Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2002Entwicklungen in der Smart Label Technologie
Klink, G.
Conference Paper
2002Reliability of thinned silicon ICs
Landesberger, C.; Bollmann, D.; Klink, G.; Bock, H.; Reichl, H.
Conference Paper
2001Gedünnte ICs für die Chip-in-Polymer-Technologie. Verfahren zur Herstellung dünner Halbleiter-Substrate
Scherbaum, S.; Landesberger, C.; Feil, M.
Conference Paper
2001Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R.
Conference Paper
2001New dicing and thinning concept improves mechanical reliability of ultra thin silicon
Landesberger, C.; Klink, G.; Schwinn, R.; Aschenbrenner, R.
Conference Paper
2001New process scheme for wafer thinning and stress-free separation of ultra thin ICs
Landesberger, C.; Scherbaum, S.; Schwinn, G.; Spöhrle, H.
Conference Paper
2001Paper-thin ICs for Future Smart Label Applications
Klink, G.; Ansorge, F.
Conference Paper
2000Ultra Thin ICs Open New Dimensions for Microelectronic Systems
Klink, G.; Landesberger, C.; Feil, M.; Ansorge, F.; Aschenbrenner,R.
Journal Article