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| 2021 | Lifetime limiting defects in 4H-SiC epitaxial layers: The influence of substrate originated defects
Erlekampf, Jürgen; Rommel, Mathias; Rosshirt-Lilla, Katharina; Kallinger, Birgit; Berwian, Patrick; Friedrich, Jochen; Erlbacher, Tobias | Journal Article |
| 2019 | Analysis of flip-chip solder joints under isothermal vibration loading
Meier, Karsten; Leslie, David; Dasgupta, Abhijit; Röllig, Mike; Bock, Karlheinz | Conference Paper |
| 2019 | Asymmetrical substrate-biasing effects at up to 350V operation of symmetrical monolithic normally-off GaN-on-Si half-bridges
Mönch, Stefan; Reiner, Richard; Waltereit, Patrick; Meder, Dirk; Basler, Michael; Quay, Rüdiger; Ambacher, Oliver; Kallfass, Ingmar | Conference Paper |
| 2019 | Modeling of the impact of the substrate voltage on the capacitances of GaN-on-Si HEMTs
Albahrani, Sayed Ali; Mahajan, Dhawal; Mönch, Stefan; Reiner, Richard; Waltereit, Patrick; Schwantuschke, Dirk; Khandelwal, Sourabh | Journal Article |
| 2018 | Direct growth of III–V/silicon triple-junction solar cells with 19.7% efficiency
Feifel, Markus; Ohlmann, Jens; Benick, Jan; Hermle, Martin; Belz, Jürgen; Beyer, Andreas; Volz, Kerstin; Hannappel, Thomas; Bett, Andreas W.; Lackner, David; Dimroth, Frank | Journal Article |
| 2017 | Electrochemical genetic profiling of single cancer cells
Sanchez, Josep L.A.; Joda, Hamdi; Henry, O.Y.F.; Solnestam, Beata W.; Kvastad, L.; Akan, Pelin S.; Lundeberg, J.; Laddach, Nadja; Ramakrishnan, Dheeraj; Riley, I.; Schwind, Carmen; Latta, Daniel; O'Sullivan, Ciara K. | Journal Article |
| 2012 | Reliability of silver sintering on DBC and DBA substrates for power electronic applications
Kraft, S.; Schletz, A.; Maerz, M. | Conference Paper |
| 2007 | PZT thick films for sensor and actuator applications
Gebhardt, S.; Seffner, L.; Schlenkrich, F.; Schönecker, A. | Journal Article |
| 1998 | AIN properties of various producers
Otschik, P.; Kretzschmar, C.; Lefrance, G. | Conference Paper |
| 1996 | Influence of MOVPE growth conditions and substrate parameters on the structural quality of multi-period InGaAsP/InP MQW structures
Reier, F.W.; Bornholdt, C.; Hoffmann, D.; Kappe, F.; Mörl, L. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H. | Conference Paper |
| 1991 | MBE overgrowth of implanted regions in InP:Fe substrates
Kunzel, H.; Gibis, R.; Schlaak, W.; Su, L.M.; Grote, N. | Journal Article |
| 1989 | Assessment of semi-insulating InP:Fe layers for substrate applications
Grote, N.; Bach, H.G.; Feifel, T.; Franke, D.; Harde, P.; Sartorious, B.; Wolfram, P. | Conference Paper |
| 1989 | Butt coupled photodiodes integrated with Y-branched optical waveguides on InP
Döldissen, W.; Fiedler, F.; Kaiser, R.; Mörl, L. | Journal Article |