Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Process variability - technological challenge and design issue for nanoscale devices
Lorenz, Jürgen; Bär, Eberhard; Barraud, Sylvain; Brown, Andrew R.; Evanschitzky, Peter; Klüpfel, Fabian; Wang, Liping
Journal Article
2018Process variability for devices at and beyond the 7 nm node
Lorenz, Jürgen; Asenov, Asen; Bär, Eberhard; Barraud, Sylvain; Millar, Campbell; Nedjalkov, Mihail
Conference Paper
2017Measuring fibre orientation in sisal fibre-reinforced, injection moulded polypropylene
Albrecht, K.; Baur, E.; Endres, H.-J.; Gente, R.; Graupner, N.; Koch, M.; Neudecker, M.; Osswald, T.; Schmidtke, P.; Wartzack, S.; Webelhaus, K.; Müssig, J.
Journal Article
2016Empirical cluster modeling revisited
Pichler, Peter
Conference Paper
2016Simulation of process variations in FinFET transistor patterning
Baer, Eberhard; Burenkov, Alex; Evanschitzky, Peter; Lorenz, Juergen
Conference Paper
2015Coupled simulation to determine the impact of across wafer variations in oxide PECVD on electrical and reliability parameters of through-silicon vias
Bär, Eberhard; Evanschitzky, Peter; Lorenz, Jürgen; Roger, Frederic; Minixhofer, Rainer; Filipovic, Lado; Orio, Roberto de; Selberherr, Siegfried
Journal Article, Conference Paper
2015Development and validation of a CAE chain for unidirectional fibre reinforced composite components
Kärger, L.; Bernath, A.; Fritz, F.; Galkin, S.; Magagnato, D.; Oeckerath, A.; Schön, A.; Henning, F.
Journal Article
2015Growth condition of amorphous ZTO films from rotatable targets
Sittinger, V.; Pflug, A.; Schulz, C.; Siemers, M.; Melzig, T.; Meyer, B.; Kronenberger, A.; Oberste Berghaus, J.; Bosscher, W. de
Journal Article, Conference Paper
2015Impact of gear finishing processes on micro geometry - simulation of defective production processes and resulting acoustic properties
Kimme, Simon; Bauer, Ruben; Drossel, Welf-Guntram; Putz, Matthias
Conference Paper
2014Challenges and opportunities for process modeling in the nanotechnology era
Lorenz, J.K.; Baer, E.; Burenkov, A.; Erdmann, A.; Evanschitzky, P.; Pichler, P.
Journal Article
2014Simultaneous simulation of systematic and stochastic process variations
Lorenz, Jürgen; Bär, Eberhard; Burenkov, Alex; Evanschitzky, Peter; Asenov, Asen; Wang, Liping; Wang, Xingsheng; Brown, Andrew; Millar, Campbell; Reid, David
Conference Paper
2013Numerical and experimental analysis of self piercing riveting process with carbon fiber-reinforced plastic and aluminium sheets
Drossel, Welf-Guntram; Mauermann, Reinhard; Grützner, Raik; Mattheß, Danilo
Conference Paper
2011Hierarchical simulation of process variations and their impact on circuits and systems: Methodology
Lorenz, J.; Bär, E.; Clees, T.; Jancke, R.; Salzig, C.P.J; Selberherr, S.
Journal Article
2011Hierarchical simulation of process variations and their impact on circuits and systems: Results
Lorenz, J.K.; Bär, E.; Clees, T.; Evanschitzky, P.; Jancke, R.; Kampen, C.; Paschen, U.; Salzig, C.P.J; Selberherr, S.
Journal Article
2011Methods for design and application of adiabatic compressed air energy storage based on dynamic modeling
Wolf, D.
Dissertation
2011Mit Druckluft Wind zwischenspeichern
Wolf, D.; Span, R.; Weidner, E.
Journal Article
2010Gear rolling technology
Neugebauer, Reimund; Hellfritzsch, U.; Lahl, M.; Schiller, S.; Milbrandt, M.
Presentation
2010Impact of technological options for 22 nm SOI CMOS transistors on IC performance
Burenkov, A.; Kampen, C.; Bär, E.; Lorenz, J.
Conference Paper
2010New modeling concepts for today's software processes. International conference on software process, ICSP 2010. Proceedings
: Münch, Jürgen (Ed.); Yang, Ye (Ed.); Schäfer, Wilhelm (Ed.)
Conference Proceedings
2009Calculation of stresses in two- and three-dimensional structures generated by induction assisted laser cladding
Brückner, F.; Lepski, D.; Beyer, E.
Conference Paper
2009Impact of lithography variations on advanced CMOS devices
Lorenz, J.; Kampen, C.; Burenkov, A.; Fühner, T.
Conference Paper
2009Model of a solar driven steam jet ejector chiller and investigation of its dynamic operational behaviour
Pollerberg, C.; Heinzel, A.; Weidner, E.
Journal Article
2009PD-SOI MOSFETs: Interface effect on point defects and doping profiles
Bazizi, E.M.; Pakfar, A.; Fazzini, P.F.; Cristiano, F.; Tavernier, C.; Claverie, A.; Burenkov, A.; Pichler, P.
Conference Paper
2009Simulation assessment of process options for advanced CMOS devices
Kampen, C.; Burenkov, A.; Lorenz, J.; Ryssel, H.
Conference Paper
2008Process models for advanced annealing schemes and their use in device simulation
Pichler, P.; Martinez-Limia, A.; Kampen, C.; Burenkov, A.; Schermer, J.; Paul, S.; Lerch, W.; Gelpey, J.; McCoy, S.; Kheyrandish, H.; Pakfar, A.; Tavernier, C.; Bolze, D.
Conference Paper
2008Shipyard investment planning by use of modern process-simulation and layout-planning tools
Weidemann, Björn; Bohnenberg, Ralf; Wanner, Martin-Christoph
Conference Paper
2008Simulation based development of the clinch connection with a plane surface on the die side
Awiszus, B.; Beyer, U.; Todtermuschke, M.; Riedel, F.
Conference Paper
2006Process-induced diffusion phenomena in advanced CMOS technologies
Pichler, P.; Burenkov, A.; Lerch, W.; Lorenz, J.; Paul, S.; Niess, J.; Nényei, Z.; Gelpey, J.; McCoy, S.; Windl, W.; Giles, L.F.
Conference Paper
2005Towards an agile development method for software process simulation
Angkasaputra, N.; Pfahl, D.
Conference Paper
20043D feature-scale simulation of sputter etching with coupling to equipment simulation
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
20043D simulation of process effects limiting FinFET performance and scalability
Burenkov, A.; Lorenz, J.
Conference Paper
2004Adaptive surface triangulations for 3D process simulation
Nguyen, P.-H.; Burenkov, A.; Lorenz, J.
Conference Paper
2004Genetic algorithm for optimization and calibration in process simulation
Fühner, T.; Erdmann, A.; Ortiz, C.J.; Lorenz, J.
Conference Paper
2004Report on ProSim'04. The 5th International Workshop on Software Process Simulation and Modeling
Pfahl, D.; Raffo, D.M.; Rus, I.; Wernick, P.
Journal Article
2003Creating an advanced software engineering laboratory by combining empirical studies with process simulation
Münch, J.; Rombach, H.D.; Rus, I.
Conference Paper
2003Dynamische Prozesssimulation zum Abbau ozeanischer Gashydrate
Schultz, H.; Deerberg, G.
Journal Article, Conference Paper
2003Goal-oriented measurement plus system dynamics. A hybrid and evolutionary approach
Pfahl, D.; Ruhe, G.
Conference Paper
2003Process simulation for advanced large area optical coatings
Pflug, A.; Szyszka, B.; Sittinger, V.; Niemann, J.
Conference Paper
2003Processing techniques for functionally graded materials
Kieback, B.; Neubrand, A.; Riedel, H.
Journal Article
2003Simulation of reactive sputtering kinetics in real in-line processing chambers
Pflug, A.; Szyszka, B.; Niemann, J.
Journal Article
2003Three-dimensional simulation of superconformal copper deposition based on the curvature-enhanced accelerator coverage mechanism
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
2003Three-dimensional triangle-based simulation of etching processes and applications
Lenhart, O.; Bär, E.
Journal Article
2003Untersuchung einstufiger Wasser-LiBr Absorptionskältemaschinen zur Kraft-Wärme-Kälte-Kopplung
Noeres, P.
Dissertation
2002IMMoS. A methodology for integrated measurement, modelling, and simulation
Pfahl, D.; Ruhe, G.
Journal Article
2002Simulation of the influence of via sidewall tapering on step coverage of sputter-deposited barrier layers
Bär, E.; Lorenz, J.; Ryssel, H.
Journal Article
2002Three-dimensional triangle-based simulation of etching processes
Lenhart, O.; Bär, E.
Conference Paper
2001A CBT module with integrated simulation component for software project management education and training
Pfahl, D.; Klemm, M.; Ruhe, G.
Journal Article
2001Compact modelling of process related effects on electrical behaviour of CMOS transistors
Burenkov, A.; Zhou, X.
Conference Paper
2001An experiment for evaluating the effectiveness of using a system dynamics simulation model in software project management education
Pfahl, D.; Koval, N.; Ruhe, G.
Conference Paper
2001An integrated approach to simulation-based learning in support of strategic and project management in software organisations
Pfahl, D.
Dissertation
2001Perspektiven des virtuellen Lackierens und der Prozesssimulation auch für kleine Lackieranlagen
Domnick, J.
Conference Paper
2000A CBT Module with Integrated Simulation Component for Software Project Management Education and Training
Pfahl, D.; Klemm, M.; Ruhe, G.
Report
2000Control and Improvement of Surface Triangulation for Three-Dimensional Process Simulation
Bär, E.; Lorenz, J.
Journal Article
2000Kalkulierbares Laserstrahlschneiden beim Einsatz von CALCut in Entwicklung, Anwendung und Ausbildung
Petring, D.
Journal Article
2000Knowledge Acquisition and Process Guidance for Building System Dynamics Simulation Models. An Experience Report from Software Industry
Pfahl, D.; Lebsanft, K.
Journal Article
2000Optimization of 0.18 µm CMOS Devices by Coupled Process and Device Simulation
Burenkov, A.; Tietzel, K.; Lorenz, J.
Journal Article
2000Three-Dimensional Simulation of the Conformality of Copper Layers Deposited by Low-Pressure Chemical Vapor Deposition from CuI(tmvs)(hfac)
Bär, E.; Lorenz, J.; Ryssel, H.
Journal Article
2000Using System Dynamics Simulation Models for Software Project Management Education and Training
Pfahl, D.; Klemm, M.; Ruhe, G.
Report
1999Control and Improvement of Surface Triangulation for Three-Dimensional Process Simulation
Bär, E.; Lorenz, J.
Conference Paper
1999Prozeßsimulation zur Verfahrens- und Werkzeugoptimierung
Leihkauf, J.
Conference Paper
1999Utilizing coupled process and device simulation for optimization of sub-quarter-micron CMOS technology
Wittl, J.; Burenkov, A.; Tietzel, K.; Müller, A.; Lorenz, J.; Ryssel, H.
Conference Paper
1998Integrated three-dimensional topography simulation and its application to dual-damascene processing
Bär, E.; Henke, W.; List, S.; Lorenz, J.
Conference Paper
1998Monte-Carlo simulation of silicon amorphization during ion implantation
Bohmayr, W.; Burenkov, A.; Lorenz, J.; Ryssel, H.; Selberherr, S.
Journal Article
1998Oberhausener UMSICHT-Tage 1998
 
Conference Proceedings
1998Three-dimensional simulation of layer deposition
Bär, E.; Lorenz, J.; Ryssel, H.
Journal Article
1998Three-dimensional simulation of SiO2 profiles from TEOS-sourced remote microwave plasma-enhanced chemical vapor deposition
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
19973D simulation for sub-micron metallization
Bär, E.; Lorenz, J.; Ryssel, H.
Journal Article, Conference Paper
19973D simulation of sputter deposition of titanium layers in contact holes with high aspect ratios
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
19973D simulation of sputter deposition of titanium layers in contact holes with high aspect ratios2
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
1997Integrated three-dimensional topography simulation of contact hole processing
Bär, E.; Benvenuti, A.; Henke, W.; Jünemann, B.; Kalus, C.; Niedermaier, P.; Lorenz, J.
Conference Paper
1997Monte-Carlo simulation of silicon amorphization during ion implantation
Bohmayr, W.; Burenkov, A.; Lorenz, J.; Ryssel, H.; Selberherr, S.
Conference Paper
1997Realization and evaluation of an ultra low-voltage/low-power 0.25 mu m (n+/p+) dual-workfunction CMOS technology
Schwalke, U.; Berthold, J.; Burenkov, A.; Eisele, M.; Krieg, R.; Narr, A.; Schumann, D.; Seibert, R.; Thanner, R.
Conference Paper
1997Three-dimensional simulation of contact hole metallization using aluminum sputter deposition at elevated temperatures
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
1997Three-dimensional simulation of conventional and collimated sputter deposition of Ti layers into high aspect ratio contact holes
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
1997Three-dimensional simulation of ion implantation
Lorenz, J.; Tietzel, K.; Burenkov, A.; Ryssel, H.
Conference Paper
1996Eine Fallstudie zur modellbasierten Risikoanalyse
Kempkens, R.
: Rombach, H.D. (Prüfer); Bröckers, A. (Prüfer)
Thesis
1996Three-dimensional simulation of ion implantation
Tietzel, K.; Burenkov, A.; Lorenz, J.; Ryssel, H.
Conference Paper
19943D Simulation of Low Pressure Chemical Vapor Deposition
Bär, E.; Lorenz, J.
Conference Paper
1993Multigrid methods for process simulation
Joppich, W.; Mijalkovic, S.
Book
1992Complete bipolar simulation using STORM
Jones, S.K.; Gerodolle, A.; Lombardi, C.; Schäfer, M.; Hill, C.
Conference Paper
1991Carrier concentration profiles by high-energy boron ion implantation into silicon
Sayama, H.; Takai, M.; Namba, S.; Ryssel, H.
Journal Article
1991Observation of inverse u-shaped profiles after platinum diffusion in silicon
Zimmermann, H.; Ryssel, H.
Journal Article
1989One- and two-dimensional process simulation with ICECREM and COMPLAN.
Pichler, P.; Dürr, R.; Holzer, N.; Schott, K.; Barthel, A.; Lorenz, J.; Ryssel, H.
Conference Paper
1989Process simulation at FhG-AIS
Lorenz, J.
Conference Paper
1989Programs for VLSI process simulation
Pichler, P.; Lorenz, J.; Pelka, J.; Ryssel, H.
Conference Paper
1989Simulation halbleitertechnologischer Prozess-Schritte in der Mikroelektronik
Lorenz, J.; Pelka, J.; Ryssel, H.
Journal Article
1989Simulation of complete process step sequences in silicon technology
Pichler, P.; Lorenz, J.
Conference Paper
1989Simulation of the lateral spread of implanted ions - theory
Barthel, A.; Krüger, W.; Lorenz, J.
Conference Paper