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A novel approach to determine the diamond occupancy of diamond wires for optimized cutting processes for crystalline silicon

: Lottspeich, L.; Theophil, L.; Fuchs, M.; Kaden, T.

Volltext urn:nbn:de:0011-n-4844266 (419 KByte PDF)
MD5 Fingerprint: b1b1554ba0b2210902dd12d7085863ff
Erstellt am: 24.2.2018

Smets, A.:
33rd European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2017 : Proceedings of the international conference held in Amsterdam, The Netherlands, 25 September - 29 September 2017
M√ľnchen: WIP, 2017
ISBN: 978-3-936338-47-8
ISBN: 3-936338-47-7
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <33, 2017, Amsterdam>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Materialien - Solarzellen und Technologie; Photovoltaik; Silicium-Photovoltaik; feedstock; Kristallisation und Wafering; wafering; wire; wear; silicon; characterization

The production of wafers from crystalline silicon for solar cells is increasingly realized by diamond wire sawing. A steel core wire is used on which diamonds are fixed in a layer of nickel or resin. The cutting efficiency of the wire is determined by the interplay of the material properties of the crystal that is cut, the cooling fluid and the characteristics of the diamond grit on the wire. Hereby, the density of diamonds with respect to the wire length, the shape of the diamonds and the grain size distribution of the diamonds are important. A new approach is presented to remove diamonds from nickel bonded diamond wires and subsequently analyze their density and grain size distribution. The gravimetrically determined mass of diamonds on the wire shows the same trend as the number of diamonds counted manually on microscope images. Thus, a quality control of diamond wires prior to the wafering process as well as a characterization of the wire wear during the cutting process becomes possible with higher accuracy.