Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019A coupled thermomechanical approach for finite element forming simulation of continuously fiber-reinforced semi-crystalline thermoplastics
Dörr, Dominik; Joppich, Tobias; Kugele, Daniel; Henning, Frank; Kärger, Luise
Zeitschriftenaufsatz
2019Injection molding simulation of short fiber reinforced thermosets with anisotropic and non-Newtonian flow behavior
Wittemann, Florian; Märtens, Robert; Kärger, Luise; Henning, Frank
Zeitschriftenaufsatz
2019Process variability - technological challenge and design issue for nanoscale devices
Lorenz, Jürgen; Bär, Eberhard; Barraud, Sylvain; Brown, Andrew R.; Evanschitzky, Peter; Klüpfel, Fabian; Wang, Liping
Zeitschriftenaufsatz
2018Platinum in Silicon after Post-Implantation Annealing: From Experiments to Process and Device Simulations
Hauf, Moritz; Schmidt, Gerhard; Niedernostheide, Franz-Josef; Johnsson, Anna; Pichler, Peter
Konferenzbeitrag
2018Process variability for devices at and beyond the 7 nm node
Lorenz, Jürgen; Asenov, Asen; Bär, Eberhard; Barraud, Sylvain; Millar, Campbell; Nedjalkov, Mihail
Konferenzbeitrag
2017Measuring fibre orientation in sisal fibre-reinforced, injection moulded polypropylene
Albrecht, K.; Baur, E.; Endres, H.-J.; Gente, R.; Graupner, N.; Koch, M.; Neudecker, M.; Osswald, T.; Schmidtke, P.; Wartzack, S.; Webelhaus, K.; Müssig, J.
Zeitschriftenaufsatz
2016Empirical cluster modeling revisited
Pichler, Peter
Konferenzbeitrag
2016Simulation of process variations in FinFET transistor patterning
Baer, Eberhard; Burenkov, Alex; Evanschitzky, Peter; Lorenz, Juergen
Konferenzbeitrag
2015Coupled simulation to determine the impact of across wafer variations in oxide PECVD on electrical and reliability parameters of through-silicon vias
Bär, Eberhard; Evanschitzky, Peter; Lorenz, Jürgen; Roger, Frederic; Minixhofer, Rainer; Filipovic, Lado; Orio, Roberto de; Selberherr, Siegfried
Zeitschriftenaufsatz, Konferenzbeitrag
2015Development and validation of a CAE chain for unidirectional fibre reinforced composite components
Kärger, L.; Bernath, A.; Fritz, F.; Galkin, S.; Magagnato, D.; Oeckerath, A.; Schön, A.; Henning, F.
Zeitschriftenaufsatz
2015Growth condition of amorphous ZTO films from rotatable targets
Sittinger, V.; Pflug, A.; Schulz, C.; Siemers, M.; Melzig, T.; Meyer, B.; Kronenberger, A.; Oberste Berghaus, J.; Bosscher, W. de
Zeitschriftenaufsatz, Konferenzbeitrag
2015Impact of gear finishing processes on micro geometry - simulation of defective production processes and resulting acoustic properties
Kimme, Simon; Bauer, Ruben; Drossel, Welf-Guntram; Putz, Matthias
Konferenzbeitrag
2014Challenges and opportunities for process modeling in the nanotechnology era
Lorenz, J.K.; Baer, E.; Burenkov, A.; Erdmann, A.; Evanschitzky, P.; Pichler, P.
Zeitschriftenaufsatz
2014Simultaneous simulation of systematic and stochastic process variations
Lorenz, Jürgen; Bär, Eberhard; Burenkov, Alex; Evanschitzky, Peter; Asenov, Asen; Wang, Liping; Wang, Xingsheng; Brown, Andrew; Millar, Campbell; Reid, David
Konferenzbeitrag
2013Numerical and experimental analysis of self piercing riveting process with carbon fiber-reinforced plastic and aluminium sheets
Drossel, Welf-Guntram; Mauermann, Reinhard; Grützner, Raik; Mattheß, Danilo
Konferenzbeitrag
2011Hierarchical simulation of process variations and their impact on circuits and systems: Methodology
Lorenz, J.; Bär, E.; Clees, T.; Jancke, R.; Salzig, C.P.J; Selberherr, S.
Zeitschriftenaufsatz
2011Hierarchical simulation of process variations and their impact on circuits and systems: Results
Lorenz, J.K.; Bär, E.; Clees, T.; Evanschitzky, P.; Jancke, R.; Kampen, C.; Paschen, U.; Salzig, C.P.J; Selberherr, S.
Zeitschriftenaufsatz
2011Methods for design and application of adiabatic compressed air energy storage based on dynamic modeling
Wolf, D.
Dissertation
2011Mit Druckluft Wind zwischenspeichern
Wolf, D.; Span, R.; Weidner, E.
Zeitschriftenaufsatz
2010Gear rolling technology
Neugebauer, Reimund; Hellfritzsch, U.; Lahl, M.; Schiller, S.; Milbrandt, M.
Vortrag
2010Impact of technological options for 22 nm SOI CMOS transistors on IC performance
Burenkov, A.; Kampen, C.; Bär, E.; Lorenz, J.
Konferenzbeitrag
2010New modeling concepts for today's software processes. International conference on software process, ICSP 2010. Proceedings
: Münch, Jürgen (Ed.); Yang, Ye (Ed.); Schäfer, Wilhelm (Ed.)
Tagungsband
2009Calculation of stresses in two- and three-dimensional structures generated by induction assisted laser cladding
Brückner, F.; Lepski, D.; Beyer, E.
Konferenzbeitrag
2009Impact of lithography variations on advanced CMOS devices
Lorenz, J.; Kampen, C.; Burenkov, A.; Fühner, T.
Konferenzbeitrag
2009Model of a solar driven steam jet ejector chiller and investigation of its dynamic operational behaviour
Pollerberg, C.; Heinzel, A.; Weidner, E.
Zeitschriftenaufsatz
2009PD-SOI MOSFETs: Interface effect on point defects and doping profiles
Bazizi, E.M.; Pakfar, A.; Fazzini, P.F.; Cristiano, F.; Tavernier, C.; Claverie, A.; Burenkov, A.; Pichler, P.
Konferenzbeitrag
2009Simulation assessment of process options for advanced CMOS devices
Kampen, C.; Burenkov, A.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
2008Process models for advanced annealing schemes and their use in device simulation
Pichler, P.; Martinez-Limia, A.; Kampen, C.; Burenkov, A.; Schermer, J.; Paul, S.; Lerch, W.; Gelpey, J.; McCoy, S.; Kheyrandish, H.; Pakfar, A.; Tavernier, C.; Bolze, D.
Konferenzbeitrag
2008Shipyard investment planning by use of modern process-simulation and layout-planning tools
Weidemann, Björn; Bohnenberg, Ralf; Wanner, Martin-Christoph
Konferenzbeitrag
2008Simulation based development of the clinch connection with a plane surface on the die side
Awiszus, B.; Beyer, U.; Todtermuschke, M.; Riedel, F.
Konferenzbeitrag
2006Process-induced diffusion phenomena in advanced CMOS technologies
Pichler, P.; Burenkov, A.; Lerch, W.; Lorenz, J.; Paul, S.; Niess, J.; Nényei, Z.; Gelpey, J.; McCoy, S.; Windl, W.; Giles, L.F.
Konferenzbeitrag
2005Towards an agile development method for software process simulation
Angkasaputra, N.; Pfahl, D.
Konferenzbeitrag
20043D feature-scale simulation of sputter etching with coupling to equipment simulation
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
20043D simulation of process effects limiting FinFET performance and scalability
Burenkov, A.; Lorenz, J.
Konferenzbeitrag
2004Adaptive surface triangulations for 3D process simulation
Nguyen, P.-H.; Burenkov, A.; Lorenz, J.
Konferenzbeitrag
2004Genetic algorithm for optimization and calibration in process simulation
Fühner, T.; Erdmann, A.; Ortiz, C.J.; Lorenz, J.
Konferenzbeitrag
2004Report on ProSim'04. The 5th International Workshop on Software Process Simulation and Modeling
Pfahl, D.; Raffo, D.M.; Rus, I.; Wernick, P.
Zeitschriftenaufsatz
2003Creating an advanced software engineering laboratory by combining empirical studies with process simulation
Münch, J.; Rombach, H.D.; Rus, I.
Konferenzbeitrag
2003Dynamische Prozesssimulation zum Abbau ozeanischer Gashydrate
Schultz, H.; Deerberg, G.
Zeitschriftenaufsatz, Konferenzbeitrag
2003Goal-oriented measurement plus system dynamics. A hybrid and evolutionary approach
Pfahl, D.; Ruhe, G.
Konferenzbeitrag
2003Process simulation for advanced large area optical coatings
Pflug, A.; Szyszka, B.; Sittinger, V.; Niemann, J.
Konferenzbeitrag
2003Processing techniques for functionally graded materials
Kieback, B.; Neubrand, A.; Riedel, H.
Zeitschriftenaufsatz
2003Simulation of reactive sputtering kinetics in real in-line processing chambers
Pflug, A.; Szyszka, B.; Niemann, J.
Zeitschriftenaufsatz
2003Three-dimensional simulation of superconformal copper deposition based on the curvature-enhanced accelerator coverage mechanism
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
2003Three-dimensional triangle-based simulation of etching processes and applications
Lenhart, O.; Bär, E.
Zeitschriftenaufsatz
2003Untersuchung einstufiger Wasser-LiBr Absorptionskältemaschinen zur Kraft-Wärme-Kälte-Kopplung
Noeres, P.
Dissertation
2002IMMoS. A methodology for integrated measurement, modelling, and simulation
Pfahl, D.; Ruhe, G.
Zeitschriftenaufsatz
2002Simulation of the influence of via sidewall tapering on step coverage of sputter-deposited barrier layers
Bär, E.; Lorenz, J.; Ryssel, H.
Zeitschriftenaufsatz
2002Three-dimensional triangle-based simulation of etching processes
Lenhart, O.; Bär, E.
Konferenzbeitrag
2001A CBT module with integrated simulation component for software project management education and training
Pfahl, D.; Klemm, M.; Ruhe, G.
Zeitschriftenaufsatz
2001Compact modelling of process related effects on electrical behaviour of CMOS transistors
Burenkov, A.; Zhou, X.
Konferenzbeitrag
2001An experiment for evaluating the effectiveness of using a system dynamics simulation model in software project management education
Pfahl, D.; Koval, N.; Ruhe, G.
Konferenzbeitrag
2001An integrated approach to simulation-based learning in support of strategic and project management in software organisations
Pfahl, D.
Dissertation
2001Perspektiven des virtuellen Lackierens und der Prozesssimulation auch für kleine Lackieranlagen
Domnick, J.
Konferenzbeitrag
2000A CBT Module with Integrated Simulation Component for Software Project Management Education and Training
Pfahl, D.; Klemm, M.; Ruhe, G.
Bericht
2000Control and Improvement of Surface Triangulation for Three-Dimensional Process Simulation
Bär, E.; Lorenz, J.
Zeitschriftenaufsatz
2000Kalkulierbares Laserstrahlschneiden beim Einsatz von CALCut in Entwicklung, Anwendung und Ausbildung
Petring, D.
Zeitschriftenaufsatz
2000Knowledge Acquisition and Process Guidance for Building System Dynamics Simulation Models. An Experience Report from Software Industry
Pfahl, D.; Lebsanft, K.
Zeitschriftenaufsatz
2000Optimization of 0.18 µm CMOS Devices by Coupled Process and Device Simulation
Burenkov, A.; Tietzel, K.; Lorenz, J.
Zeitschriftenaufsatz
2000Three-Dimensional Simulation of the Conformality of Copper Layers Deposited by Low-Pressure Chemical Vapor Deposition from CuI(tmvs)(hfac)
Bär, E.; Lorenz, J.; Ryssel, H.
Zeitschriftenaufsatz
2000Using System Dynamics Simulation Models for Software Project Management Education and Training
Pfahl, D.; Klemm, M.; Ruhe, G.
Bericht
1999Control and Improvement of Surface Triangulation for Three-Dimensional Process Simulation
Bär, E.; Lorenz, J.
Konferenzbeitrag
1999Prozeßsimulation zur Verfahrens- und Werkzeugoptimierung
Leihkauf, J.
Konferenzbeitrag
1999Utilizing coupled process and device simulation for optimization of sub-quarter-micron CMOS technology
Wittl, J.; Burenkov, A.; Tietzel, K.; Müller, A.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
1998Integrated three-dimensional topography simulation and its application to dual-damascene processing
Bär, E.; Henke, W.; List, S.; Lorenz, J.
Konferenzbeitrag
1998Monte-Carlo simulation of silicon amorphization during ion implantation
Bohmayr, W.; Burenkov, A.; Lorenz, J.; Ryssel, H.; Selberherr, S.
Zeitschriftenaufsatz
1998Oberhausener UMSICHT-Tage 1998
 
Tagungsband
1998Three-dimensional simulation of layer deposition
Bär, E.; Lorenz, J.; Ryssel, H.
Zeitschriftenaufsatz
1998Three-dimensional simulation of SiO2 profiles from TEOS-sourced remote microwave plasma-enhanced chemical vapor deposition
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
19973D simulation for sub-micron metallization
Bär, E.; Lorenz, J.; Ryssel, H.
Zeitschriftenaufsatz, Konferenzbeitrag
19973D simulation of sputter deposition of titanium layers in contact holes with high aspect ratios
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
19973D simulation of sputter deposition of titanium layers in contact holes with high aspect ratios2
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
1997Integrated three-dimensional topography simulation of contact hole processing
Bär, E.; Benvenuti, A.; Henke, W.; Jünemann, B.; Kalus, C.; Niedermaier, P.; Lorenz, J.
Konferenzbeitrag
1997Monte-Carlo simulation of silicon amorphization during ion implantation
Bohmayr, W.; Burenkov, A.; Lorenz, J.; Ryssel, H.; Selberherr, S.
Konferenzbeitrag
1997Realization and evaluation of an ultra low-voltage/low-power 0.25 mu m (n+/p+) dual-workfunction CMOS technology
Schwalke, U.; Berthold, J.; Burenkov, A.; Eisele, M.; Krieg, R.; Narr, A.; Schumann, D.; Seibert, R.; Thanner, R.
Konferenzbeitrag
1997Three-dimensional simulation of contact hole metallization using aluminum sputter deposition at elevated temperatures
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
1997Three-dimensional simulation of conventional and collimated sputter deposition of Ti layers into high aspect ratio contact holes
Bär, E.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
1997Three-dimensional simulation of ion implantation
Lorenz, J.; Tietzel, K.; Burenkov, A.; Ryssel, H.
Konferenzbeitrag
1996Eine Fallstudie zur modellbasierten Risikoanalyse
Kempkens, R.
: Rombach, H.D. (Prüfer); Bröckers, A. (Prüfer)
Diplomarbeit
1996Three-dimensional simulation of ion implantation
Tietzel, K.; Burenkov, A.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
19943D Simulation of Low Pressure Chemical Vapor Deposition
Bär, E.; Lorenz, J.
Konferenzbeitrag
1993Multigrid methods for process simulation
Joppich, W.; Mijalkovic, S.
Buch
1992Complete bipolar simulation using STORM
Jones, S.K.; Gerodolle, A.; Lombardi, C.; Schäfer, M.; Hill, C.
Konferenzbeitrag
1991Carrier concentration profiles by high-energy boron ion implantation into silicon
Sayama, H.; Takai, M.; Namba, S.; Ryssel, H.
Zeitschriftenaufsatz
1991Observation of inverse u-shaped profiles after platinum diffusion in silicon
Zimmermann, H.; Ryssel, H.
Zeitschriftenaufsatz
1989One- and two-dimensional process simulation with ICECREM and COMPLAN.
Pichler, P.; Dürr, R.; Holzer, N.; Schott, K.; Barthel, A.; Lorenz, J.; Ryssel, H.
Konferenzbeitrag
1989Process simulation at FhG-AIS
Lorenz, J.
Konferenzbeitrag
1989Programs for VLSI process simulation
Pichler, P.; Lorenz, J.; Pelka, J.; Ryssel, H.
Konferenzbeitrag
1989Simulation halbleitertechnologischer Prozess-Schritte in der Mikroelektronik
Lorenz, J.; Pelka, J.; Ryssel, H.
Zeitschriftenaufsatz
1989Simulation of complete process step sequences in silicon technology
Pichler, P.; Lorenz, J.
Konferenzbeitrag
1989Simulation of the lateral spread of implanted ions - theory
Barthel, A.; Krüger, W.; Lorenz, J.
Konferenzbeitrag