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Electrical and optical analysis of a spray coated transparent conductive adhesive for two-terminal silicon based tandem solar cells

: Heitmann, Ulrike; Höhn, Oliver; Hauser, Hubert; Kluska, Sven; Bartsch, Jonas; Janz, Stefan

Postprint urn:nbn:de:0011-n-5558402 (1.2 MByte PDF)
MD5 Fingerprint: 97e21ba5253bc9693eaf8069075ec398
Copyright AIP
Erstellt am: 6.9.2019

Poortmans, J. ; American Institute of Physics -AIP-, New York:
SiliconPV 2019, the 9th International Conference on Crystalline Silicon Photovoltaics : 8-10 April 2019, Leuven, Belgium
New York, N.Y.: AIP Press, 2019 (AIP Conference Proceedings 2147)
ISBN: 978-0-7354-1892-9
Art. 130001, 7 S.
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) <9, 2019, Leuven>
European Commission EC
H2020-Low-cost, low-carbon energy supply - Developing the next generation technologies of renewable electricity and heating/cooling; 727497; SiTaSol
Application relevant validation of c-Si based tandem solar cell processes with 30 % efficiency target
Bundesministerium fur Wirtschaft und Energie BMWi (Deutschland)
0324151A; SOLGEL-PV
Multifunktionale Sol-Gel-Schichten für die PV-Industrie; Teilvorhaben: Materialien, Nanostrukturierung, Integration, Silizium- und Tandemsolarzellen
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Photovoltaik; Neuartige Photovoltaik-Technologien; Tandemsolarzellen auf kristallinem Silicium

This work presents the results of the electrical and optical characterization of a new transparent conductive adhesive (TCA) that combines the techniques of spray pyrolysis and a sol-gel like process. This approach is of particular interest since the adhesive itself forms both the electrical and the mechanical interconnection of the bonded sub-cells. The electrical and optical characterization of the developed TCA shows a minimum connecting resistivity of 17 Ωcm2 and a simulated reflection at the Si-TCA interface of ≈ 20%. By coating both substrate surfaces with a TiO2 anti reflection coating (ARC), the reflectance at the Si-TCA interface was successfully reduced down to <5%. The efficiency potential of a glued dual junction device was simulated in dependence of the electrical and optical properties of the TCA. The reported values of 17 Ωcm2 connecting resistivity and 20% reflection limit the device efficiency to 22.3% (71% of the maximum achievable efficiency). Reducing the reflection to below 5%, as practically demonstrated in this paper, allows to increase this value to 25.3% (>80% of maximum), while additionally reducing the connecting resistivity to 10 Ωcm² or 1 Ωcm2 allows for a further increase to 27.3% and 30.0%, respectively.