Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Comprehensive study on the formation of grain boundary serrations in additively manufactured Haynes 230 alloy
Haack, Maximilian; Kuczyk, Martin; Seidel, André; Lopez, Elena; Brückner, Frank; Leyens, Christoph
Zeitschriftenaufsatz
2019Site-specific quasi in situ investigation of primary static recrystallization in a low carbon steel
Diehl, M.; Kertsch, L.; Traka, K.; Helm, D.; Raabe, D.
Zeitschriftenaufsatz
2014Intergranular stress corrosion crack propagation in rolled AZ31 Mg alloy
Casajús, P.; Winzer, N.
Zeitschriftenaufsatz
2013Differences in intermetallic phase growth in thermally aged alloyed gold bond interconnections on aluminium
Maerz, B.; Graff, A.; Klengel, R.; Petzold, M.
Konferenzbeitrag
2013Three dimensional X-ray diffraction contrast tomography reconstruction of polycrystalline strontium titanate during sintering and electron backscatter diffraction validation
Syha, M.; Reinheimer, W.; Loedermann, B.; Graff, A.; Trenkle, A.; Baeuer, M.; Weygand, D.; Ludwig, W.; Gumbsch, P.
Konferenzbeitrag
2012Analysis of microstructure and mechanical behaviour during equal channel angular pressing of aluminium for FE-modelling
Neugebauer, Reimund; Broschwitz, Elisa; Jesche, Fred; Putz, Matthias
Vortrag
2012In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions. Pt.2: The transpassive state
Schneider, M.; Schroth, S.; Richter, S.; Höhn, S.; Schubert, N.; Michaelis, A.
Zeitschriftenaufsatz
2012Twin boundaries in trained 10M Ni-Mn-Ga single crystals
Chulist, Robert; Pagounis, Emmanouel; Böhm, Andrea; Oertel, Carl-Georg; Skrotzki, Werner
Zeitschriftenaufsatz
2011Controlled grain size distribution and refinement of an EN AW-6082 aluminium alloy
Lampke, T.; Dietrich, D.; Nickel, D.; Neugebauer, Reimund; Bergmann, M.; Zachäus, R.
Zeitschriftenaufsatz
2011In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions. Pt.1: The active state
Schneider, M.; Schroth, S.; Richter, S.; Höhn, S.; Schubert, N.; Michaelis, A.
Zeitschriftenaufsatz
2009Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Dresbach, C.; Lorenz, G.; Mittag, M.; Petzold, M.; Milke, E.; Müller, T.
Konferenzbeitrag
2009Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
Dresbach, D.; Mittag, M.; Petzold, M.; Milke, M.; Müller, T.
Konferenzbeitrag
2008Scaling effects on grain size and texture of lead free interconnects - investigations by electron backscatter diffraction and nanoindentation
Krause, M.; Müller, M.; Petzold, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2007Identification of intermetallic compounds in microelectronic
Krause, M.; Petzold, M.
Konferenzbeitrag