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Progress in NDT system engineering through sensor physics and integrated efficient computing

: Kröning, M.; Ribero, J.G.; Vidal, A.

Fulltext urn:nbn:de:0011-n-884955 (554 KByte PDF)
MD5 Fingerprint: f6aef34e50d3bf58ab4425349871e67e
Created on: 27.8.2009

International Committee for Non-Destructive Testing -ICNDT-; Chinese Society for Non-destructive Testing -ChSNDT-:
17th World Conference on Nondestructive Testing : Shanghai, China, October 25 - 28, 2008
Shanghai, 2008
Paper 18
World Conference on Nondestructive Testing (WCNDT) <17, 2008, Shanghai>
Conference Paper, Electronic Publication
Fraunhofer IZFP ()
QNDT; signal processing; imaging; sampling phased array; nano-NDT agent; microwave imaging; pulsed thermography

Nondestructive testing (NDT) system engineering is comprised of different technologies, primarily measurement physics, computing, electronics, mechanical engineering and automation. Significant progress in sensor physics, microelectronics and computing in the last decade will change both the quality and application of NDT. We present examples of intelligent sensor technologies and integrated, efficient computing structures for signal processing. Keywords: Sensor-on-chip, Quantum Physical Sensing Effects and efficient scheduling of Optimized Algorithms including ill-posed problems. Our first systems designed on these principles allow for high-speed imaging with real-time quantitative assessment of inspection results. Multi-sensor systems, which communicate and combine their information for smarter processing, have also been developed. These principles will contribute to the current efforts in process integrated NDT, quantitative NDT and Structural Health Monitoring (SHM). We discuss ultrasonic inspection systems featuring distributed apertures, the use of optimized algorithms and computing structures for the processing of microwave and thermal data, and the health monitoring of lightweight structures with integrated ultrasonic sensor networks.