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Smart Platform for Rapid Prototyping: Solutions in the Dilemma of Flexibility and Standardization

 
: Anger, Sabrina; Klingert, Felix; Häublein, Volker; Pfeffer, Markus; Schellenberger, Martin

:
Postprint urn:nbn:de:0011-n-6338417 (1002 KByte PDF)
MD5 Fingerprint: 5e042ec8080dfe6bcaa5a26425858f20
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Erstellt am: 15.4.2021


Institute of Electrical and Electronics Engineers -IEEE-:
ICIT 2021, 22nd IEEE International Conference on Industrial Technology : Virtual, 10-12 March 2021
Piscataway, NJ: IEEE, 2021
ISBN: 978-1-7281-5730-6
ISBN: 978-1-7281-5729-0
ISBN: 978-1-7281-5731-3
S.1424-1431
International Conference on Industrial Technology (ICIT) <22, 2021, Online>
European Commission EC
H2020; 783163; iDev40
Integrated Development 4.0
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
Effiziente, sichere Technologien für Industrie 4.0 in der Elektronikfertigung (iDev40); 16ESE0274
Intelligente Plattform für das Rapid Prototyping von low-volume Bauelementen
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IISB ()
Rapid Prototyping; Baseline Module; Smart Experiments; Smart Logistics; data analytics

Abstract
Fraunhofer IISB offers prototyping services for electron devices. To meet economic requirements despite a unique flexibility in regard to wafer size, semiconductor material, and processes in manufacturing, a smart platform for rapid prototyping is under development. This paper reports on three embedding solution approaches: The implementation of stable baseline modules, smart experiments including data analytics, and smart logistics with a flexible MES. All were developed and partially implemented within the iDev40 project. The interaction of the solution approaches has the overall goal of reducing the integration time of novel processes into the manufacturing line by about 20%.

: http://publica.fraunhofer.de/dokumente/N-633841.html