Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020A density functional theory study on the passivation mechanisms of hydrogenated Si/Al2O3 interfaces
Colonna, F.; Kühnhold-Pospischil, S.; Elsässer, C.
Zeitschriftenaufsatz
2019Influence of Interfacial Oxides at the TCO/a-Si Contact on the Fill Factor of SHJ Solar Cells
Meßmer, Christoph Alexander; Bivour, Martin; Luderer, Christoph; Tutsch, Leonard; Schön, Jonas; Hermle, Martin
Vortrag
2018Digital uncooled IRFPAs based on microbolometers with 17 μm and 12μm pixel pitch
Weiler, Dirk; Hochschulz, Frank; Busch, Claudia; Stein, Matthias; Michel, Marvin D.; Kuhl, Andreas; Lerch, Renee G.; Petermann, Martin; Geruschke, Thomas; Blaeser, Sebastian; Weyers, Sascha; Vogt, Holger
Konferenzbeitrag
2018High-performance uncooled digital 17 μm QVGA-IRFPA-using microbolometer based on amorphous silicon with massively parallel Sigma-Delta-ADC readout
Weiler, Dirk; Hochschulz, Frank; Busch, Claudia; Stein, Matthias; Michel, Marvin D.; Würfel, Daniel; Lerch, Renee G.; Petermann, Martin; Geruschke, Thomas; Blaeser, Sebastian; Weyers, Sascha; Vogt, Holger
Konferenzbeitrag
2015CMOS integrated miniaturized photovoltaic cells for autonomous sensor nodes: Simulations and experimental results
Goehlich, Andreas; Stühlmeyer, Martin; Vogt, Holger
Konferenzbeitrag
2015Density determination and gas absorption measurements in ambient nitrogen of silicon thin films deposited by crucible-free electron beam evaporation
Saager, Stefan; Mauersberger, Tom; Metzner, Christoph; Temmler, Dietmar
Konferenzbeitrag
2015High purity deposition of silicon layers with rates ≥ to 300 nm/s
Heinß, Jens-Peter; Pfefferling, Bert; Saager, Stefan; Temmler, Dietmar
Konferenzbeitrag
2015Via hole conditioning in silicon heterojunction metal wrap through solar cells
Dirnstorfer, Ingo; Schilling, Niels; Körner, Stefan; Gierth, Paul; Waltinger, Andreas; Leszczynska, Barbara; Simon, Daniel K.; Gärtner, Jan; Jordan, Paul M.; Mikolajick, Thomas; Dani, Ines; Eberstein, Markus; Rebenklau, Lars; Krause, Jens
Zeitschriftenaufsatz, Konferenzbeitrag
2014Fabrication of short fiber reinforced SiCN by injection molding of preceramic polymers
Müller-Köhn, Axel; Janik, J.; Neubrand, Achim; Klemm, Hagen; Moritz, Tassilo; Michaelis, Alexander
Konferenzbeitrag
2014High-rate deposition of SI absorber layers by electron beam evaporation and first electron beam crystallization tests
Saager, Stefan; Ben Yaala, Marwa; Heinß, Jens-Peter; Temmler, Dietmar; Pfefferling, Bert; Metzner, Christoph
Konferenzbeitrag
2014Uncooled digital IRFPA-family with 17µm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readout
Weiler, Dirk; Hochschulz, Frank; Würfel, Daniel; Lerch, Renee G.; Geruschke, Thomas; Wall, Simone; Heß, Jennifer; Wang, Qiang; Vogt, Holger
Konferenzbeitrag
2013Far infrared digital IRFPA baed on uncooled microbolometer for automotive and military applications
Weiler, Dirk; Ruß, Marco; Würfel, Daniel; Lerch, Renee G.; Hochschulz, Frank; Wang, Qiang; Geruschke, Thomas; Heß, Jennifer; Vogt, Holger
Abstract
2011Development of an uncooled 25µm pixel-pitch VGA-IRFPA
Weiler, D.; Ruß, M.; Würfel, D.; Lerch, R.G.; Yang, P.; Bauer, J.; Heß, J.; Kropelnicki, P.; Vogt, H.
Konferenzbeitrag
2011Electrical instability of a-Si:H TFTs fabricated by maskless laser-write lithography on a spherical surface
Yoo, G.; Radtke, D.; Baek, G.; Zeitner, U.D.; Kanicki, J.
Zeitschriftenaufsatz
2011Improvements of a digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta- ADC readout
Weiler, D.; Ruß, M.; Lerch, R.G.; Yang, P.; Bauer, J.; Heß, J.; Kropelnicki, P.; Vogt, H.
Konferenzbeitrag
2010A digital 25 m pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readout
Weiler, D.; Ruß, M.; Würfel, D.; Lerch, R.G.; Yang, P.; Bauer, J.; Vogt, H.
Konferenzbeitrag
2007The geometric design of microbolometer elements for uncooled focal plane arrays
Ruß, M.; Bauer, J.; Vogt, H.
Konferenzbeitrag
1998Applicability of parametric models for amorphous silicon modules and cells
Gottschalg, R.; Rommel, M.; Infield, D.G.; Kearney, M.J.
Konferenzbeitrag