Fraunhofer-Publica

: 29

2019A 13.56 MHz RF frontend with current-mode demodulator for wide input-power dynamic-range
Fedtschenko, Tatjana; Stanitzki, Alexander; Kokozinski, Rainer; Schaal, Christopher; Müller, Kai-Uwe; Utz, Alexander; Ferres, Elischa
Konferenzbeitrag
201920-nm In₀.₈Ga₀.₂As MOSHEMT MMIC technology on silicon
Tessmann, Axel; Leuther, Arnulf; Heinz, Felix; Bernhardt, Frank; John, Laurenz; Massler, Hermann; Czornomaz, Lukas; Merkle, Thomas
Zeitschriftenaufsatz
20193D Photonic Integrated 4x4 Multi-Mode Interference Coupler
Nuck, Madeleine; Kleinert, Moritz; Conradi, Hauke; Felipe, David de; Zawadzki, Crispin; Scheu, Anja; Kresse, Martin; Brinker, Walter; Keil, Norbert; Schell, Martin
Konferenzbeitrag
2019500 GHz plasmonic Mach-Zehnder modulator enabling sub-THz microwave photonics
Burla, Maurizio; Hoessbacher, Claudia; Heni, Wolfgang; Haffner, Christian; Fedoryshyn, Yuriy; Werner, Dominik; Watanabe, Tatsuhiko; Massler, Hermann; Elder, Delwin; Dalton, Larry; Leuthold, Juerg
Zeitschriftenaufsatz
2019Benchmarking of several disparity estimation algorithms for light field processing
Zakeri, Faezeh Sadat; Bätz, Michel; Jaschke, Tobias; Keinert, Joachim; Chuchvara, Alexandra
Konferenzbeitrag
2019Bewertung von Bondverbindungen - Möglichkeiten, Normen und Herausforderungen
Dirksen, Daniel
Vortrag
2019Channeling in 4H-SiC from an Application Point of View
Pichler, Peter; Sledziewski, Tomasz; Häublein, Volker; Bauer, Anton J.; Erlbacher, Tobias
Konferenzbeitrag
2019Decoration of Al Implantation Profiles in 4H-SiC by Bevel Grinding and Dry Oxidation
Kocher, Matthias; Erlbacher, Tobias; Rommel, Mathias; Bauer, Anton J.
Konferenzbeitrag
2019Determination of Compensation Ratios of Al-Implanted 4H-SiC by TCAD Modelling of TLM Measurements
Kocher, Matthias; Yao, Boteng; Weisse, Julietta; Rommel, Mathias; Xu, Zong Wei; Erlbacher, Tobias; Bauer, Anton J.
Konferenzbeitrag
2019Development and characterization of piezoelectric AlScN-based alloys for electroacoustic applications
Lu, Yuan
: Ambacher, Oliver (Referent); Fiederle, Michael (Referent)
Dissertation
2019An experimental study on HCI under various stress conditions
Lange, André; Weddeler, Nicki; Wagner, Jakob; Bogacz, Steffen; Drehsig, Daniel
Vortrag
2019Fully integrated sensor electronics for inductive proximity switches operating up to 250 °C
Braun, Sebastian; Kordas, Norbert; Utz, Alexander; Kappert, Holger; Kokozinski, Rainer
Zeitschriftenaufsatz, Konferenzbeitrag
2019The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples
Geidel, S.; Morschhauser, A.; Otto, T.
Konferenzbeitrag
2019Influence of Sacrificial Layer Germanium Content on Stacked-Nanowire FET Performance
Klüpfel, Fabian J.
Zeitschriftenaufsatz
2019Integrated current sensing in GaN power ICs
Mönch, Stefan; Reiner, Richard; Waltereit, Patrick; Quay, Rüdiger; Ambacher, Oliver; Kallfass, Ingmar
Konferenzbeitrag
2019Investigation of the use of MOSHEMT based amplifiers in direct receivers for radiometry applications
Bansal, Nikesh
: Ambacher, Oliver (Referent); Quay, Rüdiger (Referent)
Master Thesis
2019Mechanical test structures for the determination of normal stress in multilayer freestanding MEMS-membranes
Michel, Marvin D.; Vogt, Holger
Konferenzbeitrag
2019Modeling of thermal conductivity for a CMOS-compatible MEMS-ROIC contact by TiN nanotubes
Michel, Marvin D.; Vogt, Holger
Zeitschriftenaufsatz
2019A novel high photon detection effciency silicon photomultiplier with shallow junction in 0.35 μm CMOS
D'Ascenzo, Nicola; Antonecchia, Emanuele; Brensing, Andreas; Brockherde, Werner; Dreiner, Stefan; Ewering, Johannes; Kuhn, Marvin; Schmidt, Andrei; Stein, Peter vom; Wang, Weidong; Zhou, Zhenliang; Xie, Qingguo
Zeitschriftenaufsatz
2019A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz
Konferenzbeitrag
2019Optimierung und Qualifizierung eines Bondprozesses. Tests und Analyseverfahren
Dirksen, Daniel
Vortrag
2019Optimizing reactive ion etching to remove sub-surface polishing damage on diamond
Hicks, Marie-Laure; Pakpour-Tabrizi, Alexander C.; Zürbig, Verena; Kirste, Lutz; Nebel, Christoph E.; Jackman, Richard B.
Zeitschriftenaufsatz
2019Post-CMOS 3D-integration of a nanopellistor
Münchenberger, Finja M.; Dreiner, Stefan; Kappert, Holger; Vogt, Holger
Konferenzbeitrag
2019Process and design optimization of SiC MOSFET for low on-state resistance
Sledziewski, Tomasz; Erlbacher, Tobias; Bauer, Anton
Vortrag
2019Raman Spectroscopy Characterization of Ion Implanted 4H-SiC and its Annealing Effects
Xu, Zongwei; Song, Ying; Rommel, Mathias; Liu, T.; Kocher, Matthias; He, Z.D.; Wang, H.; Yao, B.T.; Liu, L.; Fang, Fengzhou
Konferenzbeitrag
2019Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications
Bach, Linh; Dirksen, D.; Blechinger, C.; Endres, T.M.; Bayer, C.F.; Schletz, A.; März, M.
Konferenzbeitrag
2019Technological advances towards 4H-SiC JBS diodes for wind power applications
Buettner, Jonas; Erlbacher, Tobias; Bauer, Anton
Konferenzbeitrag
2018Begleitung des Wiedereintritts von Tiangong-1 mit TIRA
Sommer, Svenja
Aufsatz in Buch
2018Radarbildbasierte Navigation von Drohnen bei gestörtem GPS-Signal
Brehm, Thorsten; Janssen, Daniel
Aufsatz in Buch