Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 1997 | Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H. | Journal Article |