Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2018 | Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried | Konferenzbeitrag |
| 2016 | A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S. | Zeitschriftenaufsatz |
| 2014 | Advanced metallization concepts and impact on reliability
Hauschildt, Meike; Hintze, Bernd; Gall, Martin; Koschinsky, Frank; Preuße, Axel; Bolom, Tibor; Nopper, Markus; Beyer, Armand; Aubel, Oliver; Talut, Georg; Zschech, Ehrenfried | Zeitschriftenaufsatz |
| 2014 | Electromigration void nucleation and growth analysis using large-scale early failure statistics
Hauschildt, Meike; Gall, Martin; Hennesthal, Christian; Talut, Georg; Aubel, Oliver; Yeap, Kong Boon; Zschech, Ehrenfried | Konferenzbeitrag |
| 2014 | Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried | Konferenzbeitrag |
| 2005 | Finite-Elemente-Analyse von modernen Leitbahnsystemen
Brocke, H.F. | Dissertation |
| 2003 | Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A. | Konferenzbeitrag |