Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Industrialization of Ribbon Interconnection for Silicon Heterojunction Solar Cells with Electrically Conductive Adhesives
Geipel, T.; Nikitina, V.; Bauermann, L.P.; Fokuhl, E.; Schnabel, E.; Erath, D.; Krieg, A.; Kraft, A.; Fischer, T.; Lorenz, R.; Breitenbücher, D.
Konferenzbeitrag
2019Interconnection of Silicon Heterojunction Solar Cells by Infrared Soldering - Solder Joint Analysis and Temperature Study
Rose, Angela de; Geipel, T.; Eberlein, D.; Kraft, A.; Nowottnick, M.
Konferenzbeitrag
2019Lead-free Solders for Ribbon Interconnection of Crystalline Silicon PERC Solar Cells with Infrared Soldering
Geipel, T.; Eberlein, D.; Kraft, A.
Konferenzbeitrag
2019LeTID - A Comparison of Test Methods on Module Level
Fokuhl, E.; Naeem, T.; Schmid, A.; Gebhardt, P.; Geipel, T.; Philipp, D.
Konferenzbeitrag
2017Low-temperature soldering for the interconnection of silicon heterojunction solar cells
Rose, Angela de; Erath, D.; Geipel, T.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2016A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics
Geipel, T.; Moeller, M.; Kraft, A.; Eitner, U.
Zeitschriftenaufsatz
2016Comprehensive Study of Intermetallic Compounds in Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders
Geipel, T.; Möller, M.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2016Low-temperature interconnection of PVD-aluminium metallization
Geipel, T.; Kumm, J.; Moeller, M.; Kroely, L.; Kraft, A.; Eitner, U.; Wolf, A.; Zhang, Z.; Wolfahrt, P.
Zeitschriftenaufsatz
2015Analysis and performance of dispensed and screen printed front side contacts at cell and module level
Rodriguez, C.; Pospischil, M.; Padilla, A.; Kuchler, M.; Klawitter, M.; Geipel, T.; Padilla, M.; Fellmeth, T.; Brand, A.; Efinger, R.; Linse, M.; Gentischer, H.; König, M.; Hörteis, M.; Wende, L.; Doll, O.; Clement, F.; Biro, D.
Konferenzbeitrag
2015Modelling and verification of mechanical stress induced by soldering of wires for multi busbar interconnection
Rendler, L.C.; Walter, J.; Geipel, T.; Volk, M.; Ebert, C.; Eitner, U.
Konferenzbeitrag