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Digital holographic measurement system for use on multi-axis systems

: Stevanovic, Jonas; Seyler, Tobias; Aslan, Johannes; Beckmann, Tobias; Bertz, Alexander; Carl, Daniel

Volltext urn:nbn:de:0011-n-6361400 (1.5 MByte PDF)
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Copyright Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Erstellt am: 29.6.2021

Lehmann, Peter (Hrsg.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical Measurement Systems for Industrial Inspection XII : 21-26 June 2021, Online Only, Germany
Bellingham, WA: SPIE, 2021 (Proceedings of SPIE 11782)
ISBN: 978-1-5106-4398-7
ISBN: 978-1-5106-4399-4
Paper 117821R, 11 S.
Conference "Optical Measurement Systems for Industrial Inspection" <12, 2021, Online>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IPM ()
digital holography; Multi-Axis Systems; machine tool; Coordinate-Measurement Machine; inline measurement; production control; embedded system

Hybrid manufacturing processes, high level of automation, short product service life and decreasing vertical range of manufacture in production request for increasing flexibility and speed of quality control. With HoloCut we previously introduced the world’s first wireless digital-holographic sensor system prototype for fast and precise measurements inside a machine tool. With the experience gained so far, we now present an improved, even more compact sensor system, for the use on various multi-axis systems such as coordinate measuring machines (CMM), robots and machine tools and show first results with different handling systems. Besides improved mechanical stability, a size and weight reduction resulted from a new design approach: The arrangement of components around a central "core" made it possible to create a very compact design with a diameter of 125 mm, a height of ~180 mm and a weight of ~2 kg. The system features a 12.5 × 12.5 mm² measuring field with a lateral sampling of 4 μm. An NVIDIA Xavier embedded system enables pre-evaluations of the recorded measurement data in order to allow re-recording them, even before the complete data transmission (up to 160 MB with 2 Hz measuring rate) and evaluation. This is especially important for the use in vibration-prone environments such as multi-axis systems. Various handling systems such as a HERMLE C32U machine tool, an undamped LEITZ Reference HP 15.9.7 CMM and a UNIVERSAL ROBOT UR16e are examined with regard to vibrations. In future work, the behavior of the system under higher vibration amplitudes will be characterized.