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| 1998 | An environmental comparison of packaging and interconnection technologies
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1998 | Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M. | Conference Paper |
| 1998 | Investigation about application of auto-protection-gas soldering
Scheel, W.; Wittke, K.; Nowottnick, M.; Ulzhofer, H.-G. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Journal Article |
| 1996 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | Plasma assisted wave soldering
Scheel, W. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H. | Journal Article |