Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2020 | Dicing of MEMS devices
Martin, Devin; Sullivan, Scott; Bose, Indranil; Landesberger, Christof; Wieland, Robert | Book Article |
| 2018 | Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
Palavesam, Nagarajan; Marin, Sonia; Hemmetzberger, Dieter; Landesberger, Christof; Bock, Karlheinz; Kutter, Christoph | Journal Article |
| 2007 | Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schönfelder, S.; Ebert, M.; Landesberger, C.; Bock, K.; Bagdahn, J. | Journal Article |
| 2005 | Investigations of strength properties of ultra-thin silicon
Schönfelder, S.; Bagdahn, J.; Ebert, M.; Petzold, M.; Bock, K.; Landesberger, C. | Conference Paper |
| 2003 | A new approach for handling and transferring of thin semiconductor materials
Bagdahn, J.; Knoll, H.; Wiemer, M.; Petzold, M. | Journal Article |
| 2001 | Fast Flip Chip Assembly for Reel-to-Reel Manufacturing
König, M.; Klink, G.; Feil, M. | Conference Paper |
| 2001 | Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. | Conference Paper |