Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Zeitschriftenaufsatz
2011Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2011Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris
Konferenzbeitrag
2010Advances in the design and test of a novel open ended microwave oven
Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris
Konferenzbeitrag
2010Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Konferenzbeitrag
2010Modular microwave-based system for packaging applications
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank
Konferenzbeitrag
2010Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2010Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2010On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Konferenzbeitrag
2010On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y.
Konferenzbeitrag
2007Stress monitoring in epoxy resins and embedded components during packaging and curing processes
Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F.
Konferenzbeitrag
2002Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Konferenzbeitrag
2002Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B.
Zeitschriftenaufsatz
2001E-Packaging
Lange, V.
Konferenzbeitrag
2000E-Commerce. Potentiale für Verpackungen in der Logistik?
Lange, V.
Konferenzbeitrag
1995Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
Michel, B.
Konferenzbeitrag
1995Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B.
Konferenzbeitrag
1995Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis
 
Tagungsband
1994Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V.
Zeitschriftenaufsatz
1994Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B.
Konferenzbeitrag