Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2009Damage modelling of a TRIP steel for integrated simulation from deep drawing to crash
Sun, D.-Z.; Andrieux, F.; Feucht, M.
Conference Paper
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1991A comparison of different adhesion test methods for thermal sprayed coatings
Grützner, H.
Conference Paper