Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Presentation
20183D integration processes for advanced sensor systems and high-performance RF components
Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter
Conference Paper
2017Monolithic two-terminal III-V//Si triple-junction solar cells with 30.2% efficiency under 1-Sun AM1.5g
Cariou, R.; Benick, J.; Beutel, P.; Razek, N.; Flötgen, C.; Hermle, M.; Lackner, D.; Glunz, S.W.; Bett, A.W.; Wimplinger, M.; Dimroth, F.
Journal Article
2017Nanodiamond resonators fabricated on 8'' Si substrates using adhesive wafer bonding
Lebedev, Vadim; Lisec, Thomas; Yoshikawa, Taro; Reusch, Markus; Iankov, Dimitre; Giese, Christian; Zukauskaite, Agne; Cimalla, Volker; Ambacher, Oliver
Journal Article
2014Comparison of direct growth and wafer bonding for the fabrication of GaInP/GaAs dual-junction solar cells on silicon
Dimroth, Frank; Roesener, Tobias; Essig, Stephanie; Weuffen, Christoph; Wekkeli, Alexander; Oliva, Eduard; Siefer, Gerald; Volz, Kerstin; Hannappel, Thomas; Häussler, Dietrich; Jäger, Wolfgang; Bett, Andreas W.
Journal Article
2013Direct bonding for the encapsulation of transverse optical gratings
Kalkowski, G.; Benkenstein, T.; Rothhardt, C.; Fuchs, F.; Zeitner, U.
Journal Article
2013Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods
Langa, Sergiu; Drabe, Christian; Kunath, Christian; Dreyhaupt, André; Schenk, Harald
Conference Paper
2012Direct wafer bonding for encapsulation of fused silica optical gratings
Kalkowski, Gerhard; Zeitner, Uwe Detlef; Benkenstein, Tino; Fuchs, J. Hans-Jörg; Rothhardt, Carolin; Eberhardt, Ramona
Journal Article, Conference Paper
2012Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T.
Abstract
2008III-V and III-Nitride engineered heterostructures: Wafer bonding, ion slicing and more
Moutanabbir, O.; Christiansen, S.; Senz, S.; Scholz, R.; Petzold, M.; Gösele, U.
Conference Paper
2008Mechanical characterization and micro structure diagnostics of glass frit bonded interfaces
Boettge, B.; Dresbach, C.; Graff, A.; Petzold, M.; Bagdahn, J.
Conference Paper
2007Development of a classical force field for the oxidized Si surface
Cole, D.J.; Payne, M.C.; Csanyi, G.; Spearing, S.M.; Ciacchi, L.C.
Journal Article
2007Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding
Heidrich, H.; Hamacher, M.; Troppenz, U.; Syvridis, D.; Alexandropoulos, D.; Mikroulis, S.; Tee, C.W.; Williams, K.; Dragoi, V.; Alexe, M.; Cristea, D.; Kusko, C.; Kusko, M.
Conference Paper
2007Vertically coupled microring laser devices based on InP using BCB waferbonding
Hamacher, M.; Troppenz, U.; Heidrich, H.; Dragoi, V.
Conference Paper
2006Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, J.; Bernasch, M.; Petzold, M.
Journal Article
2006Large scale, drift free monocrystalline silicon micromirror arrays made by wafer bonding
Bakke, T.; Völker, B.; Friedrichs, M.; Rudloff, D.; Schenk, H.; Lakner, H.
Conference Paper
2006Room temperature bonding of nanostructured silicon wafers and mechanical characterization
Stubenrauch, M.; Fischer, M.; Bernasch, M.; Bagdahn, J.
Conference Paper
2006Strength characterization of directly bonded silicon
Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J.
Conference Paper
2005Mechanical reliability of directly bonded silicon MEMS components
Bagdahn, J.; Wiemer, M.; Petzold, M.
Conference Paper
2005Reliability of wafer bonding in microsystem technologies
Bagdahn, J.
Conference Paper
2005Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding
Bakke, T.; Friedrichs, M.; Völker, B.; Reiche, M.; Leonardsson, L.; Schenk, H.; Lakner, H.
Conference Paper
2004Debonding of wafer-bonded interfaces for handling and transfer applications
Bagdahn, J.; Petzold, M.
Book Article
2004Determination of residual stress in glass frit bonded MEMS by finite element analysis
Ebert, M.; Bagdahn, J.
Conference Paper
2004Strength and reliability testing for silicon based MEMS
Petzold, M.; Bagdahn, J.; Katzer, D.
Book Article
2003A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M.
Journal Article
2001Locally selective bonding of silicon and glass with laser
Wild, M.J.; Gillner, A.; Poprawe, R.
Journal Article
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M.; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
2000Lifetime investigations of directly wafer-bonded samples under static and cyclic loading
Bagdahn, J.; Petzold, M.; Sommer, E.
Conference Paper
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1998Simultaneous fabrication of dielectric and electrical joints by wafer bonding
Drost, A.; Klink, G.; Scherbaum, S.; Feil, M.
Conference Paper
1998Wafer bonding with an adhesive coating
Klink, G.; Hillerich, B.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A.
Conference Paper
1996Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Conference Paper
1993SIMOX and wafer bonding, combination of competitors complements one another
Gassel, H.; Vogt, H.
Conference Paper