, D.; Vandevelde, B. | Conference Paper |
| 2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Conference Paper, Journal Article |
| 2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S. | Book Article |
| 2014 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Journal Article, Conference Paper |
| 2014 | Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Strong localization in defective carbon nanotubes: A recursive Green's function study
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2014 | Structural health monitoring with quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Ueberfuhr, P.; Tofighi, G.; Gordan, O.D.; Dzhagan, V.M.; Lang, H.; Baumann, R.R.; Zahn, D.R.T.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2014 | Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture
Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T. | Conference Paper |
| 2014 | Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A. | Journal Article |
| 2014 | Tailored printed primary battery system for powering a diagnostic device
Willert, A.; Killard, A.J.; Baumann, R.R. | Journal Article |
| 2014 | Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T. | Conference Paper |
| 2014 | Technology approaches for tuneable IR Fabry-Perot-Filters applied in gas sensing microspectrometers
Hiller, K.; Meinig, M.; Kurth, S.; Seifert, M.; Helke, C.; Neumann, N.; Ebermann, M. | Book Article |
| 2014 | Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A. | Journal Article |
| 2014 | Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B. | Conference Paper |
| 2014 | Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S. | Conference Paper |
| 2014 | Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M. | Book Article |
| 2014 | Tip-Enhanced Raman Spectroscopy for the Characterization of Carbon Nanotubes
Sheremet, E.; Rodriguez, Raul D.; Krayev, A.; Kalbacova, Jana; Hermann, S.; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Untersuchung des Risswachstums in 3D - Verformungsmessung mittels Röntgenmikrotomographie
Zeismann, F.; Bode, B.; Motoyashiki-Besel, Y.; Brueckner-Foit, A.; Tomizato, F.; Kobayashi, M.; Toda, H.; Uesugi, K.; Takeuchi, A.; Suzuki, Y.; Haase, S.; Erb, R.; Seiler, B.; Dost, M. | Conference Paper |
| 2014 | Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M. | Journal Article |
| 2014 | Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles
Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T. | Conference Paper |
| 2014 | ZnO-Feldeffekttransistoren für flexible elektronische Schaltungen
Hilleringmann, U.; Vidor, F.F. | Conference Paper |