Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Method to study water diffusion into polymers
Boudaden, Jamila; Steinmaßl, Matthias; Endres, Hanns-Erik; Müller-Buschbaum, Peter
Zeitschriftenaufsatz, Konferenzbeitrag
2016Dependency of the lifetime estimation of power modules in fully rated wind turbine converters on the modelling depth of the overall system
Morisse, M.; Bartschat, A.; Wenske, J.; Mertens, A.
Konferenzbeitrag
2013Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates
Poller, T.; Lutz, J.; Boettge, B.; Knoll, H.
Konferenzbeitrag
2008Experimental and theoretical investigation of thermal stress in CFRP
Rinker, M.; Gutwinski, M.; Schäuble, R.
Konferenzbeitrag
2003Thermal shock crack propagation in a functionally graded strip
Sadowski, T.; Neubrand, A.
Konferenzbeitrag
2002Dislocation dynamics in sub-micron confinement: recent progress in Cu thin films plasticity
Dehm, G.; Balk, T.J.; Blanckenhagen, B. von; Gumbsch, P.; Arzt, E.
Zeitschriftenaufsatz
2000Pulsed top-hat beam thermal lens: a simple and sensitive tool for in situ measurement on ultraviolet dielectric components
Li, B.C.; Martin, S.; Welsch, E.; Thielsch, R.; Heber, J.; Kaiser, N.
Konferenzbeitrag
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Konferenzbeitrag
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Konferenzbeitrag
1998Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Konferenzbeitrag
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Zeitschriftenaufsatz, Konferenzbeitrag
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H.
Konferenzbeitrag
1997Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Zeitschriftenaufsatz
1995Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis
 
Tagungsband
1993Thermal damage by erosion and cracking under pulsed irradiation.
Schultrich, B.; Weiss, H.-J.; Bahr, H.-A.
Konferenzbeitrag
1992Thermokinetic calculations of the fast cook-off test.
Fabry, C.
Konferenzbeitrag
1991Schwingfestigkeit der keramikverstärkten Kolbengußlegierung GP-AlSi 12 CuMgNi bei erhöhten Temperaturen
Backer, E.; Sonsino, C.M.
Zeitschriftenaufsatz
1990Degradation of cellulose esters during aging and processing measured by gel permeation chromatography
Bohn, M.A.; Müller, D.; Volk, F.
Konferenzbeitrag