Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling

: Khatib, Mohamad el; Reitz, Sven; Warmuth, Jens

Postprint urn:nbn:de:0011-n-5967594 (898 KByte PDF)
MD5 Fingerprint: d877e69c97c7c41ef1f231ef4f655ce7
Created on: 21.7.2020

Institute of Electrical and Electronics Engineers -IEEE-:
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 : 5-8 July 2020, Cracow, Poland, Virtual Event
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-7281-6049-8
ISBN: 978-1-7281-6050-4
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <21, 2020, Online>
Bundesministerium für Bildung und Forschung BMBF (Deutschland)
Mikroelektronik aus Deutschland - Innovationstreiber der Digitalisierung; 16EMO036; ThermOBS
Thermische on-Board Spektroskopie für autonome Elektrofahrzeuge
Conference Paper, Electronic Publication
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Autonomous driving, together with electromobility, is the next major innovation step in future mobility. Not only does it add a gain in comfort but also increases vehicle and road safety. In addition to the more obvious challenges, such as the performance of algorithms (artificial intelligence), there are also major open issues regarding hardware reliability. A computer-controlled vehicle is directly relying on the functionality of its electronic components. In completely autonomous operation, with lack of human supervision, the functional failure of electronic components becomes a central issue. That’s why, a safe electronic surveillance system must take over the role of human supervision in the future. To improve the electronics’ functional safety, much research has already been done in recent years. On a basic level, the on-board sensor implementation to observe the system temperature and observing the thermal management for electronic devices is a well advanced topic and has been existing for a while in the automotive industry in general. However, an "intuitive" early detection of physical defects was rarely in focus. In this paper, a defect diagnosis and physical damage detection method for electronics packaging and assembly is being presented. This process of thermal on-board spectroscopy uses intelligent temperature sensors to monitor the status of electronic assemblies and ECUs during vehicle use by analyzing the thermal impedance and the time-dependent thermal changes of the electronic packaging system.