Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2004Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B.
Konferenzbeitrag
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Konferenzbeitrag
2002Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B.
Zeitschriftenaufsatz
2002Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B.
Konferenzbeitrag
2002Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B.
Konferenzbeitrag