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| 2020 | Microchannel reactor heat-exchangers: A review of design strategies for the effective thermal coupling of gas phase reactions
Engelbrecht, Nicolaas; Everson, Raymond C.; Bessarabov, Dmitri; Kolb, Gunther | Zeitschriftenaufsatz |
| 2019 | Aluminum Foam Sandwich Battery Housing for Electric Cars
Schmerler, Rico; Hipke, Thomas; Schuller, Friedrich; Richter, Alexander | Vortrag |
| 2019 | Closed Cell Aluminum Foam Products Infiltrated with Phase Change Material (PCM) Used for Battery Housing Applications of Electric Cars
Schmerler, Rico; Hipke, Thomas; Drossel, Welf-Guntram | Vortrag |
| 2019 | Comprehensive determination of heat generation and thermal modelling of a hybrid capacitor
Miller, Martin; Baltes, Norman; Rabenecker, Peter; Hagen, Marcus; Tübke, Jens | Zeitschriftenaufsatz |
| 2019 | Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter | Buch |
| 2019 | Increased thermal inertia of ball screws by using phase change materials
Voigt, Immanuel; Navarro Y De Sosa, Iñaki; Wermke, Benjamin; Bucht, Andre; Drossel, Welf-Guntram | Zeitschriftenaufsatz |
| 2019 | Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter | Aufsatz in Buch |
| 2019 | Thermal management materials based on molybdenum (Mo) and copper (Cu): Elucidation of the rolling-induced evolution of thermophysical properties (e.g. CTE)
Reiser, J.; Hoffmann, A.; Hain, J.; Jäntsch, U.; Klimenkov, M.; Hohe, J.; Mrotzek, T. | Zeitschriftenaufsatz |
| 2017 | GaSb-based VECSEL for high-power applications and Ho-pumping
Holl, Peter; Rattunde, Marcel; Adler, Steffen; Scholle, Karsten; Lamrini, Samir; Fuhrberg, Peter; Diwo-Emmer, Elke; Aidam, Rolf; Bronner, Wolfgang; Wagner, Joachim | Konferenzbeitrag |
| 2012 | Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas | Konferenzbeitrag |
| 2011 | Ermittlung und Auslegung eines Konzeptes für ein energieeffizientes Thermomanagement einer Lithium-Ionen-Batterie unter Einsatz intelligenter Werkstoffe
Ohsenbrügge, Christoph | Diplomarbeit |
| 2008 | Thermal management in 2.3-mu m semiconductor disk lasers: A finite element analysis
Kemp, A.J.; Hopkins, J.-M.; Maclean, A.J.; Schulz, N.; Rattunde, M.; Wagner, J.; Burns, D. | Zeitschriftenaufsatz |
| 2006 | 3D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | Optically pumped mid infrared emitters built using surface structured PbSe epitaxial layers
Nurnus, J.; Vetter, U.; König, J.; Glatthaar, R.; Lambrecht, A.; Weik, F.; Tomm, J.W. | Konferenzbeitrag |
| 2003 | Thermal management in high-density power converters
März, M. | Konferenzbeitrag |
| 2001 | Design of coplanar power amplifiers for millimeter-wave system applications including thermal aspects
Bessemoulin, A.; Marsetz, W.; Baeyens, Y.; Osorio, R.; Massler, H.; Hülsmann, A.; Schlechtweg, M. | Zeitschriftenaufsatz |
| 2001 | Micro thermal management of high-power diode laser bars
Lorenzen, D.; Bonhaus, J.; Fahrner, E.; Kaulfersch, E.; Wörner, E.; Koidl, P.; Unger, K.; Müller, D.; Rölke, S.; Schmidt, H.; Grellmann, M. | Zeitschriftenaufsatz |
| 2000 | Design of coplanar power amplifiers for MM-wave system applications including thermal aspects
Bessemoulin, A.; Marsetz, W.; Baeyens, Y.; Osorio, R.; Massler, H.; Hülsmann, A.; Schlechtweg, M. | Konferenzbeitrag |
| 1999 | CVD-diamonds shine brightly. Part 2: Diamond, space and related items
Schäfer, L.; Meier, M. | Zeitschriftenaufsatz |
| 1999 | Thermische und elektrische Konzeption von GaAs-HEMTs für Leistungsverstärker bis 80 GHz
Marsetz, W. | Dissertation |
| 1998 | CVD-diamonds shine brightly. Part 1
Schäfer, L.; Meier, M. | Zeitschriftenaufsatz |
| 1998 | Thermal properties and applications of CVD diamond
Wörner, E. | Aufsatz in Buch |
| 1997 | High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H. | Konferenzbeitrag |