Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019On a Novel Source Technology for Deep Aluminum Diffusion for Silicon Power Electronics
Rattmann, Gudrun; Pichler, Peter; Erlbacher, Tobias
Zeitschriftenaufsatz
2018Electrochemical corrosion on ceramic substrates for power electronics causes, phenomenological description and outlook
Bayer, Christoph Friedrich; Diepgen, Antonia; Filippi, Thomas; Fuchs, Carmen; Wüstefeld, Sophie; Kellner, Simon; Waltrich, Uwe; Schletz, Andreas
Konferenzbeitrag
2018Environmental testing, corrosion, failure analysis. Power electronics in harsh environments
Bayer, Christoph Friedrich; Kokot, Alexandra; Filippi, Thomas; Hutzler, Aaron; Fuchs, Carmen; Wüstefeld, Sophie; Kellner, Simon; Diepgen, Antonia; Zimmernmann, Victoria
Vortrag
2018Lifetime testing method for ceramic capacitors for power electronics applications
Dresel, Fabian; Tham, Nils; Erlbacher, Tobias; Schletz, Andreas
Konferenzbeitrag
2018Power antifuse device to bypass or turn-off battery cells in safety-critical and fail-operational systems
Lorentz, V.R.H.; Waller, R.; Waldhör, S.; Wenger, M.; Gepp, M.; Schwarz, R.; Koffel, S.; Wacker, S.; Akdere, M.; Giegerich, M.; März, M.
Konferenzbeitrag
2017A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application
Münch, Stefan; Röllig, Mike; Cikalova, Ulana; Bendjus, Beatrice; Chen, Lili; Lautenschläger, Georg; Sudip, Shohag Roy
Konferenzbeitrag
2017Sinter kinetics and interface reactions of silver thick films on aluminium nitride
Marcinkowski, Manja; Schwab, Olga; Schmidt, Richard; Eberstein, Markus; Partsch, Uwe
Konferenzbeitrag
2016ATHENIS-3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Wachmann, Ewald; Saponara, Sergio; Zambelli, C.; Tisserand, Pierre; Charbonnier, Jean; Erlbacher, Tobias; Grünler, Saeideh; Hartler, C.; Siegert, J.; Chassard P.; Ton D.M.; Ferrari, L.; Fanucci, L.
Konferenzbeitrag
2016Mechanical properties of silver-sintering bond lines
Letz, Sebastian; Hutzler, Aaron; Schletz, Andreas; Waltrich, Uwe
Konferenzbeitrag
2016NDE applications in microelectronic industries
Meyendorf, Norbert; Oppermann, Martin; Krüger, Peter; Röllig, Mike; Wolter, Klaus-Jürgen
Konferenzbeitrag
2015Changes of electronic properties of AlGaN/GaN HEMTs by surface treatment
Pletschen, W.; Linkohr, S.; Kirste, L.; Cimalla, V.; Müller, S.; Himmerlich, M.; Krischok, S.; Ambacher, O.
Konferenzbeitrag
2015Felddatenbasierte Analyse von Umrichterausfällen in 1300 Windenergieanlagen
Fischer, Katharina; Tegtmeier, Bernd; Bartschat, Arne; Coronado, Diego; Broer, Christian; Wenske, Jan
Vortrag
2015Field-experience based root-cause analysis of power-converter failure in wind turbines
Fischer, Katharina; Stalin, Thomas; Ramberg, Hans; Wenske, Jan; Wetter, Göran; Karlsson, Robert; Thiringer, Torbjörn
Zeitschriftenaufsatz
2015Towards reliable power converters for wind turbines: Field-data based identification of weak points and cost drivers
Fischer, Katharina; Wenske, Jan
Konferenzbeitrag
2014Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering
Hutzler, Aaron; Tokarski, Adam; Kraft, Silke; Zischler, Sigrid; Schletz, Andreas
Konferenzbeitrag
2014Silicon carbide in power electronics: Overcoming the obstacle of bipolar degradation
Kallinger, Birgit; Ehlers, Christian; Berwian, Patrick; Friedrich, Jochen; Rommel, Mathias
Vortrag
2014Towards increased reliability of power converters in wind turbines
Fischer, K.
Vortrag
2013Entwicklung eines hochtemperaturfesten Kondensators für die Mikrosystemtechnik
Celik, Yusuf; Goehlich, Andreas; Jupe, Andreas; Vogt, Holger
Konferenzbeitrag
2013Extending the lifetime of power electronic assemblies by increased cooling temperatures
Hutzler, Aaron; Tokarski, Adam; Schletz, Andreas
Zeitschriftenaufsatz, Konferenzbeitrag
2013Extending the power cycling lifetime of SiC diodes (by increased cooling temperatures)
Hutzler, Aaron; Schletz, Andreas; Tokarski, Adam
Vortrag
2012Low temperature cofired ceramics (LTCC)-based miniaturized load cells
Lenz, C.; Ziesche, S.; Partsch, U.; Neubert, H.
Konferenzbeitrag
2012LTCC membranes with integrated heating structures, temperature sensors and strain gauges
Gutzeit, N.; Müller, J.; Reinlein, C.; Gebhardt, S.
Konferenzbeitrag
2012Silver processing in thick film technology for power electronics
Eberstein, M.; Feller, C.; Seuthe, T.; Ihle, M.; Ziesche, S.; Gora, F.
Konferenzbeitrag
2012SXRT investigations on electrically stressed 4H-SiC PiN diodes for 6.5 kV
Kallinger, Birgit; Berwian, Patrick; Friedrich, Jochen; Hecht, Christian; Peters, Dethard; Friedrichs, Peter; Thomas, Bernd
Poster
2012Towards highly conductive silver pastes for LTCC power electronics
Eberstein, M.; Kretzschmar, C.; Seuthe, T.; Marcinkowski, M.; Ihle, M.; Ziesche, S.; Partsch, U.; Gora, F.
Konferenzbeitrag
2010Power electronics system integration for electric and hybrid vehicles
März, M.; Schletz, A.; Eckardt, B.; Engelkraut, S.; Rauh, H.
Konferenzbeitrag
2009Anforderungsgerechte Auslegung von Leistungselektronik im Antriebsstrang
Eckardt, B.; März, M.; Schletz, A.
Konferenzbeitrag
2008DC-arc behavior of a novel active fuse
Dorp, J. vom; Berberich, S.E.; Bauer, A.J.; Ryssel, H.
Konferenzbeitrag
2008Design and assembly of power semiconductors with double-sided water cooling
Schneider-Ramelow, M.; Baumann, T.; Hoene, E.
Konferenzbeitrag
2008High-efficiency GaN HEMTs on 3-inch semi-insulating SiC substrates
Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Raynor, B.; Mikulla, M.; Weimann, G.
Zeitschriftenaufsatz
2008Highly filled polymers for power passives packaging
Egelkraut, S.; Heinle, C.; Eckardt, B.; Krämer, P.; Brocka, Z.; März, M.; Ryssel, H.; Ehrenstein, G.W.
Konferenzbeitrag
2007Thermal shielding techniques for power electronic devices in high temperature applications
Billmann, M.; Schimanek, E.; Buerhop, L.C.
Konferenzbeitrag
2006Mechatronic integration into the hybrid powertrain - The thermal challenge
März, M.; Poech, M.H.; Schimanek, E.; Schletz, A.
Konferenzbeitrag
2004On coupling with EMI capacitors
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Konferenzbeitrag
2000Phosphorus ion shower implantation for special power IC applications
Kröner, F.; Schork, R.; Frey, L.; Burenkov, A.; Ryssel, H.
Konferenzbeitrag