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| 2012 | A Bayesian logistic regression model for binomial failure data
Kempf, Michael | Konferenzbeitrag |
| 2012 | Chemometric tools for analysing Terahertz fingerprints in a postscanner
Ellrich, Frank; Torosyan, Garik; Wohnsiedler, Sabine; Bachtler, Sebastian; Hachimi, A.; Jonuscheit, Joachim; Beigang, René; Platte, F.; Nalpantidis, K.; Sprenger, T.; Hübsch, D. | Konferenzbeitrag |
| 2012 | Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Merkle, L.; Sonner, M.; Petzold, M. | Zeitschriftenaufsatz |
| 2012 | Efficient planar SOFC technology for a portable power generator
Poenicke, A.; Reuber, S.; Dosch, C.; Megel, S.; Kusnezoff, M.; Wunderlich, C.; Michaelis, A. | Konferenzbeitrag |
| 2012 | Feasiblity and limitations of anti-fuses based on bistable non-volatile switches for power electronic applications
Erlbacher, Tobias; Hürner A.; Bauer, Anton J.; Frey, Lothar | Zeitschriftenaufsatz |
| 2012 | GaN-based high-frequency devices and circuits: A Fraunhofer perspective
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Cäsar, M.; Müller, S.; Raay, F. van; Kiefer, R.; Brueckner, P.; Kühn, J.; Musser, M.; Kirste, L.; Haupt, C.; Pletschen, W.; Lim, T.; Aidam, R.; Mikulla, M.; Ambacher, O. | Zeitschriftenaufsatz |
| 2012 | High efficiency X-band AlGaN/GaN MMICs for space applications with lifetimes above 10(5) hours
Waltereit, P.; Kühn, J.; Quay, R.; Raay, F. van; Dammann, M.; Cäsar, M.; Müller, S.; Mikulla, M.; Ambacher, O.; Lätti, J.; Rostewitz, M.; Hirche, K.; Däubler, J. | Konferenzbeitrag |
| 2012 | How to achieve and measure quality in multi-core systems
Hupp, Steffen
: Rombach, H. Dieter (Supervisor); Lampasona, Constanza (Supervisor) | Bachelor Thesis |
| 2012 | Improving module performance and reliability in power electronic applications by monolithic integration of RC-snubbers
Erlbacher, Tobias; Schwarzmann, Holger; Bauer, Anton J.; Berberich, Sven E.; Dorp, Joachim vom; Frey, Lothar | Konferenzbeitrag |
| 2012 | Portable 100 W power generator based on efficient planar SOFC technology
Pönicke, Andreas; Reuber, Sebastian; Dosch, Christian; Megel, Stefan; Kusnezoff, Mihails; Wunderlich, Christian; Michaelis, Alexander | Vortrag |
| 2012 | Portable 100W power generator based on efficient planar SOFC technology
Reuber, S.; Pönicke, A.; Wunderlich, C.; Michaelis, A. | Vortrag |
| 2012 | Safe product design - the role of the NDE reliability analysis
Pavlovic, Mato; Ronneteg, Ulf; Müller, Christina; Ewert, Uwe; Boller, Christian | Konferenzbeitrag |
| 2012 | Trade-offs between performance and reliability in AlGaN/GaN transistors
Waltereit, P.; Bronner, W.; Kiefer, R.; Quay, R.; Dammann, M.; Cäsar, M.; Brueckner, P.; Müller, S.; Mikulla, M.; Ambacher, O. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2011 | Approaching runtime trust assurance in open adaptive systems
Schneider, Daniel; Becker, Martin; Trapp, Mario | Konferenzbeitrag |
| 2011 | Approaching runtime trust assurance in open adaptive systems
Schneider, Daniel; Becker, Martin; Trapp, Mario | Forschungsbericht |
| 2011 | Characterization of reliability
Nuffer, Jürgen; Flaschenträger, D.; Janssen, Enrico; Hoffmann, D.; Gäng, J. | Aufsatz in Buch |
| 2011 | From epitaxy to backside process: Reproducible AlGaN/GaN HEMT technology for reliable and rugged power devices
Bronner, W.; Waltereit, P.; Müller, S.; Dammann, M.; Kiefer, R.; Dennler, P.; Raay, F. van; Musser, M.; Quay, R.; Mikulla, M.; Ambacher, O. | Konferenzbeitrag |
| 2011 | High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology
Grella, K.; Vogt, H.; Paschen, U. | Konferenzbeitrag |
| 2011 | Integrating mobile devices into the car ecosystem - tablets and smartphones as vital part of the car
Hess, Steffen; Meschtscherjakov, Alexander; Ronneberger, Torsten; Trapp, Marcus | Konferenzbeitrag |
| 2011 | Light switched plasma charging protection device for high-field characterization and flash memory protection
Sommer, S.P.; Paschen, U.; Figge, M.; Vogt, H. | Zeitschriftenaufsatz |
| 2011 | Properties and reliability of silicon nitride substrates with AMB copper conductor
Böhm, G.; Brunner, D.; Sichert, I.; Pönicke, A.; Schilm, J. | Konferenzbeitrag |
| 2010 | AlGaN/GaN epitaxy and technology
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Kiefer, R.; Pletschen, W.; Müller, S.; Aidam, R.; Menner, H.; Kirste, L.; Köhler, K.; Mikulla, M.; Ambacher, O. | Zeitschriftenaufsatz |
| 2010 | A Bayesian reliability model for failure count data
Kempf, Michael | Konferenzbeitrag |
| 2010 | Component-based modeling and verification of dynamic adaptation in safety-critical embedded systems
Adler, Rasmus; Schäfer, Ina; Trapp, Mario; Poetzsch-Heffter, Arnd | Zeitschriftenaufsatz |
| 2010 | Conditional safety certificates in open systems
Schneider, Daniel; Trapp, Mario | Konferenzbeitrag |
| 2010 | Data-mining-based link failure detection for wireless mesh networks
Lindhorst, Timo; Lukas, Georg; Nett, Edgar; Mock, Michael | Konferenzbeitrag |
| 2010 | Degradation of sealing glasses under electrical load
Rost, A.; Schilm, J.; Kusnezoff, M.; Michaelis, A. | Konferenzbeitrag |
| 2010 | Development of rugged 2 GHz power bars delivering more than 100 W and 60% power added efficiency
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Mikulla, M.; Ambacher, O.; Harm, L.; Lorenzini, M.; Rödle, T.; Riepe, K.; Bellmann, K.; Buchheim, C.; Goldhahn, R. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2010 | Entwickungsbegleitendes, domänenübergreifendes Zuverlässigkeitsmodell
Kempf, Michael; Rauschenbach, Matthias | Konferenzbeitrag |
| 2010 | Fault tolerant sequential control
Neugebauer, Reimund; Barthel, S.; Richter, M. | Konferenzbeitrag |
| 2010 | High efficiency and low leakage AlGaN/GaN HEMTs for a robust, reproducible and reliable X-band MMIC space technology
Waltereit, P.; Bronner, W.; Kiefer, R.; Quay, R.; Kühn, J.; Raay, F. van; Dammann, M.; Müller, S.; Libal, C.; Meier, T.; Mikulla, M.; Ambacher, O. | Konferenzbeitrag |
| 2010 | Reliability of intralogistics-systems - oversizing or maintenance
Wenzel, S.; Köpcke, C.; Bandow, G. | Konferenzbeitrag |
| 2010 | Reliability status of GaN transistors and MMICs in Europe
Dammann, M.; Cäsar, M.; Konstanzer, H.; Waltereit, P.; Quay, R.; Bronner, W.; Kiefer, R.; Müller, S.; Mikulla, M.; Wel, P.J. van der; Rödle, T.; Bourgeois, F.; Riepe, K. | Konferenzbeitrag |
| 2010 | Reliable component fatigue design applying appropriate cyclic properties
Amos, D.; Delarbre, P.; Lipp, K.; Kaufmann, H. | Konferenzbeitrag |
| 2010 | Softwarequalität in medizinischen Produkten sichern
Eschbach, Robert; Rosbach, Alla | Zeitschriftenaufsatz |
| 2010 | A survey to control unvertainties by comprehensive monitoring of load-carrying structures
Koenen, J.F.; Platz, R.; Hanselka, H. | Konferenzbeitrag |
| 2010 | Transparent combination of expert and measurement data for defect prediction - an industrial case study
Kläs, Michael; Elberzhager, Frank; Münch, Jürgen; Hartjes, Klaus; Graevemeyer, Olaf von | Forschungsbericht |
| 2009 | Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M. | Konferenzbeitrag |
| 2009 | Design of reliable circuits by determination of SOA borders as part of the degradation analysis
Jancke, R.; Ellmers, C.; Gaertner, R. | Konferenzbeitrag |
| 2009 | Influence of cyclic loading and temperature on integrity of piezoceramic patch transducers
Gall, M.; Thielicke, B. | Konferenzbeitrag |
| 2009 | Komposition von Benutzungsmodellen: Anforderungen und Konzeption
Bauer, Thomas; Eschbach, Robert; Hussain, Tanvir; Kloos, Johannes; Zimmermann, Fabian | Forschungsbericht |
| 2009 | Komposition von Benutzungsmodellen: Operatoren und Anwendungsbeispiele
Bauer, Thomas; Eschbach, Robert; Hussain, Tanvir; Kloos, Johannes; Zimmermann, Fabian | Forschungsbericht |
| 2009 | Oversizing or maintenance
Wenzel, S.; Bandow, G. | Konferenzbeitrag |
| 2009 | Packaging influence on laser bars of different dimensions
Westphalen, T.; Leers, M.; Werner, M.; Traub, M.; Hoffmann, H.-D.; Ostendorf, R. | Konferenzbeitrag |
| 2009 | Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
Dammann, M.; Pletschen, W.; Waltereit, P.; Bronner, W.; Quay, R.; Müller, S.; Mikulla, M.; Ambacher, O.; Wel, P.J. van der; Murad, S.; Rödle, T.; Behtash, R.; Bourgeois, F.; Riepe, K.; Fagerlind, M.; Sveinbjörnsson, E.Ö. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2009 | Reliability and effective signal-to-noise ratio of RuO(sub 2)-based thick film strain gauges
Dietrich, S.; Kretzschmar, C.; Partsch, U.; Rebenklau, L. | Konferenzbeitrag |
| 2009 | Reliability consideration of low-power-grid-tied inverter for photovoltaic application
Liu, J.; Henze, N. | Konferenzbeitrag |
| 2008 | Assembly of ASICs for high temperature applications - material characterization and reliability testing
Klieber, R.; Trieu, H.-K. | Konferenzbeitrag |
| 2008 | A Bayesian approach for estimating survival probabilities
Kempf, Michael | Konferenzbeitrag |
| 2008 | Berücksichtigung von Streuungen in der simulationsgeschützten Funktions- und Zuverlässigkeitsanalyse
Jöckel, M.; Bruder, T. | Konferenzbeitrag |
| 2008 | Component engineering for adaptive Ad-hoc systems
Peper, Christian; Schneider, Daniel | Konferenzbeitrag |
| 2008 | DC-arc behavior of a novel active fuse
Dorp, J. vom; Berberich, S.E.; Bauer, A.J.; Ryssel, H. | Konferenzbeitrag |
| 2008 | Development of test procedures for polymer material characterization in view of long-term durability of PV-modules
Schulze, S.-H.; Dietrich, S.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2008 | High-efficiency GaN HEMTs on 3-inch semi-insulating SiC substrates
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Raynor, B.; Mikulla, M.; Weimann, G. | Zeitschriftenaufsatz |
| 2008 | Managing software quality through a hybrid defect content and effectiveness model
Kläs, Michael; Elberzhager, Frank; Nakao, Haruka | Konferenzbeitrag |
| 2008 | Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
Dammann, M.; Pletschen, W.; Waltereit, P.; Bronner, W.; Quay, R.; Müller, S.; Mikulla, M.; Ambacher, O.; Wel, P.J. van der; Murad, S.; Rödle, T.; Behtash, R.; Bourgeois, F.; Riepe, K.; Fagerlind, M.; Sveinbjörnsson, E.Ö. | Konferenzbeitrag |
| 2008 | Reliability investigation of an automotive oil pan equipped with active noise reduction
Nuffer, J.; Pfeiffer, T.; Flaschenträger, D. | Konferenzbeitrag |
| 2008 | Reliability-based generation and view synthesis in layered depth video
Müller, K.; Smolic, A.; Dix, K.; Kauff, P.; Wiegand, T. | Konferenzbeitrag |
| 2008 | Structural durability of welded constructions - safety and reliability aspects in fatigue life assessment of offshore tubular structures
Sonsino, C.M. | Konferenzbeitrag |
| 2008 | Structural health monitoring of fiber components
Lehmann, M.; Büter, A.; Hanselka, H.; Haase, K.-H. | Konferenzbeitrag |
| 2008 | A uniform, reproducible and reliable GaN HEMT technology with breakdown voltages in excess of 160 V delivering more than 60% PAE at 80 V
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Walcher, H.; Raay, F. van; Kappeler, O.; Mikulla, M. et al. | Konferenzbeitrag |
| 2007 | Comparison of test methods for strength characterization of thin solar wafer
Schönfelder, S.; Bohne, A.; Bagdahn, J. | Konferenzbeitrag |
| 2007 | Development of safe and reliable embedded systems using dynamic adaptation
Adler, Rasmus; Schneider, Daniel; Trapp, Mario | Konferenzbeitrag |
| 2007 | Examination of reliability of piezoelektric cantilever beams
Platz, R. | Konferenzbeitrag |
| 2007 | Fracture strength of SOI springs in MEMS micromirrors
Hsu, S.-T.; Wolter, A.; Owe, W.-D.; Schenk, H. | Konferenzbeitrag |
| 2007 | High temperature reliability of organic light emitting diodes
Lesiuk, P. | Diplom-Arbeit |
| 2007 | Life-span investigations of piezoceramic patch sensors and actuators
Gall, M.; Thielicke, B. | Konferenzbeitrag |
| 2007 | Lötbarkeit und Zuverlässigkeit bleifreier Leiterplatten-Oberflächen
Pape, U. | Vortrag |
| 2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Reliability investigation of piezoelectric macro fibre composite (MFC) actuators
Nuffer, J.; Schönecker, A.; Brückner, B.; Kohlrautz, D.; Michelis, P.; Adarraga, O.; Wolf, K. | Konferenzbeitrag |
| 2007 | Reliabilty prediction with the aid of bayesian statistics
Kempf, Michael | Konferenzbeitrag |
| 2006 | A bayesian approach assessing the availability of technical systems under different operating conditions throughout their life cycle
Mannuß, O.; Schneider, S.; Kempf, M.; Westkämper, E. | Konferenzbeitrag |
| 2006 | Characterization of reliability
Nuffer, J.; Hanselka, H. | Aufsatz in Buch |
| 2006 | Condition - Monitoring - System für die Strukturüberwachung
Schubert, L.; Frankenstein, B. | Konferenzbeitrag |
| 2006 | Drop simulation and stress analysis of MEMS devices
Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J. | Konferenzbeitrag |
| 2006 | Dynamische Adaption für die Entwicklung verlässlicher Softwaresysteme im Automobil
Trapp, M.; Schäfer, C.; Robinson-Mallett, C. | Konferenzbeitrag |
| 2006 | Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors
Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H. | Konferenzbeitrag |
| 2006 | Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material
Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L. | Konferenzbeitrag |
| 2006 | Methoden zur Zuverlässigkeitsqualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik
Wilde, J.; Schneider-Ramelow, M.; Petzold, M.
: Scheel, W. | Buch |
| 2006 | Physical domain modeling for the development of dependable embedded systems
Domis, D.J.; Schäfer, C.; Trapp, M. | Konferenzbeitrag |
| 2006 | Technologies and reliability of modern embedded flash cells
Sikora, A.; Pesl, F.-P.; Unger, W.; Paschen, U. | Zeitschriftenaufsatz |
| 2006 | Untersuchung der Zuverlässigkeit hochtemperaturgeeigneter Baugruppen
Pape, U.; Nowottnick, M.; Rittner, M.; Neher, W. | Konferenzbeitrag |
| 2006 | Vibration control with adaptive structures
Hanselka, H.; Melz, T.; Drossel, W.-G.; Sporn, D.; Schönecker, A.; Poigné, A. | Konferenzbeitrag |
| 2006 | Zuverlässigkeit stoffschlüssiger Fügeverbindungen für Hochtemperatur-Elektronikbaugruppen
Nowottnick, M. | Habilitationsschrift |
| 2005 | Bewertung der Ergebnisse und Simulation der Zuverlässigkeit
Nowottnick, M.; Pape, U.; Neher, W. | Aufsatz in Buch |
| 2005 | Condition monitoring of automotive electronic systems with life cycle units
Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2005 | A coplanar X-band AlGaN/GaN power amplifier MMIC on s.i. SiC substrate
Raay, F. van; Quay, R.; Kiefer, R.; Benkhelifa, F.; Raynor, B.; Pletschen, W.; Kuri, M.; Massler, H.; Müller, S.; Dammann, M.; Mikulla, M.; Schlechtweg, M.; Weimann, G. | Zeitschriftenaufsatz |
| 2005 | Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, T.; Kallmayer, C. | Konferenzbeitrag |
| 2005 | Globalization in automotive industry and product reliability
Grubisic, V. | Konferenzbeitrag |
| 2005 | Making reliability statements for technical systems under different environmental conditions - an application of Bayesian networks
Schneider, S.; Kempf, M. | Konferenzbeitrag |
| 2005 | Mechanical failure behavior of glass frit bondet structures
Ebert, M.; Dresbach, C.; Krombholz, A.; Bagdahn, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Hofer, H. | Konferenzbeitrag |
| 2005 | Niedrigtemperaturmontage hochintegrierter elektronischer Baugruppen durch selektive Mikrowellenerwärmung
Pape, U.; Nowottnick, M.; Diehm, R. | Poster |
| 2005 | NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M. | Konferenzbeitrag |
| 2005 | Reliability of wafer bonding in microsystem technologies
Bagdahn, J. | Konferenzbeitrag |
| 2005 | Sensor modules for structural health monitoring and reliability of components
Kröning, M.; Berthold, A.; Meyendorf, N. | Konferenzbeitrag |
| 2005 | Software reliability growth prediction - state of the art
Apel, S. | Forschungsbericht |
| 2004 | Fuel cell based drive trains in public transport
Jonas, K.; Schneider, M.; Klingner, M. | Konferenzbeitrag |
| 2004 | Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2004 | Qualität im Automobil: Systematische Definition nichtfunktionaler Anforderungen
Doerr, J.; Olsson, T.; Schmid, K. | Konferenzbeitrag |
| 2004 | Reliability of active systems - an essential design aspect for commercial success
Büter, A.; Melz, T.; Hanselka, H. | Konferenzbeitrag |
| 2003 | A coplanar 94 GHz low-noise amplifier MMIC using 0.07 µm metamorphic cascode HEMTs
Tessmann, A.; Leuther, A.; Schwörer, C.; Massler, H.; Kudszus, S.; Reinert, W.; Schlechtweg, M. | Konferenzbeitrag |
| 2003 | Fatigue of polycrystalline silicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N. | Zeitschriftenaufsatz |
| 2003 | Metamorphic HEMT technologies for millimeter-wave low-noise applications
Tessmann, A.; Leuther, A.; Massler, H.; Reinert, W.; Schwörer, C.; Dammann, M.; Walther, M.; Schlechtweg, M.; Weimann, G. | Konferenzbeitrag |
| 2003 | Reliability and degradation mechanism of AlGaAs/InGaAs and InAlAs/InGaAs HEMTs
Dammann, M.; Leuther, A.; Benkhelifa, F.; Feltgen, T.; Jantz, W. | Zeitschriftenaufsatz |
| 2003 | Reliability of piezoceramic patch sensors under cyclic mechanical loading
Thielicke, B.; Gesang, T.; Wierach, P. | Zeitschriftenaufsatz |
| 2003 | Von Störungen und Ausfällen zur Zuverlässigkeit
Stender, S. | Konferenzbeitrag |
| 2002 | Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Konferenzbeitrag |
| 2002 | High-field step-stress and long term stability of PHEMTs with different gate and recess lengths
Cova, P.; Menozzi, R.; Dammann, M.; Feltgen, T.; Jantz, W. | Zeitschriftenaufsatz |
| 2002 | High-reliability MOCVD-grown quantum dot laser
Sellin, R.L.; Ribbat, C.; Bimberg, D.; Rinner, F.; Konstanzer, H.; Kelemen, M.T.; Mikulla, M. | Zeitschriftenaufsatz |
| 2002 | Mechanical and electrical failures and reliability of micro scanning mirrors
Gaumont, E.; Wolter, A.; Schenk, H.; Georgelin, G.; Schmoger, M. | Konferenzbeitrag |
| 2002 | Numerical and experimental verification of structural durability for safety components - analogy motorcar/train
Büter, A.; Fischer, G.; Störzel, K.; Weber, C. | Konferenzbeitrag |
| 2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2002 | Reliability of metamorphic HEMTs for power applications
Dammann, M.; Benkhelifa, F.; Meng, M.; Jantz, W. | Zeitschriftenaufsatz |
| 2002 | Simultaneous flip chip underfill and encapsulation
Becker, K.F.; Braun, T.; Adams, T. | Zeitschriftenaufsatz |
| 2001 | Fatigue Design, Testing and Relability of Ceramic Components by the Example of Intake and Exhaust Valves
Sonsino, C.M. | Konferenzbeitrag |
| 2000 | Analysis of HBT behavior after strong electrothermal stress
Palankovski, V.; Selberherr, S.; Quay, R.; Schultheis, R. | Konferenzbeitrag |
| 2000 | Digital signatures for interactive web services
Hirsch, C. | Projektbericht |
| 2000 | Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs
Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Marsetz, W.; Schmidt, K.; Weimann, G. | Zeitschriftenaufsatz |
| 2000 | Reliability of InAlAs/InGaAs HEMTs grown on GaAs substrate with metamorphic buffer
Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Weimann, G. | Zeitschriftenaufsatz |
| 2000 | Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches
Bagdahn, J.; Petzold, M.; Seidel, H. | Konferenzbeitrag |
| 1999 | Disparity/segmentation analysis: Matching with an adaptive window and depth-driven segmentation
Izquierdo, E. | Zeitschriftenaufsatz |
| 1999 | Fabrication and characterization of high power diode lasers
Jandeleit, J.; Wiedmann, N.; Ostlender, A.; Brandenburg, W.; Loosen, P.; Poprawe, R. | Konferenzbeitrag |
| 1999 | Moderne Entwicklungsprozesse sichern Wirtschaftlichkeit und Zuverlässigkeit
Sonsino, C.M. | Konferenzbeitrag |
| 1999 | Passivated 0,15 mu m InAlAs/InGaAs HEMTs with 500 GHz f(max). HF performance, thermal stability and reliability
Chertouk, M.; Dammann, M.; Massler, M.; Köhler, K.; Weimann, G. | Konferenzbeitrag |
| 1999 | Probabilistic fracture mechanics approach to pressure vessel reliability evaluation
Cioclov, D.; Kröning, M. | Konferenzbeitrag |
| 1999 | Reliability of passivated 0.15 mu m InAlAs/InGaAs HEMT's with pseudomorphic channel
Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Schmidt, K.H.; Weimann, G. | Konferenzbeitrag |
| 1999 | Sicherheit und Zuverlässigkeit durch präventive Anlagensimulation
Putz, M.; Naumann, B.; Noack, S. | Konferenzbeitrag |
| 1999 | Towards the re-use of electronic products-quality assurance for the re-use of electronics
Potter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.; Reichl, H. | Konferenzbeitrag |
| 1998 | Advantages of Al-free GaInP/InGaAs PHEMTs for power applications
Chertouk, M.; Bürkner, S.; Bachem, K.H.; Pletschen, W.; Kraus, S.; Braunstein, J.; Tränkle, G. | Zeitschriftenaufsatz |
| 1998 | Comparison of procedures for experimental and theoretical durability approval of a truck axle
Dini, A.; Rupp, A. | Buch |
| 1998 | Effect of atmosphere on reliability of passivated 0.15 mu m InAlAs/InGaAs HEMTs
Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Schmidt, K.H.; Weimann, G. | Zeitschriftenaufsatz |
| 1998 | Fatigue design and testing of components
Sonsino, C.M. | Konferenzbeitrag |
| 1998 | Fatigue design and testing of components
Sonsino, C.M. | Konferenzbeitrag |
| 1998 | Fatigue design. Testing, quality reliability and safety on the example of automotive PM' components
Sonsino, C.M. | Konferenzbeitrag |
| 1998 | Früherkennung sicherheitsrelevanter Betriebszustände in Chemieanlagen mit neuronalen Netzen
Neumann, J.; Deerberg, G.; Schlüter, S. | Konferenzbeitrag |
| 1998 | GaInP/GaInAs/GaAs-MODFETs with pseudomorphic GaInP barriers, device concept and device properties
Pletschen, W.; Bachem, K.H.; Chertouk, M.; Bürkner, S.; Braunstein, J. | Konferenzbeitrag |
| 1998 | Realisierung von Transaktionen innerhalb von C/S-Systemen am Beispiel eines Workflow-Management-Systems
Messer, B. | Konferenzbeitrag |
| 1998 | Service-like durability approval of wheelsets
Fischer, G.; Grubisic, V. | Konferenzbeitrag |
| 1997 | Kosten/Nutzen-Analyse von GQM-basiertem Messen und Bewerten. Eine replizierte Fallstudie
Gresse, C.; Hoisl, B.; Rombach, H.D.; Ruhe, G. | Konferenzbeitrag |
| 1997 | Long-range high-reliability telemetry in unlicensed frequency bands
Mayer, F.; Perthold, R. | Konferenzbeitrag |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H. | Konferenzbeitrag |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 1997 | Methodology for effective design evaluation and durability approval of car suspension components
Grubisic, V.; Fischer, G. | Buch |
| 1997 | Probabilistic Assessment of Failure Risk in Load-Bearing Components
Cioclov, D.; Kröning, M.; Schmitz, V. | Konferenzbeitrag |
| 1997 | Schädigungsproportionale Beschreibung von Lastfolgen mit veränderlichen Mittellasten. Das Trennverfahren
Oppermann, H. | Buch |
| 1996 | An Instrument for Measuring the Success of the Requirements Engineering Process in Information Systems Development
Emam, K. el; Madhavji, N.H. | Zeitschriftenaufsatz |
| 1996 | Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H. | Konferenzbeitrag |
| 1996 | Trends of photonic communications networks
Baack, C. | Zeitschriftenaufsatz |
| 1995 | Flip chip soldering on printed wining boards using vapor phase reflow
Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J. | Konferenzbeitrag |
| 1995 | A novel resistor system for AlN
Kretzschmar, C.; Otschik, P.; Schoene, F.; Jaenicke-Rößler, K. | Konferenzbeitrag |
| 1995 | Reliability governing factors of various dielectrics
Otschik, P.; Kretzschmar, C.; Keitel, U. | Konferenzbeitrag |
| 1994 | A CMD-only reproducible field degradation and its reliability aspect
Gieser, H.A.; Egger, P.; Reiner, J.C.; Herrmann, M.R. | Konferenzbeitrag |
| 1994 | Schadensanalyse des Dielektrikums - DP5704
Otschik, P.; Kretschmar, C.; Obenaus, P. | Buch |
| 1993 | Mehrlagenmetallisierung für hochintegrierte mikroelektronische Schaltungen
Vogt, H. | Habilitationsschrift |
| 1993 | Reliability assurance of railroad wheels by ultrasonic stress analysis
Schneider, E.; Bruche, D.; Frotscher, H.; Herzer, H.-R. | Konferenzbeitrag |
| 1993 | Tasks of Non-Destructive Testing
Dobmann, G.; Kröning, M. | Konferenzbeitrag |
| 1992 | Motion compensated interpolation for advanced standards conversion and noise reduction
Ernst, M. | Konferenzbeitrag |
| 1992 | Surface remelting and alloying of Al-based alloys with CO2 laser radiation
Kreutz, E.W.; Rozsnoki, M.; Pirch, N. | Konferenzbeitrag |
| 1992 | Testability of expert systems in system development and application
Hoenen, M.; Kloth, M.; Steven, E. | Zeitschriftenaufsatz |
| 1991 | Procjena vijeka trajanja za automobilske komponente
Grubisic, V. | Konferenzbeitrag |
| 1990 | Improving quality and reliability - a challenge for environmental engineering.
Schubert, H. | Zeitschriftenaufsatz |
| 1990 | A new explanation for the degradation of gold-aluminium bonds
Haag, F.J. | Konferenzbeitrag |
| 1990 | Reliability of interfaces in newly designed ceramic-ceramic and metal-ceramic systems
Schönholz, R.; Kleer, G.; Döll, W. | Buch |
| 1990 | Umweltsimulation sichert Qualität und Zuverlässigkeit
Schubert, H. | Zeitschriftenaufsatz |
| 1990 | Zuverlässigkeitsuntersuchungen von Aluminium-Drahtbonds auf Gold Dickschichtleiterbahnen
Haag, J.F. | Konferenzbeitrag |
| 1988 | Thermal degradation effects in InP
Sartorius, B.; Schlak, M.; Rosenzweig, M.; Parschke, K. | Zeitschriftenaufsatz |
| 1987 | An age-wear dependent model of failure
Giglmayr, J. | Zeitschriftenaufsatz |
| 1986 | Application of coherent systems in the subscriber loop
Bachus, E.-J.; Heydt, G. | Konferenzbeitrag |
| 1984 | A common approach to the analysis and optimization of bus systems and loss systems
Giglmayr, J. | Konferenzbeitrag |
| 1982 | Monitoring aids in an experimental broadband communication system
Burmeister, M.; Donner, H.; Kliem, H.; Kreutzer, H.W.; Schmidt, F. | Konferenzbeitrag |
| 1982 | Subscriber stations in service integrated optical broad band communications systems
Buenning, H.; Kreutzer, H.W.; Schmidt, F. | Zeitschriftenaufsatz |
| 1980 | Optical-fiber system with distributed access
Herold, W.E.; Ohnsorge, H. | Zeitschriftenaufsatz |
| 1980 | Switching systems for integrated communication
Nobis, R.; Saniter, J.; Schaffner, H. | Konferenzbeitrag |
| 1979 | Estimation of the reliability of hierarchical communication networks
Mrozynski, G. | Zeitschriftenaufsatz |