Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Dicing of MEMS devices
Martin, Devin; Sullivan, Scott; Bose, Indranil; Landesberger, Christof; Wieland, Robert
Book Article
2018Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph
Journal Article
2007Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J.
Journal Article
2005Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C.
Conference Paper
2003A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M.
Journal Article
2001Fast Flip Chip Assembly for Reel-to-Reel Manufacturing
König, M.; Klink, G.; Feil, M.
Conference Paper
2001Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper