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2021 | mHealthAtlas - An Approach for the Multidisciplinary Evaluation of mHealth Applications Lehmann, Nicolas J.; Spielmann, Felix; George, Bianca; Ververs, Linus; Karagülle, Muhammed-Ugur; Kmiotek, Daniel; Mielke, Laura; Junk, Oliver; Voisard, Agnès; Fluhr, Joachim W. | Conference Paper |
2021 | Sustainable and Reliable Information and Communication Technology for Resilient Smart Cities Tcholtchev, Nikolay; Schieferdecker, Ina | Journal Article |
2020 | Microstructure and Long-Term Stability of Solder Joints on Nickel-Plated Aluminium Formed During Short Soldering Times Rose, A. de; Mikolasch, G.; Kamp, M.; Kraft, A.; Nowottnick, M. | Journal Article |
2020 | Reduction of ECA Amount for the Ribbon Interconnection of Heterojunction Solar Cells Kaiser, C.; Nikitina, V.; Geipel, T.; Kraft, A. | Conference Paper |
2019 | Cognitive Edge for Factory Lambrecht, Jens; Steffens, Ernst Joachim; Geitz, Marc; Vick, Axel; Funk, Eugen; Steigerwald, Wolfgang | Conference Paper |
2019 | Exploring the Causes of Power-Converter Failure in Wind Turbines based on Comprehensive Field-Data and Damage Analysis Fischer, Katharina; Pelka, Karoline; Puls, Sebastian; Poech, Max-Hermann; Mertens, Axel; Bartschat, Arne; Tegtmeier, Bernd; Broer, Christian; Wenske, Jan | Journal Article |
2019 | FEM Simulation of Deformations in Strings of Shingled Solar Cells Subjected to Mechanical Reliability Testing Klasen, N.; Romer, P.; Beinert, A.; Kraft, A. | Conference Paper |
2019 | O&M and Reliability Data Collection in Europe and International Guidelines Hahn, Berthold | Presentation |
2019 | Potential Analysis for the Monetary Based Maintenance Optimization of Wind Turbines Yalcinkaya, Mehmet Alp | Master Thesis |
2019 | Reliability of power converters in wind turbines: Exploratory analysis of failure and operating data from a worldwide turbine fleet Fischer, Katharina; Pelka, Karoline; Bartschat, Arne; Tegtmeier, Bernd; Coronado, Diego; Broer, Christian; Wenske, Jan | Journal Article |
2019 | SHM using guided waves - Recent activities and advances in Germany Mueller, Inka; Moll, Jochen; Tschöke, Kilian; Prager, Jens; Kexel, Christian; Schubert, Lars; Lugovtsova, Yevgeniya; Bach, Martin; Vogt, Thomas | Conference Paper |
2019 | Thermochemical Stress in Solar Cells: Contact Pad Modeling and Reliability Analysis Rendler, L.; Romer, P.; Beinert, A.; Stecklum, S.; Kraft, A.; Eitner, U.; Wiese, S. | Journal Article |
2019 | Use of AI-based solutions in safety-critical applications Seydel, Dominique | Presentation |
2018 | Assessing factors impacting on reliability of wind turbines by use of survival analysis - a case study Ozturk, S.; Fthenakis, V.; Faulstich, S. | Journal Article |
2018 | Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-gate and SAG-gate technology Dammann, Michael; Baeumler, Martina; Brueckner, Peter; Kemmer, Tobias; Konstanzer, Helmer; Graff, Andreas; Simon-Najasek, Michél; Quay, Rüdiger | Journal Article |
2018 | Failure modes, effects and criticality analysis for wind turbines considering climatic regions and comparing geared and direct drive wind turbines Ozturk, S.; Fthenakis, V.; Faulstich, S. | Journal Article |
2018 | Focusing Requirements Elicitation by Using a UX Measurement Method Ohashi, Kyoko; Katayama, Asako; Hasegawa, Naoki; Kurihara, Hidetoshi; Yamamoto, Rieko; Dörr, Jörg; Magin, Dominik Pascal | Conference Paper |
2018 | Functional reliability of cognitive control systems for manufacturing processes Permin, Eike; Lossie, Karl; Schmitt, Robert H. | Journal Article |
2018 | Improving the error behavior of DRAM by exploiting its Z-channel property Kraft, Kira; Sudarshan, Chirag; Mathew, Deepak M.; Weis, Christian; Wehn, Norbert; Jung, Matthias | Conference Paper |
2018 | On the limits of scalpel AFM for the 3D electrical characterization of nanomaterials Chen, Shaochuan; Jiang, Lanlan; Buckwell, Mark; Jing, Xu; Ji, Yanfeng; Grustan-Gutierrez, Enric; Hui, Fei; Shi, Yuanyuan; Rommel, Mathias; Paskaleva, Albena; Benstetter, Günther; Ng, Wing. H.; Mehonic, Adnan; Kenyon, Anthony J.; Lanza, Mario | Journal Article |
2018 | Reliability analysis of encapsulated components in 3D-circuit board integration Schwerz, Robert; Röllig, Mike; Wolter, Klaus-Jürgen | Conference Paper |
2018 | Wave-Shaped Wires Soldered on the Finger Grid of Solar Cells: Solder Joint Stability under Thermal Cycling Rendler, L.; Haryantho, A.P.; Walter, J.; Huyeng, J.; Kraft, A.; Wiese, S.; Eitner, U. | Conference Paper |
2017 | 17. Wind Farm Data Collection and Reliability Assessment for O&M Optimization Hahn, B.; Faulstich, S. | Report |
2017 | Analysis of peel and shear forces after temperature cycle tests for electrical conductive adhesives Hoffmann, S.; Geipel, T.; Meinert, M.; Kraft, A. | Conference Paper |
2017 | Applying operational and event data to understand the turbine's performance and reliability behaviour Faulstich, S. | Presentation |
2017 | Comparison of inline hot spot detection and evaluation algorithms for crystalline silicon solar cells Wasmer, S.; Geisemeyer, I.; Pfengler, D.; Greulich, J.; Rein, S. | Conference Paper |
2017 | Failure behaviour of power converters in wind turbines Pelka, Karoline; Fischer, Katharina | Conference Paper |
2017 | Formative evaluation of a tool for managing software quality Guzman, Liliana; Vollmer, Anna Maria; Ciolkowski, Marcus; Gillmann, Michael | Conference Paper |
2017 | Impact of individual pitch control on pitch actuators in megawatt wind turbines Morisse, Marcel; Bartschat, Arne; Wenske, Jan; Mertens, Axel | Conference Paper |
2017 | Know thy neighbor - a data-driven approach to neighborhood estimation in VANETs Roscher, Karsten; Nitsche, Thomas; Knorr, Rudi | Conference Paper |
2017 | Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O. | Journal Article |
2017 | Optical stressing of 4H-SiC material and devices Kallinger, Birgit; Kaminzky, Daniel; Berwian, Patrick; Friedrich, Jochen; Oppel, Steffen | Poster |
2017 | Performance and failure analysis of concentrator solar cells after intensive stressing with thermal, electrical, and combined load Eltermann, F.; Ziegler, L.; Wiesenfarth, M.; Wilde, J.; Bett, A.W. | Conference Paper |
2017 | Performance and reliability of wind turbines: A review Pfaffel, S.; Faulstich, S.; Rohrig, K. | Journal Article |
2017 | Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applications Dammann, Michael; Baeumler, Martina; Polyakov, Vladimir M.; Brueckner, Peter; Konstanzer, Helmer; Quay, Rüdiger; Mikulla, Michael; Graff, Andreas; Simon-Najasek, M. | Journal Article |
2017 | Safe adaptation for reliable and energy-efficient E/E architectures Weiß, Gereon; Schleiß, Philipp; Drabek, Christian; Ruiz, Alejandra; Radermacher, Ansgar | Book Article |
2017 | Standardized wind farm data collection and reliability assessment for O&M optimization Berkhout, V.; Faulstich, S.; Hahn, B. | Presentation |
2017 | TPedge: Progress on cost-efficient and durable edge-sealed PV modules Mittag, M.; Eitner, U.; Neff, T. | Conference Paper |
2017 | Training the next generation of PV reliability experts - new Marie-Sklodowska Curie (MSCA) project SOLAR-TRAIN Weiß, Karl-Anders; Saile, Sandrin; Keiner, A.; Bauermann, Pitta; Oreski, G.; Gottschalg, R.; Moser, D.; Topic, M.; Lagunas, A.R.; Chiantore, P.; Iseghem, M. van | Conference Paper |
2017 | Ultra-soft wires for direct soldering on finger grids of solar cells Rendler, L.C.; Walter, J.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U. | Journal Article, Conference Paper |
2016 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Journal Article |
2016 | Gaining certainty about uncertainty: Testing for uncertainties of cyber-physical systems at the application level Schneider, Martin; Wendland, Marc-Florian; Bornemann, Leon | Presentation |
2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
2016 | Long-Term Stability Evaluation of Copper-Containing Contacts on Cell and Module Level Kluska, S. | Conference Paper |
2016 | Reliability of power converters in wind turbines: Results of a comprehensive field study Fischer, K.; Bartschat, A.; Tegtmeier, B.; Coronado, D.; Broer, C.; Wenske, J. | Poster |
2016 | Reliable message forwarding in VANETs for delay-sensitive applications Roscher, Karsten; Maierbacher, Gerhard | Conference Paper |
2016 | TPEDGE: Glass-glass photovoltaic module for BIPV-applications Mittag, M.; Neff, T.; Hoffmann, S.; Ebert, M.; Eitner, U.; Wirth, H. | Conference Paper |
2016 | Utilizing wind-turbine failure and operating data for root-cause analysis Fischer, Katharina | Presentation |
2015 | Degradation of 0.25 μm GaN HEMTs under high temperature stress test Dammann, M.; Baeumler, M.; Brückner, P.; Bronner, W.; Maroldt, S.; Konstanzer, H.; Wespel, M.; Quay, R.; Mikulla, M.; Graff, A.; Lorenzini, M.; Fagerlind, M.; Wel, P.J. van der; Roedle, T. | Journal Article |
2015 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Conference Paper |
2015 | Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Conference Paper, Journal Article |
2015 | Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging Elßner, Michael; Vogt, Holger | Journal Article, Conference Paper |
2015 | Field-experience based root-cause analysis of power-converter failure in wind turbines Fischer, Katharina; Stalin, Thomas; Ramberg, Hans; Wenske, Jan; Wetter, Göran; Karlsson, Robert; Thiringer, Torbjörn | Journal Article |
2015 | In situ time-dependent dielectric breakdown in the transmission electron microscope: A possibility to understand the failure mechanism in microelectronic devices Liao, Zhongquan; Gall, Martin; Yeap, Kong Boon; Sander, Christoph; Clausner, André; Mühle, Uwe; Gluch, Jürgen; Standke, Gisela; Aubel, Oliver; Beyer, Armand; Hauschildt, Meike; Zschech, Ehrenfried | Journal Article |
2015 | Pattern-based approach for designing fail-operational safety-critical embedded systems Penha, Dulcineia; Weiß, Gereon; Stante, Alexander | Conference Paper |
2015 | Reliability of microbolometer thermal imager sensors using chip-scale packaging Elßner, Michael; Vogt, Holger | Journal Article, Conference Paper |
2015 | Towards reliable power converters for wind turbines: Field-data based identification of weak points and cost drivers Fischer, Katharina; Wenske, Jan | Conference Paper |
2015 | TPedge: Qualification of a gas-filled, encapsulation-free glass-glass photovoltaic module Mittag, M.; Haedrich, I.; Neff, T.; Hoffmann, S.; Eitner, U.; Wirth, H. | Conference Paper |
2015 | Utilizing LTE QoS features to provide a reliable access network for cyber-physical systems Elattar, Mohammad; Dürkop, Lars; Jasperneite, Jürgen | Conference Paper |
2015 | With electroluminescence microcopy towards more reliable AlGaN/GaN transistors Baeumler, M.; Dammann, M.; Wespel, M.; George, R.; Konstanzer, H.; Maroldt, S.; Polyakov, V.M.; Müller, S.; Bronner, W.; Brueckner, P.; Benkhelifa, F.; Waltereit, P.; Quay, R.; Mikulla, M.; Wagner, J.; Ambacher, O.; Graff, A.; Altmann, F.; Simon-Najasek, M.; Lorenzini, M.; Fagerlind, M.; Wel, P. van der; Roedle, T. | Conference Paper |
2014 | Challenges of a safe adaptation architecture for vehicles Weiß, Gereon | Presentation |
2014 | Concept for simultaneous measurement of Seebeck coefficient, electrical conductivity and thermal conductivity Nissila, J.; Jacquot, A.; Barb, Y.; Jägle, M.; Leppanen, M.; Manninen, A. | Conference Paper |
2014 | Fraunhofer cluster 3D integration - key to a holistic technology and service approach Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried | Conference Paper |
2014 | Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering Hutzler, Aaron; Tokarski, Adam; Kraft, Silke; Zischler, Sigrid; Schletz, Andreas | Conference Paper |
2014 | Increasing the lifetime of power modules by smaller bond wire diameters Hutzler, Aaron; Wright, Alan; Schletz, Andreas | Presentation |
2014 | Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices Wespel, M.; Dammann, M.; Baeumler, M.; Polyakov, V.M.; Reiner, R.; Waltereit, P.; Quay, R.; Mikulla, M.; Ambacher, O. | Conference Paper |
2014 | Inline processes for the stabilization of p-type crystalline Si solar cells against potential-induced degradation Nagel, N.; Saint-Cast, P.; Glatthaar, M.; Glunz, S.W. | Conference Paper |
2014 | Microscopic-scale investigation of the degradation of InGaN-based laser diodes submitted to electrical stress Meneghini, M.; Carraro, S.; Meneghesso, G.; Trivellin, N.; Mura, G.; Rossi, F.; Salviati, G.; Holc, K.; Weig, T.; Schade, L.; Karunakaran, M.A.; Wagner, J.; Schwarz, U.T.; Zanoni, E. | Conference Paper |
2014 | Power cycling community 1995-2014 - an overview of test results over the last 20 years Hutzler, Aaron; Zeyss, Felix; Vater, Stephan; Tokarski, Adam; Schletz, Andreas; März, Martin | Journal Article |
2014 | Structural health assessment of in situ timber: An interface between service life planning and timber engineering Kasal, B. | Journal Article, Conference Paper |
2014 | Thermally-activated degradation of InGaN-based laser diodes: Effect on threshold current and forward voltage Santi, C. de; Meneghini, M.; Marioli, M.; Buffolo, M.; Trivellin, N.; Weig, T.; Holc, K.; Köhler, K.; Wagner, J.; Schwarz, U.T.; Meneghesso, G.; Zanoni, E. | Journal Article, Conference Paper |
2014 | Towards increased reliability of power converters in wind turbines Fischer, K. | Presentation |
2013 | Engineering autonomous systems Serbedzija, Nikola; Bures, Tomas; Keznikl, Jaroslav | Conference Paper |
2013 | Modeling the leakage current for potential induced degradation Hoffmann, S.; Köhl, M. | Conference Paper |
2013 | Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration Huang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul; Altmann, Frank | Journal Article |
2013 | Optimized electrode and interface for enhanced reliability of high-k based metal-insulator-metal capacitors Koch, Johannes; Seidel, Konrad; Weinreich, Wenke; Riedel, Stefan; Chiang, Jung-Chin; Beyer, Volkhard | Journal Article |
2013 | Performance optimization of an adaptive vibration absorber using a design to reliability approach Pfeiffer, Thomas; Janssen, Enrico; Nuffer, Jürgen; Melz, T. | Conference Paper |
2013 | Potential-induced degradation on cell level: The inversion model Saint-Cast, P.; Nagel, H.; Wagenmann, D.; Schön, J.; Schmitt, P.; Reichel, C.; Glunz, S.W.; Hofmann, M.; Rentsch, J.; Preu, R. | Conference Paper |
2013 | Reliability of power electronic systems in wind turbines - Damage types in frequency converters Fischer, K. | Presentation |
2013 | Structural health assessment of in-situ timber Kasal, B. | Conference Paper |
2013 | Submicron-AlGaN/GaN MMICs for space applications Quay, R.; Waltereit, P.; Kühn, J.; Brueckner, P.; Heijningen, M. van; Jukkala, P.; Hirche, K.; Ambacher, O. | Conference Paper |
2012 | A Bayesian logistic regression model for binomial failure data Kempf, Michael | Conference Paper |
2012 | Chemometric tools for analysing Terahertz fingerprints in a postscanner Ellrich, Frank; Torosyan, Garik; Wohnsiedler, Sabine; Bachtler, Sebastian; Hachimi, A.; Jonuscheit, Joachim; Beigang, René; Platte, F.; Nalpantidis, K.; Sprenger, T.; Hübsch, D. | Conference Paper |
2012 | Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds Merkle, L.; Sonner, M.; Petzold, M. | Journal Article |
2012 | Efficient planar SOFC technology for a portable power generator Poenicke, A.; Reuber, S.; Dosch, C.; Megel, S.; Kusnezoff, M.; Wunderlich, C.; Michaelis, A. | Conference Paper |
2012 | Feasiblity and limitations of anti-fuses based on bistable non-volatile switches for power electronic applications Erlbacher, Tobias; Hürner A.; Bauer, Anton J.; Frey, Lothar | Journal Article |
2012 | GaN-based high-frequency devices and circuits: A Fraunhofer perspective Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Cäsar, M.; Müller, S.; Raay, F. van; Kiefer, R.; Brueckner, P.; Kühn, J.; Musser, M.; Kirste, L.; Haupt, C.; Pletschen, W.; Lim, T.; Aidam, R.; Mikulla, M.; Ambacher, O. | Journal Article |
2012 | High efficiency X-band AlGaN/GaN MMICs for space applications with lifetimes above 10(5) hours Waltereit, P.; Kühn, J.; Quay, R.; Raay, F. van; Dammann, M.; Cäsar, M.; Müller, S.; Mikulla, M.; Ambacher, O.; Lätti, J.; Rostewitz, M.; Hirche, K.; Däubler, J. | Conference Paper |
2012 | How to achieve and measure quality in multi-core systems Hupp, Steffen : Rombach, H. Dieter (Supervisor); Lampasona, Constanza (Supervisor) | Bachelor Thesis |
2012 | Improving module performance and reliability in power electronic applications by monolithic integration of RC-snubbers Erlbacher, Tobias; Schwarzmann, Holger; Bauer, Anton J.; Berberich, Sven E.; Dorp, Joachim vom; Frey, Lothar | Conference Paper |
2012 | Interdependency of mechanical failure rate of encapsulated solar cells and module design parameters Dietrich, S.; Sander, M.; Pander, M.; Ebert, M. | Conference Paper |
2012 | Investigations on cracks in embedded solar cells after thermal and mechanical loading Sander, M.; Dietrich, S.; Pander, M.; Ebert, M.; Thormann, S.; Wendt, J.; Bagdahn, J. | Conference Paper |
2012 | Portable 100 W power generator based on efficient planar SOFC technology Pönicke, Andreas; Reuber, Sebastian; Dosch, Christian; Megel, Stefan; Kusnezoff, Mihails; Wunderlich, Christian; Michaelis, Alexander | Presentation |
2012 | Portable 100W power generator based on efficient planar SOFC technology Reuber, S.; Pönicke, A.; Wunderlich, C.; Michaelis, A. | Presentation |
2012 | Properties and reliability of silicon nitride substrates with AMB copper conductor Böhm, G.; Brunner, D.; Sichert, I.; Pönicke, A.; Schilm, J. | Conference Paper |
2012 | Safe product design - the role of the NDE reliability analysis Pavlovic, Mato; Ronneteg, Ulf; Müller, Christina; Ewert, Uwe; Boller, Christian | Conference Paper |
2012 | Trade-offs between performance and reliability in AlGaN/GaN transistors Waltereit, P.; Bronner, W.; Kiefer, R.; Quay, R.; Dammann, M.; Cäsar, M.; Brueckner, P.; Müller, S.; Mikulla, M.; Ambacher, O. | Journal Article, Conference Paper |
2011 | Approaching runtime trust assurance in open adaptive systems Schneider, Daniel; Becker, Martin; Trapp, Mario | Conference Paper |
2011 | Approaching runtime trust assurance in open adaptive systems Schneider, Daniel; Becker, Martin; Trapp, Mario | Report |
2011 | Characterization of reliability Nuffer, Jürgen; Flaschenträger, D.; Janssen, Enrico; Hoffmann, D.; Gäng, J. | Book Article |
2011 | A collaborative reliability database for maintenance optimisation Faulstich, S.; Lyding, P.; Hahn, B.; Brune, D. | Conference Paper |
2011 | From epitaxy to backside process: Reproducible AlGaN/GaN HEMT technology for reliable and rugged power devices Bronner, W.; Waltereit, P.; Müller, S.; Dammann, M.; Kiefer, R.; Dennler, P.; Raay, F. van; Musser, M.; Quay, R.; Mikulla, M.; Ambacher, O. | Conference Paper |
2011 | High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology Grella, K.; Vogt, H.; Paschen, U. | Conference Paper |
2011 | Integrating mobile devices into the car ecosystem - tablets and smartphones as vital part of the car Hess, Steffen; Meschtscherjakov, Alexander; Ronneberger, Torsten; Trapp, Marcus | Conference Paper |
2011 | Light switched plasma charging protection device for high-field characterization and flash memory protection Sommer, S.P.; Paschen, U.; Figge, M.; Vogt, H. | Journal Article |
2011 | Offshore~WMEP - monitoring offshore wind energy use Faulstich, S.; Lyding, P.; Hahn, B.; Lopez, S. | Conference Paper |
2011 | Wind turbine downtime and its importance for offshore deployment Faulstich, S.; Hahn, B.; Tavner, P.J. | Journal Article |
2010 | AlGaN/GaN epitaxy and technology Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Kiefer, R.; Pletschen, W.; Müller, S.; Aidam, R.; Menner, H.; Kirste, L.; Köhler, K.; Mikulla, M.; Ambacher, O. | Journal Article |
2010 | A Bayesian reliability model for failure count data Kempf, Michael | Conference Paper |
2010 | Component-based modeling and verification of dynamic adaptation in safety-critical embedded systems Adler, Rasmus; Schäfer, Ina; Trapp, Mario; Poetzsch-Heffter, Arnd | Journal Article |
2010 | Conditional safety certificates in open systems Schneider, Daniel; Trapp, Mario | Conference Paper |
2010 | Data-mining-based link failure detection for wireless mesh networks Lindhorst, Timo; Lukas, Georg; Nett, Edgar; Mock, Michael | Conference Paper |
2010 | Degradation of sealing glasses under electrical load Rost, A.; Schilm, J.; Kusnezoff, M.; Michaelis, A. | Conference Paper |
2010 | Development of rugged 2 GHz power bars delivering more than 100 W and 60% power added efficiency Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Mikulla, M.; Ambacher, O.; Harm, L.; Lorenzini, M.; Rödle, T.; Riepe, K.; Bellmann, K.; Buchheim, C.; Goldhahn, R. | Journal Article, Conference Paper |
2010 | Entwickungsbegleitendes, domänenübergreifendes Zuverlässigkeitsmodell Kempf, Michael; Rauschenbach, Matthias | Conference Paper |
2010 | Fault tolerant sequential control Neugebauer, Reimund; Barthel, S.; Richter, M. | Conference Paper |
2010 | High efficiency and low leakage AlGaN/GaN HEMTs for a robust, reproducible and reliable X-band MMIC space technology Waltereit, P.; Bronner, W.; Kiefer, R.; Quay, R.; Kühn, J.; Raay, F. van; Dammann, M.; Müller, S.; Libal, C.; Meier, T.; Mikulla, M.; Ambacher, O. | Conference Paper |
2010 | Reliability of intralogistics-systems - oversizing or maintenance Wenzel, S.; Köpcke, C.; Bandow, G. | Conference Paper |
2010 | Reliability status of GaN transistors and MMICs in Europe Dammann, M.; Cäsar, M.; Konstanzer, H.; Waltereit, P.; Quay, R.; Bronner, W.; Kiefer, R.; Müller, S.; Mikulla, M.; Wel, P.J. van der; Rödle, T.; Bourgeois, F.; Riepe, K. | Conference Paper |
2010 | Reliable component fatigue design applying appropriate cyclic properties Amos, D.; Delarbre, P.; Lipp, K.; Kaufmann, H. | Conference Paper |
2010 | Softwarequalität in medizinischen Produkten sichern Eschbach, Robert; Rosbach, Alla | Journal Article |
2010 | A survey to control unvertainties by comprehensive monitoring of load-carrying structures Koenen, J.F.; Platz, R.; Hanselka, H. | Conference Paper |
2010 | Transparent combination of expert and measurement data for defect prediction - an industrial case study Kläs, Michael; Elberzhager, Frank; Münch, Jürgen; Hartjes, Klaus; Graevemeyer, Olaf von | Report |
2009 | Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system Klengel, R.; Bennemann, S.; Petzold, M. | Conference Paper |
2009 | Design of reliable circuits by determination of SOA borders as part of the degradation analysis Jancke, R.; Ellmers, C.; Gaertner, R. | Conference Paper |
2009 | Influence of cyclic loading and temperature on integrity of piezoceramic patch transducers Gall, M.; Thielicke, B. | Conference Paper |
2009 | Komposition von Benutzungsmodellen: Anforderungen und Konzeption Bauer, Thomas; Eschbach, Robert; Hussain, Tanvir; Kloos, Johannes; Zimmermann, Fabian | Report |
2009 | Komposition von Benutzungsmodellen: Operatoren und Anwendungsbeispiele Bauer, Thomas; Eschbach, Robert; Hussain, Tanvir; Kloos, Johannes; Zimmermann, Fabian | Report |
2009 | Oversizing or maintenance Wenzel, S.; Bandow, G. | Conference Paper |
2009 | Packaging influence on laser bars of different dimensions Westphalen, T.; Leers, M.; Werner, M.; Traub, M.; Hoffmann, H.-D.; Ostendorf, R. | Conference Paper |
2009 | Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems Dammann, M.; Pletschen, W.; Waltereit, P.; Bronner, W.; Quay, R.; Müller, S.; Mikulla, M.; Ambacher, O.; Wel, P.J. van der; Murad, S.; Rödle, T.; Behtash, R.; Bourgeois, F.; Riepe, K.; Fagerlind, M.; Sveinbjörnsson, E.Ö. | Journal Article, Conference Paper |
2009 | Reliability and effective signal-to-noise ratio of RuO(sub 2)-based thick film strain gauges Dietrich, S.; Kretzschmar, C.; Partsch, U.; Rebenklau, L. | Conference Paper |
2009 | Reliability consideration of low-power-grid-tied inverter for photovoltaic application Liu, J.; Henze, N. | Conference Paper |
2009 | Reliability of AlGaN/GaN HEMTs under DC- and RF-operation Dammann, Michael; Cäsar, M.; Waltereit, Patrick; Bronner, Wolfgang; Konstanzer, Helmer; Quay, Rüdiger; Müller, Stefan; Mikulla, Michael; Ambacher, O.; Wel, P. van der; Rödle, T.; Behtash, R.; Bourgeois, F.; Riepe, K. | Conference Paper |
2008 | Assembly of ASICs for high temperature applications - material characterization and reliability testing Klieber, R.; Trieu, H.-K. | Conference Paper |
2008 | A Bayesian approach for estimating survival probabilities Kempf, Michael | Conference Paper |
2008 | Berücksichtigung von Streuungen in der simulationsgeschützten Funktions- und Zuverlässigkeitsanalyse Jöckel, M.; Bruder, T. | Conference Paper |
2008 | Component engineering for adaptive Ad-hoc systems Peper, Christian; Schneider, Daniel | Conference Paper |
2008 | DC-arc behavior of a novel active fuse Dorp, J. vom; Berberich, S.E.; Bauer, A.J.; Ryssel, H. | Conference Paper |
2008 | Development of test procedures for polymer material characterization in view of long-term durability of PV-modules Schulze, S.-H.; Dietrich, S.; Ebert, M.; Bagdahn, J. | Conference Paper |
2008 | High-efficiency GaN HEMTs on 3-inch semi-insulating SiC substrates Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Raynor, B.; Mikulla, M.; Weimann, G. | Journal Article |
2008 | Managing software quality through a hybrid defect content and effectiveness model Kläs, Michael; Elberzhager, Frank; Nakao, Haruka | Conference Paper |
2008 | Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems Dammann, M.; Pletschen, W.; Waltereit, P.; Bronner, W.; Quay, R.; Müller, S.; Mikulla, M.; Ambacher, O.; Wel, P.J. van der; Murad, S.; Rödle, T.; Behtash, R.; Bourgeois, F.; Riepe, K.; Fagerlind, M.; Sveinbjörnsson, E.Ö. | Conference Paper |
2008 | Reliability investigation of an automotive oil pan equipped with active noise reduction Nuffer, J.; Pfeiffer, T.; Flaschenträger, D. | Conference Paper |
2008 | Reliability-based generation and view synthesis in layered depth video Müller, K.; Smolic, A.; Dix, K.; Kauff, P.; Wiegand, T. | Conference Paper |
2008 | Structural durability of welded constructions - safety and reliability aspects in fatigue life assessment of offshore tubular structures Sonsino, C.M. | Conference Paper |
2008 | Structural health monitoring of fiber components Lehmann, M.; Büter, A.; Hanselka, H.; Haase, K.-H. | Conference Paper |
2008 | A uniform, reproducible and reliable GaN HEMT technology with breakdown voltages in excess of 160 V delivering more than 60% PAE at 80 V Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Walcher, H.; Raay, F. van; Kappeler, O.; Mikulla, M. et al. | Conference Paper |
2007 | Comparison of test methods for strength characterization of thin solar wafer Schönfelder, S.; Bohne, A.; Bagdahn, J. | Conference Paper |
2007 | Development of safe and reliable embedded systems using dynamic adaptation Adler, Rasmus; Schneider, Daniel; Trapp, Mario | Conference Paper |
2007 | Examination of reliability of piezoelektric cantilever beams Platz, R. | Conference Paper |
2007 | Fracture strength of SOI springs in MEMS micromirrors Hsu, S.-T.; Wolter, A.; Owe, W.-D.; Schenk, H. | Conference Paper |
2007 | High temperature reliability of organic light emitting diodes Lesiuk, P. | Thesis |
2007 | Life-span investigations of piezoceramic patch sensors and actuators Gall, M.; Thielicke, B. | Conference Paper |
2007 | Lötbarkeit und Zuverlässigkeit bleifreier Leiterplatten-Oberflächen Pape, U. | Presentation |
2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Conference Paper |
2007 | Reliability investigation of piezoelectric macro fibre composite (MFC) actuators Nuffer, J.; Schönecker, A.; Brückner, B.; Kohlrautz, D.; Michelis, P.; Adarraga, O.; Wolf, K. | Conference Paper |
2007 | Reliabilty prediction with the aid of bayesian statistics Kempf, Michael | Conference Paper |
2006 | A bayesian approach assessing the availability of technical systems under different operating conditions throughout their life cycle Mannuß, O.; Schneider, S.; Kempf, M.; Westkämper, E. | Conference Paper |
2006 | Characterization of reliability Nuffer, J.; Hanselka, H. | Book Article |
2006 | Condition - Monitoring - System für die Strukturüberwachung Schubert, L.; Frankenstein, B. | Conference Paper |
2006 | Drop simulation and stress analysis of MEMS devices Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J. | Conference Paper |
2006 | Dynamische Adaption für die Entwicklung verlässlicher Softwaresysteme im Automobil Trapp, M.; Schäfer, C.; Robinson-Mallett, C. | Conference Paper |
2006 | Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.; Wiemer, M.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H. | Conference Paper |
2006 | Intermetallic compound formation In Au/Al thermosonic wire bonding during high temperature annealing at 150 °C as a function of wire material Klengel, R.; Knoll, H.; Petzold, M.; Wohnig, M.; Schräpler, L. | Conference Paper |
2006 | Methoden zur Zuverlässigkeitsqualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik Wilde, J.; Schneider-Ramelow, M.; Petzold, M. : Scheel, W. | Book |
2006 | Physical domain modeling for the development of dependable embedded systems Domis, D.J.; Schäfer, C.; Trapp, M. | Conference Paper |
2006 | Technologies and reliability of modern embedded flash cells Sikora, A.; Pesl, F.-P.; Unger, W.; Paschen, U. | Journal Article |
2006 | Untersuchung der Zuverlässigkeit hochtemperaturgeeigneter Baugruppen Pape, U.; Nowottnick, M.; Rittner, M.; Neher, W. | Conference Paper |
2006 | Vibration control with adaptive structures Hanselka, H.; Melz, T.; Drossel, W.-G.; Sporn, D.; Schönecker, A.; Poigné, A. | Conference Paper |
2006 | Zuverlässigkeit stoffschlüssiger Fügeverbindungen für Hochtemperatur-Elektronikbaugruppen Nowottnick, M. | Habilitation |
2005 | Bewertung der Ergebnisse und Simulation der Zuverlässigkeit Nowottnick, M.; Pape, U.; Neher, W. | Book Article |
2005 | Condition monitoring of automotive electronic systems with life cycle units Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K. | Abstract |
2005 | A coplanar X-band AlGaN/GaN power amplifier MMIC on s.i. SiC substrate Raay, F. van; Quay, R.; Kiefer, R.; Benkhelifa, F.; Raynor, B.; Pletschen, W.; Kuri, M.; Massler, H.; Müller, S.; Dammann, M.; Mikulla, M.; Schlechtweg, M.; Weimann, G. | Journal Article |
2005 | Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric Linz, Torsten; Kallmayer, C. | Conference Paper |
2005 | Globalization in automotive industry and product reliability Grubisic, V. | Conference Paper |
2005 | Making reliability statements for technical systems under different environmental conditions - an application of Bayesian networks Schneider, S.; Kempf, M. | Conference Paper |
2005 | Mechanical failure behavior of glass frit bondet structures Ebert, M.; Dresbach, C.; Krombholz, A.; Bagdahn, J.; Glien, K.; Graf, J.; Müller-Fiedler, R.; Hofer, H. | Conference Paper |
2005 | Niedrigtemperaturmontage hochintegrierter elektronischer Baugruppen durch selektive Mikrowellenerwärmung Pape, U.; Nowottnick, M.; Diehm, R. | Poster |
2005 | NON-destructive strength testing of anodic bonded glass-silicon wafer compounds Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M. | Conference Paper |
2005 | Reliability of wafer bonding in microsystem technologies Bagdahn, J. | Conference Paper |
2005 | Sensor modules for structural health monitoring and reliability of components Kröning, M.; Berthold, A.; Meyendorf, N. | Conference Paper |
2005 | Software reliability growth prediction - state of the art Apel, S. | Report |
2004 | Fuel cell based drive trains in public transport Jonas, K.; Schneider, M.; Klingner, M. | Conference Paper |
2004 | Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Conference Paper |
2004 | Qualität im Automobil: Systematische Definition nichtfunktionaler Anforderungen Doerr, J.; Olsson, T.; Schmid, K. | Conference Paper |
2004 | Reliability of active systems - an essential design aspect for commercial success Büter, A.; Melz, T.; Hanselka, H. | Conference Paper |
2003 | A coplanar 94 GHz low-noise amplifier MMIC using 0.07 µm metamorphic cascode HEMTs Tessmann, A.; Leuther, A.; Schwörer, C.; Massler, H.; Kudszus, S.; Reinert, W.; Schlechtweg, M. | Conference Paper |
2003 | Fatigue of polycrystalline silicon under long-term cyclic loading Bagdahn, J.; Sharpe, W.N. | Journal Article |
2003 | Metamorphic HEMT technologies for millimeter-wave low-noise applications Tessmann, A.; Leuther, A.; Massler, H.; Reinert, W.; Schwörer, C.; Dammann, M.; Walther, M.; Schlechtweg, M.; Weimann, G. | Conference Paper |
2003 | Reliability and degradation mechanism of AlGaAs/InGaAs and InAlAs/InGaAs HEMTs Dammann, M.; Leuther, A.; Benkhelifa, F.; Feltgen, T.; Jantz, W. | Journal Article |
2003 | Reliability of piezoceramic patch sensors under cyclic mechanical loading Thielicke, B.; Gesang, T.; Wierach, P. | Journal Article |
2003 | Von Störungen und Ausfällen zur Zuverlässigkeit Stender, S. | Conference Paper |
2002 | Flip chip molding - highly reliable flip chip encapsulation Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
2002 | High-field step-stress and long term stability of PHEMTs with different gate and recess lengths Cova, P.; Menozzi, R.; Dammann, M.; Feltgen, T.; Jantz, W. | Journal Article |
2002 | High-reliability MOCVD-grown quantum dot laser Sellin, R.L.; Ribbat, C.; Bimberg, D.; Rinner, F.; Konstanzer, H.; Kelemen, M.T.; Mikulla, M. | Journal Article |
2002 | Mechanical and electrical failures and reliability of micro scanning mirrors Gaumont, E.; Wolter, A.; Schenk, H.; Georgelin, G.; Schmoger, M. | Conference Paper |
2002 | Numerical and experimental verification of structural durability for safety components - analogy motorcar/train Büter, A.; Fischer, G.; Störzel, K.; Weber, C. | Conference Paper |
2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
2002 | Reliability of metamorphic HEMTs for power applications Dammann, M.; Benkhelifa, F.; Meng, M.; Jantz, W. | Journal Article |
2002 | Simultaneous flip chip underfill and encapsulation Becker, K.F.; Braun, T.; Adams, T. | Journal Article |
2001 | Fatigue Design, Testing and Relability of Ceramic Components by the Example of Intake and Exhaust Valves Sonsino, C.M. | Conference Paper |
2000 | Analysis of HBT behavior after strong electrothermal stress Palankovski, V.; Selberherr, S.; Quay, R.; Schultheis, R. | Conference Paper |
2000 | Digital signatures for interactive web services Hirsch, C. | Report |
2000 | Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Marsetz, W.; Schmidt, K.; Weimann, G. | Journal Article |
2000 | Reliability of InAlAs/InGaAs HEMTs grown on GaAs substrate with metamorphic buffer Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Weimann, G. | Journal Article |
2000 | Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches Bagdahn, J.; Petzold, M.; Seidel, H. | Conference Paper |
1999 | Disparity/segmentation analysis: Matching with an adaptive window and depth-driven segmentation Izquierdo, E. | Journal Article |
1999 | Fabrication and characterization of high power diode lasers Jandeleit, J.; Wiedmann, N.; Ostlender, A.; Brandenburg, W.; Loosen, P.; Poprawe, R. | Conference Paper |
1999 | Moderne Entwicklungsprozesse sichern Wirtschaftlichkeit und Zuverlässigkeit Sonsino, C.M. | Conference Paper |
1999 | Passivated 0,15 mu m InAlAs/InGaAs HEMTs with 500 GHz f(max). HF performance, thermal stability and reliability Chertouk, M.; Dammann, M.; Massler, M.; Köhler, K.; Weimann, G. | Conference Paper |
1999 | Probabilistic fracture mechanics approach to pressure vessel reliability evaluation Cioclov, D.; Kröning, M. | Conference Paper |
1999 | Reliability of passivated 0.15 mu m InAlAs/InGaAs HEMT's with pseudomorphic channel Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Schmidt, K.H.; Weimann, G. | Conference Paper |
1999 | Sicherheit und Zuverlässigkeit durch präventive Anlagensimulation Putz, M.; Naumann, B.; Noack, S. | Conference Paper |
1999 | Towards the re-use of electronic products-quality assurance for the re-use of electronics Potter, H.; Griese, H.; Middendorf, A.; Fotheringham, G.; Reichl, H. | Conference Paper |
1998 | Advantages of Al-free GaInP/InGaAs PHEMTs for power applications Chertouk, M.; Bürkner, S.; Bachem, K.H.; Pletschen, W.; Kraus, S.; Braunstein, J.; Tränkle, G. | Journal Article |
1998 | Comparison of procedures for experimental and theoretical durability approval of a truck axle Dini, A.; Rupp, A. | Report |
1998 | Effect of atmosphere on reliability of passivated 0.15 mu m InAlAs/InGaAs HEMTs Dammann, M.; Chertouk, M.; Jantz, W.; Köhler, K.; Schmidt, K.H.; Weimann, G. | Journal Article |
1998 | Fatigue design and testing of components Sonsino, C.M. | Conference Paper |
1998 | Fatigue design and testing of components Sonsino, C.M. | Conference Paper |
1998 | Fatigue design. Testing, quality reliability and safety on the example of automotive PM' components Sonsino, C.M. | Conference Paper |
1998 | Früherkennung sicherheitsrelevanter Betriebszustände in Chemieanlagen mit neuronalen Netzen Neumann, J.; Deerberg, G.; Schlüter, S. | Conference Paper |
1998 | GaInP/GaInAs/GaAs-MODFETs with pseudomorphic GaInP barriers, device concept and device properties Pletschen, W.; Bachem, K.H.; Chertouk, M.; Bürkner, S.; Braunstein, J. | Conference Paper |
1998 | Realisierung von Transaktionen innerhalb von C/S-Systemen am Beispiel eines Workflow-Management-Systems Messer, B. | Conference Paper |
1998 | Service-like durability approval of wheelsets Fischer, G.; Grubisic, V. | Conference Paper |
1997 | Kosten/Nutzen-Analyse von GQM-basiertem Messen und Bewerten. Eine replizierte Fallstudie Gresse, C.; Hoisl, B.; Rombach, H.D.; Ruhe, G. | Conference Paper |
1997 | Long-range high-reliability telemetry in unlicensed frequency bands Mayer, F.; Perthold, R. | Conference Paper |
1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H. | Conference Paper |
1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Journal Article |
1997 | Methodology for effective design evaluation and durability approval of car suspension components Grubisic, V.; Fischer, G. | Report |
1997 | Probabilistic Assessment of Failure Risk in Load-Bearing Components Cioclov, D.; Kröning, M.; Schmitz, V. | Conference Paper |
1997 | Schädigungsproportionale Beschreibung von Lastfolgen mit veränderlichen Mittellasten. Das Trennverfahren Oppermann, H. | Book |
1996 | Entwicklungstendenzen photonischer Nachrichtennetze Baack, C. | Journal Article |
1996 | An Instrument for Measuring the Success of the Requirements Engineering Process in Information Systems Development Emam, K. el; Madhavji, N.H. | Journal Article |
1996 | Reliability investigations of different bumping processes for flip chip and TAB applications Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H. | Conference Paper |
1995 | Flip chip soldering on printed wining boards using vapor phase reflow Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J. | Conference Paper |
1995 | A novel resistor system for AlN Kretzschmar, C.; Otschik, P.; Schoene, F.; Jaenicke-Rößler, K. | Conference Paper |
1995 | Reliability governing factors of various dielectrics Otschik, P.; Kretzschmar, C.; Keitel, U. | Conference Paper |
1994 | A CMD-only reproducible field degradation and its reliability aspect Gieser, H.A.; Egger, P.; Reiner, J.C.; Herrmann, M.R. | Conference Paper |
1994 | Schadensanalyse des Dielektrikums - DP5704 Otschik, P.; Kretschmar, C.; Obenaus, P. | Book |
1993 | Mehrlagenmetallisierung für hochintegrierte mikroelektronische Schaltungen Vogt, H. | Habilitation |
1993 | Reliability assurance of railroad wheels by ultrasonic stress analysis Schneider, E.; Bruche, D.; Frotscher, H.; Herzer, H.-R. | Conference Paper |
1993 | Tasks of Non-Destructive Testing Dobmann, G.; Kröning, M. | Conference Paper |
1992 | Motion compensated interpolation for advanced standards conversion and noise reduction Ernst, M. | Conference Paper |
1992 | Surface remelting and alloying of Al-based alloys with CO2 laser radiation Kreutz, E.W.; Rozsnoki, M.; Pirch, N. | Conference Paper |
1992 | Testability of expert systems in system development and application Hoenen, M.; Kloth, M.; Steven, E. | Journal Article |
1991 | Procjena vijeka trajanja za automobilske komponente Grubisic, V. | Conference Paper |
1990 | Improving quality and reliability - a challenge for environmental engineering. Schubert, H. | Journal Article |
1990 | A new explanation for the degradation of gold-aluminium bonds Haag, F.J. | Conference Paper |
1990 | Reliability of interfaces in newly designed ceramic-ceramic and metal-ceramic systems Schönholz, R.; Kleer, G.; Döll, W. | Book |
1990 | Umweltsimulation sichert Qualität und Zuverlässigkeit Schubert, H. | Journal Article |
1990 | Zuverlässigkeitsuntersuchungen von Aluminium-Drahtbonds auf Gold Dickschichtleiterbahnen Haag, J.F. | Conference Paper |
1988 | Thermal degradation effects in InP Sartorius, B.; Schlak, M.; Rosenzweig, M.; Parschke, K. | Journal Article |
1987 | An age-wear dependent model of failure Giglmayr, J. | Journal Article |
1986 | Application of coherent systems in the subscriber loop Bachus, E.-J.; Heydt, G. | Conference Paper |
1984 | A common approach to the analysis and optimization of bus systems and loss systems Giglmayr, J. | Conference Paper |
1982 | Monitoring aids in an experimental broadband communication system Burmeister, M.; Donner, H.; Kliem, H.; Kreutzer, H.W.; Schmidt, F. | Conference Paper |
1982 | Subscriber stations in service integrated optical broad band communications systems Buenning, H.; Kreutzer, H.W.; Schmidt, F. | Journal Article |
1980 | Optical-fiber system with distributed access Herold, W.E.; Ohnsorge, H. | Journal Article |
1980 | Switching systems for integrated communication Nobis, R.; Saniter, J.; Schaffner, H. | Conference Paper |
1979 | Estimation of the reliability of hierarchical communication networks Mrozynski, G. | Journal Article |