Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Selective silver sintering of semiconductor dies on PCB
Dresel, Fabian; Letz, Sebastian; Zischler, Sigrid; Schletz, Andreas; Novak, Michael
Konferenzbeitrag
2015Assembly and packaging technologies for high-temperature and high-power GaN devices
Bajwa, A.A.; Qin, Yangyang; Reiner, R.; Quay, R.; Wilde, J.
Zeitschriftenaufsatz
2014Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering
Hutzler, Aaron; Tokarski, Adam; Kraft, Silke; Zischler, Sigrid; Schletz, Andreas
Konferenzbeitrag
2013Extending the lifetime of power electronic assemblies by increased cooling temperatures
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Zeitschriftenaufsatz, Konferenzbeitrag
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Konferenzbeitrag
2012Reliability of silver sintering on DBC and DBA substrates for power electronic applications
Kraft, S.; Schletz, A.; Maerz, M.
Konferenzbeitrag