Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Comprehensive determination of heat generation and thermal modelling of a hybrid capacitor
Miller, Martin; Baltes, Norman; Rabenecker, Peter; Hagen, Marcus; Tübke, Jens
Journal Article
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book
2019Increased thermal inertia of ball screws by using phase change materials
Voigt, Immanuel; Navarro Y De Sosa, Iñaki; Wermke, Benjamin; Bucht, Andre; Drossel, Welf-Guntram
Journal Article
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book Article
2019Thermal management materials based on molybdenum (Mo) and copper (Cu): Elucidation of the rolling-induced evolution of thermophysical properties (e.g. CTE)
Reiser, J.; Hoffmann, A.; Hain, J.; Jäntsch, U.; Klimenkov, M.; Hohe, J.; Mrotzek, T.
Journal Article
2017GaSb-based VECSEL for high-power applications and Ho-pumping
Holl, Peter; Rattunde, Marcel; Adler, Steffen; Scholle, Karsten; Lamrini, Samir; Fuhrberg, Peter; Diwo-Emmer, Elke; Aidam, Rolf; Bronner, Wolfgang; Wagner, Joachim
Conference Paper
2012Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas
Conference Paper
2011Ermittlung und Auslegung eines Konzeptes für ein energieeffizientes Thermomanagement einer Lithium-Ionen-Batterie unter Einsatz intelligenter Werkstoffe
Ohsenbrügge, Christoph
Thesis
2008Thermal management in 2.3-mu m semiconductor disk lasers: A finite element analysis
Kemp, A.J.; Hopkins, J.-M.; Maclean, A.J.; Schulz, N.; Rattunde, M.; Wagner, J.; Burns, D.
Journal Article
20063D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
2005Optically pumped mid infrared emitters built using surface structured PbSe epitaxial layers
Nurnus, J.; Vetter, U.; König, J.; Glatthaar, R.; Lambrecht, A.; Weik, F.; Tomm, J.W.
Conference Paper
2003Thermal management in high-density power converters
März, M.
Conference Paper
2001Design of coplanar power amplifiers for millimeter-wave system applications including thermal aspects
Bessemoulin, A.; Marsetz, W.; Baeyens, Y.; Osorio, R.; Massler, H.; Hülsmann, A.; Schlechtweg, M.
Journal Article
2001Micro thermal management of high-power diode laser bars
Lorenzen, D.; Bonhaus, J.; Fahrner, E.; Kaulfersch, E.; Wörner, E.; Koidl, P.; Unger, K.; Müller, D.; Rölke, S.; Schmidt, H.; Grellmann, M.
Journal Article
2000Design of coplanar power amplifiers for MM-wave system applications including thermal aspects
Bessemoulin, A.; Marsetz, W.; Baeyens, Y.; Osorio, R.; Massler, H.; Hülsmann, A.; Schlechtweg, M.
Conference Paper
1999CVD-diamonds shine brightly. Part 2: Diamond, space and related items
Schäfer, L.; Meier, M.
Journal Article
1999Thermische und elektrische Konzeption von GaAs-HEMTs für Leistungsverstärker bis 80 GHz
Marsetz, W.
Dissertation
1998CVD-diamonds shine brightly. Part 1
Schäfer, L.; Meier, M.
Journal Article
1998Thermal properties and applications of CVD diamond
Wörner, E.
Book Article
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper