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High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

: Laskin, Gennadii; Huai, Haosu; Fratz, Markus; Seyler, Tobias; Beckmann, Tobias; Schiffmacher, Alexander; Bertz, Alexander; Wilde, J├╝rgen; Carl, Daniel

Volltext urn:nbn:de:0011-n-6361388 (4.3 MByte PDF)
MD5 Fingerprint: 467736902146786a43948d7c3ba4dcb7
Copyright Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Erstellt am: 30.6.2021

Lehmann, Peter (Hrsg.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical Measurement Systems for Industrial Inspection XII : 21-26 June 2021, Online Only, Germany
Bellingham, WA: SPIE, 2021 (Proceedings of SPIE 11782)
ISBN: 978-1-5106-4398-7
ISBN: 978-1-5106-4399-4
Paper 117820A, 7 S.
Conference "Optical Measurement Systems for Industrial Inspection" <12, 2021, Online>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IPM ()
ESPI; speckle interferometry; Interferometric Imaging; digital holography; Real-Time Deformation Measurement; inline inspection

The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.