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| 2020 | Dynamic electro‐mechanical analysis of highly conductive particle‐elastomer composites
Stier, Simon P.; Uhl, Detlev; Löbmann, Peer; Holger Böse | Zeitschriftenaufsatz |
| 2016 | Designing 3D multihierarchical heteronanostructures for high-performance on-chip hybrid supercapacitors: Poly(3,4-(ethylenedioxy)thiophene)-coated diamond/silicon nanowire electrodes in an aprotic ionic liquid
Aradilla, D.; Gao, F.; Lewes-Malandrakis, G.; Müller-Sebert, W.; Gentile, P.; Boniface, M.; Aldakov, D.; Iliev, B.; Schubert, T.J.S.; Nebel, C.E.; Bidan, G. | Zeitschriftenaufsatz |
| 2015 | An alternative anionic polyelectrolyte for aqueous PEDOT dispersions: Toward printable transparent electrodes
Hofmann, Anna; Smaal, Wiljan; Mumtaz, Muhammad; Katsigiannopoulus, Dimitros; Brochon, Cyril; Schütze, Falk; Hild, Olaf-Rüdiger; Cloutet, Eric; Hadziioannou, Georges | Zeitschriftenaufsatz |
| 1998 | Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H. | Konferenzbeitrag |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 1996 | Electroluminescence in thin films
Mauch, R.H. | Konferenzbeitrag, Zeitschriftenaufsatz |