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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Screen-printed metallization for p-Type poly-Si passivated contacts formed by LPCVD
Mack, S.; Fellmeth, T.; Schube, J.; Feldmann, F.; Lenes, M.; Luchies, J.R.M.
Konferenzbeitrag
2006Drop simulation and stress analysis of MEMS devices
Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J.
Konferenzbeitrag
2003Fatigue of polycrystalline silicon under long-term cyclic loading
Bagdahn, J.; Sharpe, W.N.
Zeitschriftenaufsatz
2003Fracture strength of polysilicon at stress concentrations
Bagdahn, J.; Sharpe, W.N.; Jadaan, O.
Zeitschriftenaufsatz
1998Comparative study of surface roughness measured on polysilicon using spectroscopic ellipsometry and atomic force microscopy
Petrik, P.; Biro, L.P.; Fried, M.; Lohner, T.; Berger, R.; Schneider, C.; Gyulai, J.; Ryssel, H.
Zeitschriftenaufsatz
1995Influence of annealing on elastic properties of LPCVD silicon nitride and LPCVD polysilicon
Maier-Schneider, D.; Ersoy, A.; Maibach, J.; Schneider, D.; Obermeier, E.
Zeitschriftenaufsatz
1992Stress compensation techniques in thin layers applied to silicon micromachining
Mück, G.; Bausells, J.; Csepregi, L.; Moldovan, N.; Suski, J.; Lang, W.
Tagungsband
1991Effect of deposition temperature of arsenic implanted poly-Si-on-insulator on grain size and residual stress
Takai, M.; Kato, K.; Namba, S.; Pfannenmüller, U.; Ryssel, H.
Zeitschriftenaufsatz
1989An advanced fabrication process for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Konferenzbeitrag
1989Process technology for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Konferenzbeitrag
1989Substrate-damage-free laser recrystallization of polycrystalline silicon
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Zeitschriftenaufsatz