Fraunhofer-Publica

: 30

2021Development and evaluation of a GaAs based 300 GHz module
Dyck, Alexander
: Backofen, Rolf; Ambacher, Oliver; Kallfass, Ingmar
Dissertation
2021Monolithic integration of a smart temperature sensor on a modular silicon-based organ-on-a-chip device
Ponte, Ronaldo Martins da; Gaio, Nikolas; Zeijl, Henk van; Vollebregt, Sten; Dijkstra, Paul; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Zeitschriftenaufsatz
2020Analysen der Lotermüdung an montierten Testbaugruppen unter Thermowechselbeanspruchungen
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Doering, R.; Scheiter, L.; Tegehall, P.-E.; Zhang, M.; Ortmann, R.W.
Konferenzbeitrag
2020Fall risk assessment - a comparative analysis of fall risks in elderly and their underlying causes
Wuerich, Carolin; Wiede, Christian; Schiele, Gregor; Grabmaier, Anton
Zeitschriftenaufsatz, Konferenzbeitrag
2020Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs
Schroeder, D.; Lange, S.; Hangmann, C.; Hedayat, C.
Aufsatz in Buch
2020Fast triage of Covid-19 patients in hospitals by means of remote respiration rate determination
Wiede, Christian; Grundmann, Kai; Wuerich, Carolin; Rademacher, Robin; Heidemann, Burkhard; Grabmaier, Anton
Zeitschriftenaufsatz, Konferenzbeitrag
2020Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
Conti, F.; Liu, E.; Bhogaraju, S.K.; Wunderle, B.; Elger, G.
Konferenzbeitrag
2020Head localization and orientation by pruned neural networks in thermal images - a method for a robust and automatic pain detection
Wiede, Christian; Stender, David; Grabmaier, Anton
Zeitschriftenaufsatz, Konferenzbeitrag
2020A hybrid framework for bearing fault diagnosis using physics-guided neural networks
Krupp, Lukas; Hennig, Andreas; Wiede, Christian; Grabmaier, Anton
Konferenzbeitrag
2020The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H.
Zeitschriftenaufsatz
2020Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000
Lange, S.; Schroeder, D.; Hedayat, C.; Hangmann, C.; Otto, T.; Hilleringmann, U.
Konferenzbeitrag
2020Leitfaden zur industriellen Bildverarbeitung
Spinnler, Klaus
: Sackewitz, Michael
Buch
2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Der Mensch in der Digitalisierung
Schmitt-Rüth, Stephanie; Jussli, Alexandra
Buch
2020Metallic Top Contacts to Self-Assembled Monolayers of Aliphatic Phosphonic Acids on Titanium Nitride
Dlugosch, Julian M.; Devendra, Deepthi; Chryssikos, Domenikos; Artmeier, Sabrina; Speckbacher, Maximilian; Kamiyama, Takuya; Tornow, Marc
Konferenzbeitrag
2020Nonvolatile Memristive Switching in Self-assembled Nanoparticle Dimers
Speckbacher, Maximilian; Jakob, Matthias; Döblinger, Markus; Veinot, Jonathan G.C.; Kartouzian, Aras; Heiz, Ueli; Tornow, Marc
Zeitschriftenaufsatz
2020PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
Bakhshaee, Nasim; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020pH-and oxygen sensors based on fluorescent nanoparticles for Lab-on-Chip applications
Netaev, Alexander; Karaduman, Birvan Dogan; Sheikh, Mohammed Ali; Schierbaum, Nicolas; Seidl, Karsten
Zeitschriftenaufsatz, Konferenzbeitrag
2020PHM features for large circuit boards to be implemented into electric drivetrain applications
Otto, A.; Kaulfersch, E.; Singh, P.; Romano, C.; Hildebrandt, M.; Rzepka, S.
Konferenzbeitrag
2020Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B.
Konferenzbeitrag
2020Quantifying the influence of graphene film nanostructure on the macroscopic electrical conductivity
Rizzi, L.; Wijaya, A.F.; Palanisamy, L.V.; Schuster, J.; Koehne, M.; Schulz, S.E.
Zeitschriftenaufsatz
2020Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
Schaal, M.; Klingler, M.; Metais, B.; Grueninger, R.; Hoffmann, S.; Wunderle, B.
Konferenzbeitrag
2020Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, R.; Anu, M.; Albrecht, J.; Scherf, C.; Rzepka, S.; Subbiah, N.; Wilde, J.
Konferenzbeitrag
2020Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests
Majd, M.; Meszmer, P.; Priscaru, A.; Gromala, P.J.; Wunderle, B.
Konferenzbeitrag
2020System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain
Doncker, R.W.de; Fuchs, L.; Hepp, M.; Luedecke, C.; Meyne, C.; Nisch, A.; Otto, A.; Reum, T.; Rzepka, S.; Strenger, C.; Uhlemann, A.; Vanegas, O.; Wondrak, W.
Konferenzbeitrag
2020The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F.
Konferenzbeitrag
2020Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using Finite Element Method and Raman spectroscopy
Liu, E.; Conti, F.; Bhogaraju, S.K.; Signorini, R.; Pedron, D.; Wunderle, B.; Elger, G.
Zeitschriftenaufsatz, Konferenzbeitrag
2020Towards CMOS Bulk Sensing for In-Situ Evaluation of ALD Coatings for Millimeter Sized Implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Water-Based Primary Cell for Powering of Wireless Sensors
Petrov, D.; Hilleringmann, U.
Konferenzbeitrag
2020Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten
Subbiah, N.; Hamza, A.; Wilde, J.; Mathew, A.; Dudek, R.
Konferenzbeitrag