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| 2017 | CAD-integrated modelling of lattice structures for additive manufacturing and property evaluation of generated specimens
Kordaß, Richard; Koch, Peter; Töppel, Thomas; Korn, Hannes; Schöne, Christine; Müller, Bernhard; Stelzer, Ralph | Conference Paper |
| 2015 | Metal foam lightweight structures bonded with fibre-reinforced plastics
Drebenstedt, Claudia; Drossel, Welf-Guntram; Hipke, Thomas; Eichler, Jana; Nestler, Daisy; Trautmann, Maik | Poster |
| 2014 | Advanced material studies for additive manufacturing in terms of future gear application
Bräunig, Jan; Töppel, Thomas; Müller, Bernhard; Burkhardt, Martin; Hipke, Thomas; Drossel, Welf-Guntram | Journal Article |
| 2012 | Basic investigations to establish an ultrasonic stress evaluation technique for aero engine materials
Hubel, Sebastian; Dillhöfer, Alexander; Rieder, Hans; Spies, Martin; Bamberg, Joachim; Hessert, Roland; Preikszas, Christina | Conference Paper |
| 2012 | Loss of wire tension in the wire web: Towards stable cutting conditions for all wafers
Meißner, D.; Hurka, B.; Zeh, J.; Sunder, K.; Koepge, R.; Wagner, T.; Moeller, H.-J.; Schoenfelder, S.; Anspach, O. | Conference Paper |
| 2009 | Greatly increased toughness of infiltrated spider silk
Lee, S.-M.; Pippel, E.; Gösele, U.; Dresbach, C.; Qin, Y.; Chandran, C.V.; Bräuniger, T.; Hause, G.; Knez, M. | Journal Article |
| 2009 | Low-temperature ZnO atomic layer deposition on biotemplates
Lee, S.-M.; Grass, G.; Kim, G.-M.; Dresbach, C.; Zhang, L.; Gösele, U.; Knez, M. | Journal Article |
| 2008 | Investigation into the strength of components made of UFG aluminium alloys
Lang, H.; Bruzek, B.; Leidich, E.; Semmler, U. | Conference Paper |
| 2006 | Determination of sheet material properties using biaxial bulge tests
Altan, T.; Palaniswamy, H.; Bortot, P.; Mirtsch, M.; Heidl, W.; Bechtold, A. | Conference Paper |
| 2005 | Investigation of the notch sensitivity of a short fibre reinforced C/SiC
Neubrand, A.; Thielicke, B.; Hirsch, E. | Conference Paper |
| 2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 1990 | Preparation and mechanical properties of ultrafine grained metals
Baalmann, A.; Weiss, H.; Günther, B. | Conference Paper |