Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Consideration of inhomogeneous shrinkages for LTCC-applications in panel-level processes
Lenz, Christian; Kappert, Sandro; Ziesche, Steffen; Neubert, Holger; Partsch, Uwe
Konferenzbeitrag
2016High-speed microscopy of continuously moving cell culture vessels
Schenk, Friedrich; Brill, Nicolai; Marx, Ulrich; Hardt, Daniel; König, Niels; Schmitt, Robert
Zeitschriftenaufsatz
2016A modular flexible scalable and reconfigurable system for manufacturing of Microsystems based on additive manufacturing and e-printing
Scholz, Steffen; Müller, Tobias; Plasch, Matthias; Limbeck, Hannes; Adamietz, Raphael; Iseringhausen, Tobias; Kimmig, Daniel; Dickerhof, Markus; Wögerer, Christian
Zeitschriftenaufsatz
2016Simulating wafer bow for integrated capacitors using a multiscale approach
Wright, Alan; Krach, Florian; Thielen, Nils; Grünler, Saeideh; Erlbacher, Tobias; Pichler, Peter
Konferenzbeitrag
2015Multilayer based lab-on-a-chip-systems for substance testing
Sonntag, Frank; Grünzner, Stefan; Schmieder, Florian; Busek, Mathias; Klotzbach, Udo; Franke, Volker
Konferenzbeitrag
2014Feeding of small components using the surface tension of fluids
Burgard, Matthias; Othman, Nabih; Mai, Uwe; Schlenker, Dirk; Verl, Alexander
Konferenzbeitrag
2014Microsystem technology as a basis for integrated manufacturing
Schlenker, Dirk
Aufsatz in Buch
2014A modular flexible scalable and reconfigurable system for manufacturing of microsystems based on additive manufacturing and E-printing
Wögerer, Christian; Plasch, Matthias; Heidl, Wolfgang; Dickerhof, Markus; Kimmig, Daniel; Scholz, Steffen; Adamietz, Raphael; Iseringhausen, Tobias
Konferenzbeitrag
2014Modular workpiece carrier system for micro production
Iseringhausen, Tobias; Adamietz, Raphael; Schlenker, Dirk; Verl, Alexander
Konferenzbeitrag
2014Multilayer-based lab-on-a-chip systems for perfused cell-based assays
Klotzbach, Udo; Sonntag, Frank; Grünzner, Stefan; Busek, Mathias; Schmieder, Florian; Franke, Volker
Zeitschriftenaufsatz
2014R2R production and multilayer lamination of functionalised films
Baum, Christoph; Bastuck, Thomas
Konferenzbeitrag
2013IPA.FluidSort - separation of smallest components
Othman, Nabih
Konferenzbeitrag
2013Neue Herausforderungen an die Montagetechnik
Burgard, Matthias; Othman, Nabih; Frei, Marcus
Konferenzbeitrag
2012'Human-on-a-chip' developments: A translational cuttingedge alternative to systemic safety assessment and efficiency evaluation of substances in laboratory animals and man?
Marx, U.; Walles, H.; Hoffmann, S.; Lindner, G.; Horland, R.; Sonntag, F.; Klotzbach, U.; Sakharov, D.; Tonevitsky, A.; Lauster, R.
Zeitschriftenaufsatz
2012Aerosol printing of high resolution films for LTCC-multilayer components
Ihle, M.; Partsch, U.; Mosch, S.; Goldberg, A.
Konferenzbeitrag
2010Intelligente Lasersystemtechnik
Stimpfl, Joffrey; Brecher, Christian; Emonts, Michael
Zeitschriftenaufsatz
1999Sensor systems: interface between environment and application
Hammerschmidt, D.
Konferenzbeitrag
1998Industrieller Einsatz von Verbindungstechniken für Mikro- und Millimeterwellenkomponenten
Carraß, A.; Jeremias, M.; Vonderhagen, H.; Nienhaus, M.; Gramann, U.; Schäfer, H.
Zeitschriftenaufsatz
1998On-chip microsystems for medical applications
Mokwa, W.; Schnakenberg, U.
Konferenzbeitrag
1998Silicon microsystems: merging sensors, circuits and systems
Manoli, Y.; Mokwa, W.
Konferenzbeitrag
1997Electrical network formulations of mechanical finite-element models
Bielefeld, J.; Pelz, G.; Zimmer, G.
Konferenzbeitrag
1997Silicon sensor systems
Hosticka, B.J.; Brockherde, W.; Hammerschmidt, D.
Zeitschriftenaufsatz
19941.2 Volt CMOS readout electronics for capacitive sensors
Schnatz, F.V.; Brockherde, W.; Dudaicevs, H.; Hosticka, B.J.
Konferenzbeitrag
1994Automatischer Abgleichalgorithmus für integrierte CMOS-Drucksensoren mit on-chip Programmierung.
Schlichting, V.; Lossy, R.; Graf, N.; Obermeier, E.; Hammerschmidt, D.; Schnatz, F.V.; Hosticka, B.J.
Konferenzbeitrag
1994MEXEL: Simulation of microsystems in a circuit simulator using automatic electromechanical modeling.
Pelz, G.; Bielefeld, J.; Zappe, F.-J.; Zimmer, G.
Konferenzbeitrag
1994Potential of mixed analog/digital signal processing for silicon microsystems.
Hosticka, B.J.
Konferenzbeitrag
1994Residual stress analysis in components of microsystems
Schubert, A.; Michel, B.
Konferenzbeitrag
1994Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B.
Konferenzbeitrag
1994X-ray residual stress analysis in components of microsystem technology
Schubert, A.; Kämpfe, B.; Michel, B.
Konferenzbeitrag