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| 2020 | 2D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride
Meinel, K.; Melzer, M.; Stoeckel, C.; Shaporin, A.; Forke, R.; Zimmermann, S.; Hiller, K.; Otto, T.; Kuhn, H. | Journal Article |
| 2020 | Advanced Packaging Cost Reduction by Selective Copper Metallization
Mavliev, R.; Gottfried, K.; Rhoades, R. | Conference Paper |
| 2020 | Analysen der Lotermüdung an montierten Testbaugruppen unter Thermowechselbeanspruchungen
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Doering, R.; Scheiter, L.; Tegehall, P.-E.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2020 | Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Scheiter, L.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2020 | Calculation technique of diffuse reflectance spectra using an ensemble of damped harmonic oscillators model for substances identification
Anfimov, D.R.; Fufurin, I.L.; Golyak, I.S.; Tabalina, A.S.; Kurth, S. | Conference Paper |
| 2020 | Charged domains in ferroelectric, polycrystalline yttrium manganite thin films resolved with scanning electron microscopy
Rayapati, V.R.; Bürger, D.; Du, N.; Kowol, C.; Blaschke, D.; Stöcker, H.; Matthes, P.; Patra, R.; Skorupa, I.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2020 | Co-sputtering of Al1−xScxN thin films on Pt(111): a characterization by Raman and IR spectroscopies
Solonenko, D.; Lan, C.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
| 2020 | Control of magneto-optical properties of cobalt-layers by adsorption of α-helical polyalanine self-assembled monolayers
Sharma, A.; Matthes, P.; Soldatov, I.; Arekapudi, S.S.P.K.; Böhm, B.; Lindner, M.; Selyshchev, O.; Thi Ngoc Ha, N.; Mehring, M.; Tegenkamp, C.; Schulz, S.E.; Zahn, D.R.T.; Paltiel, Y.; Hellwig, O.; Salvan, G. | Journal Article |
| 2020 | Cover Feature: Ferrocenyl‐Pyrenes, Ferrocenyl‐9,10‐Phenanthrenediones, and Ferrocenyl‐9,10‐Dimethoxyphenanthrenes
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Crystallization of optically thick films of CoxFe 80-xB20
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Hellwig, O.; Kowol, C.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2020 | Design of a synthetic jet actuator for flow separation control
Weigel, P.; Schüller, M.; Gratias, A.; Lipowski, M.; Meer, T. ter; Bardet, M. | Journal Article |
| 2020 | A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups
Rasadujjaman, M.; Wang, Y.; Zhang, L.; Naumov, S.; Attallah, A.G.; Liedke, M.O.; Koehler, N.; Redzheb, M.; Vishnevskiy, A.S.; Seregin, D.S.; Wu, Y.; Zhang, J.; Leu, J.; Wagner, A.; Vorotilov, K.A.; Schulz, S.E.; Baklanov, M.R. | Journal Article |
| 2020 | Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I
Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S. | Conference Paper |
| 2020 | Disturbing-free determination of yeast concentration in DI water and in glucose using impedance biochips
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Blaschke, D.; Schmidt, H. | Journal Article |
| 2020 | Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs
Schroeder, D.; Lange, S.; Hangmann, C.; Hedayat, C. | Book Article |
| 2020 | Ferrocenyl-Pyrenes, Ferrocenyl-9,10-Phenanthrenediones, and Ferrocenyl-9,10-Dimethoxyphenanthrenes: Charge-Transfer Studies and SWCNT Functionalization
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
Conti, F.; Liu, E.; Bhogaraju, S.K.; Wunderle, B.; Elger, G. | Conference Paper |
| 2020 | Formation and crystallographic orientation of NiSi2-Si interfaces
Fuchs, Florian; Bilal Khan, Muhammad; Deb, Dipjyoti; Pohl, Darius; Schuster, Jörg; Weber, Walter M.; Mühle, Uwe; Löffler, Markus; Georgiev, Yordan M.; Erbe, Artur; Gemming, Sibylle | Journal Article |
| 2020 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2019
| Annual Report |
| 2020 | Gate Spacer Investigation for Improving the Speed of High-Frequency Carbon Nanotube-Based Field-Effect Transistors
Hartmann, M.; Tittmann-Otto, J.; Böttger, S.; Heldt, G.; Claus, M.; Schulz, S.E.; Schröter, M.; Hermann, S. | Journal Article |
| 2020 | The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H. | Journal Article |
| 2020 | Increased static dielectric constant in ZnMnO and ZnCoO thin films with bound magnetic polarons
Vegesna, S.V.; Bhat, V.J.; Bürger, D.; Dellith, J.; Skorupa, I.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2020 | Induktives Fügen in der Mikrosystemtechnik
Hofmann, C.; Fröhlich, A.; Kroll, M. | Journal Article |
| 2020 | Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices
Mitra, K.Y.; Willert, A.; Chandru, R.; Baumann, R.R.; Zichner, R. | Journal Article |
| 2020 | Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000
Lange, S.; Schroeder, D.; Hedayat, C.; Hangmann, C.; Otto, T.; Hilleringmann, U. | Conference Paper |
| 2020 | The Limits of the Post‐Growth Optimization of AlN Thin Films Grown on Si(111) via Magnetron Sputtering
Solonenko, D.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T. | Journal Article |
| 2020 | Macroheterocyclic Compounds - a Key Building Block in New Functional Materials and Molecular Devices
Koifman, O.I.; Ageeva, T.A.; Beletskaya, I.P.; Averin, A.D.; Yakushev, A.A.; Tomilova, L.G.; Dubinina, T.V.; Tsivadze, A.Y.; Gorbunova, Y.G.; Martynov, A.G.; Konarev, D.V.; Khasanov, S.S.; Lyubovskaya, R.N.; Lomova, T.N.; Korolev, V.V.; Zenkevich, E.I.; Blaudeck, T.; Borczyskowski, C. von; Zahn, D.R.T.; Mironov, A.F.; Bragina, N.A.; Ezhov, A.V.; Zhdanova, K.A.; Stuzhin, P.A.; Pakhomov, G.L.; Rusakova, N.V.; Semenishyn, N.N.; Smola, S.S.; Parfenyuk, V.I.; Vashurin, A.S.; Makarov, S.V.; Dereven’kov, I.A.; Mamardashvili, N.Z.; Kurtikyan, T.S.; Martirosyan, G.G.; Burmistrov, V.A.; Aleksandriiskii, V.V.; Novikov, I.V.; Pritmov, D.A.; Grin, M.A.; Suvorov, N.V.; Tsygankov, A.A.; Fedorov, A.Y.; Kuzmina, N.S.; Nyuchev, A.V.; Otvagin, V.F.; Kustov, A.V.; Belykh, D.V.; Berezin, D.B.; Solovieva, A.B.; Timashev, P.S.; Milaeva, E.R.; Gracheva, Y.A.; Dodokhova, M.A.; Safronenko, A.V.; Shpakovsky, D.B.; Syrbu, S.A.; Gubarev, Y.A.; Kiselev, A.N.; Koifman, M.O.; Lebedeva, N.S.; Yurina, E.S. | Journal Article |
| 2020 | Microbial Community Distribution and Core Microbiome in Successive Wound Grades of Individuals with Diabetic Foot Ulcers
Jnana, Apoorva; Muthuraman, Vigneshwaran; Varghese, Vinay Koshy; Chakrabarty, Sanjiban; Murali, Thokur Sreepathy; Ramachandra, Lingadakai; Shenoy, Kallya Rajgopal; Rodrigues, Gabriel Sunil; Prasad, Seetharam Shiva; Dendukuri, Dhananjaya; Morschhauser, A.; Nestler, Joerg; Peter, Harald; Bier, Frank F.; Satyamoorthy, Kapaettu | Journal Article |
| 2020 | Nanoindentation as part of material characterization of thin metal films
Jöhrmann, N.; Ecke, R.; Wunderle, B. | Conference Paper |
| 2020 | On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M. | Journal Article |
| 2020 | On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes
Haase, M.; Melzer, M.; Lang, N.; Ecke, R.; Zimmermann, S.; Helden, J.-P.H. van; Schulz, S.E. | Journal Article |
| 2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Abstract |
| 2020 | Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y. | Conference Paper |
| 2020 | PHM features for large circuit boards to be implemented into electric drivetrain applications
Otto, A.; Kaulfersch, E.; Singh, P.; Romano, C.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
| 2020 | Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride
Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T. | Journal Article |
| 2020 | A Platform for Fostering Industry-Academia Collaboration
Otto, T. | Journal Article |
| 2020 | Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B. | Conference Paper |
| 2020 | Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS
Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A. | Journal Article, Conference Paper |
| 2020 | Quantifying the influence of graphene film nanostructure on the macroscopic electrical conductivity
Rizzi, L.; Wijaya, A.F.; Palanisamy, L.V.; Schuster, J.; Koehne, M.; Schulz, S.E. | Journal Article |
| 2020 | Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
Schaal, M.; Klingler, M.; Metais, B.; Grueninger, R.; Hoffmann, S.; Wunderle, B. | Conference Paper |
| 2020 | Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, R.; Anu, M.; Albrecht, J.; Scherf, C.; Rzepka, S.; Subbiah, N.; Wilde, J. | Conference Paper |
| 2020 | Ruthenium(II) MOCVD Precursors for Phosphorus‐Doped Ruthenium Layer Formation
Preuß, A.; Tamuliene, J.; Madajska, K.; Szymanska, I.B.; Korb, M.; Rüffer, T.; Jeschke, J.; Melzer, M.; Bankwitz, J.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | Selective Heat Input for Low Temperature Metallic Wafer Level Bonding
Wiemer, M.; Hofmann, C.; Vogel, K. | Journal Article, Conference Paper |
| 2020 | Selective induction heating of metallic microstructures for wafer-level MEMS packaging
Fröhlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kräusel, V. | Journal Article, Conference Paper |
| 2020 | Selective Metal Deposition to Increase Productivity
Rhoades, R.L.; Mavliev, R.; Gottfried, K. | Conference Paper |
| 2020 | Special issue: International conference on applied system innovation (ICASI 2018)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
| 2020 | Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests
Majd, M.; Meszmer, P.; Priscaru, A.; Gromala, P.J.; Wunderle, B. | Conference Paper |
| 2020 | Synthesis of β-Ketoiminato Copper(II) Complexes and their Use in Copper Deposition
Preuß, A.; Korb, M.; Rüffer, T.; Bankwitz, J.; Georgi, C.; Jakob, A.; Schulz, S.E.; Lang, H. | Journal Article |
| 2020 | System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain
Doncker, R.W.de; Fuchs, L.; Hepp, M.; Luedecke, C.; Meyne, C.; Nisch, A.; Otto, A.; Reum, T.; Rzepka, S.; Strenger, C.; Uhlemann, A.; Vanegas, O.; Wondrak, W. | Conference Paper |
| 2020 | The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F. | Conference Paper |
| 2020 | Thermal kinetics of free volume in porous spin-on dielectrics: Exploring the network- and pore-properties
Attallah, A.G.; Koehler, N.; Liedke, M.O.; Butterling, M.; Hirschmann, E.; Ecke, R.; Schulz, S.E.; Wagner, A. | Journal Article |
| 2020 | Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using Finite Element Method and Raman spectroscopy
Liu, E.; Conti, F.; Bhogaraju, S.K.; Signorini, R.; Pedron, D.; Wunderle, B.; Elger, G. | Journal Article, Conference Paper |
| 2020 | Towards Bacteria Counting in DI Water of Several Microliters or Growing Suspension Using Impedance Biochips
Kiani, M.; Tannert, A.; Du, N.; Hübner, U.; Skorupa, I.; Bürger, D.; Zhao, X.; Blaschke, D.; Rebohle, L.; Cherkouk, C.; Neugebauer, U.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2020 | Tunable Magnetic Vortex Dynamics in Ion-Implanted Permalloy Disks
Ramasubramanian, L.; Kákay, A.; Fowley, C.; Yildirim, O.; Matthes, P.; Sorokin, S.; Titova, A.; Hilliard, D.; Böttger, R.; Hübner, R.; Gemming, S.; Schulz, S.E.; Kronast, F.; Makarov, D.; Fassbender, J.; Deac, A. | Journal Article |
| 2020 | Verbesserte Prozessüberwachung durch hochsensitive CNT-Kraftaufnehmer
Bonitz, Jens; Hamm, Lucas; Müller, Peter; Hermann, Sascha | Journal Article |
| 2020 | Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T. | Conference Paper |
| 2020 | Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir
Franz, M.; Junghans, R.; Schmitt, P.; Szeghalmi, A.; Schulz, S.E. | Journal Article |
| 2020 | Wafer-level vacuum-packaged translatory MEMS actuator with large stroke for NIR-FT spectrometers
Sandner, Thilo; Gaumont, Eric; Graßhoff, Thomas; Rieck, Andreas; Seifert, T.; Auböck, Gerald; Grahmann, Jan | Journal Article |
| 2020 | Water-Based Primary Cell for Powering of Wireless Sensors
Petrov, D.; Hilleringmann, U. | Conference Paper |
| 2020 | Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten
Subbiah, N.; Hamza, A.; Wilde, J.; Mathew, A.; Dudek, R. | Conference Paper |
| 2019 | Accelerated Pump Out Testing for Thermal Greases
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Schacht, R.; Abo Ras, M. | Conference Paper |
| 2019 | Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales
Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T. | Journal Article |
| 2019 | Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving
Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S. | Conference Paper |
| 2019 | Ar+ ions irradiation induced memristive behavior and neuromorphic computing in monolithic LiNbO3 thin films
Pan, X.; Shuai, Y.; Wu, C.; Zhang, L.; Guo, H.; Cheng, H.; Peng, Y.; Qiao, S.; Luo, W.; Wang, T.; Sun, X.; Zeng, H.; Zhang, J.; Zhang, W.; Ou, X.; Du, N.; Schmidt, H. | Journal Article |
| 2019 | Assessment of FOWLP process dependent wafer warpage using parametric FE study
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas | Conference Paper |
| 2019 | BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Auersperg, J.; Auerswald, E.; Vogel, D.; Rzepka, S. | Conference Paper |
| 2019 | Beschleunigungssensoren mit großer Bandbreite und geringer Leistungsaufnahme für industrielle Anwendungen
Forke, R.; Hiller, K.; Küchler, M.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T. | Conference Paper |
| 2019 | Carbon Nanotubes for Mechanical Sensor Applications
Wagner, C.; Blaudeck, T.; Meszmer, P.; Böttger, S.; Fuchs, F.; Hermann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E. | Journal Article |
| 2019 | Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T. | Journal Article |
| 2019 | A Combined Methodology to Include System Effects in Board-Level Stress Simulations
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Döring, R.; Scheiter, L.; Tröger, B.; Zhang, M.J.; Ortmann, R.W. | Conference Paper |
| 2019 | Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, R.; Kreyssig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Frühauf, P.; Weigert, A. | Conference Paper |
| 2019 | Compliance-current-modulated resistive switching with multi-level resistance states in single-crystalline LiNbO3 thin film
Pan, X.; Shuai, Y.; Wu, C.; Luo, W.; Sun, X.; Zeng, H.; Guo, H.; Yuan, Y.; Zhou, S.; Böttger, R.; Cheng, H.; Zhang, J.; Zhang, W.; Schmidt, H. | Journal Article |
| 2019 | A Compound Control System for FR4-Based Electromagnetic Scanning Micrograting
Yu, F.; Wen, Q.; Lei, H.; Huang, L.; Wen, Z. | Journal Article |
| 2019 | Computationally efficient simulation method for conductivity modeling of 2D-based conductors
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
| 2019 | Concept of the 3rd Generation of Reliability for Electronic Smart Systems
Gromala, P.; Dietz, F.; Rzepka, S.; Han, B. | Conference Paper |
| 2019 | The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki | Conference Paper |
| 2019 | Design, Modeling, Fabrication, and Verification of New Multifunctional MEMS/NEMS Components
Freitag, M.; Sauppe, M.; Auerswald, C.; Kriebel, D.; Schmidt, H.; Voigt, S.; Arnold, B.; Markert, E.; Hahn, S.; Hiller, K.; Heinkel, U.; Mehner, J. | Journal Article |
| 2019 | Developing a process to remove single silicon layers by atomic layer etching
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
| 2019 | Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles
Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D. | Conference Paper |
| 2019 | Development of synthetic jet actuator array for vortex-flow generation
Lipowski, M.; Bäcker, D. | Conference Paper |
| 2019 | Doctor blade system for the deposition of thin semiconducting films
Petrov, D.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
| 2019 | Electrically Controlled Actuation of Strained Nanomembranes
Enderlein, T.; Nestler, J.; Stiehl, C.; Morschhauser, A.; Otto, T. | Journal Article |
| 2019 | Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution
Rayapai, V.R.; Bürger, D.; Du, N.; Patra, R.; Skorupa, I.; Blaschke, D.; Stöcker, H.; Matthes, P.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2019 | Electron transport through NiSi2–Si contacts and their role in reconfigurable field-effect transistors
Fuchs, F.; Gemming, S.; Schuster, J. | Journal Article |
| 2019 | Evaporation study based on micromodel experiments: Comparison of theory and experiment
Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J. | Journal Article |
| 2019 | Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Busse, S.; Selyshchev, O.; Mack, P.; Exner, H.; Horn, A.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2019 | FR4-based electromagnetic scanning micro-grating integrated with an angle sensor for a low-cost NIR micro-spectrometer
Wen, Q.; Lei, H.; Huang, J.; Yu, F.; Huang, L.; Zhang, J.; Li, D.; Peng, Y.; Wen, Z. | Journal Article |
| 2019 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2018
| Annual Report |
| 2019 | Herstellung von neuartigen Reflektorsystemen und Erarbeitung einer systembezogenen Integrationstechnologie für VIS und IR Fabry-Pérot Interferometer (Dissertation)
Helke, C.
: Hiller, K.; Sinzinger, S. | Dissertation |
| 2019 | Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements - Technology and Functional Test Results
Meszmer, P.; Hahn, S.; Hiller, K.; Wunderle, B. | Journal Article |
| 2019 | The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples
Geidel, S.; Morschhauser, A.; Otto, T. | Conference Paper |
| 2019 | An improved Green's function algorithm applied to quantum transport in carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2019 | Improved organic thin-film transistor performance by dielectric layer patterning
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Vollbrecht, J.; Kitzerow, H.; Paradies, J.; Hilleringmann, U. | Conference Paper |
| 2019 | Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics
Lange, S.; Schröder, D.; Hedayat, C.; Otto, T.; Hilleringmann, U. | Conference Paper |
| 2019 | Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik
Hofmann, C.; Froehlich, A.; Kroll, M.; Wiemer, M. | Conference Paper |
| 2019 | Induktives Fügen in der Mikrosystemtechnik
Hofmann, C.; Fröhlich, A. | Journal Article |
| 2019 | Inkjet Printing of Self‐Supporting and Self‐Contained Structured Objects Onto Liquid Surfaces
Goedel, W.A.; Gläser, K.; Mitra, D.; Thalheim, R.; Ueberfuhr, P.; Hammerschmidt, J.; Baumann, R.R. | Journal Article |
| 2019 | Inorganic p-channel thin-film transistors using CuO nanoparticles
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2019 | Integration of plasmonic nanostructures for micro-opto-electromechanical-systems
Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T. | Conference Paper |
| 2019 | Intelligenter Werkstückträger mit Inertialsensorik zum Überwachen und Optimieren von Fertigungsprozessen
Forke, Roman; Forke, Erik; Alalus, Mohaned Khaled; Weidlich, Sebastian; Bülz, Daniel | Conference Paper |
| 2019 | Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
Otto, A.; Rzepka, S.; Wunderle, B. | Journal Article |
| 2019 | Iron(III) β-diketonates: CVD precursors for iron oxide film formation
Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2019 | Joining two worlds - hybrid integration of silicon based electronics and printed functionalities
Roscher, F.; Thalheim, R.; Seifert, T.; Paul, S.-D.; Zichner, R.; Wiemer, M.; Otto, T. | Conference Paper |
| 2019 | Low Power High Bandwidth Acceleration Sensor for Industrial Applications
Forke, R.; Hiller, K.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T. | Conference Paper |
| 2019 | Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2019 | Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls
Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Conference Paper |
| 2019 | Measurements on the fly: Introducing mobile micro-sensors for biotechnological applications
Lauterbach, T.; Lüke, T.; Büker, M.-J.; Hedayat, C.; Gernandt, T.; Moll, R.; Grösel, M.; Lenk, S.; Seidel, F.; Brunner, D.; Bley, T.; Walther, T.; Lenk, F. | Journal Article |
| 2019 | Mechanical deformation on nanoparticle-based thin-film transistors
Vidor, F.F.; Meyers, T.; Reker, J.; Mueller, K.; Wirth, G.I.; Hilleringmann, U. | Conference Paper |
| 2019 | A MEMS IR optical chopper based on subwavelength structures
Kurth, S.; Meinig, M.; Wecker, J.; Seifert, M.; Hiller, K.; Otto, T. | Conference Paper |
| 2019 | Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications
Zschenderlein, U.; Klingler, M.; Arnold, J.; Baum, M.; Weißbach, M.; Schaal, M.; Wunderle, B. | Conference Paper |
| 2019 | Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J. | Journal Article |
| 2019 | Microwave Radiation Detection with an Ultrathin Free-Standing Superconducting Niobium Nanohelix
Loesch, S.; Alfonsov, A.; Dobrovolskiy, O.V.; Keil, R.; Engemaier, V.; Baunack, S.; Li, G.; Schmidt, O.G.; Buerger, D. | Journal Article |
| 2019 | Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Filter
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Otto, T. | Conference Paper |
| 2019 | Miniaturized multi sensor implant for monitoring of hemodynamic parameters
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Schröder, Thomas; Wünsch, Dirk; Görtz, Michael; Seidl, Karsten | Conference Paper |
| 2019 | Multisensor-Implantat zur Überwachung der Hämodynamik
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Görtz, Michael; Seidl, Karsten | Conference Paper |
| 2019 | Nanoparticles and Organic Semiconductors for Flexible Electronics
Hilleringmann, U.; Reker, J.; Meyers, T.; Vidor, F.F.; Bezuidenhout, P.H.; Joubert, T.-H. | Conference Paper |
| 2019 | Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers
Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T. | Conference Paper |
| 2019 | Next Generation of highly miniaturized Bulk-MEMS Fabry-Pérot Filters for infrared Microspectrometers
Ebermann, M.; Neumann, N.; Hoppe, S.; Hiller, K.; Seiler, J.; Helke, C.; Meinig, M.; Kurth, S. | Conference Paper |
| 2019 | A Nonlinear Broadband Electromagnetic Vibration Energy Harvester Based on Double-Clamped Beam
Lu, Z.; Wen, Q.; He, X.; Wen, Z. | Journal Article |
| 2019 | A Novel Indirect Quasi-Static Actuation Concept for 2D MEMS Micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Journal Article |
| 2019 | A Novel Method for MEMS Wafer-Level Packaging. Selective and Rapid Induction Heating for Copper-Tin SLID Bonding
Hofmann, C.; Fröhlich, A.; Kimme, J.; Wiemer, M.; Otto, T. | Conference Paper |
| 2019 | Optimization of Platinum dioxide properties by plasma oxidation of sputtered PtOx
Basu, Nivedita; Sterin, N.S.; Saketh, Ram Mamidala; Shenoy, Apoorva; Bhat, Navakanta | Journal Article |
| 2019 | Oxygen detection with zinc oxide nanoparticle structures
Schwabe, T.; Balke, A.; Bezuidenhout, P.H.; Reker, J.; Meyers, T.; Joubert, T.-H.; Hilleringmann, U. | Conference Paper |
| 2019 | P-N Junction-Based Si Biochips with Ring Electrodes for Novel Biosensing Applications
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2019 | Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T. | Journal Article, Conference Paper |
| 2019 | Photosensitive Field‐Effect Transistors Made from Semiconducting Carbon Nanotubes and Non‐Covalently Attached Gold Nanoparticles
Blaudeck, T.; Preuß, A.; Scharf, S.; Notz, S.; Kossmann, A.; Hartmann, S.; Kasper, L.; Mendes, R.G.; Gemming, T.; Hermann, S.; Lang, H.; Schulz, S.E. | Journal Article |
| 2019 | Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter | Conference Paper |
| 2019 | Printing Reinforcing Structures onto Microsieves that are Floating on a Water Surface
Goedel, W.A.; Gläser, K.; Mitra, D.; Hammerschmidt, J.; Thalheim, R.; Ueberfuhr, P.; Baumann, R.R. | Journal Article |
| 2019 | Radially resolved electronic structure and charge carrier transport in silicon nanowires
Fuchs, F.; Gemming, S.; Schuster, J. | Journal Article |
| 2019 | Regeneration of Assembled, Molecular-Motor-Based Bionanodevices
Rahman, M.A.; Reuther, C.; Lindberg, F.W.; Mengoni, M.; Salhotra, A.; Heldt, G.; Linke, H.; Diez, S.; Mansson, A. | Journal Article |
| 2019 | Role of contacts in carbon nanotube giant piezoresistive sensors
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S. | Conference Paper |
| 2019 | Sealing of glass with titanium by glass pressing at the softening point
Winkler, Sebastian; Edelmann, Jan; Günther, Daniel; Wieland, Sebastian; Selbmann, Franz; Baum, Mario; Schubert, Andreas | Journal Article |
| 2019 | Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
Froehlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kraeusel, V. | Conference Paper |
| 2019 | Self-aligned organic thin-film transistors for flexible electronics
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2019 | Sensitivity control of carbon nanotube-based piezoresistive sensors by drain-induced barrier thinning
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Schuster, J.; Hermann, S. | Journal Article |
| 2019 | Sensoric Micro and Nano Systems. Editorial
Zahn, D.R.T.; Schulz, S.E.; Hiller, K.; Wagner, C.; Reuter, D.; Otto, T. | Journal Article |
| 2019 | Simulation der Eigenerwärmung gedruckter Leiterbahnen für die thermische Auslegung
Bülz, D.; Streit, P.; Forke, R.; Otto, T. | Conference Paper |
| 2019 | Simulation of Self-Heating of Printed Interconnects for Thermal Design
Bülz, D.; Streit, P.; Forke, R.; Otto, T. | Conference Paper |
| 2019 | Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films
Hoffmann, M.A.; Sharma, A.; Matthes, P.; Okano, S.; Hellwig, O.; Ecke, R.; Zahn, D.R.T.; Salvan, G.; Schulz, S.E. | Journal Article |
| 2019 | Strain and screening: Optical properties of a small-diameter carbon nanotube from first principles
Wagner, C.; Schuster, J.; Schleife, A. | Journal Article |
| 2019 | Surface effects and photoinduced relaxation processes in nanocomposites based on semiconductor quantum dots CdSe/ZnS and organic dye molecules
Zenkevich, E.I.; Stupak, A.P.; Kowerko, D.; Blaudeck, T.; Borczyskowski, C. von | Conference Paper |
| 2019 | Synthesis of Mg and Zn diolates and their use in metal oxide deposition
Frenzel, P.; Preuß, A.; Bankwitz, J.; Georgi, C.; Ganss, F.; Mertens, L.; Schulz, S.E.; Hellwig, O.; Mehring, M.; Lang, H. | Journal Article |
| 2019 | Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C. | Journal Article |
| 2019 | Transport Properties in Co-doped ZnO/YMnO3 n-p Heterojunctions
Torres, M.L.; Skorupa, I.; Schmidt, H.; Schmidt, O.G.; Gomez, M.E. | Conference Paper, Journal Article |
| 2019 | VIS Fabry-Pérot Interferometer with structured (TiO2/PE-SiO2)3 Bragg-reflectors on 5mm large LP-Si3N4 membranes
Helke, C.; Hiller, K.; Seiler, J.; Werner, T.; Meinig, M.; Kurth, S.; Otto, T. | Conference Paper |
| 2018 | "3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W. | Conference Paper |
| 2018 | 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M. | Conference Paper |
| 2018 | Active flow control in wind turbines - integration technologies and assessment of economic effects
Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar | Conference Paper |
| 2018 | AlN film based piezoelectric large-aperture MEMS scanning micromirror integrated with angle sensors
Lei, H.; Wen, Q.; Yu, F.; Li, D.; Shang, Z.; Huang, J.; Wen, Z. | Journal Article |
| 2018 | Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T. | Journal Article |
| 2018 | Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van | Conference Paper |
| 2018 | Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Journal Article |
| 2018 | Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E. | Conference Paper |
| 2018 | Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven | Conference Paper |
| 2018 | β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton | Abstract |
| 2018 | Challenges in transferring quantum dot sensitized solar cells on technical textiles
Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T. | Conference Paper |
| 2018 | Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W. | Journal Article |
| 2018 | Deposition methods for C8-BTBT in flexible TFTs
Meyers, T.; Reker, J.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development
Correia, V.; Mitra, K.Y.; Castro, H.; Rocha, J.G.; Sowade, E.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2018 | Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T. | Journal Article |
| 2018 | Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R. | Conference Paper |
| 2018 | Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung
Schacht, R.; Rzepka, S. | Conference Paper |
| 2018 | Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren
Noerdemann, A. | Bachelor Thesis |
| 2018 | Electrical Conductivity Modeling of Graphene-based Conductor Materials
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E. | Journal Article |
| 2018 | Electroanalysis moves towards paper-based printed electronics
Cinti, S.; Colozza, N.; Cacciotti, I.; Moscone, D.; Polomoshnov, M.; Sowade, E.; Baumann, R.R.; Arduini, F. | Journal Article |
| 2018 | Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas | Conference Paper |
| 2018 | Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H. | Journal Article |
| 2018 | Electronic transport through defective semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2018 | Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S. | Conference Paper |
| 2018 | Elektronentransport in Graphen-Nanobändern mit Kantenrauheit
Rodemund, T.S. | Bachelor Thesis |
| 2018 | Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T. | Conference Paper |
| 2018 | Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S. | Conference Paper |
| 2018 | Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S. | Conference Paper |
| 2018 | Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S. | Conference Paper |
| 2018 | Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes
Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R. | Journal Article |
| 2018 | Fatigue Crack Growth Analysis of Interface between Lead Frame and Molding Compound
Bektas, E.; Broermann, K.; Brumm, S.P.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2018 | Feasible device architectures for ultrascaled CNTFETs
Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M. | Journal Article |
| 2018 | Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching
Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H. | Journal Article |
| 2018 | FR4-Based Electromagnetic Scanning Micromirror Integrated with Angle Sensor
Lei, H.; Wen, Q.; Yu, F.; Zhou, Y.; Wen, Z. | Journal Article |
| 2018 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017
| Annual Report |
| 2018 | Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas | Conference Paper |
| 2018 | Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology
Geneiß, V.; Lüke, T.; Hedayat, C.; Wolf, M.; Janek, F.; Meißner, T.; Barth, M.; Eberhardt, W.; Zimmermann, A.; Otto, T. | Conference Paper |
| 2018 | Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Journal Article |
| 2018 | An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Indirect X-ray detectors based on inkjet-printed photodetectors with a screen-printed scintillator layer
Oliveira, J.; Correia, V.; Sowade, E.; Etxebarria, I.; Rodriguez, R.D.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2018 | Influence of defect-induced deformations on electron transport in carbon nanotubes
Teichert, F.; Wagner, C.; Croy, A.; Schuster, J. | Journal Article |
| 2018 | Influence of the electrode material on the performance of BTBT-based thin-film transistors
Meyers, T.; Reker, J.; Petrov, D.; Hilleringmann, U.; Vidor, F.F. | Conference Paper |
| 2018 | Inkjet printing and intense pulsed light sintering of multiwall carbon nanotubes for sensor applications
Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R. | Conference Paper |
| 2018 | Inkjet Printing and Intense Pulsed Light Sintering of Multiwall Carbon Nanotubes for Sensor Applications
Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R. | Journal Article |
| 2018 | Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Inkjet-Printed Wireless Chemiresistive Sensors: A review
Hartwig, M.; Zichner, R.; Joseph, Y. | Journal Article |
| 2018 | Integrated Microsystems for Smart Applications
Otto, T.; Kurth, S.; Voigt, S.; Morschhauser, A.; Meinig, M.; Hiller, K.; Martin, J.; Vogel, M. | Journal Article |
| 2018 | Integration of covalent and non-covalent functionalized SWCNTs in FETs
Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H. | Abstract |
| 2018 | Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications
Otto, A.; Rzepka, S.; Wunderle, B. | Conference Paper |
| 2018 | Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T. | Conference Paper |
| 2018 | Investigation of Electromagnetic Angle Sensor Integrated in FR4-Based Scanning Micromirror
Wen, Q.; Lei, H.; Yu, F.; Li, D.; She, Y.; Huang, J.; Huang, L.; Wen, Z. | Journal Article |
| 2018 | Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing
Wolf, M.; Janek, F.; Meissner, T.; Wigger, B.; Barth, M.; Guenter, T.; Eberhardt, W.; Zimmermann, A.; Geneiss, V.; Lueke, T.; Hedayat, C.; Otto, T. | Conference Paper |
| 2018 | Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Journal Article |
| 2018 | Klebeelement und Ventilanordnung
Morschhauser, Andreas; Nestler, Jörg; Otto, Thomas; Stiehl, Cornelia | Patent |
| 2018 | Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung
Otto, T. | Book Article |
| 2018 | Liquid crystalline dithienothiophene derivatives for organic electronics
Vollbrecht, J.; Oechsle, P.; Stepen, A.; Hoffmann, F.; Paradies, J.; Meyers, T.; Hilleringmann, U.; Schmidtke, J.; Kitzerow, H. | Journal Article |
| 2018 | Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B. | Conference Paper |
| 2018 | Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B. | Conference Paper |
| 2018 | Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G. | Abstract |
| 2018 | Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S. | Conference Paper |
| 2018 | A micro-electromechanical systems based vibration energy harvester with aluminum nitride piezoelectric thin film deposited by pulsed direct-current magnetron sputtering
He, X.; Wen, Q.; Lu, Z.; Shang, Z.; Wen, Z. | Journal Article |
| 2018 | Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Wecker, J. | Conference Paper |
| 2018 | Miniaturized NIR Spectrometer Based on Novel MOEMS Scanning Tilted Grating
Huang, J.; Wen, Q.; Nie, Q.; Chang, F.; Zhou, Y.; Wen, Z. | Journal Article |
| 2018 | Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S. | Conference Paper |
| 2018 | Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X. | Dissertation |
| 2018 | Nanostructures for smart systems
Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T. | Conference Paper |
| 2018 | A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A. | Conference Paper |
| 2018 | On the Experimental Characterization of Morphing Structures
Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M. | Book Article |
| 2018 | On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements
Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P. | Conference Paper |
| 2018 | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S. | Conference Paper |
| 2018 | Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
| 2018 | Performance analysis of CuO nanoparticle-based thin-film transistors
Reker, J.; Meyers, T.; Petrov, D.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2018 | Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D. | Conference Paper |
| 2018 | Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2018 | Portable Sensor System for UV-Irradiation Measurements
Petrov, D.; Narayan, R.S.; Hilleringmann, U. | Conference Paper |
| 2018 | Printed batteries and conductive patterns in technical textiles
Willert, A.; Meuser, C.; Baumann, R.R. | Journal Article, Conference Paper |
| 2018 | Printing techniques for batteries
Willert, A.; Tran-Le, A.-T.; Mitra, K.Y.; Clair, M.; Costa, C.M.; Lanceros-Méndez, S.; Baumann, R.R. | Book Article |
| 2018 | Process development of large area R2R printing and sintering of conductive patterns by inkjet and infra-red technologies tailored for printed electronics
Mitra, K.Y.; Kapadia, S.; Hartwig, M.; Sowade, E.; Xu, Z.; Baumann, R.R.; Zichner, R. | Journal Article |
| 2018 | Quantum transport in defective carbon nanotubes at mesoscopic length scales
Teichert, F. | Dissertation |
| 2018 | Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T. | Conference Paper |
| 2018 | Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Journal Article |
| 2018 | Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O. | Journal Article |
| 2018 | Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K. | Journal Article, Conference Paper |
| 2018 | RFID units for a product based control of industrial production systems
Schmidt, M.; Metz, G.; Hedayat, C.; Otto, T.; Petrov, D. | Conference Paper |
| 2018 | The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T. | Journal Article, Conference Paper |
| 2018 | SAMPL - Secure Additive Manufacturing Platform
Gratias, A.; Böttcher, F.; Holland, M.; Schueller, M. | Conference Paper |
| 2018 | Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems
Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S. | Conference Paper |
| 2018 | Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
| 2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2016)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article |
| 2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Journal Article, Conference Paper |
| 2018 | Stochastic analyzes and Monte-Carlo simulations of nonlinear and non-ideal mixed-signal phase-locked loops
Schmidt, M.; Hangmann, C.; Hedayat, C.; Hilleringmann, U.; Otto, T. | Conference Paper |
| 2018 | Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen
Rothe, T.
: Gemming, S.; Schuster, J.; Lorenz, E. | Bachelor Thesis |
| 2018 | Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S. | Conference Paper |
| 2018 | Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt | Book Article |
| 2018 | Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer
Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E. | Conference Paper |
| 2018 | Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication
Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H. | Journal Article |
| 2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Conference Paper |
| 2018 | Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints
Kumar, A.; Zschenderlein, U.; Baum, M.; Brunschwiler, T.; Wright, D.N.; Wunderle, B. | Conference Paper |
| 2018 | Thin Film Piezoelectric Aluminum Nitride for Piezoelectric Micromachined Ultrasonic Transducers
Stoeckel, C.; Meinel, K.; Melzer, M.; Otto, T. | Conference Paper |
| 2018 | Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors
Becker, T.E.; Vidor, F.F.; Wirth, G.I.; Meyers, T.; Reker, J.; Hilleringmann, U. | Conference Paper |
| 2018 | Transient electro-thermal coupled system simulation
Schacht, R.; Rzepka, S. | Conference Paper |
| 2018 | Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R. | Conference Paper |
| 2018 | Tuning of diameter and electronic type of CCVD grown SWCNTs
Jafarpour, S.M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2018 | Vertically aligned carbon nanotube films as absorption layers for IR applications
Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha | Conference Paper |
| 2018 | Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T. | Conference Paper |
| 2018 | Welcome to the 12th Smart Systems Integration
Otto, T. | Conference Paper |
| 2018 | Work function and conductivity of inkjet-printed silver layers: Effect of inks and post-treatments
Mitra, D.; Mitra, K.Y.; Dzhagan, V.; Pillai, N.; Zahn, R.T.; Baumann, R.R. | Journal Article |
| 2017 | 3D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T. | Journal Article, Conference Paper |
| 2017 | 3D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael | Conference Paper |
| 2017 | 3D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2017 | 3D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias
Hofmann, L. | Dissertation |
| 2017 | Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes
Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J. | Journal Article |
| 2017 | Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Conference Paper |
| 2017 | Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny | Conference Paper |
| 2017 | Ätzung von Nanostrukturen
Hilleringmann, U. | Book Article |
| 2017 | Biomedical diagnostics enabled by integrated organic and printed electronics
Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J. | Journal Article |
| 2017 | Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W. | Conference Paper |
| 2017 | Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates
Mitra, D.; Baumann, R.R. | Conference Paper |
| 2017 | Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L. | Conference Paper |
| 2017 | Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Journal Article, Conference Paper |
| 2017 | Complementary field-effect transistors for flexible electronics
Hilleringmann, U.; Vidor, F.F.; Meyers, T. | Conference Paper |
| 2017 | A concept for an ice detection system on overhead power lines, theory and practical results
Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S. | Conference Paper |
| 2017 | Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates
Mitra, D.; Baumann, R.R. | Conference Paper |
| 2017 | Control system design for a morphing wing trailing edge
Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R. | Conference Paper |
| 2017 | Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment
Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R. | Journal Article |
| 2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Conference Paper |
| 2017 | Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2017 | Design of a 2D MEMS micromirror with indirect static actuation
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Conference Paper |
| 2017 | Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T. | Conference Paper |
| 2017 | Development history and current achievements of printed primary batteries
Willert, A.; Baumann, R.R. | Conference Paper |
| 2017 | Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B. | Presentation |
| 2017 | Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L. | Conference Paper |
| 2017 | Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S. | Conference Paper |
| 2017 | Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S. | Journal Article |
| 2017 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Conference Paper |
| 2017 | Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S. | Conference Paper |
| 2017 | Elastic and piezoresistive properties of nickel carbides from first principles
Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S. | Journal Article |
| 2017 | An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F. | Journal Article |
| 2017 | Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2017 | Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T. | Journal Article |
| 2017 | Emerging applications: PICs as a platform for lab on chip devices
Geidel, S.; Otto, T. | Journal Article |
| 2017 | Erweiterung konventioneller Bauelemente durch Nanotechniken
Hilleringmann, U.; Horstmann, J.T. | Book Article |
| 2017 | Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan | Abstract |
| 2017 | Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S. | Journal Article |
| 2017 | FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R. | Conference Paper |
| 2017 | Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K. | Conference Paper |
| 2017 | Fluidic actuators for separation control at the engine/wing junction
Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M. | Journal Article, Conference Paper |
| 2017 | Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016
| Annual Report |
| 2017 | Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications
Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R. | Journal Article |
| 2017 | Go beyond 4.0 - towards digital fabrication based on printing
Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T. | Conference Paper |
| 2017 | Halbleitende Nanopartikel für Feldeffekttransistoren
Hilleringmann, U. | Book Article |
| 2017 | HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | High-Q whispering gallery microdisk resonators based on silicon oxynitride
Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A. | Journal Article |
| 2017 | Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten
Hangmann, C. | Dissertation |
| 2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
| 2017 | Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton | Conference Paper |
| 2017 | Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2017 | Increase of functional density of hybrid structures by integration of micro and nano systems
Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L. | Conference Paper |
| 2017 | Inductive temperature measurement for fast and optimized adhesive curing
Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A. | Conference Paper |
| 2017 | Influence of processing atmosphere for QD-LEDs
Langenickel, J.; Weiß, A.; Otto, T. | Conference Paper |
| 2017 | Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application
Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Journal Article |
| 2017 | Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates
Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G. | Conference Paper |
| 2017 | Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M. | Conference Paper |
| 2017 | Integration of ZnO nanoparticle transistors on freestanding flexible substrates
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
| 2017 | Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2017 | Investigation on inkjet printing for electromagnetic applications
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Abstract |
| 2017 | Investigation on inkjet printing for electromagnetic compatibility application
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R. | Conference Paper |
| 2017 | Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T. | Conference Paper |
| 2017 | Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T. | Conference Paper |
| 2017 | Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T. | Conference Paper |
| 2017 | Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities
Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M. | Journal Article, Conference Paper |
| 2017 | Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Conference Paper |
| 2017 | Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G. | Journal Article |
| 2017 | A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester
He, X.; Wen, Q.; Sun, Y.; Wen, Z. | Journal Article |
| 2017 | Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E. | Journal Article |
| 2017 | Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U. | Journal Article |
| 2017 | Mass production of magnesium silicide as a TEG material
Schoenhoff, M.; Hilleringmann, U.; Boor, J. de | Conference Paper |
| 2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Conference Paper |
| 2017 | Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fügmann, U.; Illing-Günther, H.; Nestler, D.; Hübler, A.C.; Nendel, K.; Kroll, L.; Otto, T. | Journal Article |
| 2017 | Mechanical, electronic and optical properties of strained carbon nanotubes
Wagner, C.F. | Dissertation |
| 2017 | MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung
Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T. | Conference Paper |
| 2017 | Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate
Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T. | Journal Article |
| 2017 | Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A. | Conference Paper |
| 2017 | Multilayer micromechanics process with thick functional layers (EPyC40)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E. | Journal Article |
| 2017 | Nanophotonic biosensor for space exploration (PBSA instrument)
Pantoja, S.; Parro, V.; Nestler, J.; Geidel, S.; Martins, R.; Cuesta, F.; Elvira, J.G.; Sousa, A. | Conference Paper |
| 2017 | Novel concept of integrated micro actuation of membranes in liquid environments
Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T. | Conference Paper |
| 2017 | A novel gyroscopic actuation concept for 2D MEMS micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Organic thin-film transistors for AMOLED applications
Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U. | Conference Paper |
| 2017 | Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol
Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P. | Journal Article |
| 2017 | Printing technologies for the manufacturing of passive microwave components: Antennas
Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R. | Journal Article |
| 2017 | Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T. | Conference Paper |
| 2017 | Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk | Patent |
| 2017 | Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U. | Conference Paper |
| 2017 | Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N. | Conference Paper |
| 2017 | Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Journal Article, Conference Paper |
| 2017 | Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A. | Conference Paper |
| 2017 | Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S. | Conference Paper |
| 2017 | Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2017 | Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D. | Conference Paper |
| 2017 | Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E. | Abstract |
| 2017 | Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T. | Journal Article, Conference Paper |
| 2017 | Sens-o-Spheres - A concept for location independent acquisition of process measurement signals
Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P. | Conference Paper |
| 2017 | Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael | Journal Article, Conference Paper |
| 2017 | Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T. | Journal Article, Conference Paper |
| 2017 | Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B. | Journal Article, Conference Paper |
| 2017 | Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T. | Conference Paper |
| 2017 | A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B. | Conference Paper |
| 2017 | Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E. | Conference Paper |
| 2017 | Welcome to the 11th Smart Systems Integration
Otto, T. | Conference Paper |
| 2016 | 3D integration technologies for MEMS
Geßner, T.; Hofmann, L.; Wang, W.-S.; Baum, M.; Seifert, T.; Wiemer, M.; Schulz, S. | Conference Paper |
| 2016 | Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs
Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K. | Conference Paper |
| 2016 | Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2016 | Advances in Deposition of Main-Group Metal Oxides and Rare-Earth Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | Advances in Deposition of Metals from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | Advances in Deposition of Transition-Metal Oxides from Metal Enolates
Lang, H.; Adner, D.; Georgi, C. | Book Article |
| 2016 | All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates
Moya, A.; Sowade, E.; del Campo, F.J.; Mitra, K.Y.; Ramon, E.; Villa, R.; Baumann, R.R.; Gabriel, G. | Journal Article |
| 2016 | All-inkjet-printed low-pass filters with adjustable cutoff frequency consisting of resistors, inductors and transistors for sensor applications
Castro, H.F.; Correia, V.; Sowade, E.; Mitra, K.Y.; Rocha, J.G.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2016 | All-inkjet-printed thin-film transistors: Manufacturing process reliability by root cause analysis
Sowade, E.; Ramon, E.; Mitra, K.Y.; Martínez-Domingo, C.; Pedró, M.; Pallarès, J.; Loffredo, F.; Villani, F.; Gomes, H.L.; Terés, L.; Baumann, R.R. | Journal Article |
| 2016 | Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K. | Conference Paper |
| 2016 | Application of microcontrollers in solar-powered model gliders with sensor systems
Petrov, D.; Hilleringmann, U. | Conference Paper |
| 2016 | Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection
Passilly, N.; Perrin, S.; Lullin, J.; Albero, J.; Bargiel, S.; Froehly, L.; Gorecki, C.; Krauter, J.; Osten, W.; Wang, W.-S.; Wiemer, M. | Conference Paper |
| 2016 | Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S. | Conference Paper |
| 2016 | Bis(β-diketonato)-and allyl-(β-diketonato)-palladium(II) complexes: Synthesis, characterization and MOCVD application
Assim, K.; Melzer, M.; Korb, M.; Rüffer, T.; Jakob, A.; Noll, J.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Cavity-enhanced mm-wave spectrometer with integrated SiGe front-end for oxygen concentration measurement
Wecker, J.; Kurth, S.; Mangalgiri, G.; Otto, T.; Gessner, T.; Gaitzsch, M.; Bauch, A.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
| 2016 | Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Wang, W.-S.; Wiemer, M. | Conference Paper |
| 2016 | Ceramic substrate technology for wafer level packaging of MEMS
Ziesche, Steffen; Ihle, Martin; Gabler, Felix; Roscher, Frank | Conference Paper |
| 2016 | CF3Br plasma cryo etching of low-k porous dielectric
Clemente, I.; Koehler, N.; Miakonkikh, A.; Zimmermann, S.; Schulz, S.E.; Rudenko, K. | Journal Article, Conference Paper |
| 2016 | Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2016 | Chemical vapor deposition of ruthenium-based layers by a single-source approach
Jeschke, J.; Möckel, S.; Korb, M.; Rüffer, T.; Assim, K.; Melzer, M.; Herwig, G.; Georgi, C.; Schulz, S.E.; Lang, H. | Journal Article |
| 2016 | CNTFET-based RF electronics - State-of-the-art and future prospects
Schröter, M.; Claus, M.; Hermann, S.; Tittman-Otto, J.; Haferlach, M.; Mothes, S.; Schulz, S. | Conference Paper |
| 2016 | Comparison of atomistic quantum transport and numerical device simulation for carbon nanotube field-effect transistors
Fuchs, F.; Zienert, A.; Mothes, S.; Claus, M.; Gemming, S.; Schuster, J. | Conference Paper |
| 2016 | Competitive impact of nanotube assembly and contact electrodes on the performance of CNT-based FETs
Toader, M.; Hermann, S.; Scharfenberg, L.; Hartmann, M.; Mertig, M.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Concept for a miniaturized cardiovascular multi sensor implant
Dogan, Özgü; Weidenmüller, Jens; Gembaczka, Pierre; Stanitzki, Alexander; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Görtz, Michael | Abstract |
| 2016 | COSIVU - Compact, smart and reliable drive unit for fully electric vehicles
Andersson, D.R.; Brinkfeldt, K.; Nord, S.; Ottosson, J.; Lampic, G.; Gotovac, G.; Zschieschang, O.; Baumgartel, H.; Brusius, M.; Kaulfersch, E.; Hilpert, F.; Otto, A.; Frankeser, S. | Conference Paper |
| 2016 | Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | Design and fabrication of a SiC-based power module with double-sided cooling for automotive applications
Brinkfeldt, K.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Kaulfersch, E.; Edwards, M.; Otto, A.; Andersson, D. | Conference Paper |
| 2016 | The design challenge in printing devices and circuits: Influence of the orientation of print patterns in inkjet-printed electronics
Sowade, E.; Polomoshnov, M.; Baumann, R.R. | Journal Article |
| 2016 | Direct integration of field effect transistors as electro mechanical transducer for stress on beam structures
Haas, S.; Hafez, N.; Loebel, K.-U.; Koegel, E.; Ramsbeck, M.; Reuter, D.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2016 | Effect of cleaning procedures on the electrical properties of carbon nanotube transistors - a statistical study
Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R.D.; Schulz, S.E.; Zahn, D.R.T.; Gessner, T. | Journal Article |
| 2016 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T. | Journal Article |
| 2016 | Efficient design methodology for inductive energy transmission
Büker, M.-J.; Hedayat, C.; Hilleringmann, U.; Geßner, T. | Conference Paper |
| 2016 | Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S. | Conference Paper |
| 2016 | Electron transport in defective metallic and semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
| 2016 | Electroplating of neodymium iron alloys
Kurth, F.; Froemel, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
| 2016 | Embedding electrochemical impedance spectroscopy in smart battery management systems using multicore technology
Armengaud, E.; Macher, G.; Groppo, R.; Novaro, M.; Otto, A.; Döring, R.; Schmidt, H.; Kras, B.; Stankiewicz, S. | Conference Paper |
| 2016 | Empirical transport model of strained CNT transistors used for sensor applications
Wagner, C.; Schuster, J.; Gessner, T. | Journal Article |
| 2016 | Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S. | Journal Article |
| 2016 | ENIAC-Projekt ESEE: Photoakustischer Sensor und Sauerstoffsensor mit mm-Wellen Cavity-Resonator
Wecker, Julia; Gaitzsch, Markus; Kurth, Steffen; Weber, Christian; Schmitt, Katrin; Wöllenstein, Jürgen | Report |
| 2016 | Erarbeitung einer Fertigungstechnologie und Charakterisierungsmethodik für die Herstellung hochsensitiver Vibrationssensoren unter Nutzung des Mikroschweißprozesses
Haubold, M. | Dissertation |
| 2016 | Event driven modeling and characterization of the second order voltage switched charge pump PLL
Ali, E.; Hangmann, C.; Hedayat, C.; Haddad, F.; Rahajandraibe, W.; Hilleringmann, U. | Journal Article |
| 2016 | Exchange-biased Py/CoO vortex structures: Magnetization reversal, cooling-field dependence, and training
Nissen, D.; Klein, O.; Matthes, P.; Albrecht, M. | Journal Article |
| 2016 | Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Exploitation of giant piezoresistivity - CNT sensors fabricated with a wafer-level technology
Böttger, S.; Schulz, S.E.; Hermann, S. | Journal Article, Conference Paper |
| 2016 | Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies
Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T. | Conference Paper |
| 2016 | Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S. | Journal Article |
| 2016 | Fluidic actuators for active flow control on airframe
Schueller, M.; Weigel, P.; Lipowski, M.; Meyer, M.; Schlösser, P.; Bauer, M. | Conference Paper |
| 2016 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2015
| Annual Report |
| 2016 | High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly
Dinh, Nghia Trong; Sowade, Enrico; Blaudeck, T.; Hermann, S.; Rodriguez, Raul D.; Zahn, Dietrich R.T.; Schulz, S.E.; Baumann, R.R.; Kanoun, Olfa | Journal Article |
| 2016 | A highly miniaturized two-axis acceleration sensor for implantable hemody-namic controlling system
Wünsch, Dirk; Hiller, Karla; Forke, Roman; Baum, Mario; Wiemer, Maik; Geßner, Thomas; Görtz, Michael; Weidenmüller, Jens; Dogan, Özgü | Abstract |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
| 2016 | Improved RF design using precise 3D near-field measurements and near-field to far-field transformations
Hangmann, C.; Mager, T.; Khan, S.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2016 | An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals
Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Journal Article |
| 2016 | Integration of an optical ring resonator biosensor into a self-contained microfluidic cartridge with active, single-shot micropumps
Geidel, S.; Peransi Llopis, S.; Rodrigo, M.; Diego-Castilla, G. de; Sousa, A.; Nestler, J.; Otto, T.; Gessner, T.; Parro, V. | Journal Article |
| 2016 | Integration of humidity sensors into fibre-reinforced thermoplastic composites
Ebert, F.; Seider, T.; Illing-Günther, H.; Nendel, K.; Martin, J.; Otto, T.; Gessner, T.; Nestler, D.; Wagner, G. | Journal Article, Conference Paper |
| 2016 | Intense pulsed light sintering of an inkjet printed silver nanoparticle ink depending on the spectral absorption and reflection of the background
Mitra, D.; Mitra, K.Y.; Hartwig, M.; Baumann, R.R. | Journal Article |
| 2016 | Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S. | Conference Paper |
| 2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Journal Article |
| 2016 | Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding
Tanaka, K.; Wang, W.-S.; Baum, M.; Froemel, J.; Hirano, H.; Tanaka, S.; Wiemer, M.; Otto, T. | Journal Article |
| 2016 | Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors
Böttger, S.; Hermann, S.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Light electric vehicle enabled by smart systems integration
John, R.; Kahrimanovic, E.; Otto, A.; Tavernini, D.; Camocardi, M.; Perelli, P.; Dalmasso, D.; Blaz, S.; Trojaniello, D.; Oleari, E.; Sanna, A.; Groppo, R.; Romano, C. | Conference Paper |
| 2016 | Liquid reagent storage in self-pumping lab-on-a-chip systems for quick assay and biosensor integration
Nestler, J.; Haber, N.; Stiehl, C.; Otto, T.; Gessner, T. | Conference Paper |
| 2016 | Low temperature layer purification by pulsed UV-irradiation for flexible dye sensitized solar cells
Kleine, A.; Hilleringmann, U. | Conference Paper |
| 2016 | Low temperature thermo compression bonding with printed intermediate bonding layers
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T. | Conference Paper |
| 2016 | Low-cost treatment for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Conference Paper |
| 2016 | Magnesium silicide TEGs as self-sufficient power supply for smart systems
Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
| 2016 | Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films
Assim, K.; Jeschke, J.; Jakob, A.; Dhakal, D.; Melzer, M.; Georgi, C.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2016 | Maskless reduction of crosstalk suitable for flexible electronics
Meyers, T.; Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2016 | Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S. | Conference Paper |
| 2016 | Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas | Conference Paper |
| 2016 | Measurement and modeling of the effective thermal conductivity of sintered silver pastes
Ordonez-Miranda, J.; Hermens, M.; Nikitin, I.; Kouznetsova, V.G.; Sluis, O. van der; Ras, M.A.; Reparaz, J.S.; Wagner, M.R.; Sledzinska, M.; Gomis-Bresco, J.; Sotomayor Torres, C.M.; Wunderle, B.; Volz, S. | Journal Article |
| 2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Conference Paper |
| 2016 | A MEMS test stage for in situ testing of interfaces between carbon nanotubes and metals
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2016 | MEMS tunable Fabry-Pérot filters for infrared microspectrometer applications
Neumann, N.; Ebermann, M.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2016 | Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles
Rodriguez, R.D.; Blaudeck, T.; Kalbacova, J.; Sheremet, E.; Schulze, S.; Adner, D.; Hermann, S.; Hietschold, M.; Lang, H.; Schulz, S.E.; Zahn, D.R.T. | Journal Article |
| 2016 | Microelectromechanical switch and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
| 2016 | Microelectromechanical system and method for manufacturing the same
Kurth, Steffen; Voigt, Sven; Haas, Sven; Ikeda, Koichi; Akiba, Akira | Patent |
| 2016 | Microwave filter design optimized for ceramic multilayer technique
Uhlig, P.; Kassner, J.; Guenner, C.; Noack, E. | Journal Article, Conference Paper |
| 2016 | Miniaturized vortex-induced vibration energy harvester for low velocity air flow application
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Geßner, T. | Conference Paper |
| 2016 | Modeling of MOEMS electromagnetic scanning grating mirror for NIR micro-spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.; Yang, T. | Journal Article |
| 2016 | A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | Next generation drivetrain concept featuring self-learning capabilities enabled by extended information technology functionalities
Otto, A.; Rzepka, S. | Conference Paper |
| 2016 | Novel test stand for thermal diffusivity measurement of bulk and thin films
Ras, M.A.; May, D.; Wunderle, B. | Conference Paper |
| 2016 | Novel through silicon wiring technology using dry etched sloping vertical terminals
Haas, S.; Voigt, S.; Arnold, M.; Schwenzer, F.; Braunschweig, M.; Küchler, M.; Kurth, S.; Gessner, T. | Conference Paper |
| 2016 | Optimization of a zinc oxide dispersion for building Quantum Dot Light Emitting Diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2016 | Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end
Wecker, J.; Bauch, A.; Kurth, S.; Mangalgiri, G.; Gaitzsch, M.; Meinig, M.; Gessner, T.; Nasr, I.; Weigel, R.; Kissinger, D.; Hackner, A.; Prechtel, U. | Conference Paper |
| 2016 | Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2016 | Piezoelektrische Aluminiumnitrid-Dünnschichten für mikroelektromechanische Systeme
Stöckel, C. | Dissertation |
| 2016 | A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics
Koehler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Journal Article |
| 2016 | Printed batteries designed to power OLED applications
Willert, A.; Helmert, M.; Baumann, R.R. | Conference Paper |
| 2016 | Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B. | Conference Paper |
| 2016 | Product data and Sensor-based intelligent drive Control for flexible manufacturing and intralogistic processes
Geneiß, V.; Hedayat, C.; Bertelsmeier, F.; Henke, C.; Vathauer, K.-E.; Geßner, T. | Conference Paper |
| 2016 | Re-building the underfill: Performance of percolating fillers at package scale
Zschenderlein, U.; Baum, M.; Schlottig, G.; Schindler-Saefkow, F.; Kumar, S.G.; Wang, W.-S.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
| 2016 | Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles
Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I. | Conference Paper |
| 2016 | Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B. | Conference Paper |
| 2016 | Reliability investigation on SiC BJT power module
Otto, A.; Kaulfersch, E.; Frankeser, S.; Brinkfeldt, K.; Zschieschang, O.; Rzepka, S. | Conference Paper |
| 2016 | Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Brunschwiler, T.; Zürcher, J.; Zimmermann, S.; Burg, B.R.; Schlottig, G.; Chen, X.; Sinha, T.; Baum, M.; Hofmann, C.; Pantou, R.; Achen, A.; Zschenderlein, U.; Kumar, S.; Wunderle, B.; Haupt, M.; Schindler-Saefkow, F.; Strässle, R. | Conference Paper |
| 2016 | Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Conference Paper |
| 2016 | Self-assembly of spherical colloidal photonic crystals inside inkjet-printed droplets
Sowade, E.; Blaudeck, T.; Baumann, RR. | Journal Article |
| 2016 | Silicon oxynitride microdisk resonators for integrated waveguide coupling
Hett, T.; Frers, T.; Widhalm, A.; Berth, G.; Hilleringmann, U.; Zrenner, A. | Conference Paper |
| 2016 | Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg | Conference Paper |
| 2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Abstract |
| 2016 | Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Conference Paper |
| 2016 | Structure and thermoelectric properties of PbTe films deposited by thermal evaporation method
Nguyen, M.P.; Froemel, J.; Hatayama, S.; Sutou, Y.; Koike, J.; Tanaka, S.; Esashi, M.; Gessner, T. | Conference Paper |
| 2016 | Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2016 | Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling
Niessner, M.; Dudek, R.; Hildebrandt, M.; Gehring, M.; Yongbo, Y.; Piller, A.; Schrag, G. | Conference Paper |
| 2016 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Journal Article, Conference Paper |
| 2016 | Thermal design of integrated heating for lab-on-a-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Schulze, R.; Gessner, T. | Conference Paper |
| 2016 | Thermal simulations and experimental verification of power modules designed for double sided cooling
Brinkfeldt, K.; Ottosson, J.; Otto, A.; Mann, A.; Zschieschang, O.; Frankeser, S.; Andersson, D. | Conference Paper |
| 2016 | Time-efficient curing of printed dielectrics via infra-red suitable to S2S and R2R manufacturing platforms for electronic devices
Mitra, K.Y.; Weise, D.; Hartwig, M.; Kapadia, S.; Baumann, R.R. | Journal Article |
| 2016 | Towards distributed intelligent sensor and information fusion
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article |
| 2016 | Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2016 | Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers
Meinig, M.; Kurth, S.; Seifert, M.; Hiller, K.; Wecker, J.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2016 | Tunable MEMS Fabry-Pérot filters for infrared microspectrometers: A review
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2016 | Tuning the reduction and conductivity of solution-processed graphene oxide by intense pulsed light
Al-Hamry, A.; Kang, H.; Sowade, E.; Dzhagan, V.; Rodriguez, R.D.; Müller, C.; Zahn, D.R.T.; Baumann, R.R.; Kanoun, O. | Journal Article |
| 2016 | Up-scaling of the manufacturing of all-inkjet-printed organic thin-film transistors: Device performance and manufacturing yield of transistor arrays
Sowade, E.; Mitra, K.Y.; Ramon, E.; Martinez-Domingo, C.; Villani, F.; Loffredo, F.; Gomes, H.L.; Baumann, R.R. | Journal Article |
| 2016 | Upscaling of the inkjet printing process for the manufacturing of passive electronic devices
Sternkiker, C.; Sowade, E.; Mitra, K.Y.; Zichner, R.; Baumann, R.R. | Journal Article |
| 2016 | Using quantum dot photoluminescence for load detection
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.; Gessner, T. | Journal Article |
| 2016 | Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding
Wang, W.-S.; Wiemer, M.; Froemel, J.; Enderlein, T.; Gessner, T.; Lullin, J.; Bargiel, S.; Passilly, N.; Albero, J.; Gorecki, C. | Conference Paper |
| 2016 | VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy
Helke, C.; Meinig, M.; Seifert, M.; Seiler, J.; Hiller, K.; Kurth, S.; Martin, J.; Gessner, T. | Conference Paper |
| 2016 | Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems
Bonitz, J.; Böttger, S.; Herrmann, S.; Schulz, S.E.; Gessner, T.; Hartmann, S.; Wunderle, B. | Conference Paper |
| 2016 | Welcome to smart systems integration 2016
Gessner, T. | Conference Paper |
| 2015 | [Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2015 | "LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B. | Conference Paper |
| 2015 | 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
Hofmann, L.; Dempwolf, S.; Reuter, D.; Ecke, R.; Gottfried, K.; Schulz, S.E.; Knechtel, R.; Geßner, T. | Conference Paper |
| 2015 | 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages
Hofmann, L.; Reuter, D.; Schubert, I.; Wuensch, D.; Rennau, M.; Ecke, R.; Vogel, K.; Gottfried, K.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2015 | Acceleration of lifetime modeling by isothermal bending fatigue tests
Heilmann, J.; Arnold, J.; Wunderle, B. | Conference Paper |
| 2015 | Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
Seifert, T.; Sowade, E.; Roscher, F.; Wiemer, M.; Gessner, T.; Baumann, R.R. | Journal Article |
| 2015 | Advances in percolated thermal underfill (PTU) simulations for 3D-integration
Kumar, S.G.; Zschenderlein, U.; Pantou, R.; Brunschwiler, T.; Schlottig, G.; Schindler-Saefkow, F.; Wunderle, B. | Conference Paper |
| 2015 | Aerosol jet printing of nano particle based electrical chip interconnects
Seifert, T.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime
Gomes, H.L.; Medeiros, M.C.R.; Villani, F.; Canudo, J.; Loffredo, F.; Miscioscia, R.; Martinez-Domingo, C.; Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; McCulloch, I.; Carrabina, J. | Journal Article |
| 2015 | Assembly and packaging of micro systems by using reactive bonding processes
Schumacher, Axel; Gaiß, Ulrike; Knappmann, Stefan; Dietrich, Georg; Braun, Stefan; Pflug, Erik; Roscher, Frank; Vogel, Klaus; Hertel, Silvia; Kähler, Dirk; Reinert, Wolfgang | Conference Paper |
| 2015 | Back-end-of-line compatible contact materials for carbon nanotube based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rennau, M.; Rodriguez, R.D.; Sheremet, E.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Carbon nanotube based field-effect transistors: Comparison between atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
| 2015 | Carbon Nanotube based sensors in MEMS/NEMS
Hermann, S.; Bonitz, J.; Boettger, S.; Hartmann,S; Shaporin, A.; Mehner, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2015 | Carbon nanotubes under strain: Electronic and Optical properties
Wagner, C.; Schuster, J.; Gessner, T. | Abstract |
| 2015 | Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Conference Paper |
| 2015 | Charakterisierung der Verbindungseigenschaften
Dudek, R.; Döring, R.; Kreysig, K.; Seiler, B.; Nowottnick, M.; Ehrhard, C. | Book Article |
| 2015 | Comparative analysis of multi-mass high precision vibratory MEMS gyroscopes
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Hiller, K.; Hahn, S.; Gessner, T. | Conference Paper |
| 2015 | Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers
Niittynen, J.; Sowade, E.; Kang, H.; Baumann, R.R.; Mäntysalo, M. | Journal Article |
| 2015 | Controlling the ink spreading on uncoated paper for inkjet printed nanoparticle silver inks in combination with intense pulsed light (IPL) sintering
Weise, D.; Hartwig, M.; Mitra, K.Y.; Wagenbach, A.; Shah, K.Y.; Baumann, R.R. | Conference Paper |
| 2015 | Correction: Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second (J. Mater. Chem. C (2015) DOI: 10.1039/c5tc02291f)
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
| 2015 | Degradation of all-inkjet-printed organic thin-film transistors with TIPS-pentacene under processes applied in textile manufacturing
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Machado, A.V.; Baumann, R.R.; Lanceros-Méndez, S. | Journal Article |
| 2015 | Demonstratoren
Herberholz, T.; Fix, A.; Ehrhardt, C.; Kreysig, K.; Seiler, B.; Dudek, R.; Schulze, J.; Wilke, K.; Strogies, J. | Book Article |
| 2015 | Direct integrated strain sensors for robust temperature behaviour
Haas, S.; Schramm, M.; Reuter, D.; Loebel, K.-U.; Horstmann, J.T.; Gessner, T. | Conference Paper |
| 2015 | Effect of the light spectrum of various substrates for inkjet printed conductive structures sintered with intense pulsed light
Weise, D.; Mitra, K.Y.; Ueberfuhr, P.; Baumann, R.R. | Conference Paper |
| 2015 | Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Rzepka, S. | Conference Paper |
| 2015 | Efficient K-band antennas fabricated with large-scale processes
Gaitzsch, M.; Grossmann, T.D.; Hartwig, M.; Heinrich, M.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L. | Conference Paper |
| 2015 | Electrical conductivity enhancement of spin-coated PEDOT:PSS thin film via dipping method in low concentration aqueous DMSO
Deetuam, C.; Weise, D.; Samthong, C.; Praserthdam, P.; Baumann, R.R.; Somwangthanaroj, A. | Journal Article |
| 2015 | Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration
Meinig, M.; Kurth, S.; Helke, C.; Seifert, M.; Hiller, K.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2015 | Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M. | Conference Paper |
| 2015 | Electromagnetic simulation of flexible strain sensor based microstrip patch antenna
Benchirouf, A.; Zichner, R.; Müller, C.; Kanoun, O. | Journal Article, Conference Paper |
| 2015 | Ereignisgesteuerte Methode für schnelle und präzise Analysen
Hangmann, C.; Vogel, M. | Journal Article |
| 2015 | Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S. | Conference Paper |
| 2015 | Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application
Vogel, K.; Wiemer, M.; Gessner, T.; Vogel, J.; Lin, Y.-C.; Tsai, Y.-C.; Esashi, M.; Tanaka, S. | Conference Paper |
| 2015 | Exact and approximated discrete-time non-linear models of voltage switched CP-PLL
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials
Foerster, A.; Koehler, N.; Zimmermann, S.; Fischer, T.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E.; Gessner, T. | Abstract |
| 2015 | Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics
Köhler, N.; Fischer, T.; Zimmermann, S.; Schulz, S.E. | Conference Paper |
| 2015 | Fabrication of micro needle arrays using an ultra short pulse laser
Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Fabrication of nanoporous gold and the application for substrate bonding at low temperature
Wang, W.-S.; Lin, Y.-C.; Gessner, T.; Esashi, M. | Journal Article |
| 2015 | Fast and accurate event-driven simulation of a mixed-signal system using the example of a PLL
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2015 | A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases
Ebermann, M.; Neumann, N.; Binder, S.; Meinig, M.; Seifert, M.; Kurth, S.; Hiller, K. | Conference Paper |
| 2015 | FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B. | Conference Paper |
| 2015 | FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B. | Conference Paper |
| 2015 | Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K. | Conference Paper |
| 2015 | Flexible electronics: Integration processes for organic and inorganic semiconductor-based thin-film transistors
Vidor, F.F.; Meyers, T.; Hilleringmann, U. | Journal Article |
| 2015 | Fluidic actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Symmank, C.; Schmidt, A.; Kroll, L.; Gessner, T.; Götze, U. | Conference Paper |
| 2015 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2014
| Annual Report |
| 2015 | Fügeverfahren, Material- oder Phasentransformationsverfahren, Sicherungsverfahren, Fügemittel und Sicherheitssystem unter Verwendung reaktiver Materialsysteme
Bräuer, Jörg; Besser, Jan; Roscher, Frank; Seifert, Tobias; Wiemer, Maik | Patent |
| 2015 | Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process
Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H. | Journal Article |
| 2015 | Hierarchical, high-rate, hybrid and roll-to-roll manufacturing
: Poliks, M.D.; Blaudeck, T. | Conference Proceedings |
| 2015 | High-performance giant magnetoresistive sensorics on flexible Si membranes
Pérez, N.; Melzer, M.; Makarov, D.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Schmidt, O.G. | Journal Article |
| 2015 | Highly-sensitive humidity sensors for condition monitoring of hybrid laminates
Seider, T.; Martin, J.; Boeddicker, A.; Ruehling, J.; Wett, D.; Nestler, D.J.; Wagner, G.; Huebler, A.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | An improved micromechanical method for investigating the statistical strength of poly-silicon membranes
Brückner, J.; Pfaff, H.; Dehe, A.; Rzepka, S. | Abstract |
| 2015 | Improving HV battery efficiency by smart control systems
Armengaud, E.; Macher, G.; Kurtulus, C.; Groppo, R.; Haase, S.; Hofer, G.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
| 2015 | An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Conference Paper |
| 2015 | Influence of different hole transport layers on the performance of quantum dot light emitting diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
| 2015 | Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics
Vidor, F.F.; Meyers, T.; Hilleringmann, U.; Wirth, G.I. | Conference Paper |
| 2015 | Infra-red curing methodology for Roll-to-Roll (R2R) manufacturing of conductive electrodes through inkjet technology applicable for devices in the field of flexible electronics
Mitra, K.Y.; Weise, D.; Hartwig, M.; Baumann, R.R. | Journal Article, Conference Paper |
| 2015 | An inkjet adaptive backend strategy for low-yield OTFT digital circuits
Ramon, E.; Sowade, E.; Mitra, K.Y.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet and gravure printing of conductive patterns for the application in lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet printing of colloidal nanospheres: Engineering the evaporation-driven self-assembly process to form defined layer morphologies
Sowade, E.; Blaudeck, T.; Baumann, R.R. | Journal Article |
| 2015 | Inkjet printing of group-11 metal structures
Gäbler, Christian; Schliebe, Christian; Adner, David; Blaudeck, T.; Hildebrandt, Alexander; Lang, Heinrich | Book Article |
| 2015 | Inkjet printing of UHF antennas on corrugated cardboards for packaging applications
Sowade, E.; Göthel, F.; Zichner, R.; Baumann, R.R. | Journal Article |
| 2015 | Inkjet-printed quantum dot-based sensor for structural health monitoring
Hartwig, M.; Ortlepp, F.; Möbius, M.; Martin, J.; Otto, T.; Geßner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring
Ortlepp, F.; Hartwig, M.; Moebius, M.; Martin, J.; Otto, T.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Integrated load detection sensor for lightweight structures based on quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Hartwig, M.; Dzhagan, D.; Gordan, O.D.; Lang, H.; Zahn, D.R.T.; Baumann, R.R.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Integration and test of synthetic jet actuators
Schueller, M.; Weigel, P.; Lipowski, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Integration of fluidic jet actuators in composite structures
Schueller, M.; Lipowski, M.; Schirmer, E.; Walther, M.; Otto, T.; Geßner, T.; Kroll, L. | Conference Paper |
| 2015 | Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes
Weise, D.; Sternkiker, C.; Baumann, R.R. | Conference Paper |
| 2015 | Intense pulsed light sintering of inkjet printed silver nanoparticle ink: Influence of flashing parameters and substrate
Weise, D.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Journal Article, Conference Paper |
| 2015 | Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys
Franz, M.; Ecke, R.; Kaufmann, C.; Kriz, J.; Schulz, S.E. | Conference Paper |
| 2015 | Investigation of carbon nanotube based field-effect transistors using atomistic quantum transport and numerical device simulation
Fuchs, F.; Zienert, A.; Schuster, J. | Abstract |
| 2015 | Investigation of Uncertainty Sources of Piezoresistive Silicon Based Stress Sensor
Palczynska, Alicja; Schindler-Saefkow, Florian; Gromala, Przemyslaw; Kreyßig, Kerstin; Rzepka, Sven; Mayer, Dirk; Melz, Tobias | Conference Paper |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Conference Paper |
| 2015 | k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study
Foerster, A.; Wagner, C.; Schuster, J.; Gemming, S.; Schulz, S.E. | Abstract |
| 2015 | Kombinierte Simulation integrierter mikrofluidischer Aktoren
Schulze, R.; Nestler, J.; Streit, P.; Billep, D.; Otto, T.; Gessner, T. | Conference Paper |
| 2015 | Life cycle-oriented analysis and evaluation of Active Flow Control in wind turbines
Götze, U.; Symmank, C.; Dressel, M.; Schüller, M.; Schmidt, A.; Lipowski, M.; Geßner, T.; Otto, T. | Journal Article |
| 2015 | Low-temperature wafer bonding using solid-liquid inter-diffusion mechanism
Froemel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Journal Article |
| 2015 | Materials for Advanced Metallization 2014 (MAM 2014). Preface
Schulz, S.E.; Hecker, M.; Korner, H.; Wolf, H. | Conference Paper, Journal Article |
| 2015 | Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A. | Conference Paper |
| 2015 | Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints
Zschenderlein, U.; Suresh, K.; Baum, M.; Wunderle, B. | Conference Paper |
| 2015 | Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Conference Paper |
| 2015 | Metallic glass as a mechanical material for microscanners
Lin, Y.C.; Tsai, Y.C.; Ono, T.; Liu, P.; Esashi, M.; Gessner, T.; Chen, M.W. | Journal Article |
| 2015 | Micro welding of aluminum for post process electrode gap reduction using femtosecond laser
Meinecke, C.; Mueller, M.; Rennau, M.; Bertz, A.; Ebert, R.; Reuter, D.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems
Baranski, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Jia, C.P.; Frömel, J.; Wiemer, M. | Journal Article |
| 2015 | Microelectronics packaging materials: Investigating the influence of moisture by molecular dynamics simulations
Hölck, O.; Wunderle, B. | Conference Paper |
| 2015 | Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A. | Conference Paper |
| 2015 | Mobile communication and control for Smart Microfluidic Systems
Otto, T.; Geidel, S.; Morschhauser, A.; Streiter, R.; Gessner, T.; Heibutzki, B.; Nestler, J. | Conference Paper |
| 2015 | Modeling & PVT characterization of arbitrary ordered VSCP-PLL using an efficient event-driven approach
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen
Weidlich, S.; Forke, R.; Billep, D.; Konietzka, S.; Koehler, D.; Hiller, K.; Gessner, T. | Conference Paper |
| 2015 | Monolithic integration of 2D spin valve magnetic field sensors for angular sensing
Almeida, M.J.; Götze, T.; Ueberschär, O.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Exner, H.; Schulz, S.E. | Conference Paper |
| 2015 | Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer
Wang, W.S.; Lullin, J.; Froemel, J.; Wiemer, M.; Bargiel, S.; Passilly, N.; Gorecki, C.; Gessner, T. | Conference Paper |
| 2015 | Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Zürcher, J.; Yu, K.; Schlottig, G.; Baum, M.; Taklo, M.M.V.; Wunderle, B.; Warszyński, P.; Brunschwiler, T. | Conference Paper |
| 2015 | A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J. | Conference Paper |
| 2015 | Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres
Wright, D.N.; Taklo, M.M.V.; Baum, M.; Hofmann, C.; Kristiansen, H. | Conference Paper |
| 2015 | On the optimization of piezoelectric vibration energy harvester
Deng, L.; Wen, Q.; Jiang, S.; Zhao, X.; She, Y. | Journal Article |
| 2015 | On treatment of ultra-low-k SiCOH in CF4 plasmas: Correlation between the concentration of etching products and etching rate
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J. | Journal Article |
| 2015 | On-chip micro-pseudocapacitors for ultrahigh energy and power delivery
Han, J.; Lin, Y.-C.; Chen, L.; Tsai, Y.-C.; Ito, Y.; Guo, X.; Hirata, A.; Fujita, T.; Esashi, M.; Gessner, T.; Chen, M. | Journal Article |
| 2015 | Optimized monolithic 2-D spin-valve sensor for high-sensitivity compass applications
Ueberschär, O.; Almeida, M.J.; Matthes, P.; Müller, M.; Ecke, R.; Rückriem, R.; Schuster, J.; Exner, H.; Schulz, S.E. | Journal Article |
| 2015 | Optimum laser exposure for setting exchange bias in spin valve sensors
Almeida, M.J.; Matthes, P.; Ueberschär, O.; Müller, M.; Ecke, R.; Exner, H.; Albrecht, M.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator
Wecker, J.; Mangalgiri, G.; Kurth, S.; Meinig, M.; Hackner, A.; Prechtel, U.; Gessner, T. | Journal Article |
| 2015 | Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips
Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Conference Paper |
| 2015 | Performance investigation of UHF RFID tags designed for air and Rubber Belts - impact of electrical parameters and the shape of the belts
Kanwar, K.; Mager, T.; Hilleringmann, U.; Hedayat, C.; Geneis, V.; Gessner, T. | Conference Paper |
| 2015 | A photonic biosensor for space applications (PBSA)
Diego-Castilla, G. de; Pantoja, S.; Geidel, S.; Peransi, S.; Nestler, J.; Martins, R.; Sousa, A.; Gomez-Elvira, J.; Moreno-Paz, M.; Cuesta, L.; Parro, V. | Conference Paper |
| 2015 | Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics
Mitra, K.Y.; Sowade, E.; Martinez-Domingo, C.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R. | Conference Paper |
| 2015 | Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T. | Conference Paper |
| 2015 | Precision determination of thermoreflectance coefficients for localised thermometry
Schlag, R.; Ras, M.A.; Arlt, V.; May, D.; Winkler, T.; Wunderle, B. | Conference Paper |
| 2015 | Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology
Nossol, P.; Schaufuss, J.; Tsapkolenko, A.; Rost,F; Arnold, B.; Kroll, L.; Mehner, J.; Gessner, T. | Conference Paper |
| 2015 | Preparation of Ni-C thin films for strain sensor applications in new hybrid laminates with thermoplastic matrix
Wett, D.; Nestler, D.; Wagner, G.; Wielage, B.; Seider, T.; Martin, J.; Gessner, T. | Conference Paper |
| 2015 | Printed functionalities in hybrid laminates
Nestler, D.J.; Jung, H.; Trautmann, M.; Wielage, B.; Wagner, G.; Seider, T.; Martin, J.; Otto, T.; Gessner, T.; Ebert, F.; Illing-Guenther, H.; Nendel, K.; Boeddicker, A.; Fuegmann, U.; Huebler, A. | Conference Paper |
| 2015 | Printing of conductive patterns for application in smart lightweight structures
Hartwig, M.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2015 | Pulsed jet actuators and their integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2015 | Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes
Hübner, M.; Lang, N.; Zimmermann, S.; Schulz, S.E.; Buchholtz, W.; Röpcke, J.; Helden, J.H. van | Journal Article |
| 2015 | Quantum dot-based sensor layer in lightweight structures
Fischer, T.; Heinrich, K.; Spudat, C.; Martin, J.; Otto, T.; Gessner, T.; Kroll, L. | Journal Article |
| 2015 | Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification
Merten, E.; Essen, T. von; Luczack, F.; Otto, A.; Lunding, A.; Lürkens, P.; Bast, M.; Abo Ras, M.; Rzepka, S. | Conference Paper |
| 2015 | Remote ice detection on rotor blades of wind turbines
Großmann, T.D.; Gaitzsch, M.; Hartwig, M.; Heinrich, M.; Symmank, C.; Schmidt, A.; Kurth, S.; Gessner, T.; Baumann, R.R.; Kroll, L.; Götze, U. | Conference Paper |
| 2015 | RF MEMS switch for modulated backscatter communication
Gaitzsch, M.; Voigt, S.; Haas, S.; Kurth, S.; Gessner, T. | Conference Paper |
| 2015 | Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second
Sowade, E.; Kang, H.; Mitra, K.Y.; Weiß, O.J.; Weber, J.; Baumann, R.R. | Journal Article |
| 2015 | Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
Hofmann, C.; Baum, M.; Bodny, F.; Wiemer, M.; Gessner, T.; Brunschwiler, T.; Zürcher, J.; Burg, B.R.; Zimmermann, S. | Conference Paper |
| 2015 | Semiconductor nanocrystals – versatile building blocks for innovative microsystems
Weiss, A.; Heinrich, K.; Martin, J.; Otto, T.; Gessner, T.; Langenickel, J. | Conference Paper |
| 2015 | Simulation and validation of arbitrary ordered VSCP-PLLs using event-driven macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Tall, N.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2015 | Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2015 | Smart systems integration. Short review and further development of smart systems
Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Kurth, S.; Nestler, J.; Köhler, T. | Book Article |
| 2015 | SMART-LIC - Smart and Compact Battery Management System Module for Integration into Lithium-Ion Cell for Fully Electric Vehicles
Langheim, J.; Carcaillet, S.; Cavro, P.; Steinau, M.; Kanoun, O.; Günther, T.; Mager, T.; Otto, A.; Lanciotti, C. | Conference Paper |
| 2015 | Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S. | Conference Paper |
| 2015 | Strong localization in defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Abstract |
| 2015 | Strong localization in quasi one-dimensional systems with realistic defects: Application to carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Conference Paper |
| 2015 | Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen
Baum, M. | Dissertation |
| 2015 | Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters
Rupprecht, J.; Kurth, S.; Hiller, K.; Seifert, M.; Besser, J.; Meinig, M.; Ebermann, M.; Neumann, N.; Gessner, T. | Conference Paper, Journal Article |
| 2015 | Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Journal Article |
| 2015 | Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures
Helke, C.; Nestler, J.; Gessner, T. | Conference Paper |
| 2015 | Synthesis and characterization of nanogenerators based on doped zinc oxide
Heinrich, K.; Justeau, C.; Mielke, B.; Martin, J.; Otto, T.; Geßner, T. | Conference Paper |
| 2015 | System zum Messen einer Axialkraft einer Schraubverbindung
Geßner, Thomas; Otto, Thomas; Halder, Stefan; Hummel, Dieter; Martin, Jörg; Weiss, Martin; Möbius, Martin; Spudat, Christian; Gessner, Thomas; Otto, Thomas | Patent |
| 2015 | Technological platform for vertical multi-wafer integration of miniature imaging instruments
Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C.; Wiemer, M.; Frömel, J.; Wünsch, D.; Wang, W.S. | Conference Paper |
| 2015 | Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochauflösenden Sensorsystemen
Meinecke, C.; Mueller, M.; Rennau, M.; Reuter, D.; Ebert, R.; Bertz, A.; Exner, H.; Gessner, T. | Conference Paper |
| 2015 | Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation
Förster, A.; Wagner, C.; Gemming, S.; Schuster, J. | Journal Article |
| 2015 | Theoretical investigation of in situ k-restore processes for damaged ultra-low-k materials
Förster, A.; Wagner, C.; Schuster, J.; Gemming, S. | Conference Paper |
| 2015 | Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S. | Conference Paper |
| 2015 | Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B. | Poster |
| 2015 | Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2015 | Thermo-mechanical simulations of SiC power modules with single and double sided cooling
Brinkfeldt, K.; Edwards, M.; Ottosson, J.; Neumaier, K.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Andersson, D. | Conference Paper |
| 2015 | Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2015 | TSCuPc/Au hybrid trench devices. A comparative study of solution processed and thermally evaporated molecular channels
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Salvan, G.; Zahn, D.R.T. | Abstract |
| 2015 | VORRICHTUNGEN ZUR AUSSENDUNG UND/ODER ZUM EMPFANG ELEKTROMAGNETISCHER STRAHLUNG UND VERFAHREN ZUR BEREITSTELLUNG DERSELBEN
Geßner, Thomas; Otto, Thomas; Schulz, Stefan; Hermann, Sascha; Blaudeck, Thomas; Spudat, Christian | Patent |
| 2015 | Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach
Blaudeck, T.; Adner, D.; Hermann, S.; Lang, H.; Gessner, T.; Schulz, S.E. | Journal Article, Conference Paper |
| 2015 | A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes
Hartmann, M.; Hermann, S.; Pohl, D.; Rellinghaus, B.; Schulz, S.E. | Abstract |
| 2015 | Wake up MEMS for inertial sensors
Stoeckel, C.; Billep, D.; Konietzka, S.; Zimmermann, S.; Otto, T. | Conference Paper |
| 2015 | Welcome to Smart Systems Integration 2015
Gessner, T. | Conference Paper |
| 2015 | Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics
Ahner, N.; Zimmermann, S.; Köhler, N.; Krüger, S.; Schulz, S.E. | Conference Paper |
| 2015 | Yet another tuning fork gyroscope
Forke, R.; Hiller, K.; Hahn, S.; Konietzka, S.; Motl, T.; Köhler, D.; Heinz, S.; Billep, D.; Gessner, T. | Conference Paper |
| 2014 | System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS
Kolchuzhin, V.; Mehner, J.; Markert, E.; Heinkel, U.; Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
| 2014 | 3D technology as a holistic approach - quo vadis?
Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried | Presentation |
| 2014 | An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B. | Book Article |
| 2014 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B. | Conference Paper |
| 2014 | Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B. | Conference Paper |
| 2014 | Adjustment of Carbon Nanotube Properties for Sensor Applications using Pd Adatoms: An Ab-Initio Study
Fuchs, F.; Wagner, C.; Zienert, A.; Schuster, J. | Abstract |
| 2014 | Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies
Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R. | Book Article |
| 2014 | AIM technology and devices - from basic research to industrial proven MEMS platform
Bertz, A.; Reuter, D.; Nowack, M. | Book Article |
| 2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Conference Paper |
| 2014 | All-inkjet-printed bottom-gate thin-film transistors using UV curable dielectric for well-defined source-drain electrodes
Castro, H.F.; Sowade, E.; Rocha, J.G.; Alpuim, P.; Lanceros-Méndez, S.; Baumann, R.R. | Journal Article |
| 2014 | Analysis of Au metal–metal contacts in a lateral actuated RF MEMS switch
Gaitzsch, M.; Kurth, S.; Voigt, S.; Haas, S.; Gessner, T. | Conference Paper, Journal Article |
| 2014 | Analysis of interface delamination by combined theoretical and experimental means
Dudek, R.; Braemer, B.; Auersperg, J. | Book Article |
| 2014 | Analytische und numerische Beschleunigungsmodelle für Lötverbindungen und Verifizierung mit Feldtestergebnissen
Dudek, R.; Hildebrandt, M.; Faust, W.; Trageser, H.; Kohl, R.; Schuch, B. | Conference Paper |
| 2014 | ANAn UPS/IPS Study of Band Level Alignment Of a Quantum Dot Based Sensor
Tofighi, G.; Moebius, M.; Haidu, F.; Martin, J.; Dzhagan, V.M.; Spudat, C.; Otto, T.; Gessner, T.; Gordan, O.D.; Zahn, D.R.T. | Abstract |
| 2014 | Anodized aluminum as effective and cheap alternative substrate for thermoelectric generators
Assion, F.; Geneiß, V.; Schönhoff, M.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B. | Book Article |
| 2014 | Applications driven by printed batteries
Willert, A.; Espig, M.; Helmert, M.; Baumann, R.R. | Book Article |
| 2014 | Assisting the design of sensor and information fusion systems
Mönks, U.; Trsek, H.; Dürkop, L.; Geneiß, V.; Lohweg, V. | Journal Article, Conference Paper |
| 2014 | Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Gessner, Thomas | Poster |
| 2014 | Capillary microfluidic chip with integrated pump and valve actuator
Große, Allyn; Geidel, Sascha; Enderlein, Tom; Groß, Stefan; Morschhauser, Andreas; Nestler, Jörg; Edelmann, Jan; Otto, Thomas; Geßner, Thomas | Conference Paper |
| 2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Journal Article, Conference Paper |
| 2014 | Carbon nanotubes under strain: Ab-initio investigations and compact models
Wagner, C.; Kolchuzhin, V.; Markert, E.; Schuster, J.; Mehner, J.; Gessner, T. | Abstract |
| 2014 | Ceramic wafer bonding for vertically integrated MEMS
Wuensch, D.; Froemel, J.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Challenges of current and future advanced interconnect systems for integrated circuits
Schulz, S.E.; Ahner, N.; Fischer, T.; Koerner, H.; Oszinda, T.; Schulze, K.; Zimmermann, S. | Book Article |
| 2014 | Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B. | Conference Paper |
| 2014 | Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B. | Conference Paper |
| 2014 | Characterization of fully inkjet-printed microsieves and of patterns for the mechanical reinforcement of fragile membranes
Hammerschmidt, J.; Ueberfuhr, P.; Eck, E.-M.; Zeiner, C.; Thalheim, R.; Baumann, R.R. | Conference Paper |
| 2014 | Characterization of particle beds in percolating thermal underfills based on centrifugation
Zimmermann, S.; Brunschwiler, T.; Zuercher, J.; Burg, B.; Hong, G.; Poulikakos, D.; Baum, M.; Hofmann, C. | Conference Paper |
| 2014 | Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films
Luo, J.; Billep, D.; Blaudeck, T.; Sheremet, E.; Rodriguez, R.D.; Zahn, Dietrich R.T.; Toader, M.; Hietschold, M.; Otto, T.; Gessner, T. | Journal Article |
| 2014 | Cluster of Excellence MERGE - Integration of Micro- and Nanosystems in Hybrid Structures
Kroll, L.; Troeltzsch, J.; Schueller, M. | Book Article |
| 2014 | A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Journal Article |
| 2014 | Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R.; Döring, R.; Sommer, P.; Seiler, B.; Kreyssig, K.; Walter, H.; Becker, M.; Günther, M. | Conference Paper |
| 2014 | Conductivity and microstructure of inkjet-printed silver tracks depending on the digital pattern, sintering process, substrate and ink
Weise, D.; Grimm, A.; Weiß, U.; Mitra, K.Y.; Sowade, E.; Baumann, R.R. | Journal Article, Conference Paper |
| 2014 | Corrigendum to "Controlling SWCNT assembling density by electrokinetics" [Sensors and Actuators, A: Physical (2013) 201 (36-42)]
Yu, H.; Hermann, S.; Dong, Z.; Mai, J.; Li, W.J.; Schulz, S.E. | Journal Article |
| 2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Book Article |
| 2014 | Design and manufacturing of roll-to-roll printed copper layers for communication applications
Zichner, R.; Baumann, R.R. | Conference Paper |
| 2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Conference Paper |
| 2014 | Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Book Article |
| 2014 | Development and Characterization of a High Voltage Amplifier ASIC for MEMS based Piezoelectric Actuator Active Flow Control
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
| 2014 | Development and test of synthetic jet actuators based on dual transducer concept
Schueller, M.; Wiegel, P.; Lipowski, M.; Schulze, R.; Otto, T.; Gessner, T. | Conference Paper |
| 2014 | Development of Micro-Valves for Pulsed Jet Actuators
Lipowski, M.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2014 | The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds
Kang, H.; Sowade, E.; Baumann, R.R. | Journal Article |
| 2014 | Dispersion Preparation for Wafer-Level Liquid Processing of Carbon Nanotube Microsensors
Hille, Toni; Blaudeck, T.; Hermann, S.; Schulz, S.E. | Conference Paper |
| 2014 | Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R. | Conference Paper |
| 2014 | Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Dry Integration Strategies of rolled-up Nanostructures by a Combination of Laser and Mems Technologies
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Electronic transport through defective carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J. | Abstract |
| 2014 | Elektronischer Transport in defektbehafteten quasi-eindimensionalen Systemen am Beispiel von Kohlenstoffnanoröhrchen
Teichert, F. | Master Thesis |
| 2014 | Embedded UHF RFID tag design process for rubber transmission belt using 3D model
Kanwar, K.; Mager, T.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Conference Paper |
| 2014 | Enhanced organic light-emitting diode based on a columnar liquid crystal by integration in a microresonator
Kasdorf, O.; Vollbrecht, J.; Ohms, B.; Hilleringmann, U.; Bock, H.; Kitzerow, H.S. | Journal Article |
| 2014 | Entwicklung eines experimentellen Aufbaus zur Systemcharakterisierung von MEMS Gyroskopen auf Waferlevel
Weidlich, S.; Forke, R.; Konietzka, S.; Hiller, K.; Gessner, T. | Conference Paper |
| 2014 | Entwicklung eines intelligenten, textilen Halbzeugs
Schaufuss, J.; Decker, R.; Walther, M.; Tsapkolenko, A.; Dienel, M.; Schueller, M.; Kroll, L.; Gessner, T.; Mehner, J. | Conference Paper |
| 2014 | EUCEMAN - the European Center for MicroNanoReliability Research in Europe
Michel, B.; Winkler, T. | Book Article |
| 2014 | Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M. | Book Article |
| 2014 | Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips
Rezaie Adli, A.R.; Jansen, K.M.B.; Schindler-Saefkow, F.; Rost, F. | Conference Paper |
| 2014 | Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Extended event-driven modeling of a ΣΔ-fractional-N PLL including non-ideal effects
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Fiber-reinforced Composite Structures with Embedded Piezoelectric Sensors
Schulze, R.; Streit, P.; Fischer, T.; Tsapkolenko, A.; Heinrich, M.; Sborikas, M.; Kroll, L.; Gessner, T.; Wegener, M. | Conference Paper |
| 2014 | Flash lamp annealing of spray coated films containing oxidized or hydrogen terminated silicon nanoparticles
Seidel, F.; Toader, I.G.; Koth, S.; Fritzsche, R.; Schäfer, P.; Bülz, D.; Büchter, B.; Gordan, O.D; Freitag, H.; Jakob, A.; Buschbeck, R.; Hietschold, M.; Lang, H.; Mehring, M.; Baumann, R.R.; Zahn, D.R.T. | Journal Article |
| 2014 | A flexible measurement system for the characterization of thermoelectric materials
Schönhoff, M.; Assion, F.; Hilleringmann, U. | Conference Paper |
| 2014 | Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B. | Book Article |
| 2014 | Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
| 2014 | Fraunhofer-Institute for Electronic Nano Systems. Annual Report 2013
| Annual Report |
| 2014 | Fügen mit iRMS: Eine neue Raumtemperatur - Aufbau- und Verbindungstechnik in der Informationstechnik
Bräuer, J.; Besser, J.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Functional nano patterns realized by aligned nano imprint lithography
Baum, M.; Besser, J.; Wiemer, M.; Thanner, C.; Kreindl, G.; Wimplinger, M.; Gessner, T. | Conference Paper |
| 2014 | German association of nanotechnology: Objectives and benefits
Nonninger, R.; Michel, B. | Book Article |
| 2014 | A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems
Braeuer, J.; Gessner, T. | Journal Article |
| 2014 | High precision 3D surface reconstruction by combining shape-from-shading and light sectioning techniques
Bachmann, M.; Gerken, B.; Mager, T.; Hedayat, C. | Book Article |
| 2014 | High precision vibratory MEMS gyroscope
Billep, D.; Hiller, K.; Hahn, S.; Forke, R.; Köhler, D.; Stöckel, C.; Konietzka, S.; Heinz, S. | Book Article |
| 2014 | High Voltage Amplifier ASIC for High Capacitive Load MEMS based Piezoelectric Actuators
Köhler, D.; Seidel, R.; Helke, C.; Hiller, K.; Schüller, M.; Lipowski, M. | Conference Paper |
| 2014 | The history of micro mirror fabrication at the center of microtechnologies
Kaufmann, C. | Book Article |
| 2014 | Hysteresis-free carbon nanotube field-effect transistors without passivation
Tittmann, J.; Hermann, S.; Schulz, S.E.; Pacheco-Sanchez, A.; Claus, M.; Schröter, M. | Conference Paper |
| 2014 | Implantable MEMS sensors and medical MEMS packaging issues for future implants
Baum, M.; Haubold, M.; Wiemer, M.; Gessner, T. | Conference Paper, Journal Article |
| 2014 | Improvement of copper bonding by analyzing the mechanical properties of the bond interface
Vogel, K.; Baum, M.; Roscher, F.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B. | Book Article |
| 2014 | In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S. | Conference Paper |
| 2014 | In-situ characterization of microelectronic systems using 2D digital image correlation and 3D digital volume correlation of X-ray microtomography images
Seiler, B.; Haase, S.; Noack, E.; Erb, R.; Scheiter, L. | Book Article |
| 2014 | INCOBAT – Improving HV battery efficiency by E/E control systems
Armengaud, E.; Groppo, R.; Haase, S.; Hofer, G.; Lanciotti, C.; Otto, A.; Schmidt, H.; Stankiewicz, S. | Conference Paper |
| 2014 | Influence of porosity and methyl doping inside silica network
Singh, P.K.; Knaup, J.M.; Zimmermann, S.; Schulze, S.; Schulz, S.E.; Frauenheim, T.; Hietschold, M. | Journal Article |
| 2014 | Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R. | Journal Article |
| 2014 | Inkjet printed WLAN antenna for an application in smartphones
Zichner, R.; Sowade, E.; Baumann, R.R. | Conference Paper |
| 2014 | Integrateable light sources based on semiconductor nanocrystals
Böttger, P.; Meyer, M.; Martin, J.; Otto, T.; Gessner, T.; Seidlitz, H.; Kroll, L. | Conference Paper |
| 2014 | Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S. | Journal Article, Conference Paper |
| 2014 | Integration concept for fluidic actuators in hybrid structures
Schüller, M.; Walther, M.; Lipowski, M.; Weigel, P.; Schulze, R.; Nestler, J.; Otto, T.; Geßner, T.; Kroll, L. | Conference Paper |
| 2014 | Integration von MOS-Transistoren als Wandler für mechanische Spannungen
Schramm, M.; Haas, S.; Reuter, D.; Loebel, K.-U.; Heinz, S.; Bertz, A.; Horstmann, J.T.; Gessner, T. | Abstract |
| 2014 | Integration von ZnO Nanopartikel Dünnschicht-Transistoren durch Sprühbeschichtung
Vidor, F.F.; Hilleringmann, U. | Conference Paper |
| 2014 | Interaction Between Carbon Nanotubes and Metals: Electronic Properties, Stability, and Sensing
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interaction between semiconducting carbon nanotubes and metals: Sensing, stability and electronic properties
Fuchs, F.; Zienert, A.; Wagner, C.; Schuster, J.; Schulz, S.E. | Conference Paper |
| 2014 | Interface characterisation at electronic packages by means af nanoscale deformation analysis
Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B. | Book Article |
| 2014 | Interface Resistance of Carbon-Nanotube-Based Interconnects
Fiedler, H.; Toader, Marius; Hermann, S.; Rennau, M.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Hietschold, Michael; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Introducing aerosol-jet printing as semiconductor and MEMS fabrication process
Roscher, F.; Seifert, T.; Wiemer, M. | Book Article |
| 2014 | Investigation of low temperature wafer bonding using plasma activation
Wünsch, D.; Hofmann, C.; Bräuer, J.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Investigation of reactive and nano scale material systems for room-temperature reactive wafer bonding
Bräuer, J.; Besser, J.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
Johansson, J.; Belov, I.; Johnson, E.; Dudek, R.; Leisner, P. | Journal Article |
| 2014 | Kombination von Laser- und MEMS Technologieprozessen fuer Integrationsstrategien von rolled-up Nano-Architekturen
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Laser based dry Integration of rolled-up Nanomembranes into Polymer Substrates
Enderlein, T.; Helke, C.; Harazim, S.; Geidel, S.; Nestler, J.; Otto, T.; Schmidt, O.G.; Gessner, T. | Conference Paper |
| 2014 | Laser based integration method of rolled-up nano membranes in polymer based LoC systems
Enderlein, T.; Helke, C.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
| 2014 | Laser micromachining of brittle and fragile functional materials
Enderlein, T.; Nestler, J.; Otto, T.; Gessner, T. | Conference Paper |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Localization length of integrated multi-walled carbon nanotubes
Fiedler, H.; Hermann, S.; Rennau, M.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics
Vidor, F.F.; Wirth, G.I.; Hilleringmann, U. | Journal Article |
| 2014 | Magnetite nanoparticles: Synthesis, thin film properties and inkjet printing of magnetic cores for inductor applications
Marjanovic, N.; Chiolerio, A.; Kus, M.; Ozel, F.; Tilki, S.; Ivanović, N.; Rakočević, Z.; Andrić, V.; Barudžija, T.; Baumann, R.R. | Journal Article |
| 2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Mathematical modeling and simulations for machine directional register in hybrid roll-to-roll printing systems
Kang, H.; Baumann, R.R. | Journal Article |
| 2014 | Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S. | Conference Paper |
| 2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | MEMS based integration of nano scaled architectures manufactured by the rolled-up nanotech method
Helke, C.; Enderlein, T.; Harazim, S.; Nestler, J.; Schmidt, O.G.; Otto, T.; Gessner, T. | Abstract |
| 2014 | Metallic carbon nanotubes with metal contacts: electronic structure and transport
Zienert, A.; Schuster, J.; Gessner, T. | Journal Article |
| 2014 | Microfluidic chips for cells capture using 3-D hydrodynamic structure array
Chen, J.; Chen, D.; Yuan, T.; Chen, X.; Zhu, J.; Morschhauser, A.; Nestler, J.; Otto, T.; Gessner, T. | Journal Article |
| 2014 | Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Modeling and characterization of CP-PLL phase noise in presence of dead zone
Hangmann, C.; Wüllner, I.; Hedayat, C.; Hilleringmann, U. | Conference Paper |
| 2014 | Modeling and optimization of a vortex induced vibration fluid kinetic energy harvester
Wen, Q.; Schulze, R.; Billep, D.; Otto, T.; Gessner, T. | Journal Article, Conference Paper |
| 2014 | Modeling of SiC power modules with double sided cooling
Brinkfeldt, K.; Neumaier, K.; Mann, A.; Zschieschang, O.; Otto, A.; Kaulfersch, E.; Edwards, M.; Andersson, D. | Conference Paper |
| 2014 | Modellierung des optimalen Arbeitsbereiches für Inertialsensoren auf Basis von Kohlenstoffnanoröhrchen
Wagner, C.; Schuster, J.; Gessner, T. | Conference Paper |
| 2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding
Masser, R.; Braeuer, J.; Gessner, T. | Journal Article |
| 2014 | Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Conference Paper |
| 2014 | Monolithic microelectronic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Matthes, P.; Ecke, R.; Mueller, M.; Exner, H.; Schulze, K. | Conference Paper |
| 2014 | Monolithic spin valve compass for autonomous MEMS navigation in geomagnetic field
Almeida, M.J.; Ueberschär, O.; Ecke, R.; Schulz, S.E.; Matthes, P.; Müller, M.; Exner, H. | Conference Paper |
| 2014 | Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners
Wiemer, M.; Wuensch, D.; Frömel, J.; Gessner, T.; Bargiel, S.; Baranski, M.; Passilly, N.; Gorecki, C. | Journal Article |
| 2014 | Multifunctional nanomembranes as sensitive optical sensors in compact MEMS devices
Harazim, S.; Bolanos, V.; Helke, C.; Enderlein, T.; Otto, T.; Schmidt, O.G. | Abstract |
| 2014 | Nanoporous gold as a versatile bonding intermediate
Lin, Y.-C.; Wang, W.-S.; Gessner, T.; Esashi, M. | Conference Paper |
| 2014 | A new generation of MEMS middle-infrared spectrometers
Otto, T.; Saupe, R.; Stock, V.; Seider, T.; Gessner, T. | Conference Paper |
| 2014 | New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B. | Book Article |
| 2014 | A novel wearable electronic nose for healthcare based on flexible printed chemical sensor array
Lorwongtragool, P.; Sowade, E.; Watthanawisuth, N.; Baumann, R.R.; Kerdcharoen, T. | Journal Article |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2014 | On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Optimization of primary printed batteries based on Zn/MnO2
Madej, E.; Espig, M.; Baumann, R.R.; Schuhmann, W.; Mantia, F. la | Journal Article |
| 2014 | Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS study
Tofighi, G.; Moebius, M.; Haidu, F.; Gordan, O.D.; Martin, J.; Spudat, C.; Otto, T.; Gessner, T.; Zahn, D.R.T. | Conference Paper |
| 2014 | Organic lateral trench devices fabricated by trench technology
Banerjee, S.; Richter, P.; Buelz, D.; Reuter, D.; Hiller, K.; Gessner, T.; Zahn, D.R.T.; Salvan, G. | Abstract |
| 2014 | Overview of wafer bonding and characterization of the bonded interface
Vogel, K.; Haubold, M.; Wiemer, M.; Gessner, T. | Book Article |
| 2014 | Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R. | Conference Paper |
| 2014 | Piezoelectric P(VDF-TrFE) transducers assembled with micro injection molded polymers
Schulze, R.; Heinrich, M.; Nossol, P.; Forke, R.; Sborikas, M.; Tsapkolenko, A.; Billep, D.; Wegener, M.; Kroll, L.; Gessner, T. | Journal Article |
| 2014 | Preparing reliability testing for increased demands of automotive electronics
Kreyßig, K.; Otto, A. | Book Article |
| 2014 | Printed antennas on flexible substrates for highly integrated smart systems
Zichner, R.; Baumann, R.R. | Book Article |
| 2014 | Printed elliptically polarized transponder antenna for UHF-RFID metal item tagging
Zichner, R.; Baumann, R.R. | Conference Paper |
| 2014 | Pulsed DC magnetron sputtered piezoelectric thin film aluminum nitride - Technology and piezoelectric properties
Stoeckel, C.; Kaufmann, C.; Hahn, R.; Schulze, R.; Billep, D.; Gessner, T. | Journal Article |
| 2014 | Pulsed Jet Actuator development for the integration in composite structures
Lipowski, M.; Stiehl, C.; Schueller, M.; Nestler, J.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2014 | Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B. | Journal Article |
| 2014 | Raman spectroscopy study of the interaction of gold nanoparticles with carbon-nanotubefield-effect transistors
Kalbacova, Jana; Rodriguez, Raul D.; Blaudeck, T.; Hermann, S.; Sheremet, E.; Adner, David; Lang, Heinrich; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H. | Book Article |
| 2014 | Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-art and future development trends
Braeuer, J.; Besser, J.; Hertel, S.; Masser, R.; Schneider, W.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Journal Article, Conference Paper |
| 2014 | Reliability of new SiC BJT power modules for fully electric vehicles
Otto, A.; Kaulfersch, E.; Brinkfeldt, K.; Neumaier, K.; Zschieschang, O.; Andersson, D.; Rzepka, S. | Conference Paper |
| 2014 | Replacing TCO electrodes in dye sensitized solar cells by metal grids
Hilleringmann, U.; Kleine, A. | Conference Paper |
| 2014 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B. | Conference Paper |
| 2014 | Resolution and speed improvements of mid-infrared Fabry-Perot microspectrometers for the analysis of hydrocarbon gases
Ebermann, M.; Neumann, N.; Hiller, K.; Seifert, M.; Meinig, M.; Kurth, S. | Conference Paper |
| 2014 | Roll-to-roll infrared sintering of gravure printed silver patterns in applications of back-injection-molded functional lightweight structures
Hartwig, M.; Ueberfuhr, P.; Mischke, A.; Gaitzsch, M.; Heinrich, M.; Großmann, T.D.; Kurth, S.; Kroll, L.; Gessner, T.; Baumann, R.R. | Conference Paper |
| 2014 | A satellite multiple-beam antenna for high-rate data relays
Greda, L.A.; Winterstein, A.; Dreher, A.; Figur, S.A.; Schoenlinner, B.; Ziegler, V.; Haubold, M.; Brueck, M.W. | Journal Article |
| 2014 | Self-Assembly of Ordered Colloidal Nanoparticle Films in Few-Micron Wide Laser-Desorbed Lines of Octadecylsiloxane Monolayers on Silicon Oxide Surfaces
Belgardt, Christian; Blaudeck, T.; Borczyskowsi, Christian von; Graaf, Harald | Journal Article |
| 2014 | Semiconducing nanoparticles for field effect transistor integration on foils
Hilleringmann, U.; Wolff, K.; Vidor, F.F.; Assion, F. | Book Article |
| 2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Conference Paper |
| 2014 | Silizium-Halbleitertechnologie. Grundlagen mikroelektronischer Integrationstechnik. 6., korr. und verb. Aufl.
Hilleringmann, U. | Book |
| 2014 | SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Simulation of ALD chemistry of copper metalorganic precursors on Ta(110) Surface
Hu, X.; Schuster, J.; Schulz, S.E.; Gessner, T. | Conference Paper |
| 2014 | Simulations of 3rd order voltage switched CP-PLL using a fast event switching macromodeling
Ali, E.; Rahajandraibe, W.; Haddad, F.; Hangmann, C.; Hedayat, C. | Conference Paper |
| 2014 | Simultaneous damage detection and deflection measurement of morphing wing structures by fiber optic sensing system
Djinovic, Z.; Scheerer, M.; Tomic, M.; Stojkovic, M.; Schueller, M. | Conference Paper |
| 2014 | Smart monitoring systems for a green future
Saupe, R.; Stock, V.; Otto, T.; Kurth, S.; Hiller, K.; Meinig, M.; Neumann, N.; Gessner, T. | Conference Paper |
| 2014 | Smart system integration technologies for lightweight structures
Schüller, M.; Walther, M.; Tröltzsch, J.; Otto, T.; Mehner, J.; Geßner, T.; Kroll, L. | Conference Paper |
| 2014 | Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T. | Book |
| 2014 | Smart universal power antenna for optimized wireless energy transfer - SUPA
Büker, M.J.; Hilleringmann, U.; Geneiß, V.; Hedayat, C. | Book Article |
| 2014 | Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C. | Conference Paper |
| 2014 | Solid Liquid Inter-Diffusion Bonding at Low Temperature
Frömel, J.; Baum, M.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Stability analysis of a charge pump phase-locked loop using autonomous difference equations
Hangmann, C.; Hedayat, C.; Hilleringmann, U. | Journal Article |
| 2014 | Standard-Reflowlöten für Anwendungen bis 300°C - ein Widerspruch?
Fix, A.; Herberholz, T.; Guyenot, M.; Nowottnick, M.; Novikov, A.; Schulze, J.; Trodler, J.; Hutter, M.; Ehrhardt, C.; Dudek, R.; Wilke, K.; Strogies, J.; Seiler, B.; Kreyßig, K.; Diehm, R.; Liedke, V.; Zerna, T.; Klemm, A. | Conference Paper |
| 2014 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A. | Conference Paper |
| 2014 | Strategies for responding to the reliability challenges of future smart systems
Rzepka, S.; Andersson, D.; Vandevelde, B. | Conference Paper |
| 2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Conference Paper, Journal Article |
| 2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Conference Paper |
| 2014 | Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S. | Book Article |
| 2014 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Journal Article, Conference Paper |
| 2014 | Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Book Article |
| 2014 | Strong localization in defective carbon nanotubes: A recursive Green's function study
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M. | Journal Article |
| 2014 | Structural health monitoring with quantum dots
Moebius, M.; Martin, J.; Poppitz, E.A.; Ueberfuhr, P.; Tofighi, G.; Gordan, O.D.; Dzhagan, V.M.; Lang, H.; Baumann, R.R.; Zahn, D.R.T.; Otto, T.; Gessner, T.; Kroll, L. | Conference Paper |
| 2014 | Subwavelength grating reflectors in MEMS tunable Fabry-Perot infrared filters with large aperture
Kurth, S.; Hiller, K.; Meinig, M.; Besser, J.; Seifert, M.; Ebermann, M.; Neumann, N.; Schlachter, F.; Gessner, T. | Conference Paper |
| 2014 | Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A. | Journal Article |
| 2014 | Tailored printed primary battery system for powering a diagnostic device
Willert, A.; Killard, A.J.; Baumann, R.R. | Journal Article |
| 2014 | Technologieentwicklung, Herstellung und Charakterisierung von hochauflösenden Inertialsystemen
Meinecke, C.; Bertz, A.; Dittrich, C.; Schunke, S.; Kreutziger, P.; Gessner, T. | Conference Paper |
| 2014 | Technology approaches for tuneable IR Fabry-Perot-Filters applied in gas sensing microspectrometers
Hiller, K.; Meinig, M.; Kurth, S.; Seifert, M.; Helke, C.; Neumann, N.; Ebermann, M. | Book Article |
| 2014 | Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors
Waber, T.; Pahl, W.; Schmidt, M.; Feiertag, G.; Stufler, S.; Dudek, R.; Leidl, A. | Journal Article |
| 2014 | Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B. | Conference Paper |
| 2014 | Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S. | Conference Paper |
| 2014 | Thermocompression bonding of semiconductor wafers
Frömel, J.; Baum, M.; Wiemer, M. | Book Article |
| 2014 | Tip-Enhanced Raman Spectroscopy for the Characterization of Carbon Nanotubes
Sheremet, E.; Rodriguez, Raul D.; Krayev, A.; Kalbacova, Jana; Hermann, S.; Schulz, S.E.; Zahn, Dietrich R.T. | Conference Paper |
| 2014 | Untersuchung des Risswachstums in 3D - Verformungsmessung mittels Röntgenmikrotomographie
Zeismann, F.; Bode, B.; Motoyashiki-Besel, Y.; Brueckner-Foit, A.; Tomizato, F.; Kobayashi, M.; Toda, H.; Uesugi, K.; Takeuchi, A.; Suzuki, Y.; Haase, S.; Erb, R.; Seiler, B.; Dost, M. | Conference Paper |
| 2014 | Wafer bonding technologies for 3D integration
Baum, M.; Hofmann, C.; Besser, J.; Vogel, K.; Wiemer, M.; Gessner, T. | Conference Paper |
| 2014 | Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate
Baranski, M.; Bargiel, S.; Passilly, N.; Guichardaz, B.; Herth, E.; Gorecki, C.; Jia, C.; Frömel, J.; Wiemer, M. | Journal Article |
| 2014 | Wafer-Level Functionalization of Integrated Carbon Nanotubes with Metal Nanoparticles
Blaudeck, T.; Adner, David; Hermann, S.; Schulz, S.E.; Lang, Heinrich; Gessner, T. | Conference Paper |
| 2014 | Welcome to Smart Systems Integration 2014
Gessner, T. | Conference Paper |
| 2014 | ZnO-Feldeffekttransistoren für flexible elektronische Schaltungen
Hilleringmann, U.; Vidor, F.F. | Conference Paper |