Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
1997An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article