Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021IC package related stress effects on the characteristics of ring oscillator circuits
Schlipf, Simon; Sander, Christoph; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Conference Paper
2021Relevance evaluation of solder joints attributes to reduce the variance of the lifetime model
Berger, Rike; Schwerz, Robert; Röllig, Mike; Heuer, Henning
Conference Paper
2018A thermodynamically consistent model for elastoplasticity, recovery, recrystallization and grain coarsening
Kertsch, L.; Helm, D.
Journal Article