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| 2021 | A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Kosfeld, Andre; Utz, Alexander; Weber, Constanze; Rämer, Olaf; Spanier, Malte; Ihle, Martin; Ziesche, Steffen; Kokozinski, Rainer | Zeitschriftenaufsatz |
| 2021 | Smart sensor systems for extremely harsh environments
Kappert, Holger; Schopferer, Sebastian; Döring, Ralf; Ziesche, Steffen; Olowinsky, Alexander; Naumann, Falk; Jaegle, Martin; Ostmann, Andreas | Konferenzbeitrag |
| 2021 | Temperature Challenges for Integrated Systems due to High Power Density
Schletz, Andreas; Bayer, Christoph Friedrich; Hutzler, Aaron | Vortrag |
| 2020 | Hochtemperaturversiegelung für thermisch gespritzte Schichten
Hildebrandt, Stefanie; Berger, Lutz-Michael | Zeitschriftenaufsatz |
| 2020 | Impact of Channel Implantation on a 4H-SiC CMOS Operational Amplifier for High Temperature Applications
Albrecht, M.; Perez, D.; Martens, R.C.; Bauer, A.J.; Erlbacher, T. | Konferenzbeitrag |
| 2020 | Temperature Challenges for Integrated Systems due to High Power Density
Schletz, A.; Bayer, C.F.; Hutzler, A. | Vortrag |
| 2019 | Brazes for extremely high temperatures
Martin, Hans-Peter; Roszeitis, Sven; Matthey, Björn; Herrmann, Marion; Graffé, Marius; Lippmann, Wolfgang; Schmidt, Marcus Peter; Burkhardt, Ulrich; Michaelis, Alexander | Konferenzbeitrag |
| 2019 | Characterization of a silicon carbide BCD process for 300°C circuits
Abbasi, A.; Roy, S.; Murphree, R.; Rashid, A.-U.; Hossain, M.M.; Lai, P.; Fraley, J.; Erlbacher, T.; Chen, Z.; Mantooth, A. | Konferenzbeitrag |
| 2019 | Energy coupling of laser radiation on AISI 304 stainless steel: Effect of high temperatures and surface oxidation
Hipp, Dominik; Mahrle, Achim; Beyer, Eckhard | Zeitschriftenaufsatz |
| 2019 | Feasibility of 4H-SiC p-i-n diode for sensitive temperature measurements between 20.5 K and 802 K
Matthus, C.D.; Benedetto, L. di; Kocher, M.; Bauer, A.J.; Licciardo, G.D.; Rubino, A.; Erlbacher, T. | Zeitschriftenaufsatz |
| 2019 | Improving 5V Digital 4H-SiC CMOS ICs for Operating at 400°C Using PMOS Channel Implantation
Albrecht, M.; Erlbacher, T.; Bauer, A.J.; Frey, L. | Konferenzbeitrag |
| 2019 | Monolithic Ceramic IR-Emitter in Multilayer Technology
Goldberg, Adrian; Manhica, Birgit; Ziesche, Steffen | Konferenzbeitrag |
| 2019 | Technology development and tool concepts for high-temperature forming of titanium
Landgrebe, Dirk; Demmler, Matthias; Albert, Andre`; Schieck, Frank; Weber, Martin | Konferenzbeitrag |
| 2019 | Tool aspects for high temperature level gas forming
Schieck, Frank; Albert, André; Demmler, Matthias | Vortrag |
| 2018 | Improving the high temperature abrasion resistance of thermally sprayed Cr3C2-NiCr coatings by WC addition
Janka, Leo; Berger, Lutz-Michael; Norpoth, Jonas; Trache, Richard; Thiele, Sven; Tomastik, Christian; Matikainen, Ville; Vuoristo, Petri | Zeitschriftenaufsatz |
| 2018 | Inter-fuel substitution in European industry: A random utility approach on industrial heat demand
Rehfeldt, Matthias; Fleiter, Tobias; Worrell, Ernst | Zeitschriftenaufsatz |
| 2017 | High temperature EEPROM using a differential approach for high reliability
Kappert, Holger; Braun, Sebastian; Alfring, Michael; Kordas, Norbert; Kelberer, Andreas; Dreiner, Stefan; Kokozinski, Rainer | Zeitschriftenaufsatz |
| 2017 | Ta-Ni- and Ti-Al-braze-alloys for high temperature stable ceramic - ceramic junctions
Roszeitis, Sven | Vortrag |
| 2017 | Thermal stability and failure mechanism of schottky gate AlGaN/GaN HEMTs
Mocanu, Manuela; Unger, Christian; Pfost, Martin; Waltereit, Patrick; Reiner, Richard | Zeitschriftenaufsatz |
| 2016 | Experimental analysis of the gate-leakage-induced failure mechanism in GaN HEMTs
Unger, C.; Mocanu, M.; Pfost, M.; Waltereit, P.; Reiner, R. | Konferenzbeitrag |
| 2016 | Experimental investigations of TiAl-brazes for ceramic joining
Martin, Hans-Peter; Triebert, Anke | Konferenzbeitrag |
| 2016 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Zeitschriftenaufsatz |
| 2016 | High temperature GaN gate driver in SOI CMOS technology
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Dreiner, Stefan; Kokozinski, Rainer | Zeitschriftenaufsatz |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Konferenzbeitrag |
| 2016 | Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas | Konferenzbeitrag |
| 2016 | Performance evaluation of a proof-of-concept 70 W internal reforming methanol fuel cell system
Avgouropoulos, G.; Schlicker, Sebastian; Schelhaas, Karl-Peter; Papavasiliou, J.; Papadimitriou, K.D.; Theodorakopoulou, E.; Gourdoupi, N.; MacHocki, A.; Ioannides, T.; Kallitsis, J.K.; Kolb, Gunther; Neophytides, S. | Zeitschriftenaufsatz |
| 2016 | Potential of 4H-SiC CMOS for high temperature applications using advanced lateral p-MOSFETs
Albrecht, Matthäus; Erlbacher, Tobias; Bauer, Anton J.; Frey, Lothar | Konferenzbeitrag |
| 2016 | Quantification of identical and unique segments in ethylene-propylene copolymers using two dimensional liquid chromatography with infra-red detection
Bhati, Sampat Singh; Macko, Tibor; Brüll, Robert | Zeitschriftenaufsatz |
| 2016 | Sliding and abrasive wear behaviour of HVOF- and HVAF-sprayed Cr3C2-NiCr hardmetal coatings
Bolelli, Giovanni; Berger, Lutz-Michael; Börner, Tim; Koivuluoto, Heli; Matikainen, V.; Lusvarghi, Luca; Lyphout, Christophe; Markocsan, Nicolaie; Nylén, Per E.; Sassatelli, Paolo; Trache, Richard; Vuoristo, Petri | Zeitschriftenaufsatz |
| 2016 | Using Ion/Ioff to predict switch-based circuit accuracy in an extended temperature range up to 300°C
Tallhage, Jonas; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2015 | Aging behavior of reactive air brazed seals for SOFC
Pönicke, Andreas; Schilm, Jochen; Kusnezoff, Mihails; Michaelis, Alexander | Zeitschriftenaufsatz |
| 2015 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Konferenzbeitrag |
| 2015 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Zeitschriftenaufsatz |
| 2015 | High temperature SOI CMOS technology and circuit realization for applications up to 300°C
Kappert, Holger; Kordas, Norbert; Dreiner, Stefan; Paschen, Uwe; Kokozinski, Rainer | Konferenzbeitrag |
| 2015 | High-temperature solar organic rankine cycle - annual simulation of various system designs
Hunstock, Björn; Strauch, Sabine; Althaus, Wilhelm; Bülten, Björn; Grob, Johannes; Paucker, Ralf | Konferenzbeitrag |
| 2015 | High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger | Zeitschriftenaufsatz |
| 2015 | High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger | Konferenzbeitrag |
| 2014 | Analog circuit design in PD-SOI CMOS technology for high temperatures up to 400 °C using reverse body biasing (RBB)
Schmidt, Alexander
: Kokozinski, Rainer (Gutachter); Fiedler, Horst-Lothar (Gutachter) | Dissertation |
| 2014 | Comparative study of the dry sliding wear behaviour of HVOF-sprayed WC-(W,Cr)2C-Ni and WC-CoCr hardmetal coatings
Bolelli, G.; Berger, L.-M.; Bonetti, M.; Lusvarghi, L. | Zeitschriftenaufsatz |
| 2014 | Evaluation of TFR-characteristics in a wide temperature range
Partsch, Uwe; Lenz, Christian; Wenzel, Marco; Eberstein, Markus | Konferenzbeitrag |
| 2014 | High temperature 0.35 micron Silicon-on-Insulator CMOS technology
Kappert, Holger; Dreiner, Stefan; Kordas, Norbert; Schmidt, Alexander; Paschen, Uwe; Kokozinski, Rainer | Konferenzbeitrag |
| 2013 | Analog performance of PD-SOI MOSFETs at high temperatures using reverse body bias
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2013 | Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2013 | Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Zeitschriftenaufsatz |
| 2013 | High temperature analog circuit design in PD-SOI CMOS technology using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2013 | High temperature characterization up to 450°C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Zeitschriftenaufsatz |
| 2013 | One-step method for separation and identification of n-alkanes/oligomers in HDPE using high-temperature high-performance liquid chromatography
Mekap, D.; Macko, Tibor; Brüll, Robert; Cong, R.; Groot, A.W. de; Parrott, A.; Yau, W. | Zeitschriftenaufsatz |
| 2013 | PD-SOI MOSFET performance optimization for high temperatures up to 400°C using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2012 | Bulk material heat storage system for high temperatures
Daschner, R.; Ebner, L.; Binder, S. | Konferenzbeitrag |
| 2012 | A cyclic RSD analog-digital-converter for application specific high temperature integrated circuits up to 250°C
Schmidt, Alexander; Kappert, Holger; Heiermann, Wolfgang; Kokozinski, Rainer | Konferenzbeitrag |
| 2012 | Direct integration of carbon nanotubes on CMOS with high-temperature tungsten metallization
Jupe, Andreas; Hoeren, André; Goehlich, Andreas; Meißner, Frank; Endler, Ingolf; Vogt, Holger | Konferenzbeitrag |
| 2012 | High temperature characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Konferenzbeitrag |
| 2012 | Precision analog circuit design in SOI CMOS for a wide temperature range up to 350°C
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer | Konferenzbeitrag |
| 2011 | High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology
Grella, K.; Vogt, H.; Paschen, U. | Konferenzbeitrag |
| 2011 | Next generation 8xx nm laser bars and single emitters
Strauss, U.; Müller, M.; Swietlik, T.; Fehse, R.; Lauer, C.; Grönninger, G.; König, H.; Keidler, M.; Fillardet, T.; Kohl, A.; Stoiber, M.; Scholl, I.; Biesenbach, J.; Baeumler, M.; Konstanzer, H. | Konferenzbeitrag |
| 2011 | A robust SOI gain-boosted operational amplifier targeting high temperature precision applications up to 300°C
Schmidt, A.; Marzouk, A.M.; Kappert, H.; Kokozinski, R. | Konferenzbeitrag |
| 2010 | Evaluation of materials for high temperature IC packaging
Klieber, R.; Lerch, R.G. | Konferenzbeitrag |
| 2010 | High-temperature modeling of AlGaN/GaN HEMTs
Vitanov, S.; Palankovski, V.; Maroldt, S.; Quay, R. | Zeitschriftenaufsatz |
| 2010 | Micromachined mid-infrared emitter for fast transient temperature operation for optical gas sensing systems
Hildenbrand, J.; Korvink, J.; Wollenstein, J.; Peter, C.; Kurzinger, A.; Naumann, F.; Ebert, M.; Lamprecht, F. | Zeitschriftenaufsatz |
| 2009 | Assembly of pressure sensor chips as an example for integrated MEMS for high temperature applications
Klieber, R.; Goehlich, A.; Trieu, H.-K.; Kappert, H.; Grabmaier, A. | Konferenzbeitrag |
| 2009 | Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D.; Berthold, S.; Dötsch, C.; Lopez, J.U.; Erkan, T.; Span, R. | Konferenzbeitrag |
| 2009 | Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D. | Vortrag |
| 2009 | Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D.; Berthold, S.; Dötsch, C.; Lopez, J.U.; Erkan, T.; Span, R. | Konferenzbeitrag |
| 2009 | Evaluating plant configurations for adiabatic compressed air energy storage by dynamic simulation
Wolf, D. | Vortrag |
| 2009 | Evaluating plant configurations for adiabatic compressed air energy storage by dynamic simulation
Wolf, D.; Dötsch, C.; Span, R. | Konferenzbeitrag |
| 2009 | Fast transient temperature operating micromachined emitter for mid-infrared for optical gas sensing systems
Hildenbrand, J.; Peter, C.; Lamprecht, F.; Kürzinger, A.; Naumann, F.; Ebert, M.; Wehrspohn, R.; Wöllenstein, J. | Konferenzbeitrag |
| 2008 | Untersuchung von Nachschaltprozessen an Verbrennungsmotoren
Grob, J.; Paucker, R.; Eckert, F.; Mieck, S.; Althaus, W.; Eckert, F. | Konferenzbeitrag |
| 2007 | Neues Konvektions-Reflowlötverfahren für bleifreie hochtemperaturgeeignete Lötverbindungen
Pape, U. | Vortrag |
| 2007 | Process design and modelling of ethanol reforming HT-PEM fuel cell system
Padgilwar, G.S.
: Schulzke, T. (Prüfer); Fahlenkamp, H. (Prüfer); Jörissen, J. (Prüfer) | Master Thesis |
| 2007 | Reliability testing of wire-bond at high temperature storage
Schelle, B.; Arik, B.; Klieber, R.; Trieu, H.-K. | Konferenzbeitrag |
| 2006 | Entwicklung von Weichlotpasten für das Löten mit der Mikrowelle
Nowottnick, M.; Pape, U. | Konferenzbeitrag |
| 2006 | Fatigue life simulation for optimized exhaust manifold geometry
Mohrmann, R.; Seifert, T.; Willeke, W.; Hartmann, D. | Konferenzbeitrag |
| 2006 | Solarunterstützte Kraft-Wärme-Kälte-Kopplung - Hybridsysteme im Trend
Lokurlu, A.; Buck, R.; Henning, H.-M.; Dötsch, C. | Konferenzbeitrag |
| 2006 | Solarunterstützte Kraft-Wärme-Kälte-Kopplung - Hybridsysteme im Trend
Lokurlu, A.; Buck, R.; Henning, H.-M.; Dötsch, C. | Zeitschriftenaufsatz |
| 2006 | Zuverlässigkeit stoffschlüssiger Fügeverbindungen für Hochtemperatur-Elektronikbaugruppen
Nowottnick, M. | Habilitationsschrift |
| 2005 | Bewertung der Ergebnisse und Simulation der Zuverlässigkeit
Nowottnick, M.; Pape, U.; Neher, W. | Aufsatz in Buch |
| 2005 | Comparison of material behavior and economic effects of cold and high temperature forming technologies applied to high-strength steels
Neugebauer, Reimund; Göschel, A.; Sterzing, A.; Kurka, P.; Seifert, M. | Konferenzbeitrag |
| 2005 | High temperature (T >= 400 K) operation of strain-compensated quantum cascade lasers with thin InAs insertion layers and AlAs blocking barriers
Yang, Q.K.; Mann, C.; Fuchs, F.; Köhler, K.; Bronner, W. | Konferenzbeitrag |
| 2003 | A compact IGBT driver for high temperature applications
Zeltner, S.; Billmann, M.; März, M.; Schimanek, E. | Konferenzbeitrag |
| 2003 | HTPAL. Ein programmierbarer Logikbaustein für den Einsatz in Hochtemperaturanwendungen
Gorontzi, K. | Dissertation |
| 2003 | Structure and properties of high-temperature annealed CVD diamond
Ralchenko, V.; Nistor, L.; Pleuler, E.; Khomich, A.; Vlasov, I.; Khmelnitskii, R. | Konferenzbeitrag |
| 2002 | Ganzheitliche Systemanalyse der energetischen Nutzung biogener Vergasungsgase in Brennstoffzellen
Schleitzer, D.-K. | Dissertation |
| 2000 | A 1-Kbit EEPROM in SIMOX technology for high-temperature applications up to 250 deg C
Gogl, D.; Fiedler, H.-L.; Spitz, M.; Parmentier, B. | Zeitschriftenaufsatz |
| 1997 | Laser based strain measurement above 1500 deg C
Aswendt, P. | Konferenzbeitrag |
| 1997 | Laser induced creep and fracture in ceramics
Pompe, W.; Bahr, H.-A.; Pflugbeil, I.; Kirchhoff, G.; Langmeier, P.; Weiss, H.-J. | Zeitschriftenaufsatz |
| 1997 | Using speckle interferometry under extreme conditions
Aswendt, P. | Konferenzbeitrag |
| 1994 | Fracture toughness and time-dependent strength behavior of low-doped silicon nitrides for applications at 1400 degree
Klemm, H.; Pezzotti, G. | Zeitschriftenaufsatz |
| 1994 | Hochtemperaturcharakterisierung von Siliziumnitridwerkstoffen durch dynamische Ermüdung
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C. | Zeitschriftenaufsatz |
| 1994 | Silicon nitride materials featured by superior creep and fracture resistance at 1400 degree
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C. | Konferenzbeitrag |
| 1993 | Kinetics of growing oxide layers studied by means of X-ray diffraction.
Kolarik, V.; Engel, W.; Eisenreich, N. | Konferenzbeitrag |
| 1993 | Optisches Prozessieren
Eyer, A.; Räuber, A. | Konferenzbeitrag |
| 1992 | Fatigue and short crack propagation behaviour of cast nickel base alloys in 713 C and MAR-M-247 LC at high temperatures
Bergmann, J.; Brandt, U.; Sonsino, C.M. | Konferenzbeitrag |
| 1991 | High pressure high temperature solvolysis of polymer binders in propellants and explosives
Bohn, M.A. | Konferenzbeitrag |
| 1991 | Rückgewinnung von Treibmittelkomponenten durch Hochdruck-Hochtemperatur-Solvolyse
Bohn, M.A.; Neumann, H. | Konferenzbeitrag |
| 1991 | Schwingfestigkeit der keramikverstärkten Kolbengußlegierung GP-AlSi 12 CuMgNi bei erhöhten Temperaturen
Backer, E.; Sonsino, C.M. | Zeitschriftenaufsatz |
| 1990 | Creep crack growth under small-scale creep conditions.
Riedel, H. | Zeitschriftenaufsatz |