Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Copper availability from the recycling of electric vehicles in Europe, North America and China: A model based estimation until 2050
Soulier, Marcel; Goldmann, Daniel
Konferenzbeitrag
2019Influence of the surface properties of the connector material on the reliable and reproducible contacting of battery cells with a laser beam welding process
Helm, Johanna; Dietz von Bayer, Ingo; Olowinsky, Alexander; Gillner, Arnold
Zeitschriftenaufsatz
2019Solids under extreme shear: Friction-mediated subsurface structural transformations
Greiner, C.; Gagel, J.; Gumbsch, P.
Zeitschriftenaufsatz
2018Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching
Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U.
Konferenzbeitrag
2018Antimicrobial effects and dissolution properties of silver copper mixed layers
Gotzmann, G.; Jorsch, C.; Wetzel, C.; Funk, H.W.R.
Zeitschriftenaufsatz
2018The Chinese copper cycle: Tracing copper through the economy with dynamic substance flow and input-output analysis
Soulier, Marcel; Pfaff, Matthias; Goldmann, Daniel; Walz, Rainer; Geng, Yong; Zhang, Ling; Tercero Espinoza, Luis A.
Zeitschriftenaufsatz
2018Comparative analysis of the transcriptome responses of zebrafish embryos after exposure to low concentrations of cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Zeitschriftenaufsatz
2018Dynamic analysis of European copper flows
Soulier, Marcel; Glöser-Chahoud, Simon; Goldmann, Daniel; Tercero Espinoza, Luis A.
Zeitschriftenaufsatz
2018Magnetic pulse welding of dissimilar material sheet metal joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Vortrag
2018Microstructure evolution and deformation mechanisms during high rate and cryogenic sliding of copper
Chen, X.; Schneider, R.; Gumbsch, P.; Greiner, C.
Zeitschriftenaufsatz
2018The origin of surface microstructure evolution in sliding friction
Greiner, C.; Liu, Z.; Schneider, R.; Pastewka, L.; Gumbsch, P.
Zeitschriftenaufsatz
2018Stages in the tribologically-induced oxidation of high-purity copper
Liu, Z.; Patzig, C.; Selle, S.; Höche, T.; Gumbsch, P.; Greiner, C.
Zeitschriftenaufsatz
2017Concentration dependent transcriptome responses of zebrafish embryos after exposure to cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Zeitschriftenaufsatz
2017Enhanced manufacturing possibilities using multi-materials in laser metal deposition
Brückner, Frank; Riede, Mirko; Müller, Michael M.; Marquardt, Franz; Willner, Robin; Seidel, André; Lopez, Elena; Leyens, Christoph; Beyer, Eckhard
Konferenzbeitrag
2017JOIN'EM - Industrial technologies for advanced joining and assembly processes for multi-materials
Psyk, Verena
Vortrag
2017Manufacturing of hybrid aluminum copper joints by electromagnetic pulse welding - identification of quantitative process windows
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Konferenzbeitrag
2017Materials response to glancing incidence femtosecond laser ablation
Echlin, M.P.; Titus, M.S.; Straw, M.; Gumbsch, P.; Pollock, T.M.
Zeitschriftenaufsatz
2017Measurement and GIS-based spatial modelling of copper corrosion in different environments in Europe
Slamova, K.; Koehl, M.
Zeitschriftenaufsatz
2017Siloxane-treated and copper-plasma-coated wood
Gascón-Garrido, P.; Thévenon, M. F.; Mainusch, N.; Militz, H.; Viöl, W.; Mai, C.
Zeitschriftenaufsatz
2017Synergistic Toxicity of Copper and Gold Compounds in Cupriavidus metallidurans
Wiesemann, N.; Bütof, L.; Herzberg, M.; Hause, G.; Berthold, L.; Etschmann, B.; Brugger, J.; Martinez-Criado, G.; Dobritzsch, D.; Baginsky, S.; Reith, F.; Nies, D.H.
Zeitschriftenaufsatz
2016Entwicklung und Anpassung einer Free-Flow-Elektrophorese zur selektiven quantitativen Trennung von Metallionen
Kotzur, Maximilian; König, Lea; Egner, Siegfried
Zeitschriftenaufsatz
2016An examination of copper contained in international trade flows
Tercero Espinoza, Luis A.; Soulier, Marcel
Zeitschriftenaufsatz
2016JOIN'EM - Dissimilar materials joining using magnetic pulse welding
Assuncao, Enrico; Coutinho, Luisa; Faes, Koen; Psyk, Verena
Vortrag
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Zeitschriftenaufsatz
2016Process analysis for magnetic pulse welding of aluminium-copper joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Vortrag
2016Visualizing global trade flows of copper. An examination of copper contained in international trade flows in 2014
Tercero Espinoza, Luis A.; Soulier, Marcel; Haag, Stefan
Bericht
2015Characterization of copper diffusion in silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.
Zeitschriftenaufsatz, Konferenzbeitrag
2015Consideration of the bioavailability of metal/metalloid species in freshwaters: Experiences regarding the implementation of biotic ligand model-based approaches in risk assessment frameworks
Rüdel, Heinz; Díaz Muñiz, Cristina; Garelick, Hemda; Kandile, Nadia G.; Miller, Bradley W.; Pantoja Munoz, Leonardo; Peijnenburg, Willie J.G.M.; Purchase, Diane; Shevah, Yehuda; Sprang, Patrick van; Vijver, Martina; Vink, Jos P.M.
Zeitschriftenaufsatz
2015Long term stability of copper front side contacts for crystalline silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.; Glunz, S.
Zeitschriftenaufsatz
2015Plasma deposited silicon oxide films for controlled permeation of copper as antimicrobial agent
Lehmann, Antje; Rupf, Stefan; Schubert, Andreas; Zylla, Isabella-Maria; Seifert, Hans Jürgen; Schindler, Axel; Arnold, Thomas
Zeitschriftenaufsatz
2015Quantification of Front Side Metallization Area on Silicon Wafer Solar Cells for Background Plating Detection
Heinrich, M.; Lieder, M.; Hoex, B.; Aberle, A.G.; Glatthaar, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Konferenzbeitrag
2015Small-scale multiaxial setup for damage detection into the very high cycle fatigue regime
Straub, T.; Berwind, M.F.; Kennerknecht, T.; Lapusta, Y.; Eberl, C.
Zeitschriftenaufsatz
2014Antimicrobial bioactive polymer coatings
Förch, Renate; Duque, Luis; Lotz, Alexander
Aufsatz in Buch
2014Challenges in joining aluminium with copper for applications in electro mobility
Kaspar, Jörg; Zimmermann, Martina; Ostwaldt, Andrea; Göbel, Gunther; Standfuß, Jens; Brenner, Berndt
Konferenzbeitrag
2014Long term stability analysis of copper front side metallization for silicon solar cells
Kraft, A.; Wolf, C.; Lorenz, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Origins of folding instabilities on polycrystalline metal surfaces
Beckmann, N.; Romero, P.A.; Linsler, D.; Dienwiebel, M.; Stolz, U.; Moseler, M.; Gumbsch, P.
Zeitschriftenaufsatz
2014Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading
Yoo, B.-G.; Boles, S. T.; Liu, Y.; Zhang, X.; Schwaiger, R.; Eberl, C.; Kraft, O.
Zeitschriftenaufsatz
2013The effects of organic pollutants on metals in museums
Lafuente, D.; Cano, E.; Crespo, A.; Künne, J.; Schieweck, A.
Konferenzbeitrag
2013Inert drying system for copper paste application in PV
Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe
Zeitschriftenaufsatz, Konferenzbeitrag
2013Light-induced degradation in copper-contaminated gallium-doped silicon
Lindroos, J.; Yli-Koski, M.; Haarahiltunen, A.; Schubert, M.C.; Savin, H.
Zeitschriftenaufsatz
2013Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells
Mondon, A.; Jawaid, M.N.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Zeitschriftenaufsatz
2012Electrodeposition of copper on aligned multi-walled carbon nanotubes
Schneider, M.; Weiser, M.; Dörfler, S.; Althues, H.; Kaskel, S.; Michaelis, A.
Zeitschriftenaufsatz
2012Microstructural analysis and process chain simulation of copper-ribbons for solar cell interconnections
Butz, A.; Helm, D.; Meier, R.
Konferenzbeitrag
2010Calculation of emissions into rivers in Germany using the MONERIS model
Fuchs, S.; Scherer, U.; Wander, R.; Behrendt, H.; Venohr, M.; Opitz, D.; Hillenbrand, T.; Marscheider-Weidemann, F.; Götz, T.
Bericht
2010Opening of via-holes in flexible electronics by a UV-laser
Bollmann, Dieter
Poster
2009The behavior of silicon nitride tools in hot rolling copper wire
Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R.
Konferenzbeitrag
2009Kombinierte Verwertung von Altbeizsäuren und Composite-Verpackungen zur Gewinnung von Kupferzementat
Egenolf, B.; Erich, E.; Grüning, F.; Mrotzek, A.; Deerberg, G.
Konferenzbeitrag, Zeitschriftenaufsatz
2009Novel construction of a deformable mirror for laser beam shaping
Bruchmann, C.; Eberhardt, R.; Beckert, E.; Peschel, T.; Gramens, S.; Gebhardt, S.E.; Tünnermann, A.
Konferenzbeitrag
2009Structure and failure of Fcc/Bcc heterophase boundaries in metals
Hashibon, A.; Elsässer, C.; Gumbsch, P.
Konferenzbeitrag
2008Micro-bending tests: A comparison between three-dimensional discrete dislocation dynamics simulations and experiments
Motz, C.; Weygand, D.; Senger, J.; Gumbsch, P.
Zeitschriftenaufsatz
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Konferenzbeitrag
2008Vesicular localization of the rat ATP-binding cassette half-transporter rAbcb6
Abdul, J.Y.; Ritz, V.; Jakimenko, A.; Schmitz-Salue, C.; Siebert, H.; Awuah, D.; Kotthaus, A.; Kietzmann, T.; Ziemann, C.; Hirsch-Ernst, K.
Zeitschriftenaufsatz
2007Ab initio study of electronic densities of states at copper-alumina interfaces
Hashibon, A.; Elsässer, C.; Rühle, M.
Zeitschriftenaufsatz
2007Damage mechanisms of silicon nitride rolls in hot rolling of copper wire
Khader, I.; Gumbsch, P.; Kailer, A.
Konferenzbeitrag
2005Einträge von Kupfer, Zink und Blei in Gewässer und Böden
Hillenbrand, T.; Toussaint, D.; Böhm, E.; Fuchs, S.; Scherer, U.; Rudolphi, A.; Hoffmann, M.; Kreißig, J.; Kotz, C.
Bericht
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Konferenzbeitrag
2005Structure at abrupt copper-alumina interfaces: An ab-initio study
Hashibon, A.; Elsässer, C.; Rühle, M.
Zeitschriftenaufsatz
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Konferenzbeitrag
2002Emissions of heavy metals and lindane into river basins of Germany
Fuchs, S.; Scherer, U.; Hillenbrand, T.; Marscheider-Weidemann, F.; Behrendt, H.; Opitz, D.
Buch
2000Breakdown of Elasticity in Copper and Aluminium Interconnects
Schreiber, J.; Melov, V.G.; Herms, M.
Konferenzbeitrag
2000Quantitative topographic assessment of Cu incorporation in GaAs
Baeumler, M.; Stibal, R.; Stolz, W.; Steinegger, T.; Jurisch, M.; Maier, M.; Jantz, W.
Zeitschriftenaufsatz
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Konferenzbeitrag
1999Investigation of Cu films by focused ion beam induced deposition using nuclear microprobe
Park, Y.K.; Takai, M.; Lehrer, C.; Frey, L.; Ryssel, H.
Zeitschriftenaufsatz
1997Effect of process parameters on the microstructure and properties of TiC dispersion strengthened copper alloys
Weißgärber, T.; Sauer, C.; Püsche, W.; Kieback, B.; Dehm, G.; Mayer, J.
Konferenzbeitrag
1997Infrared micromirror array with large pixel size and large deflection angle
Wagner, B.; Reimer, K.; Maciossek, A.; Hofmann, U.
Konferenzbeitrag
1993Influence of plasma activation on the deposition of Ti, TiN and Cu using metalorganic compounds
Weber, A.; Nikulski, R.; Bringmann, U.; Gernhuber, M.; Pöckelmann, R.; Klages, C.-P.
Konferenzbeitrag
1992Einfluß von Kaltverformung und Rekristallisationsglühung auf Reinkupfer.
Grussenmeyer, A.
Buch
1992Investigation into the effects of planned restrictions with regard to the use, circulation and substitution of cadmium in products.
Bätcher, K.; Böhm, E.; Tötsch, W.
Buch
1992Untersuchung über die Auswirkungen geplanter gesetzlicher Beschränkungen auf die Verwendung, Verbreitung und Substitution von Cadmium in Produkten. Umweltforschungsplan des Bundesministers für Umwelt, Naturschutz und Reaktorsicherheit. Produktbezogener Immissionsschutz. Forschungsbericht Nr. 104 08 320
Bätcher, K.; Böhm, E.
: Tötsch, W.
Buch
1992Verbundprojekt - Kombination von PVD und Galvanik - Teilvorhaben. Metallisierung faserverstärkter Kunststoffe mittels kombinierter galvanischer/physikalischer Beschichtungsverfahren
Fessmann, J.; Mertz, K.
Konferenzbeitrag
1990Removal and drilling of metals by eximer laser radiation.
Schulze, W.; Kreutz, E.W.; Poprawe, R.
Konferenzbeitrag
1989Einfluß unterschiedlicher Schweißbedingungen auf die Qualität der Schweißnähte von Weißblechdosen
Hollaender, J.
Zeitschriftenaufsatz
1989Mechanisms in neo-vascularization of avascular ocular tissue by a monocytic angio-morphogen
Renner, H.; Logemann, E.; Wissler, J.H.
Aufsatz in Buch
1988Accomodation of polarization and shaping in laser beam welding
Schulz, W.; Wolf, N.; Welsing, O.; Behler, K.; Beyer, E.
Konferenzbeitrag