Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021The Impact of the Lamination Process on the Adhesion Properties at the Glass-Encapsulant Interface and Damp Heat Stability of PV Modules
Öz, A.K.; Herzog, C.; Wellens, C.; Mansour, D.E.; Heinrich, M.; Kraft, A.
Konferenzbeitrag
2021Performance of Shingled Solar Modules Under Partial Shading
Klasen, N.; Weißer, D.; Rößler, T.; Neuhaus, D.-H.; Kraft, A.
Zeitschriftenaufsatz
2021Quantitative Evaluation of the Shading Resilience of PV Modules
Klasen, N.; Lux, F.; Weber, J.; Weißer, D.; Roessler, T.; Kraft, A.; Neuhaus, D.H.
Konferenzbeitrag
2020Solderable PVD Al Back Contacts for the Module Integration of High-Efficiency c-Si Solar Cells
Nagel, H.; Gledhill, S.; Kroyer, T.; Eberlein, D.; Kraft, A.; Fischer, T.; Hain, A.; Wohlfart, P.; Glatthaar, M.; Glunz, S.W.
Konferenzbeitrag
2019Accelerated TC Test in Comparison with Standard TC Test for PV Modules with Ribbon, Wire and Shingle Interconnection
Schiller, C.; Rendler, L.C.; Eberlein, D.; Mülhöfer, G.; Kraft, A.; Neuhaus, D.-H.
Konferenzbeitrag
2019Industrialization of Ribbon Interconnection for Silicon Heterojunction Solar Cells with Electrically Conductive Adhesives
Geipel, T.; Nikitina, V.; Bauermann, L.P.; Fokuhl, E.; Schnabel, E.; Erath, D.; Krieg, A.; Kraft, A.; Fischer, T.; Lorenz, R.; Breitenbücher, D.
Konferenzbeitrag
2019Interconnection of Silicon Heterojunction Solar Cells by Infrared Soldering - Solder Joint Analysis and Temperature Study
Rose, Angela de; Geipel, T.; Eberlein, D.; Kraft, A.; Nowottnick, M.
Konferenzbeitrag
2019Lead-free Solders for Ribbon Interconnection of Crystalline Silicon PERC Solar Cells with Infrared Soldering
Geipel, T.; Eberlein, D.; Kraft, A.
Konferenzbeitrag
2018Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching
Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2018Wave-Shaped Wires Soldered on the Finger Grid of Solar Cells: Solder Joint Stability under Thermal Cycling
Rendler, L.; Haryantho, A.P.; Walter, J.; Huyeng, J.; Kraft, A.; Wiese, S.; Eitner, U.
Konferenzbeitrag
2017Low-temperature soldering for the interconnection of silicon heterojunction solar cells
Rose, Angela de; Erath, D.; Geipel, T.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2017Shingled cell interconnection: A new generation of bifacial PV-modules
Klasen, N.; Mondon, A.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2017Solder interconnection of aluminum foil rear side metallization for passivated emitter and rear solar cells
Rose, Angela de; Kraft, A.; Gledhill, S.; Ali, M.T.; Kroyer, T.; Pscherer, C.; Graf, M.; Nekarda, J.; Eitner, U.
Konferenzbeitrag
2017Solder joint stability study of wire-based interconnection compared to ribbon interconnection
Walter, J.; Rendler, L.C.; Ebert, C.; Kraft, A.; Eitner, U.
Zeitschriftenaufsatz
2017Ultra-soft wires for direct soldering on finger grids of solar cells
Rendler, L.C.; Walter, J.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U.
Zeitschriftenaufsatz
2017Ultrasonically tinned PVD AL rear contacts on high-efficiency crystalline silicon solar cells for module integration
Nagel, H.; Eberlein, D.; Hoffmann, S.; Graf, M.; Steinhauser, B.; Feldmann, F.; Kraft, A.; Eitner, U.; Glatthaar, M.; Hermle, M.; Glunz, S.W.; Haverkamp, H.; Fischer, T.; Hain, A.; Wohlfart, P.; Mertens, V.; Müller, J.; Buck, T.
Konferenzbeitrag
2016A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics
Geipel, T.; Moeller, M.; Kraft, A.; Eitner, U.
Zeitschriftenaufsatz
2016Comprehensive Study of Intermetallic Compounds in Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders
Geipel, T.; Möller, M.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2016Enabling Solderability of PVD Al Rear Contacts on High-Efficiency Crystalline Silicon Solar Cells by Wet Chemical Treatment
Nagel, H.; Kamp, M.; Eberlein, D.; Kraft, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Konferenzbeitrag
2016Investigation of Thermomechanical Stress in Solar Cells with Multi Busbar Interconnection by Finite Element Modeling
Rendler, L.C.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U.
Konferenzbeitrag
2016Low-temperature interconnection of PVD-aluminium metallization
Geipel, T.; Kumm, J.; Moeller, M.; Kroely, L.; Kraft, A.; Eitner, U.; Wolf, A.; Zhang, Z.; Wolfahrt, P.
Zeitschriftenaufsatz
2016Towards a 300 WP p-Type HIP-MWT-Module - Simulation, Experimental Results and Costs
Spribille, A.; Savisalo, T.; Kraft, A.; Eberlein, D.; Ebert, M.; Fellmeth, T.; Nold, S.; Pantsar, H.; Clement, F.
Konferenzbeitrag
2015Comprehensive comparison of different fine line printing technologies addressing the seed and plate approach with Ni-Cu-plating
Lorenz, A.; Kraft, A.; Gredy, C.; Filipovic, A.; Binder, S.; Krüger, K.; Bartsch, J.; Clement, F.; Biro, D.; Preu, R.; Reinecke, H.
Konferenzbeitrag
2014Developing a high throughput metallization approach for silicon solar cells based on flexographic printing
Lorenz, A.; Kalio, A.; Barnes Hofmeister, T.; Kroh, S.; Kraft, A.; Bartsch, J.; Clement, F.; Biro, D.
Konferenzbeitrag
2013Flexographic printing - high throughput technology for fine line seed layer printing on silicon solar cells
Lorenz, A.; Kalio, A.; Hofmeister, G.; Nold, S.; Kraft, A.; Bartsch, J.; Wolf, D.; Dreher, M.; Clement, F.; Biro, D.
Konferenzbeitrag
2012Progress with multi-step metallization processes featuring copper as conducting layer at Fraunhofer ISE
Bartsch, J.; Mondon, A.; Kamp, M.; Kraft, A.; Wendling, M.; Mehling, M.; Wehkamp, N.; Jawaid, M.; Lorenz, A.; Clement, F.; Schetter, C.; Glatthaar, M.; Glunz, S.
Konferenzbeitrag